CN106055055A - Computer heat dissipation method - Google Patents

Computer heat dissipation method Download PDF

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Publication number
CN106055055A
CN106055055A CN201610644267.3A CN201610644267A CN106055055A CN 106055055 A CN106055055 A CN 106055055A CN 201610644267 A CN201610644267 A CN 201610644267A CN 106055055 A CN106055055 A CN 106055055A
Authority
CN
China
Prior art keywords
radiating
heat
heat dissipation
computer
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610644267.3A
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Chinese (zh)
Inventor
魏辉
査晓冬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU BSE AIR CONDITIONER CO Ltd
Original Assignee
SUZHOU BSE AIR CONDITIONER CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU BSE AIR CONDITIONER CO Ltd filed Critical SUZHOU BSE AIR CONDITIONER CO Ltd
Priority to CN201610644267.3A priority Critical patent/CN106055055A/en
Publication of CN106055055A publication Critical patent/CN106055055A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The invention discloses a computer heat dissipation method. The computer heat dissipation method comprises the following steps that a refrigerating medium is added into a heat dissipation pipe; one end of the heat dissipation pipe absorbs heat dissipated at a heat source position of a computer and transmits the heat to the refrigerating medium; the refrigerating medium absorbs heat and evaporates to move upwards, and heat is dissipated through heat dissipation wires on the outer pipe wall of the heat dissipation pipe; the refrigerating medium rises to the end, making contact with the outside, of the heat dissipation pipe, the refrigerating medium releases heat and liquefies, and the refrigerating medium flows back to the end, making contact with a heat source of the computer, of the heat dissipation pipe again. According to the computer heat dissipation method, by means of the heat dissipation pipe loaded with the refrigerating medium, the first heat dissipation wire and the second heat dissipation wire on the outer pipe wall of the heat dissipation pipe, heat exchange between the heat source of the computer and the outside is achieved, the heat at the heat source position of the computer is brought to the outside in time, and a good heat dissipation effect is achieved for the computer; compared with a traditional fan heat dissipation method, the electric energy is greatly saved, noise pollution cannot be produced, and environment-friendly and effective heat dissipation is achieved.

Description

A kind of computer heat radiation method
Technical field
The present invention relates to computer heat radiation technical field, particularly to a kind of computer heat radiation method.
Background technology
Along with the raising of quality of life, computer has become as one of popular indispensable equipment, can produce during computer work Raw substantial amounts of heat, the most general method using fan cooling, by carrying out heat exchange with ambient temperature, but a large amount of producing During heat, the efficiency of fan cannot meet actual demand, and, the operation of fan can produce serious noise pollution, and consumes How substantial amounts of electric energy, design one not only environmental protection but also effective heat dissipating method is one of this field urgent problem.
Summary of the invention
In order to solve the problems referred to above, the invention provides a kind of computer heat radiation method.
According to an aspect of the invention, it is provided a kind of computer heat radiation method, comprise the following steps:
Refrigerant is added in radiating tube;
Radiating tube one end absorbs the heat distributed at computer thermal source, and transfers heat to refrigerant;
Refrigerant heat absorption evaporation, is moved upward, and is distributed by heat by the radiating wire of radiating tube outer tube wall;
Refrigerant rises to one end of radiating tube and extraneous contact, and heat release is liquefied, and refrigerant flows back to radiating tube again The one end contacted with computer thermal source;
Radiating wire includes the first radiating wire and the second radiating wire, and the first radiating wire is axially welded in radiating tube along radiating tube Outer tube wall, and the first radiating wire interlocks superposition, the first radiating wire is also opened along the circumferential array of radiating tube, and the second radiating wire is along heat radiation The circumference of pipe is welded as a whole with the first radiating wire.
It provides the benefit that: the computer heat radiation method of this invention is by the heat absorption evaporation of refrigerant, the thing of heat release liquefaction Reason characteristic, carries out heat exchange by the heat distributed at computer thermal source with extraneous cold air, and in evaporation process, it is possible to pass through Heat is distributed by radiating wire, and the circulation of whole radiation processes is constantly, it is achieved the purpose persistently dispelled the heat.Owing to the first radiating wire is first Tail two ends are all welded on the outer tube wall of radiating tube, and the first radiating wire interlocks superposition, therefore improves the first radiating wire and heat radiation Compactness, fastness and the stability connected between pipe, improves its service life, increases axial the dissipating of radiating tube simultaneously Hot side amasss, the beneficially conduction of heat;First radiating wire is opened along the circumferential array of radiating tube, thus, increases radiating tube circumference Area of dissipation, further increase radiating efficiency, the second radiating wire is welded as one along circumference and first radiating wire of radiating tube Body so that the first radiating wire, the second radiating wire and radiating tube are collectively forming the entirety being stably difficult to deformation, and outside shape Become network structure, increase area of dissipation.It addition, by radiating tube, the first radiating wire and the second heat radiation by the way of welding If wire bond is connected together, it is ensured that the steadiness of connection, and it is greatly saved production cost.The computer heat radiation side of the present invention Method realizes computer by the first radiating wire and second radiating wire of the radiating tube and radiating tube outer tube wall that are mounted with refrigerant Thermal source and extraneous heat exchange, take the heat at computer thermal source to the external world in time, computer play good radiating effect, phase Ratio, in traditional fan cooling method, is greatly saved electric energy, and will not produce sound pollution, it is achieved environmental protection the most effectively dissipates Heat.
In some embodiments, radiating tube, the first radiating wire and the second radiating wire are copper material.
It provides the benefit that: the heat conductivity of copper material is high, and mechanical performance is excellent, extremely durable, therefore enhance radiating tube, Refrigerant in first radiating wire and the heat conductivity of the second radiating wire, beneficially radiating tube and the external world carry out heat exchange, will Heat distributes, and improves radiating efficiency and heat dispersion, and extends radiating tube, the first radiating wire and the second radiating wire Service life, can repeatedly recycle, improve resource utilization.
In some embodiments, radiating tube, the first radiating wire and the second radiating wire are aluminium material.
It provides the benefit that: aluminium material heat conductivility and good heat dispersion performance, is conducive to carrying out refrigerant and the external world Heat exchange, and low cost, thus reduce production cost.
In some embodiments, the quantity of radiating tube is at least one.
It provides the benefit that: radiating tube quantity is adjustable, and user can be increased or decreased according to the heat degree that computer produces The quantity of radiating tube, thus while ensureing radiating effect, also save use cost.
Accompanying drawing explanation
Fig. 1 is the flow chart of the computer heat radiation method of one embodiment of the present invention;
Fig. 2 is the structural representation of the computer heat radiation method of one embodiment of the present invention.
Detailed description of the invention
The present invention is further detailed explanation below in conjunction with the accompanying drawings.
Fig. 1~2 show schematically show the computer heat radiation method according to one embodiment of the present invention.As it can be seen, Comprise the following steps:
Refrigerant is added in radiating tube 1;
Radiating tube 1 one end absorbs the heat distributed at computer thermal source 4, and transfers heat to refrigerant;
Refrigerant heat absorption evaporation, is moved upward, and is distributed by heat by the radiating wire of radiating tube 1 outer tube wall;
Refrigerant rises to one end of radiating tube 1 and extraneous contact, and heat release is liquefied, and refrigerant flows back to radiating tube again 1 one end contacted with computer thermal source 4;
Radiating wire includes the first radiating wire 2 and the second radiating wire 3, and the first radiating wire 2 is axially welded in heat radiation along radiating tube 1 The outer tube wall of pipe 1, and the first radiating wire 2 interlocks superposition, the first radiating wire 2 is also opened along the circumferential array of radiating tube 1, the second heat radiation Silk 3 is welded as a whole along the circumference of radiating tube 1 with the first radiating wire 2.
The computer heat radiation method of this invention is by the heat absorption evaporation of refrigerant, the physical characteristic of heat release liquefaction, by computer The heat distributed at thermal source 4 carries out heat exchange with extraneous cold air, and in evaporation process, it is possible to by radiating wire by heat Distributing, the circulation of whole radiation processes is constantly, it is achieved the purpose persistently dispelled the heat.Owing to the first radiating wire 2 head and the tail two ends are all welded It is connected on the outer tube wall of radiating tube 1, and the first radiating wire 2 interlocks superposition, therefore improves between the first radiating wire 2 and radiating tube 1 Compactness, fastness and the stability connected, improves its service life, increases the radiating surface that radiating tube 1 is axial simultaneously Long-pending, the beneficially conduction of heat;First radiating wire 2 is opened along the circumferential array of radiating tube 1, thus, increases radiating tube 1 circumference Area of dissipation, further increases radiating efficiency, and the second radiating wire 3 is welded as one along the circumference of radiating tube 1 with the first radiating wire 2 Body so that first radiating wire the 2, second radiating wire 3 and radiating tube 1 are collectively forming the entirety being stably difficult to deformation, and outward Side defines network structure, increases area of dissipation.It addition, by radiating tube the 1, first radiating wire 2 and the by the way of welding If two radiating wires 3 weld together, it is ensured that the steadiness of connection, and it is greatly saved production cost.The electricity of the present invention First radiating wire 2 and the second heat radiation of brain heat dissipating method radiating tube 1 and radiating tube 1 outer tube wall by being mounted with refrigerant Silk 3 realizes computer thermal source 4 and extraneous heat exchange, takes the heat at computer thermal source 4 to the external world in time, plays computer well Radiating effect, compared to traditional fan cooling method, be greatly saved electric energy, and sound pollution will not be produced, it is achieved Environmental protection is the most effectively dispelled the heat.
Radiating tube the 1, first radiating wire 2 and the second radiating wire 3 are copper material.The heat conductivity of copper material is high, and mechanical performance is excellent Different, extremely durable, therefore enhance radiating tube the 1, first radiating wire 2 and the heat conductivity of the second radiating wire 3, beneficially radiating tube Refrigerant in 1 and the external world carry out heat exchange, are distributed by heat, improve radiating efficiency and heat dispersion, and prolong Grow radiating tube the 1, first radiating wire 2 and the service life of the second radiating wire 3, can repeatedly recycle, improve resource utilization.
Radiating tube the 1, first radiating wire 2 and the second radiating wire 3 are aluminium material.Aluminium material heat conductivility and heat dispersion are relatively Good, be conducive to carrying out refrigerant and the external world heat exchange, and low cost, thus reduce production cost.
The quantity of radiating tube 1 is at least one.Radiating tube 1 quantity is adjustable, the heat journey that user can produce according to computer Degree is increased or decreased the quantity of radiating tube, thus while ensureing radiating effect, also saves use cost.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, not On the premise of departing from the invention design, it is also possible to making some deformation and improvement, these broadly fall into the protection model of the present invention Enclose.

Claims (4)

1. a computer heat radiation method, it is characterised in that comprise the following steps:
Refrigerant is added in radiating tube (1);
Described radiating tube (1) one end absorbs the heat that computer thermal source (4) place distributes, and transfers heat to described refrigerant;
The heat absorption evaporation of described refrigerant, is moved upward, and is distributed by heat by the radiating wire of described radiating tube (1) outer tube wall Go out;
Described refrigerant rises to one end of described radiating tube (1) and extraneous contact, and heat release is liquefied, and described refrigerant is again Flow back to one end that described radiating tube (1) contacts with computer thermal source (4);
Described radiating wire includes the first radiating wire (2) and the second radiating wire (3), and described first radiating wire (2) is along radiating tube (1) axle To being welded in the outer tube wall of radiating tube (1), and the staggered superposition of described first radiating wire (2), the first radiating wire (2) is also along radiating tube (1) circumferential array is opened, and described second radiating wire (3) is welded as one along the circumference of radiating tube (1) with described first radiating wire (2) Body.
Computer heat radiation method the most according to claim 1, it is characterised in that described radiating tube (1), the first radiating wire (2) It is copper material with the second radiating wire (3).
Computer heat radiation method the most according to claim 1, it is characterised in that described radiating tube (1), the first radiating wire (2) It is aluminium material with the second radiating wire (3).
Computer heat radiation method the most according to claim 1, it is characterised in that the quantity of described radiating tube (1) is at least one Individual.
CN201610644267.3A 2016-08-09 2016-08-09 Computer heat dissipation method Pending CN106055055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610644267.3A CN106055055A (en) 2016-08-09 2016-08-09 Computer heat dissipation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610644267.3A CN106055055A (en) 2016-08-09 2016-08-09 Computer heat dissipation method

Publications (1)

Publication Number Publication Date
CN106055055A true CN106055055A (en) 2016-10-26

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Country Status (1)

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CN (1) CN106055055A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109759807A (en) * 2019-03-21 2019-05-17 熊宇 A kind of processing technology of electronic device radiator

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130720A (en) * 1981-02-09 1982-08-13 Mitsubishi Heavy Ind Ltd Manufacture of acicular fin heat exchanger
JPH07305981A (en) * 1994-05-11 1995-11-21 Nippondenso Co Ltd Heat exchanger
CN1713375A (en) * 2004-06-21 2005-12-28 鸿富锦精密工业(深圳)有限公司 Radiator and its production
JP2007147233A (en) * 2005-11-30 2007-06-14 Usui Kokusai Sangyo Kaisha Ltd Fin tube
CN201199139Y (en) * 2008-03-12 2009-02-25 江苏萃隆精密铜管股份有限公司 Reinforced heat transfer pipe
CN202153112U (en) * 2011-06-13 2012-02-29 苏州新太铜高效管有限公司 Falling film evaporating heat exchange tube with fins formed by wire mesh
CN103217047A (en) * 2013-03-26 2013-07-24 佛山神威热交换器有限公司 Three-dimensional taper finned tube
JP2014138060A (en) * 2013-01-16 2014-07-28 Nec Corp Cooling device
CN104075606A (en) * 2014-06-25 2014-10-01 上海理工大学 Twisted tooth fin oblate heat exchange tube
CN104834366A (en) * 2015-04-30 2015-08-12 天津徊达科技有限公司 CPU (central processing unit) integrated heating pipe radiator structure
CN204730525U (en) * 2015-06-02 2015-10-28 浙江同星制冷有限公司 A kind of refrigerator and heat exchanger of air conditioner adopting aluminium faller gill heat exchanger tube

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130720A (en) * 1981-02-09 1982-08-13 Mitsubishi Heavy Ind Ltd Manufacture of acicular fin heat exchanger
JPH07305981A (en) * 1994-05-11 1995-11-21 Nippondenso Co Ltd Heat exchanger
CN1713375A (en) * 2004-06-21 2005-12-28 鸿富锦精密工业(深圳)有限公司 Radiator and its production
JP2007147233A (en) * 2005-11-30 2007-06-14 Usui Kokusai Sangyo Kaisha Ltd Fin tube
CN201199139Y (en) * 2008-03-12 2009-02-25 江苏萃隆精密铜管股份有限公司 Reinforced heat transfer pipe
CN202153112U (en) * 2011-06-13 2012-02-29 苏州新太铜高效管有限公司 Falling film evaporating heat exchange tube with fins formed by wire mesh
JP2014138060A (en) * 2013-01-16 2014-07-28 Nec Corp Cooling device
CN103217047A (en) * 2013-03-26 2013-07-24 佛山神威热交换器有限公司 Three-dimensional taper finned tube
CN104075606A (en) * 2014-06-25 2014-10-01 上海理工大学 Twisted tooth fin oblate heat exchange tube
CN104834366A (en) * 2015-04-30 2015-08-12 天津徊达科技有限公司 CPU (central processing unit) integrated heating pipe radiator structure
CN204730525U (en) * 2015-06-02 2015-10-28 浙江同星制冷有限公司 A kind of refrigerator and heat exchanger of air conditioner adopting aluminium faller gill heat exchanger tube

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109759807A (en) * 2019-03-21 2019-05-17 熊宇 A kind of processing technology of electronic device radiator

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Application publication date: 20161026

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