CN112188817A - Wick array structure flat heat pipe and server based on wick array structure flat heat pipe - Google Patents
Wick array structure flat heat pipe and server based on wick array structure flat heat pipe Download PDFInfo
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- CN112188817A CN112188817A CN202011205882.7A CN202011205882A CN112188817A CN 112188817 A CN112188817 A CN 112188817A CN 202011205882 A CN202011205882 A CN 202011205882A CN 112188817 A CN112188817 A CN 112188817A
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- heat pipe
- heat
- pipe
- upper cover
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- 238000010438 heat treatment Methods 0.000 claims abstract description 54
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000007779 soft material Substances 0.000 claims abstract description 6
- 238000001704 evaporation Methods 0.000 claims description 32
- 230000008020 evaporation Effects 0.000 claims description 32
- 238000009833 condensation Methods 0.000 claims description 22
- 230000005494 condensation Effects 0.000 claims description 22
- 239000000498 cooling water Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000005484 gravity Effects 0.000 abstract description 8
- 238000004321 preservation Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000005086 pumping Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 210000001503 joint Anatomy 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
Abstract
The invention discloses a wick array structure flat heat pipe and a server based on the wick array structure flat heat pipe, comprising an upper cover, a shell, a wire harness, a screen plate, a vacuumizing and filling pipe, a plug, an upper cover positioning baffle, a shell positioning baffle and a heat transfer working medium, wherein a server body comprises a first circuit board, a first heating component, an L-shaped heat pipe, a second circuit board 75, a second heating component, a Z-shaped heat pipe, a third circuit board, a third heating component, an inverted Z-shaped heat pipe, a main heat pipe, a heat exchange water pipe and an insulating heat preservation soft material; the invention has high heat transfer efficiency and can realize the non-gravity heat transfer from top to bottom.
Description
Technical Field
The invention relates to the technical field of flat heat pipes, in particular to a wick array structure flat heat pipe and a server based on the wick array structure flat heat pipe.
Background
At present, a flat heat pipe used in the existing heat control field is formed by a plurality of cavities in the heat pipe, which is equivalent to a plurality of heat pipes arranged in parallel, and the heat transfer of the flat heat pipe is directional, namely, the flat heat pipe can only transfer heat from bottom to top or horizontally, because the heat transfer working medium filled in the flat heat pipe is under the action of gravity.
Disclosure of Invention
In order to overcome the problem that the traditional flat heat pipe is limited in heat transfer direction due to the action of gravity, the invention provides a novel heat pipe which adopts a wick capillary principle, not only can transfer heat in the horizontal direction, but also can transfer heat in the up-down direction, can transfer heat from bottom to top, and is not influenced by the action of gravity.
Based on the non-gravity heat transfer performance of the flat heat pipe with the wick array structure, the flat heat pipe is applied to heat dissipation of a server, and power-source-free heat dissipation and mute heat dissipation are achieved.
The technical scheme adopted by the invention for realizing the purpose is as follows: the flat heat pipe with the wick array structure comprises an upper cover, a shell, a wire harness, a screen plate, a vacuumizing and filling pipe, a plug, an upper cover positioning baffle, a shell positioning baffle and a heat transfer working medium, wherein a plurality of upper cover positioning baffles are arranged on one side of the upper cover, which faces the shell; a plurality of shell positioning baffles are arranged in the shell, and the distance between the shell positioning baffles is large, so that a groove structure is formed; the shell positioning baffle plates on the shell correspond to the upper cover positioning baffle plates one by one; the groove structure is tightly filled with the wire harnesses which are arranged in parallel; the wire harness is a metal wire which is arranged in parallel and naturally bundled, and gaps among the metal wires form a capillary structure; a screen plate used for fixing the wire harness is placed on the groove, the upper cover is extruded in the shell, and meanwhile, the screen plate is pressed tightly, so that the wire harness is pressed in the groove structure; the seam between the upper cover and the shell is sealed and welded without leakage; the plugs at two ends of the flat heat pipe with the wick array structure are also welded in a sealing way and do not leak, a vacuumizing and filling pipe is also arranged on the plug at one end, and the vacuumizing and filling pipe is also welded with the plugs in a sealing way and does not leak; and after the assembly is completed, the interior of the heat pipe is heated and evacuated through the vacuumizing and filling pipe, the interior is vacuumized and filled with a heat transfer working medium, and finally the tail ends of the vacuumizing and filling pipe are welded in a cold pressing mode.
Preferably, at least one upper cover fin is arranged between the upper cover positioning baffles.
Preferably, the upper cover and the shell are formed by extrusion molding of an aluminum alloy material, and the mesh plate is a copper plate mesh.
Preferably, the seam between the upper cover and the shell is welded by brazing.
A server based on a wick array structure flat heat pipe comprises a server body, wherein the server body comprises a circuit board, a heating element and a heat pipe, and is connected with a cooling water circulation system through a heat exchange water pipe; the two sides of the heating element are respectively provided with the circuit board and the heat pipe, and the heat pipe transmits the heat of the heating element to the heat exchange water pipe and then cools the heating element through the cooling water circulation system.
Preferably, all the heat pipes and the heating components are wrapped by insulation soft materials.
Preferably, the circuit board comprises 3 circuit boards with different arrangement orientations, namely a first circuit board, a second circuit board and a third circuit board; the heating components comprise a first heating component, a second heating component and a third heating component which are respectively arranged on the first circuit board, the second circuit board and the third circuit board; the heat pipe is designed with 4 different shapes according to different arrangement directions of the circuit board, and comprises an L-shaped heat pipe, a Z-shaped heat pipe, an inverted Z-shaped heat pipe and a main heat pipe;
the L-shaped heat pipe is designed into an L shape according to the vertical position of the first heating component, wherein the vertical edge is the wick array structure flat heat pipe and is an evaporation end, and the evaporation end is tightly attached to the first heating component; the horizontal section is only a cavity which is a condensation end and is tightly attached to the evaporation end of the total heat pipe;
the Z-shaped heat pipe is designed into a Z shape according to a second heating component and consists of three sections of wick array structure flat heat pipes, wherein the top horizontal section is an evaporation end and is tightly attached to the second heating component, and the bottom horizontal section is a condensation end and is tightly attached to the evaporation end of the main heat pipe;
the reverse Z-shaped heat pipe is designed into a reverse Z shape according to a third heating component and consists of three sections of wick array structure flat heat pipes, wherein the bottom horizontal section is an evaporation end and is tightly attached to the third heating component, and the top horizontal section is a condensation end and is tightly attached to the evaporation end of the main heat pipe;
the horizontal section of the main heat pipe has the same structure as the flat heat pipe with the wick array structure and is an evaporation end, the vertical section is only a cavity and is a condensation end, and the condensation end is tightly attached to the heat exchange water pipe;
the L-shaped heat pipe, the Z-shaped heat pipe and the reverse Z-shaped heat pipe transmit heat of the first heating component, the second heating component and the third heating component to the main heat pipe, and the main heat pipe transmits the heat to the heat exchange water pipe.
The invention has the advantages of high heat transfer efficiency and capability of realizing non-gravity heat transfer from top to bottom.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a flat heat pipe with a wick array structure.
Fig. 2 is a schematic structural view of the upper cover.
Fig. 3 is a schematic structural view of the housing.
Fig. 4 is a partially enlarged view at I of fig. 1.
FIG. 5 is a schematic view of a structure of a mesh sheet.
Fig. 6 is a side sectional view a-a of fig. 1.
Fig. 7 is a schematic diagram of a server architecture.
Fig. 8 is a schematic structural view of the overall heat pipe 81.
Fig. 9 is a schematic structural view of the L-shaped heat pipe 74.
Fig. 10 is a schematic structural view of the Z-shaped heat pipe 77.
Fig. 11 is a schematic structural view of the inverted Z-shaped heat pipe 80.
FIG. 12 is a schematic diagram of a flat heat pipe with a wick array structure according to a second embodiment.
Fig. 13 is a side sectional view B-B of fig. 12.
Wherein: 1. an upper cover; 11. an upper cover positioning baffle plate; 12. an upper cover fin; 2. a housing; 21. a shell positioning baffle plate; 3. a wire harness; 4. a screen plate; 5. vacuumizing and filling the tube; 6. plugging; 71. a server body; 72. a first circuit board; 73. a first heat generating element; 74. an L-shaped heat pipe; 75. a second circuit board; 76. a second heat generating element; 77. a Z-shaped heat pipe; 78. a third circuit board; 79. a third heating element; 80. a reverse Z-shaped heat pipe; 81. a main heat pipe; 82. a heat exchange water pipe; 83. insulating and heat-preserving soft material.
Detailed Description
The first embodiment is as follows:
as shown in figure 1, the flat heat pipe with the wick array structure consists of an upper cover 1, a shell 2, a wire harness 3, a screen 4, a vacuumizing and filling pipe 5, a plug 6 and a heat transfer working medium.
As shown in fig. 2, the upper cover 1 is formed by extrusion molding of an aluminum alloy material, and has a plurality of upper cover positioning baffles 11 on the side facing the housing.
As shown in fig. 3, the housing 2 is also formed by extrusion molding of an aluminum alloy material, and has a plurality of housing positioning baffles 21 therein, and the spacing between the housing positioning baffles 21 is large to form a groove structure.
As shown in fig. 4, the housing positioning baffles 21 on the housing 2 correspond to the upper cover positioning baffles 11 on the upper cover 1 one to one, and can bear negative pressure during vacuum pumping, so that the upper cover 1 or the housing 2 is not deformed.
A plurality of upper cover fins 12 are arranged between the upper cover positioning baffles 11.
The groove is tightly filled with the wire harness 3. Each of the harnesses 3 is arranged in parallel and cannot be twisted in a twisted shape.
The wire harness 3 is a wire. The metal wires are arranged in parallel and naturally bundled, and a capillary structure is formed by gaps among the metal wires, so that heat transfer media at two ends of the heat pipe can be quickly transferred to the other end, can be transferred from a high position to a low position and can also be transferred from the low position to the high position, and non-gravity heat transfer is realized.
Each trough is filled with wire bundles 3 and a mesh plate 4 is placed over the trough. The net plate 4 is a copper wire net, which can prevent the wiring harness 3 from being scattered, and plays a role in fixing the wiring harness 3.
The upper cover 1 is pressed in the housing 2, and simultaneously the mesh plate 4 is pressed, so that the wire harness 3 is pressed in the groove.
The seam between the upper cover 1 and the shell 2 is sealed by welding and can not leak.
The plugs 6 at the two ends of the heat pipe are welded and cannot be leaked. The vacuum pumping and filling pipe 5 is arranged on the plug 6 at one end and is also welded with the plug 6, so that leakage cannot occur.
And (3) completely assembling, after welding, heating and evacuating the interior of the heat pipe through the vacuumizing and filling pipe 5, vacuumizing the interior, filling a heat transfer working medium, and finally flattening and sealing the tail end of the vacuumizing and filling pipe 5.
The heat pipe can be applied to a heat dissipation scheme of a certain server. According to the internal structure of a certain server body 71, as shown in fig. 7, there are 3 circuit boards, a first circuit board 72, a second circuit board 75 and a third circuit board 78, which are arranged in different directions, and each of the circuit boards has a heat generating component, a first heat generating component 73, a second heat generating component 76 and a third heat generating component 79; 4 heat pipes with different shapes are designed according to the arrangement position of the circuit board, namely an L-shaped heat pipe 74, a Z-shaped heat pipe 77, an inverted Z-shaped heat pipe 80 and a total heat pipe 81; the L-shaped heat pipe 74, the Z-shaped heat pipe 77 and the inverted Z-shaped heat pipe 80 transfer heat of the first heating element 73, the second heating element 76 and the third heating element 79 to the heat pipe 81, and the heat pipe 81 transfers heat to the heat exchange water pipe 82; the heat exchange water pipe 82 is connected with a cooling water circulation system of the machine room, so that heat of a heating point in the server can be directly transmitted to the cooling water circulation system of the machine room, a cooling fan of a server case is omitted, and passive and efficient heat dissipation is realized.
The heat pipe 81 is a heat pipe for transmitting heat of a heating element in the server to the outside of the case, all heat is transmitted to the heat pipe 81 in a concentrated manner, and finally transmitted to the heat exchange water pipe 82 by the heat pipe 81, and the heat exchange water pipe 82 is connected in a cooling water circulation system of the machine room.
The structure of the heat pipe 81 is shown in fig. 8, the horizontal section of the heat pipe is the same as the flat heat pipe with the wick array structure, the vertical section is only a cavity and is a condensation end, the condensation end is tightly attached to the heat exchange water pipe 82, and the horizontal section is an evaporation end.
The L-shaped heat pipe 74 is designed to be L-shaped according to the position of the heat generating component, as shown in fig. 9, wherein the vertical side is the flat heat pipe with the wick array structure, and is an evaporation end, and the evaporation end is tightly attached to the first heat generating component 73 of the first circuit board 72 of the server. The horizontal section is only a cavity and is a condensation end, and the condensation end is tightly attached to the evaporation end of the total heat pipe 81.
The Z-shaped heat pipe 77 is designed to be Z-shaped because the heat generating components are located at a horizontal position and above, and as shown in fig. 10, is composed of three sections of wick array structure flat heat pipes. The top horizontal section is an evaporation end, which is closely attached to the second heating element 76 of the second server circuit board 75, and the bottom horizontal section is a condensation end, which is closely attached to the evaporation end of the total heat pipe 81.
The reverse Z-shaped heat pipe 80 is designed to be in a reverse Z-shape according to the position of the heat generating component at a horizontal position and below, and as shown in fig. 11, is composed of three sections of wick array structure flat heat pipes. The bottom horizontal section is an evaporation end, which is closely attached to the third heating element 79 of the third circuit board 78 of the server, and the top horizontal section is a condensation end, which is closely attached to the evaporation end of the total heat pipe 81.
All heat pipes and heating components are wrapped by the insulation soft material 83 to prevent heat from being dissipated into the server chassis, which causes the chassis to be still hot. The final heat is concentrated on the total heat pipe 81, and the heat is transmitted to the outside of the server chassis by the heat pipe 81 and conducted to the heat exchange water pipe 82. 82 are pipes of the machine room cooling water circulation system, so that the heat of the server body 71 is directly transferred to the outside of the machine room.
Example two:
as shown in figure 12, the wick array structure flat heat pipe is composed of an upper cover 1, a shell 2, a wire harness 3, a screen 4, a vacuumizing and filling pipe 5, a plug 6 and a heat transfer working medium.
As shown in fig. 2, the upper cover 1 is formed by extrusion molding of an aluminum alloy material, and has a plurality of upper cover positioning baffles 11 on the side facing the housing.
As shown in fig. 3, the housing 2 is also formed by extrusion molding of an aluminum alloy material, and has a plurality of housing positioning baffles 21 therein, and the spacing between the housing positioning baffles 21 is large to form a groove structure.
As shown in fig. 4, the housing positioning baffles 21 on the housing 2 correspond to the upper cover positioning baffles 11 on the upper cover 1 one to one, and can bear negative pressure during vacuum pumping, so that the upper cover 1 or the housing 2 is not deformed.
A plurality of upper cover fins 12 are arranged between the upper cover positioning baffles 11.
The wire harness 3 is closely placed inside the groove. Each of the harnesses 3 is arranged in parallel and cannot be twisted in a twisted shape.
The wire harness 3 is a wire. The metal wires are arranged in parallel and naturally bundled, and a capillary structure is formed by gaps among the metal wires, so that heat transfer media at two ends of the heat pipe can be quickly transferred to the other end, can be transferred from a high position to a low position and can also be transferred from the low position to the high position, and non-gravity heat transfer is realized.
Each tank is not filled with a wire harness 3 and a mesh plate 4 is placed in the tank. The net plate 4 is a copper wire net, which can prevent the wiring harness 3 from being scattered, and plays a role in fixing the wiring harness 3.
The upper cover 1 is pressed inside the housing 2.
The mesh plate 4 is pressed into the groove to press the wire harness 3 into the groove.
The seam between the upper cover 1 and the shell 2 is sealed by welding, and can not leak, and the fins which are brazed to facilitate butt joint can also be welded.
The plugs 6 at the two ends of the heat pipe are welded and cannot be leaked. The vacuum pumping and filling pipe 5 is arranged on the plug 6 at one end and is also welded with the plug 6, so that leakage cannot occur.
And (3) completely assembling, after welding, heating and evacuating the interior of the heat pipe through the vacuumizing and filling pipe 5, vacuumizing the interior, filling a heat transfer working medium, and finally flattening and sealing the tail end of the vacuumizing and filling pipe 5.
The heat pipe can be applied to a heat dissipation scheme of a certain server. According to the internal structure of a server body 71, as shown in fig. 7, there are 3 circuit boards with different arrangement orientations, first circuit boards 72, 75, 78, each having a heat generating component 73, 76, 79. The heat pipes 74, 77, 80 and 81 are designed in 4 different shapes according to the arrangement orientation of the circuit board. The heat pipes 74, 77 and 80 transfer heat from the heat generating components 73, 76 and 79 to the heat pipe manifold 81, and the heat pipe manifold 81 transfers heat to the heat exchanging water pipe 82. The heat exchange water pipe 82 is connected to a cooling water circulation system of the machine room. Therefore, heat of heating points in the server can be directly transmitted to a cooling water circulation system of a machine room, a cooling fan of a server case is omitted, and passive and efficient heat dissipation is achieved.
The main heat pipe 81 is a heat pipe for transferring heat of a heating component in the server to the outside of the chassis, and all the heat is intensively transferred to the main heat pipe 81 and finally transferred to the heat exchange water pipe 82 by the main heat pipe 81. 82 are connected in the cooling water circulation system of the machine room.
The structure of the heat pipe 81 is shown in fig. 8, the horizontal section of the heat pipe is the same as the flat heat pipe with the wick array structure, the vertical section is only a cavity and is a condensation end, the condensation end is tightly attached to the heat exchange water pipe 82, and the horizontal section is an evaporation end.
The L-shaped heat pipe 74 is designed to be L-shaped according to the position of the heat generating component, as shown in fig. 9, wherein the vertical side is the flat heat pipe with the wick array structure, and is an evaporation end, and the evaporation end is tightly attached to the first heat generating component 73 of the first circuit board 72 of the server. The horizontal section is only a cavity and is a condensation end, and the condensation end is tightly attached to the evaporation end of the total heat pipe 81.
The Z-shaped heat pipe 77 is designed to be Z-shaped because the heat generating components are located at a horizontal position and above, and as shown in fig. 10, is composed of three sections of wick array structure flat heat pipes. The top horizontal section is an evaporation end, which is closely attached to the second heating element 76 of the second server circuit board 75, and the bottom horizontal section is a condensation end, which is closely attached to the evaporation end of the total heat pipe 81.
The reverse Z-shaped heat pipe 80 is designed to be in a reverse Z-shape according to the position of the heat generating component at a horizontal position and below, and as shown in fig. 11, is composed of three sections of wick array structure flat heat pipes. The bottom horizontal section is an evaporation end, which is closely attached to the third heating element 79 of the third circuit board 78 of the server, and the top horizontal section is a condensation end, which is closely attached to the evaporation end of the total heat pipe 81.
All heat pipes and heating components are wrapped by the insulation soft material 83 to prevent heat from being dissipated into the server chassis, which causes the chassis to be still hot. The final heat is concentrated on the total heat pipe 81, the heat is transmitted to the outside of the server case by the heat pipe 81 and is conducted to the heat exchange water pipe 82, and the heat exchange water pipe 82 is a pipeline of a cooling water circulation system of the machine room, so that the heat of the server body 71 is directly transmitted to the outside of the machine room.
Claims (7)
1. Dull and stereotyped heat pipe of wick array structure, its characterized in that: the heat-conducting wire harness comprises an upper cover (1), a shell (2), a wire harness (3), a screen plate (4), a vacuumizing and filling pipe (5), a plug (6), an upper cover positioning baffle (11), a shell positioning baffle (21) and a heat-conducting working medium, wherein a plurality of upper cover positioning baffles (11) are arranged on one side of the upper cover (1) facing the shell (2); a plurality of shell positioning baffles (21) are arranged in the shell (2), and the distance between the shell positioning baffles (21) is larger to form a groove structure; the shell positioning baffles (21) on the shell (2) correspond to the upper cover positioning baffles (11) one by one; the groove structure is internally and tightly filled with wire harnesses (3) which are arranged in parallel; the wire harness (3) is made of metal wires which are arranged in parallel and naturally bundled, and gaps among the metal wires form a capillary structure; a screen plate (4) used for fixing the wiring harness (3) is placed on the groove, the upper cover (1) is extruded in the shell (2), the screen plate (4) is compressed, and the wiring harness (3) is pressed in the groove structure; the seam between the upper cover (1) and the shell (2) is sealed and welded without leakage; the plugs (6) at the two ends of the flat heat pipe with the wick array structure are also welded in a sealing way and do not leak, the vacuumizing and filling pipe (5) is also arranged on the plug (6) at one end, and the vacuumizing and filling pipe (5) is also welded with the plugs (6) in a sealing way and does not leak; and after the assembly is completed and the welding is finished, the interior of the heat pipe is heated and evacuated through the vacuumizing and filling pipe (5), then the interior is vacuumized and filled with a heat transfer working medium, and finally the tail end of the vacuumizing and filling pipe (5) is welded in a cold pressing mode.
2. The wick array structure flat plate heat pipe of claim 1, wherein: at least one upper cover fin (12) is arranged between the upper cover positioning baffles (11).
3. The wick array structure flat plate heat pipe of claim 1, wherein: the upper cover (1) and the shell (2) are made of aluminum alloy materials through extrusion molding, and the mesh plate (4) is a copper plate mesh.
4. The wick array structure flat plate heat pipe of claim 1, wherein: the joint of the upper cover (1) and the shell (2) is welded by brazing.
5. A server based on the wick array structure flat plate heat pipe of claim 1, comprising a server body (71), characterized in that: the server body (71) comprises a circuit board, a heating element and a heat pipe, and the server body (71) is connected with a cooling water circulation system through a heat exchange water pipe (82); the circuit board and the heat pipe are respectively arranged on two sides of the heating element, the heat pipe transmits the heat of the heating element to the heat exchange water pipe (82), and the cooling water circulation system is used for cooling.
6. The server of claim 5, wherein: all heat pipes and heating components are wrapped by insulation soft materials (83).
7. The server of claim 5, wherein: the circuit boards comprise 3 circuit boards with different arrangement orientations, namely a first circuit board (72), a second circuit board (75) and a third circuit board (78); the heating components comprise a first heating component (73), a second heating component (76) and a third heating component (79), and are respectively arranged on the first circuit board (72), the second circuit board (75) and the third circuit board (78); the heat pipes are different in arrangement direction according to the circuit board, and 4 kinds of heat pipes with different shapes are designed, including an L-shaped heat pipe (74), a Z-shaped heat pipe (77), a reverse Z-shaped heat pipe (80) and a main heat pipe (81);
the L-shaped heat pipe (74) is designed into an L shape according to the vertical position of the first heating component (73), wherein the vertical edge is the wick array structure flat heat pipe and is an evaporation end, and the evaporation end is tightly attached to the first heating component (73); the horizontal section is only a cavity which is a condensation end and is tightly attached to the evaporation end of the total heat pipe (81);
the Z-shaped heat pipe (77) is designed into a Z shape according to the second heating element (76) and consists of three sections of wick array structure flat heat pipes, wherein the top horizontal section is an evaporation end and is tightly attached to the second heating element (76), and the bottom horizontal section is a condensation end and is tightly attached to the evaporation end of the main heat pipe (81);
the reverse Z-shaped heat pipe (80) is designed into a reverse Z shape according to a third heating component (79) and consists of three sections of wick array structure flat heat pipes, wherein the bottom horizontal section is an evaporation end and is tightly attached to the third heating component (79), and the top horizontal section is a condensation end and is tightly attached to the evaporation end of the total heat pipe (81);
the structure of the horizontal section of the main heat pipe (81) is the same as that of the flat heat pipe with the wick array structure, the main heat pipe is an evaporation end, the vertical section is only a cavity and is a condensation end, and the condensation end is tightly attached to the heat exchange water pipe (82);
the L-shaped heat pipe (74), the Z-shaped heat pipe (77) and the reverse Z-shaped heat pipe (80) transmit the heat of the first heating component (73), the second heating component (76) and the third heating component (79) to the main heat pipe (81), and the main heat pipe (81) transmits the heat to the heat exchange water pipe (82).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011205882.7A CN112188817A (en) | 2020-11-02 | 2020-11-02 | Wick array structure flat heat pipe and server based on wick array structure flat heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011205882.7A CN112188817A (en) | 2020-11-02 | 2020-11-02 | Wick array structure flat heat pipe and server based on wick array structure flat heat pipe |
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| Publication Number | Publication Date |
|---|---|
| CN112188817A true CN112188817A (en) | 2021-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011205882.7A Pending CN112188817A (en) | 2020-11-02 | 2020-11-02 | Wick array structure flat heat pipe and server based on wick array structure flat heat pipe |
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|---|---|
| CN (1) | CN112188817A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401588A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Composite microarray flat heat pipe |
| CN102778157A (en) * | 2011-05-12 | 2012-11-14 | 北京芯铠电子散热技术有限责任公司 | Flat plate vapor chamber and manufacturing method thereof |
| CN104834366A (en) * | 2015-04-30 | 2015-08-12 | 天津徊达科技有限公司 | CPU (central processing unit) integrated heating pipe radiator structure |
| CN108848658A (en) * | 2018-08-17 | 2018-11-20 | 中国科学院电工研究所 | A kind of controller inside cooling structure |
| CN214046440U (en) * | 2020-11-02 | 2021-08-24 | 田国涛 | Flat heat pipe with wick array structure |
-
2020
- 2020-11-02 CN CN202011205882.7A patent/CN112188817A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102778157A (en) * | 2011-05-12 | 2012-11-14 | 北京芯铠电子散热技术有限责任公司 | Flat plate vapor chamber and manufacturing method thereof |
| CN102401588A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Composite microarray flat heat pipe |
| CN104834366A (en) * | 2015-04-30 | 2015-08-12 | 天津徊达科技有限公司 | CPU (central processing unit) integrated heating pipe radiator structure |
| CN108848658A (en) * | 2018-08-17 | 2018-11-20 | 中国科学院电工研究所 | A kind of controller inside cooling structure |
| CN214046440U (en) * | 2020-11-02 | 2021-08-24 | 田国涛 | Flat heat pipe with wick array structure |
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