CN103474404A - Loop parallel type heat pipe radiator - Google Patents

Loop parallel type heat pipe radiator Download PDF

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Publication number
CN103474404A
CN103474404A CN2013104535699A CN201310453569A CN103474404A CN 103474404 A CN103474404 A CN 103474404A CN 2013104535699 A CN2013104535699 A CN 2013104535699A CN 201310453569 A CN201310453569 A CN 201310453569A CN 103474404 A CN103474404 A CN 103474404A
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China
Prior art keywords
radiator
heat
loop parallel
power device
evaporator
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Pending
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CN2013104535699A
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Chinese (zh)
Inventor
张馨元
李晓楠
李奕伯
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Individual
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Individual
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Priority to CN2013104535699A priority Critical patent/CN103474404A/en
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Abstract

The invention belongs to the technical field of power electronic power device heat dissipation, and particularly relates to a loop parallel type heat pipe radiator. The loop parallel type heat pipe radiator comprises a radiator body and a power device installation base plate and is characterized in that a set of tubular annular cavities are formed in the radiator body, a set of end covers which are arranged at the upper portions of the tubular annular cavities respectively are arranged in the radiator body, and each tubular annular cavity comprises an evaporator, a condenser, a steam passageway, a condensing medium backflow passageway, a liquid accumulator and a capillary liquid suction core arranged in each evaporator. A loop parallel type heat pipe is directly formed in each tubular annular cavity, the characteristic that heat can be efficiently transmitted through a two-phase fluid return circuit which is exclusively arranged in the loop parallel type heat pipes is fully used, therefore, the heat transmission performance of the radiator is effectively improved, the contact thermal resistance between the heat pipes and a profile and the contact thermal resistance between cooling fins and the base plate are completely avoided, the heat dissipation efficiency is obviously improved, the generality is very strong, and the radiator is flexible in application, simple in process and low in cost.

Description

The loop parallel heat-pipe radiator
Technical field
The invention belongs to power electronic power device heat dissipation technology field, especially relate to a kind of loop parallel heat-pipe radiator.
Background technology
Adopt heat-pipe radiator to be dispelled the heat and become trend power electronic power device.And at present most heat-pipe radiator is all that heat pipe and solid profile radiator are assembled into to one (as CN201010512127.3) by interference expanded joint, soldering or the mode such as be threaded, also has the moulding (as CN203103278U) of directly holing on radiator body.These modes all inevitably produce the contact heat resistance between heat pipe and solid profile, directly affected heat transfer efficiency, and being seen Aluminum Hollow profile heat pipe radiator all adopts single siphon heat pipe structure, and the gas-liquid mixed flow state presented during the work of single siphon heat pipe, because making the backflow of condensed fluid, the resistance that is subject to boil-off gas becomes very slow, so in order to improve the back-flow velocity of condensed fluid, have to adopt and install capillary wick additional in heat pipe chamber, rely on the suction of capillary wick and the backflow that the natural gravity guiding promotes condensed fluid.Owing in the heat pipe cavity, having installed capillary wick additional, make the steam channel of single siphon heat pipe become narrow and small, hindered again the heat-transfer capability of this heat pipe, especially single siphon heat pipe is 0 0near angle, be difficult to use, its heat-transfer capability is by sharp-decay.At present the finding heat-pipe radiator is all that its application limitation is larger for the designed manufacture of power device of a certain type, will certainly cause that radiator body is of a great variety, technique is loaded down with trivial details, cost up.
Summary of the invention
The purpose of this invention is to provide a kind of simple in structurely, directly, at the inner heat pipe that forms of radiator body, eliminate unnecessary contact heat resistance, heat-transfer capability is large, and radiating efficiency is high, is easy to processing and manufacturing, the loop parallel heat-pipe radiator that versatility is extremely strong.
 
The objective of the invention is to realize by following technical proposals:
Loop parallel heat-pipe radiator of the present invention, comprise the radiator body of surface with corrugated teeth shape profile of tooth radiating fin, the power device installation base plate that radiator body is connected therewith, it is characterized in that being provided with one group of tubulose annular housing in described radiator body inside, be located at described radiator body top, and lay respectively at one group of end cover on described one group of tubulose annular housing top, described tubulose annular housing comprises evaporator, the condenser that evaporator walks abreast and arranges therewith, the steam channel that connects described evaporator and upper end of condenser, the condensation working medium return flow line and the reservoir that connect described evaporator and condenser lower end, be arranged on the capillary wick in described evaporator, be arranged on the heat-transfer working medium in described condensation working medium return flow line and reservoir, described end cover comprises lid, be arranged on vacuum drawn and liquid injection hole on this lid, be located at the link block in this vacuum drawn and liquid injection hole, described vacuum drawn and liquid injection hole are connected with described steam channel.
The version of described tubulose annular housing is square shape, day font or order font.
Described power device installation base plate is provided with radiator panel and share dovetail groove.
Described power device installation base plate surface is provided with one group of power device.
Described radiator body adopts aluminium, copper or the shaping of high heat conduction engineering plastics extrusion stretching, machining is shaped or hot investment casting is shaped.
Described capillary wick is multi-layer silk screen structure, carbon fiber structural or powder sintered shaped structure.
Advantage of the present invention:
(1) the present invention has banned the mode of routine pre-buried copper heat pipe in substrate or on substrate, directly in the tubulose annular housing, form the loop parallel heat pipe, take full advantage of this efficient heat transfer feature of the peculiar two-phase fluid of loop parallel heat pipe loop, effectively improve its heat transfer property; Due to the generation of having avoided contact heat resistance between heat pipe and section bar, radiating fin and substrate fully, radiating efficiency will improve more than 30% than the attached copper pipe Section Bar Heat Sinks of tradition simultaneously.
(2) the present invention is due to the existence of loop, and the flexible arrangement of heat pipe, can have a plurality of evaporators and condenser, and can be 0 0-90 0rotate and use between arbitrarily angled, overcome single siphon heat-pipe radiator 0 0use the phenomenon of heat transfer deterioration near angle, increased flexibility and the adaptability of its application, enlarged range of application; Under suitable liquid filled ratio, its heat-transfer capability than the large 2-4 of single siphon heat-pipe radiator doubly.
(3) the present invention can be according to the practical application needs, and the conversion combination, both can be used for power device, can be used for again the bipolar power component heat radiation, and versatility is extremely strong, applying flexible.
(4) simple in structure, the simple process of the present invention, be easy to processing and manufacturing, greatly reduces cost.
The accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
The vertical view that Fig. 2 is Fig. 1 of the present invention.
Fig. 3 is that the present invention is applied to power device heat radiation schematic diagram.
Fig. 4 is that the present invention is applied to bipolar power component heat radiation schematic diagram.
Embodiment
Further illustrate the specific embodiment of the present invention below in conjunction with accompanying drawing.
As Fig. 1, 2, shown in 3 and 4, loop parallel heat-pipe radiator of the present invention, comprise the radiator body 1 of surface with corrugated teeth shape profile of tooth radiating fin 6, the power device installation base plate 7 that radiator body 1 is connected therewith, it is characterized in that being provided with one group of tubulose annular housing in described radiator body 1 inside, be located at described radiator body 1 top, and lay respectively at one group of end cover on described one group of tubulose annular housing top, described tubulose annular housing comprises evaporator 2, the condenser 3 that evaporator walks abreast and arranges therewith, the steam channel 4 that connects described evaporator 2 and condenser 3 upper ends, the condensation working medium return flow line and the reservoir 5 that connect described evaporator 2 and condenser 3 lower ends, be arranged on the capillary wick 11 in described evaporator 2, be arranged on the heat-transfer working medium 12 in described condensation working medium return flow line and reservoir 5, described end cover comprises lid 8, be arranged on vacuum drawn and liquid injection hole 9 on this lid 8, be located at the link block 10 in this vacuum drawn and liquid injection hole 9, described vacuum drawn and liquid injection hole 9 are connected with described steam channel 4.Heat-transfer working medium 12 is infused in condensation working medium return flow line and reservoir 5 by vacuum drawn and liquid injection hole 9, after fluid injection and vacuum drawn, with link block 10, seals fully.
The version of described tubulose annular housing is square shape, day font or order font.
Loop parallel heat-pipe radiator of the present invention has been banned the mode of routine pre-buried copper heat pipe in substrate or on substrate, directly in the tubulose annular housing, form the loop parallel heat pipe, take full advantage of this efficient heat transfer feature of the peculiar two-phase fluid of loop parallel heat pipe loop, effectively improve its heat transfer property; Due to the generation of having avoided contact heat resistance between heat pipe and section bar, radiating fin and substrate fully, radiating efficiency will improve more than 30% than the attached copper pipe Section Bar Heat Sinks of tradition simultaneously.Due to the existence of loop, the layout of heat pipe is more flexible, and a plurality of evaporators 2 and condenser 3 can be arranged, and can be 0 0-90 0rotate and use between arbitrarily angled, overcome single siphon heat-pipe radiator 0 0use the phenomenon of heat transfer deterioration near angle, increased flexibility and the adaptability of its application, enlarged range of application; Under suitable liquid filled ratio, its heat-transfer capability than the large 2-4 of single siphon heat-pipe radiator doubly.
Described radiator body 1 adopts aluminium, copper or the shaping of high heat conduction engineering plastics extrusion stretching, machining is shaped or hot investment casting is shaped.
Described capillary wick 11 is multi-layer silk screen structure, carbon fiber structural or powder sintered shaped structure.
Described power device installation base plate 7 is provided with radiator panel and share dovetail groove 14.
Described power device installation base plate 7 surfaces are provided with one group of power device 15.During with a radiator body 1, installation power device 15 on the power device installation base plate 7 of radiator, can be used as power device radiator (as shown in Figure 3).During with two radiator bodies, can be aided with supporting clamping device 13 clamps two power device installation base plates 7 in opposite directions, bipolar power component 16 is clipped between two power device installation base plates 7, can be used as bipolar power component radiator (as shown in Figure 4).The present invention is directly at the inner heat pipe that forms of radiator body 1, eliminate unnecessary contact heat resistance, and can be according to the practical application needs, while dispelling the heat for power device, be located at radiator panel on power device installation base plate 7 and share dovetail groove 14 and can be used as many assembled bindiny mechanisms of radiator and use; During for the bipolar power component heat radiation, radiator panel share dovetail groove 14 and can be used as again the busbar bindiny mechanism use of confluxing, and versatility is extremely strong, and applying flexible, simple process, and cost is low.

Claims (6)

1. a loop parallel heat-pipe radiator, comprise the radiator body of surface with corrugated teeth shape profile of tooth radiating fin, the power device installation base plate that radiator body is connected therewith, it is characterized in that being provided with one group of tubulose annular housing in described radiator body inside, be located at described radiator body top, and lay respectively at one group of end cover on described one group of tubulose annular housing top, described tubulose annular housing comprises evaporator, the condenser that evaporator walks abreast and arranges therewith, the steam channel that connects described evaporator and upper end of condenser, the condensation working medium return flow line and the reservoir that connect described evaporator and condenser lower end, be arranged on the capillary wick in described evaporator, be arranged on the heat-transfer working medium in described condensation working medium return flow line and reservoir, described end cover comprises lid, be arranged on vacuum drawn and liquid injection hole on this lid, be located at the link block in this vacuum drawn and liquid injection hole, described vacuum drawn and liquid injection hole are connected with described steam channel.
2. loop parallel heat-pipe radiator according to claim 1, the version that it is characterized in that described tubulose annular housing is square shape, day font or order font.
3. loop parallel heat-pipe radiator according to claim 1, is characterized in that described power device installation base plate is provided with radiator panel and share dovetail groove.
4. loop parallel heat-pipe radiator according to claim 1, is characterized in that described power device installation base plate surface is provided with one group of power device.
5. loop parallel heat-pipe radiator according to claim 1, is characterized in that described radiator body adopts aluminium, copper or the shaping of high heat conduction engineering plastics extrusion stretching, machining is shaped or hot investment casting is shaped.
6. loop parallel heat-pipe radiator according to claim 1, is characterized in that described capillary wick is multi-layer silk screen structure, carbon fiber structural or powder sintered shaped structure.
CN2013104535699A 2013-09-29 2013-09-29 Loop parallel type heat pipe radiator Pending CN103474404A (en)

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Application Number Priority Date Filing Date Title
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017128812A1 (en) * 2016-01-30 2017-08-03 边疆 Integrated heat radiator and heat dissipation method
CN108323099A (en) * 2018-01-16 2018-07-24 南昌大学 Finned heat pipe coupling radiator
CN108511092A (en) * 2018-06-14 2018-09-07 华南理工大学 A kind of integral structure that nuclear fuel element is nested with circuit parallel type cooling heat pipe
CN109245556A (en) * 2018-08-31 2019-01-18 西安中车永电电气有限公司 A kind of diesel locomotive high-power loop circuit heat pipe power module and its mirror-image structure
CN110932571A (en) * 2019-12-03 2020-03-27 西安中车永电电气有限公司 Novel inversion power unit and power circuit thereof
CN112018059A (en) * 2019-05-31 2020-12-01 华为技术有限公司 Heat dissipation device and electrical equipment

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2906660Y (en) * 2006-06-09 2007-05-30 李冬庆 Loop parallel thermo-tube astronomical telescope focal surface heat radiator
CN200941023Y (en) * 2006-06-09 2007-08-29 李冬庆 Loop parallel heat pipe and heat exchanger thereof
CN101105377A (en) * 2007-07-27 2008-01-16 株洲南车时代电气股份有限公司 Large power plate integral type phase change heat-radiation method and heat radiator
JP2008281275A (en) * 2007-05-10 2008-11-20 Toshiba Corp Loop heat pipe, cooling apparatus, electronic equipment
CN202749364U (en) * 2012-09-10 2013-02-20 鞍山欧博达热管设备制造有限公司 Annular heat pipe section material superconducting radiator
CN202750396U (en) * 2012-09-10 2013-02-20 张馨元 Annular heat pipe radiator used on power device
CN203456441U (en) * 2013-09-29 2014-02-26 张馨元 Parallel loop heat pipe radiator

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2906660Y (en) * 2006-06-09 2007-05-30 李冬庆 Loop parallel thermo-tube astronomical telescope focal surface heat radiator
CN200941023Y (en) * 2006-06-09 2007-08-29 李冬庆 Loop parallel heat pipe and heat exchanger thereof
JP2008281275A (en) * 2007-05-10 2008-11-20 Toshiba Corp Loop heat pipe, cooling apparatus, electronic equipment
CN101105377A (en) * 2007-07-27 2008-01-16 株洲南车时代电气股份有限公司 Large power plate integral type phase change heat-radiation method and heat radiator
CN202749364U (en) * 2012-09-10 2013-02-20 鞍山欧博达热管设备制造有限公司 Annular heat pipe section material superconducting radiator
CN202750396U (en) * 2012-09-10 2013-02-20 张馨元 Annular heat pipe radiator used on power device
CN203456441U (en) * 2013-09-29 2014-02-26 张馨元 Parallel loop heat pipe radiator

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017128812A1 (en) * 2016-01-30 2017-08-03 边疆 Integrated heat radiator and heat dissipation method
CN108323099A (en) * 2018-01-16 2018-07-24 南昌大学 Finned heat pipe coupling radiator
CN108323099B (en) * 2018-01-16 2024-03-29 南昌大学 Fin type heat pipe coupling radiator
CN108511092A (en) * 2018-06-14 2018-09-07 华南理工大学 A kind of integral structure that nuclear fuel element is nested with circuit parallel type cooling heat pipe
CN109245556A (en) * 2018-08-31 2019-01-18 西安中车永电电气有限公司 A kind of diesel locomotive high-power loop circuit heat pipe power module and its mirror-image structure
CN109245556B (en) * 2018-08-31 2024-03-26 西安中车永电电气有限公司 High-power loop heat pipe power module for internal combustion locomotive and mirror image structure thereof
CN112018059A (en) * 2019-05-31 2020-12-01 华为技术有限公司 Heat dissipation device and electrical equipment
CN112018059B (en) * 2019-05-31 2022-10-04 华为技术有限公司 Heat dissipation device and electrical equipment
CN110932571A (en) * 2019-12-03 2020-03-27 西安中车永电电气有限公司 Novel inversion power unit and power circuit thereof

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Application publication date: 20131225