CN100498125C - Evaporation box of hot end heat sink for semiconductor electronic refrigerator - Google Patents
Evaporation box of hot end heat sink for semiconductor electronic refrigerator Download PDFInfo
- Publication number
- CN100498125C CN100498125C CNB2005100125332A CN200510012533A CN100498125C CN 100498125 C CN100498125 C CN 100498125C CN B2005100125332 A CNB2005100125332 A CN B2005100125332A CN 200510012533 A CN200510012533 A CN 200510012533A CN 100498125 C CN100498125 C CN 100498125C
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- China
- Prior art keywords
- hole
- semiconductor electronic
- evaporation box
- electronic refrigerator
- heat sink
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- 238000001704 evaporation Methods 0.000 title claims abstract description 62
- 230000008020 evaporation Effects 0.000 title claims abstract description 59
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000000926 separation method Methods 0.000 claims description 18
- 238000005057 refrigeration Methods 0.000 abstract description 7
- 239000007787 solid Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to an evaporation box of heat end heat-radiating device for semiconductor electronic cryostat. It is a solid structure whose interior has a closed evaporation cavity communicated with heat tube, the described evaporation cavity is a closed tubeline-like or capillary microgap-like hollow cavity structure. Said evaporation box is good in rigidity, the planeness of its abutted surface can not be affected by gas pressure in the cavity interior, when it is worked, its abutted state is stable, its heat-conducting area is enlarged and its refrigeration property is stable.
Description
Technical field
The invention belongs to semiconductor electronic refrigeration and field of heat transfer, relate in particular to a kind of evaporation box that is used for semiconductor electronic refrigeration hot end heat sink.
Background technology
Present conductor refrigeration industry, the heat radiation form in the hot junction of its conductor refrigeration sheet mainly contains three kinds of forms: 1. fit in entity aluminium section bar and semiconductor electronic refrigerator hot junction, add fan and force heat exchange; 2. water-cooling pattern, promptly being full of heat-transfer working medium in the metal cavitg of fitting in semiconductor electronic refrigerator hot junction is water, by the power of pump, it is mobile that working-medium water in the metal cavitg is forced, so that heat carries out heat exchange in circulating; 3. adopt heat transfer technology of heat pipe, select a plane of evaporation cavity to fit, utilize the interior working medium gas-liquid phase transition of evaporation cavity, carry out energy exchange with semiconductor electronic refrigerator hot junction.
The notification number of applying for and announcing on September 29th, 1999 on March 30th, 1998 as Chinese patent is the utility model patent of CN2341091Y, disclose a kind of " adopting the thermoelectric refrigerator of heat pipe for conductive heat dissipation ", its vaporization chamber is the trapezoidal vaporization chamber that has the hollow evaporation cavity.The trapezoidal evaporation cavity operating pressure of the hollow of above-mentioned heat-pipe radiator causes the evaporation cavity binding face to be out of shape because of pressure is excessive more greatly and easily, and the applying tight ness rating is affected, and then the thermal contact resistance of increase binding face causes heat transfer efficiency low.
Summary of the invention
Technical problem to be solved by this invention is that a kind of evaporation box that is used for the electronic refrigerator hot end heat sink will be provided, and its evaporation cavity is closed pipeline shape or capillary microgap shape cavity structure.Increased the integral rigidity of evaporation box, be difficult for, so that can not be subjected to the influence of intracavity gas pressure, improved with the applying tight ness rating of refrigerating sheet with the flatness of the binding face of refrigerating sheet because of pressure-bearing produces distortion; Heat-conducting area is big, and heat-transfer effect is good.
The present invention will solve the technical scheme that above-mentioned technical problem takes: a kind of evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink, for inside is provided with the entity structure in the closed evaporating chamber that is connected with heat pipe, described evaporation cavity is closed pipeline shape or capillary microgap shape cavity structure.
The closed-loop path that described evaporation cavity is made up of the pipeline that is interconnected.
As improvement of the present invention, described evaporation cavity is the formed netted closed-loop path that is interconnected by crisscross pipe-like cavity.
The pipe-like cavity comprises laterally or the hole of longitudinal separation setting and be communicated with connected chamber between the corresponding hole; Described hole, connected chamber are at least two.
As further improvement, the axis in the hole of described longitudinal separation setting is arranged in parallel.
The axis coplane in the hole that described longitudinal separation is provided with, the plane at its axis place parallels with the binding face of fitting in evaporation box and semiconductor electronic refrigerator hot junction.
The hole horizontal or the longitudinal separation setting of described evaporation cavity is vertical post hole or horizontal columns hole; Connected chamber and each hole are conducted, and form the closed-loop path.
Further improve as of the present invention, the opposite face of the binding face of fitting in described evaporation box and evaporation box and semiconductor electronic refrigerator hot junction is provided with fin.
Laterally or the radial section in the hole of longitudinal separation setting be a kind of in rectangle, circle, ellipse, Long Circle or the polygon.
The end coplane of the hole correspondence that described longitudinal separation is provided with, described connected chamber is the flat column cavity that is positioned at the both ends, hole.
The evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink of said structure provided by the present invention, compare with the evaporation box of the trapezoidal evaporation cavity structure of existing hollow, because evaporation cavity has adopted closed pipeline shape or capillary microgap shape cavity structure, form dowel between the binding face that makes evaporation cavity and evaporation box and semiconductor electronic refrigerator hot junction fit, increase the rigidity of product, the flatness of binding face can not be subjected to the influence of intracavity gas pressure, during work and the fit-state of refrigerating sheet stable; Heat-conducting area increases; The moulding of this body structure of evaporation box does not have solder joint, improves the sealing of device, and refrigeration performance is stable.Evaporation box of the present invention is applicable to the semiconductor electronic refrigerator of heat pipe-type conduction heat.
The present invention is described in further detail below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is the embodiment of the invention (one's) a sectional side elevation;
Fig. 2 is C-C view of Fig. 1;
Fig. 3 is A-A view of Fig. 1;
Fig. 4 is the vertical view of Fig. 1;
Fig. 5 is the embodiment of the invention (a two) evaporation cavity structure sectional side elevation;
Fig. 6 is the embodiment of the invention (a three) evaporation cavity structure sectional side elevation.
The specific embodiment
Embodiment (one)
A kind of evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink, as Fig. 1-shown in Figure 4, in establish closed evaporating chamber 1, the opposite face of the binding face 2 of fitting with the evaporation box of conductor refrigeration sheet and semiconductor electronic refrigerator hot junction is provided with one group of radiating fin 3.
Evaporation cavity 1 is for the hole 41 of longitudinal separation setting and be communicated with the closed type pipeline shape cavity structure that the connected chamber 42 between the corresponding hole is formed.
The hole 41 of longitudinal separation setting is the vertical cylindrical hole of four same spline structures, shape, size, and its axis is parallel and be positioned at the same plane that parallels with the binding face 2 of semiconductor electronic refrigerator hot junction applying with evaporation box; It is that the horizontal flat column connected chamber 42 of oval type is conducted with each hole 41 that the both ends in hole 41 have a horizontal cross-section respectively, forms closed evaporation cavity 1.
Being used for of being reserved with on the evaporation box is connected evaporation cavity 1 with heat pipe connection holes 5.
The shape that above-mentioned evaporation box is extended by the axially bored line direction that longitudinally is provided with is at interval made with the end cap sealing after connected chamber 42 is dug in machined, and there are two solder joints the junction of heat pipe and evaporation box.Processing technology is simple, cuts down finished cost.
Embodiment (two)
The main distinction of present embodiment and embodiment (one) is the quantity in the hole 412 that longitudinal separation is provided with and the difference of radial section shape.As shown in Figure 5, the hole of present embodiment longitudinal separation setting has 9, and radial section is shaped as round rectangle.
Embodiment (three)
The main distinction of present embodiment and embodiment (two) is the difference of the hole 413 radial section shapes that longitudinal separation is provided with.As shown in Figure 6, the radial section in the hole of the longitudinal separation setting of present embodiment is shaped as Long Circle.
Claims (10)
1, a kind of evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink, for inside is provided with the entity structure in the closed evaporating chamber that is connected with heat pipe, it is characterized in that: described evaporation cavity is closed pipeline shape or capillary microgap shape cavity structure.
2, the evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink according to claim 1 is characterized in that: the closed-loop path that described evaporation cavity is made up of the pipeline that is interconnected.
3, the evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink according to claim 2 is characterized in that: described evaporation cavity is the formed netted closed-loop path that is interconnected by crisscross pipe-like cavity.
4, the evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink according to claim 3 is characterized in that: described pipe-like cavity comprises laterally or the hole of longitudinal separation setting and be communicated with connected chamber between the corresponding hole; Described hole, connected chamber are at least two.
5, the evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink according to claim 4, it is characterized in that: the axis in the hole of described longitudinal separation setting is arranged in parallel.
6, the evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink according to claim 5, it is characterized in that: the axis coplane in the hole that described longitudinal separation is provided with, the plane at its place parallels with the binding face of fitting in evaporation box and semiconductor electronic refrigerator hot junction.
7, the evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink according to claim 6 is characterized in that: the hole horizontal or the longitudinal separation setting of described evaporation cavity is vertical post hole or horizontal columns hole; Connected chamber and each hole are conducted, and form the closed-loop path.
8, according to each described evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink in the claim 1-7, it is characterized in that: the opposite face of the binding face of fitting in described evaporation box and evaporation box and semiconductor electronic refrigerator hot junction is provided with fin.
9, according to each described evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink in the claim 4-7, it is characterized in that: laterally or a kind of in circular, oval, Long Circle or the polygon of the radial section in the hole that is provided with of longitudinal separation.
10, according to each described evaporation box that is used for the semiconductor electronic refrigerator hot end heat sink in the claim 4-7, it is characterized in that: the end coplane of the hole correspondence that described longitudinal separation is provided with, described connected chamber is the flat column cavity that is positioned at the both ends, hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100125332A CN100498125C (en) | 2005-05-26 | 2005-05-26 | Evaporation box of hot end heat sink for semiconductor electronic refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100125332A CN100498125C (en) | 2005-05-26 | 2005-05-26 | Evaporation box of hot end heat sink for semiconductor electronic refrigerator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1727811A CN1727811A (en) | 2006-02-01 |
| CN100498125C true CN100498125C (en) | 2009-06-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100125332A Expired - Fee Related CN100498125C (en) | 2005-05-26 | 2005-05-26 | Evaporation box of hot end heat sink for semiconductor electronic refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100498125C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100463092C (en) * | 2006-11-14 | 2009-02-18 | 西安交通大学 | High voltage vacuum circuit breaker with high rated current |
| CN101881567B (en) * | 2010-07-01 | 2013-03-20 | 郭琛 | Cylindrical evaporation chamber specially used for semiconductor electronic freezing device and manufacture method thereof |
| CN105135388A (en) * | 2015-10-13 | 2015-12-09 | 刘真 | Evaporation box of heat tube device for LED (light-emitting diode) lighting fixture heat dissipation |
| EP3510849B1 (en) * | 2017-02-03 | 2023-08-30 | Hewlett-Packard Development Company, L.P. | Thermal control with vapor and isolation chambers |
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2005
- 2005-05-26 CN CNB2005100125332A patent/CN100498125C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1727811A (en) | 2006-02-01 |
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Owner name: LUQUAN JIWEI ELECTRICAL CO., LTD. Free format text: FORMER OWNER: WANG SHUANGLING Effective date: 20090918 |
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Effective date of registration: 20090918 Address after: No. 1, Xiangyang South Avenue, Hebei, Luquan Patentee after: Luquan Jiwei Electric Appliance Co., Ltd. Address before: 1, unit 5, building 18, No. 501 van West Road, Hebei, Shijiazhuang Patentee before: Wang Shuangling |
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