CN104834366A - CPU (central processing unit) integrated heating pipe radiator structure - Google Patents
CPU (central processing unit) integrated heating pipe radiator structure Download PDFInfo
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- CN104834366A CN104834366A CN201510218194.7A CN201510218194A CN104834366A CN 104834366 A CN104834366 A CN 104834366A CN 201510218194 A CN201510218194 A CN 201510218194A CN 104834366 A CN104834366 A CN 104834366A
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- heat pipe
- heating pipe
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- flat board
- radiator structure
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Abstract
The invention belongs to the technical field of computer radiation and particularly relates to a CPU (central processing unit) integrated heating pipe radiator structure. A rectangular cross-section condensation heating pipe is arranged above a flat plate evaporation heating pipe; the downside of the flat plate evaporation heating pipe is in direct contact with a heat source; fiber liquid absorbing core structures which are laminated are arranged in the flat plate evaporation heating pipe; a through hole supporting frame is arranged in the rectangular cross-section condensation heating pipe; radiating fins are arranged outside the rectangular cross-section condensation heating pipe and combine the flat plate evaporation heating pipe and the rectangular cross-section condensation heating pipe into a whole and communicate the flat plate evaporation heating pipe with the rectangular cross-section condensation heating pipe to form an inner passage type structure; the fiber liquid absorbing core structures are formed by arranging three cylindrical metal wires of which the circles are tangential to one another; a flowing passage is arranged between every two metal wires. The CPU integrated heating pipe radiator structure has the beneficial effects that due to the fact that the flat plate evaporation heating pipe is in direct contact with the heat source, the contact heat resistance is reduced, and the heat transfer power is high; a larger condensation area is obtained on the basis that steam is enabled to fully flow by the rectangular cross-section condensation heating pipe, and the heat transfer performance is high.
Description
Technical field
The invention belongs to computer heat radiation technical field, particularly relate to a kind of CPU integrated heat pipe radiator structure.
Background technology
Along with improving constantly of PC CPU integrated level and performance, the power consumption of CPU is increasing, and CPU surface heat flux sharply increases, and reduces performance and the life-span of chip, have impact on the reliability of system cloud gray model.Very high request be it is also proposed to CPU cooling means simultaneously, make cooling means there occurs many changes.The method of tradition cooling CPU adopts aluminium extrusion heating radiator usually, and this heating radiator shows superiority at unit cost, weight and aspect of performance.But along with computing machine develops towards compactedness, the cooling performance of heating radiator is restricted, and aluminum current extruded heat sinks is tending towards heat transport limitation.Therefore, the heat pipe with the title of superconduction receives the attention of electrical cooling field application, current conventional heat pipe heating radiator is embedded by one or more circular heat pipe on the bottom heat radiation copper billet that contacts with CPU, heat is delivered to the colling end of heat radiator covering by heat pipe, shed by heat, but the backflow efficiency of heat pipe is not high by heat radiator, cost is high, and the surface of contact of heat pipe and thermal source is not high, radiating efficiency is limited, is further improved.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, the object of this invention is to provide a kind of CPU integrated heat pipe radiator structure, flat board evaporation heat pipe directly fully contacts with thermal source, reduce thermal contact resistance, heat power is high, the heat pipe of square-section ensures the basis that steam fully flows obtains larger condensation area, good heat-transfer.
To achieve these goals, the present invention adopts following technical scheme:
A kind of CPU integrated heat pipe radiator structure, it is characterized in that comprising flat board evaporation heat pipe, square-section condensation heat pipe, the top of described flat board evaporation heat pipe is provided with described square-section condensation heat pipe, the below of described flat board evaporation heat pipe directly contacts with thermal source, the fiber liquid sucting core structure of layered arrangement is provided with in described flat board evaporation heat pipe, described square-section inside heat pipe is provided with through hole bracing frame, heat pipe outside, described square-section is provided with radiating fin, described radiating fin is by described flat board evaporation heat pipe, described square-section heat pipe is integrated, and by described flat board evaporation heat pipe, described square-section heat pipe is communicated with formation internal passage type structure, described fiber liquid sucting core structure is arranged by the cylindrical metal silk that three circles are tangent and is formed, runner is formed between described tinsel and described tinsel.
Described fiber liquid sucting core structure comprise connect successively evaporator section, adiabatic section, condensation segment.
Described fiber liquid sucting core structure comprises shell and lower shell, is welded between described upper shell and described lower shell by welded bands.
Described upper shell is provided with dividing plate, and described lower shell is rectangular channel body structure.
The length of described fiber liquid sucting core structure is less than the length of described lower shell.
Described runner is sharp-pointed class triangle runner.
The invention has the beneficial effects as follows: flat board evaporation heat pipe directly fully contacts with thermal source, reduce thermal contact resistance, and the hot-fluid produced is two-dimentional, raceway groove is multilayer arrangement, and raceway groove quantity in unit area is increased greatly, not by the restriction of existing working ability, in addition sharp-pointed class triangle runner is easy to liquid and forms larger capillary force at sharp corner, thus improve the backflow efficiency of liquid working substance, reduce the possibility that capillary limitation occurs, there is higher heat power; Condensation heat pipe working cavity in square-section, ensureing the basis that steam fully flows obtains larger condensation area, reduces the resistance of flow of external air; Square-section condensation heat pipe peace plate evaporation heat pipe directly communicates, and the heat transfer property of heat pipe can not be reduced; The contact area of radiating fin and radiating surface outside square-section condensation heat pipe is large and contact abundant, improves the heat exchange efficiency of radiating fin, reduces thermal contact resistance; The length of fiber liquid sucting core structure is less than the length of lower shell, making two edges of lower shell reserve space, flowing into for reserving at evaporation ends with liquid at condensation end.The present invention not changing heat pipe apparent volume, do not increase technology difficulty, under the prerequisite that do not improve cost of manufacture, radiating effect meets the cooling requirement of CPU completely, and compared with the heating radiator of initial configuration, volume decreases 20-30%, be applicable to large-scale promotion.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of flat board evaporation heat pipe of the present invention;
Fig. 3 is the vertical view of flat board evaporation heat pipe of the present invention;
Fig. 4 is the sectional view of fiber liquid sucting core structure of the present invention;
Fig. 5 is runner schematic diagram of the present invention.
In figure, 1, flat board evaporation heat pipe, 2, square-section condensation heat pipe, 3, radiating fin, 4, fiber liquid sucting core structure, 5, tinsel, 6, runner, 7, upper shell, 8, lower shell, 9, welded bands.
Embodiment
Below in conjunction with accompanying drawing, a kind of embodiment of the present invention is explained.
As shown in Figure 1, the invention provides a kind of CPU integrated heat pipe radiator structure, it is characterized in that comprising flat board evaporation heat pipe 1, square-section condensation heat pipe 2, the top of described flat board evaporation heat pipe 1 is provided with described square-section condensation heat pipe 2, the below of described flat board evaporation heat pipe 1 directly contacts with thermal source, the fiber liquid sucting core structure 4 of layered arrangement is provided with in described flat board evaporation heat pipe 1, described square-section inside heat pipe is provided with through hole bracing frame, both can augmentation of heat transfer, heat pipe can be prevented again in interior pressure, larger distortion is produced under external pressure or alternating pressure, enhance the intensity of heat pipe.Heat pipe outside, described square-section is provided with radiating fin 3, described flat board evaporation heat pipe 1, described square-section heat pipe are integrated by described radiating fin 3, and described flat board evaporation heat pipe 1, described square-section heat pipe are communicated with formation internal passage type structure, described fiber liquid sucting core structure 4 is arranged by the tangent cylindrical metal silk 5 of three circles and is formed, runner 6 is formed between described tinsel 5 and described tinsel 5, described runner 6 is sharp-pointed class triangle runner 6, and the cross section of runner 6 as shown in Figure 5.
Described fiber liquid sucting core structure 4 comprise connect successively evaporator section, adiabatic section, condensation segment.Described fiber liquid sucting core structure 4 comprises shell 7 and lower shell 8, as shown in Figure 2, welded by welded bands 9 between described upper shell 7 and described lower shell 8, described upper shell 7 is provided with dividing plate, described lower shell 8 is rectangular channel body structure, and the length of described fiber liquid sucting core structure 4 is less than the length of described lower shell 8.
Flat board evaporation heat pipe 1 inside arranges fiber liquid sucting core structure 4 to the capillary force providing working medium to reflux.
Flat board evaporation heat pipe 1 course of work: when heating at the evaporator section of heating radiator, working medium (the pure water of high vacuum conditions is in pipe, or other fluent meterials) being heated is evaporated to rapidly isothermal saturated vapor, steam flows to square-section condensation heat pipe 2 under small pressure differential, release heat at condensation segment gas and condense into liquid, heat is also delivered in the environment of surrounding by radiating fin 3 by the release heat of transformation, and liquid is back to evaporator section by fiber liquid-sucking core.Condensation working medium to be back in steam cavity and repetitive cycling under capillary force effect.
Treat the filling of liquid-sucking core: will can complete the filling of fiber liquid sucting core structure 4 in shell 8 under being placed on neat for ready fiber liquid-sucking core, but because fiber is very thin, quantity is a lot, is difficult to arranging its rule, adopts the mode of liquid self assembly to place it.First fiber liquid-sucking core is placed in lower shell 8, then on fiber, several ethanol liquid are dripped, because liquid and fiber and lower shell 8 have good wetting state, liquid is evenly distributed in rapidly between fiber, finally slightly shake shell, and above fiber, certain pressure is applied to fiber, make liquid be easy to be uniformly distributed about the surface tension due to liquid, thus enable neat being arranged within shell of fiber.After fiber architecture is neat, upper shell 7 is compressed, prepare welding.
The welding of flat board evaporation heat pipe 1 is by upper shell 7 and the sealing of lower shell 8 firm welding, welded bands 9 is had at the preparation process advance reservation of shell, as shown in Figure 3, the first step of welding in welded bands 9, evenly will plate one deck solder before fiber liquid sucting core structure 4 is filled, adopt scolding tin as solder, namely clean in complete welded bands 9 afterwards at upper and lower shell 8 and evenly plate one deck scolding tin.Second step sends in fixture to clamp after upper shell 7 being built compression after liquid-sucking core filling is complete.
Upper and lower shell 8 adopts copper product, and the thermal resistance between thermal source and working medium is reduced as far as possible.Lower shell 8 is rectangle cell bodies, fiber liquid sucting core structure 4 can be laid in cell body closely, the length of fiber liquid sucting core structure 4 is less than the length of described lower shell 8, making two edges of the two ends of fiber and lower shell 8 reserve certain space, flowing at condensation end with liquid for reserving at evaporation ends.
As shown in Figure 4, the liquid-sucking core of flat board evaporation heat pipe 1 is formed by compact arranged fibre structure, defining many cross sections after the arrangement of these fibre compacts is three runners 6 justifying tangent class triangular structure, and the leg-of-mutton wedge angle of class and sharp-pointed, be easy to liquid and form larger capillary force at sharp corner, be convenient to liquid backflow.In addition because fibre structure can multilayer arrange, the backflow raceway groove of liquid also can multilayer be arranged, even if the quantity of raceway groove is not limited to the width of heat pipe.When the structure of flat board evaporation heat pipe 1 makes to make portion gas flow to condensation segment from evaporator section during its work not with liquid generation high speed convection, decrease high speed convection two-phase fluid produce friction force, reduce entrainment limit produce impact.
Above-described embodiment preferred embodiment of the present invention, can not be considered to for limiting practical range of the present invention.All equalizations done according to the present patent application scope change and improve, and all should still belong within patent covering scope of the present invention.
Claims (6)
1. a CPU integrated heat pipe radiator structure, it is characterized in that comprising flat board evaporation heat pipe, square-section condensation heat pipe, the top of described flat board evaporation heat pipe is provided with described square-section condensation heat pipe, the below of described flat board evaporation heat pipe directly contacts with thermal source, the fiber liquid sucting core structure of layered arrangement is provided with in described flat board evaporation heat pipe, described square-section inside heat pipe is provided with through hole bracing frame, heat pipe outside, described square-section is provided with radiating fin, described radiating fin is by described flat board evaporation heat pipe, described square-section heat pipe is integrated, and by described flat board evaporation heat pipe, described square-section heat pipe is communicated with formation internal passage type structure, described fiber liquid sucting core structure is arranged by the cylindrical metal silk that three circles are tangent and is formed, runner is formed between described tinsel and described tinsel.
2. CPU integrated heat pipe radiator structure according to claim 1, it is characterized in that described fiber liquid sucting core structure comprise connect successively evaporator section, adiabatic section, condensation segment.
3. CPU integrated heat pipe radiator structure according to claim 2, be is characterized in that described fiber liquid sucting core structure comprises shell and lower shell, is welded between described upper shell and described lower shell by welded bands.
4. CPU integrated heat pipe radiator structure according to claim 3, it is characterized in that described upper shell is provided with dividing plate, described lower shell is rectangular channel body structure.
5. CPU integrated heat pipe radiator structure according to claim 4, is characterized in that the length of described fiber liquid sucting core structure is less than the length of described lower shell.
6. the CPU integrated heat pipe radiator structure according to any one of claim 1-5, is characterized in that described runner is sharp-pointed class triangle runner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510218194.7A CN104834366A (en) | 2015-04-30 | 2015-04-30 | CPU (central processing unit) integrated heating pipe radiator structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510218194.7A CN104834366A (en) | 2015-04-30 | 2015-04-30 | CPU (central processing unit) integrated heating pipe radiator structure |
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| CN104834366A true CN104834366A (en) | 2015-08-12 |
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| CN201510218194.7A Pending CN104834366A (en) | 2015-04-30 | 2015-04-30 | CPU (central processing unit) integrated heating pipe radiator structure |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105446444A (en) * | 2016-01-19 | 2016-03-30 | 昆山福硕精密电子有限公司 | Integrated heat pipe cooler for CPU cooling |
| CN106055055A (en) * | 2016-08-09 | 2016-10-26 | 苏州必信空调有限公司 | Computer heat dissipation method |
| CN106767068A (en) * | 2016-11-29 | 2017-05-31 | 上海卫星工程研究所 | A kind of slim vapor chamber |
| CN109425247A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | A kind of radiator, outdoor unit and air conditioner |
| CN109799893A (en) * | 2019-04-02 | 2019-05-24 | 济南大学 | A kind of combination heat pipe cpu heat |
| CN112188817A (en) * | 2020-11-02 | 2021-01-05 | 田国涛 | Wick array structure flat heat pipe and server based on wick array structure flat heat pipe |
-
2015
- 2015-04-30 CN CN201510218194.7A patent/CN104834366A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105446444A (en) * | 2016-01-19 | 2016-03-30 | 昆山福硕精密电子有限公司 | Integrated heat pipe cooler for CPU cooling |
| CN106055055A (en) * | 2016-08-09 | 2016-10-26 | 苏州必信空调有限公司 | Computer heat dissipation method |
| CN106767068A (en) * | 2016-11-29 | 2017-05-31 | 上海卫星工程研究所 | A kind of slim vapor chamber |
| CN109425247A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | A kind of radiator, outdoor unit and air conditioner |
| CN109799893A (en) * | 2019-04-02 | 2019-05-24 | 济南大学 | A kind of combination heat pipe cpu heat |
| CN109799893B (en) * | 2019-04-02 | 2024-01-30 | 济南大学 | Combined heat pipe CPU radiator |
| CN112188817A (en) * | 2020-11-02 | 2021-01-05 | 田国涛 | Wick array structure flat heat pipe and server based on wick array structure flat heat pipe |
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Application publication date: 20150812 |