CN101105377A - Large power plate integral type phase change heat-radiation method and heat radiator - Google Patents
Large power plate integral type phase change heat-radiation method and heat radiator Download PDFInfo
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- CN101105377A CN101105377A CNA2007100354523A CN200710035452A CN101105377A CN 101105377 A CN101105377 A CN 101105377A CN A2007100354523 A CNA2007100354523 A CN A2007100354523A CN 200710035452 A CN200710035452 A CN 200710035452A CN 101105377 A CN101105377 A CN 101105377A
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Abstract
The invention relates to a large-power flat integral type phase-change heat dissipation method and a heat radiator utilizing phase-change principle and adopting the method. Capillary wicks are added at the evaporation section in the inner cavity of a flat integral type heat radiator, vertical narrow grooves are uniformly distributed at the heating region where the capillary wick locates, and efficient phase-change heat dissipation is realized through the liquid working medium film formed on the heating surface of the narrow grooves protruding out of the inner cavity. The heat radiator has flat integral type structure, and comprises a heat dissipation body, heat dissipation fins and a copper plate platform, wherein a hollow structure is arranged in the heat dissipation body, the heat dissipation fins are arranged outside the heat dissipation body, capillary wicks capable of improving heat dissipation efficiency are uniformly provided at the evaporation section in the hollow cavity of the heat dissipation body and perpendicular to narrow grooves, the narrow grooves are uniformly distributed at the height at which the corresponding element of the capillary wicks heats in order to assure liquid working medium film is formed on the surface of the inner cavity at this place, and the steam from liquid working medium film by heat absorption and phase change can directly enter the hollow cavity of the heat dissipation body.
Description
Technical field
The present invention relates to a kind of radiator heat-dissipation method and device that utilizes heat conducting and radiating, refer in particular to the radiator heat-dissipation method and the radiator of the heat radiation of a kind of phase transformation (or heat pipe) heat dissipation technology, international Patent classificating number is F28B1/00, because the phase-change heat technology has energy-efficient advantage, the radiator of the type has had uses (as heat-pipe radiator) widely, and technology of the present invention is mainly used in the high power semiconductor component radiator.
Background technology
Use semiconductor element to make switching device in power rectifier (unsteady flow) device, in order to reduce the quantity of single bridge arm unit parallel connection, all trend towards using big element, as the use for electric locomotive fairing by an original brachium pontis with 62 inches IGCT series and parallels, a brachium pontis is till now only used 5 inches IGCTs, and the heating power consumption of single semiconductor element reaches thousands of watts.So, require supporting radiator that higher heat-sinking capability is arranged, and will in limited space, realize heat radiation.Because it is energy-efficient that phase transformation class radiator has, so, in high power semiconductor component heat radiation field increasing application has been arranged.
The general at present phase transformation class radiator that uses is made up of circular heat pipe, radiating fin and substrate (fixedly heater element), and advantage is a technology maturation.Its weak point: because heat pipe is a kind of assembly structure with being connected of fin and substrate, in the very little application scenario of thermal resistance requirement of radiator, the thermal contact resistance influence is bigger, is subjected to the influence of technology also bigger, and radiating efficiency is restricted; In addition, the arrangement by many heat pipes realizes the transmission of big thermal power, and the temperature of substrate can be inhomogeneous, and this temperature difference can increase with power and become greatly, is disadvantageous to the influence of semiconductor element.In order effectively to solve the high power semiconductor component heat dissipation problem, necessary this is studied.
Summary of the invention
The objective of the invention is in order to solve the high power semiconductor component heat dissipation problem, it is better to propose a kind of radiating effect, and has a narrow range of temperature, and can satisfy heat dissipating method and radiator that the locomotive fairing requires with the heat radiation of high power semiconductor component.
The objective of the invention is to be achieved through the following technical solutions: a kind of high power semi-conductor radiator, the principle of application phase-change heat, the radiator that the mode of employing plate integral type phase change heat-radiation is dispelled the heat.And increase capillary wick at the evaporator section of plate integral type lumen of radiator, in the uniform vertical slot that has of the heating region at element place, the liquid refrigerant film that the inner chamber heating surface that exposes by narrow groove forms is realized phase-change heat-exchange efficiently at capillary wick.
The concrete mode of described radiator heat-dissipation is: adopt the vertical plate integral type radiator of placing, increase capillary wick by evaporator section in the lumen of radiator bottom, and capillary wick is in the regional uniform vertical slot of opening at element place, moisture by capillary wick, the inner chamber heating surface that exposes at narrow groove forms the liquid refrigerant film, this layer liquid refrigerant film absorbs heat from heating surface, directly enter the radiator cavity after being phase-changed into gaseous working medium, by lumen of radiator top condensation segment exothermic phase liquefy working medium, flow back to evaporator section from vertical little shape groove of lumen of radiator surface distributed, realize circulating phase-change heat; For the situation of single face pyrotoxin, 3 backflows of lumen of radiator dammed and import the heating face of evaporator section, with heat-transfer path fall cause minimum.By lumen of radiator top condensation segment exothermic phase liquefy working medium, flow back to evaporator section from vertical little shape groove of lumen of radiator surface distributed and realize phase-change heat efficiently.
The high power semi-conductor radiator of developing according to above-mentioned principle, be the plate integral type structure, the vertical placement, comprise heat radiator body, radiating fin and copper coin table top, in the heat radiator body is cavity structure, the outside is a radiating fin, is provided with the capillary wick of the uniform vertical slot that can improve radiating efficiency in the evaporator section of heat radiator body cavity structure, and the vertical little shape groove of whole cavity inner surface distribution plays the backflow effect of liquid refrigerant.The inner chamber lower end of heat radiator body is an evaporator section, and capillary wick is installed on the evaporator section of heat radiator body inner chamber lower end.Capillary wick is a cavity body structure, is formed by the copper powder sintering.Height and position in the heating of capillary wick counter element is evenly equipped with vertical slot, and groove width 0.8～1.5mm can guarantee that surface of internal cavity herein forms the liquid refrigerant film, and the heat absorption of liquid refrigerant film is phase-changed into steam and can directly enters the cavity of heat radiator body.To the heat radiation of single face pyrotoxin, on capillary wick, be provided with the piece that dams, the piece that dams is positioned at the top of capillary wick, and the piece that dams forms the three faces structure of damming in the heat radiator body inner chamber, and the backflow liquid refrigerant is imported unique heating face.
Reinforcement is arranged in the middle of described heat radiator body inner chamber, guarantee the rigidity of copper coin table top.The whole surface distributed of inner chamber has vertical uniform little shape (capillary) groove, plays the backflow effect of liquid refrigerant.The heat radiator body outside is a radiating fin, and the radiating fin surface can increase area of dissipation for curved surface.
At the upper and lower plug that is provided with of heat radiator body, heat radiator body forms closed cavity by upper and lower plug and body welding.Heat radiator body and radiating fin material are aluminium alloy, overall chemical nickel plating, and table top soldering copper coin, heater element just is installed in this table top, realizes copper-copper contact, reduces thermal contact resistance.
The top of heat radiator body inner chamber is condensation segment, and the outside of condensation segment is the radiating fin of one, by fin heat is imported in the air.The copper coin table top is positioned at the bottom of heat radiator body.
The primary structure characteristics are:
With extrusion forming process with dull and stereotyped rectangular inner cavity, comprise the vertical hair fine groove of surface of internal cavity, and outside radiating fin disposal molding, obtain monolithic construction, form element mounting platform and installing hole with machined again.
2. increase the capillary wick of uniform vertical slot at the evaporator section of inner chamber.This radiator is vertical the placement and vertical ventilation, and during owing to startup, the backflow of liquid refrigerant forms as yet, if there is not the imbibition core that liquid refrigerant is distributed to the element heating district, will produce big temperature rise.Capillary wick is in the regional uniform vertical slot of opening at element place, the inner chamber heating surface that narrow groove exposes can form the liquid refrigerant film, although the liquid refrigerant heat conductivility is poor, but this tunic is very thin, the thermal resistance of its formation is also very little, and the heat absorption of liquid refrigerant film is phase-changed into gaseous working medium, directly enter cavity, resistance is little.
3. have only the situation that element heating is simultaneously arranged for radiator, the backflow of liquid refrigerant be assembled the heating face of evaporator section.Top at the lumen of radiator capillary wick increases the piece that dams, and imports unique heating face with refluxing, and reduces heat-transfer path, raises the efficiency.
4. the base material aluminium alloy of radiator, overall chemical nickel plating sealing of hole, the installation table top brazed copper plate that contacts with element guarantees that with contacting of element be copper-copper contact, reduces and the thermal contact resistance of element.
5. radiator two welding plug forms annular seal space, and perforate on one of them plug is finished exhaust and added liquid working medium with drainage is disposable, adopts compound seal.
Description of drawings
Fig. 1 is the structural representation of one embodiment of the invention;
Fig. 2 is the structure side schematic view of one embodiment of the invention;
Fig. 3 is the capillary wick schematic diagram of one embodiment of the invention;
Fig. 4 is the section bar schematic cross-section of one embodiment of the invention;
Fig. 5 is the enlarged diagram of the section bar section A part of one embodiment of the invention;
Fig. 6 is the enlarged diagram of the section bar cross section B part of one embodiment of the invention.
Among the figure: 1, capillary wick, 2, the piece that dams, 3, the copper coin table top, 4, upper plug head, 5, lower end cap, 6, heat radiator body, 7, radiating fin, 8, V-groove, 9, narrow groove.
The specific embodiment
Accompanying drawing has provided one embodiment of the present of invention, is applied to the heat radiation of locomotive rectification high-power components, and the invention will be further described below in conjunction with drawings and Examples.
Embodiment one
A kind of high power semi-conductor radiator, the principle of application phase-change heat adopts the mode of plate integral type phase change heat-radiation to carry out the heat radiation of radiator.And increase capillary wick at the evaporator section of plate integral type lumen of radiator, in the uniform vertical slot that has of the heating region at element place, the liquid refrigerant film that the inner chamber heating surface that exposes by narrow groove forms is realized phase-change heat-exchange efficiently at capillary wick.Because the radiator of present embodiment has only the single face heater element, is provided with the piece that dams on capillary wick top, the piece that dams is packed in capillary wick top, by the piece that dams three faces of inner chamber is dammed, and the liquid refrigerant that refluxes is imported the heating face of inner chamber.
Adopt the vertical plate integral type radiator of placing, increase capillary wick by evaporator section in the lumen of radiator bottom, and capillary wick is in the regional uniform vertical slot of opening at element place, moisture by capillary wick, the inner chamber heating surface that exposes at narrow groove forms the liquid refrigerant film, this layer liquid refrigerant film absorbs heat from heating surface, directly enter the radiator cavity after being phase-changed into gaseous working medium, by lumen of radiator top condensation segment exothermic phase liquefy working medium, flow back to evaporator section from vertical little shape groove of lumen of radiator surface distributed, realize circulating phase-change heat.
Radiator is the plate integral type structure, comprises heat radiator body 6, radiating fin 7 and copper coin table top 3, and heat radiator body 6 is a cavity structure, and reinforcement is arranged in the middle of the cavity, guarantees the rigidity of copper coin table top 3.V-type (capillary) groove 8 that the whole cavity surface distributed is vertical plays the backflow effect of liquid refrigerant.Heat radiator body 6 outsides are radiating fins 7, with heat radiator body 6 be an overall structure, radiating fin 7 surface can increase area of dissipation for curved surface.Heat radiator body 6 forms closed cavity with upper and lower plug 4,5 welding.Heat radiator body 6 tops are condensation segment, by the radiating fin 7 of outside heat are imported in the air.Copper coin table top 3 is positioned at the bottom, and element just is installed in this.In heat radiator body 6 lower ends is evaporator section, and the inner chamber place of evaporator section is equipped with capillary wick 1, and capillary wick 1 is provided with the piece 2 that dams.Capillary wick 1 is a cavity body structure, is formed by the copper powder sintering.Height and position in the heating of capillary wick 1 counter element is evenly equipped with vertical slot 9, and groove width 0.8～1.5mm can guarantee that the surface of internal cavity that exposes at narrow groove place forms moisture film, and the moisture film heat absorption is phase-changed into the cavity that steam directly enters heat radiator body.The piece 2 that dams that is positioned at capillary wick 1 top will dam with three welding of inner chamber, the backflow liquid refrigerant be imported the heating face of evaporator section inner chamber.Beyond copper removal pallet face 3, the capillary wick 1, be aluminium alloy, chemical nickel plating on surface.
Embodiment two
A kind of high power semi-conductor radiator, the principle of application phase-change heat adopts the mode of plate integral type phase change heat-radiation to carry out the heat radiation of radiator.And increase capillary wick at the evaporator section of plate integral type lumen of radiator, in the uniform vertical slot that has of the heating region at element place, the liquid refrigerant film that the inner chamber heating surface that exposes by narrow groove forms is realized phase-change heat-exchange efficiently at capillary wick.Adopt the vertical plate integral type radiator of placing, increase capillary wick by evaporator section in the lumen of radiator bottom, and capillary wick is in the regional uniform vertical slot of opening at element place, moisture by capillary wick, the inner chamber heating surface that exposes at narrow groove forms the liquid refrigerant film, this layer liquid refrigerant film absorbs heat from heating surface, directly enter the radiator cavity after being phase-changed into gaseous working medium, by lumen of radiator top condensation segment exothermic phase liquefy working medium, flow back to evaporator section from vertical little shape groove of lumen of radiator surface distributed, realize circulating phase-change heat.Radiator is the plate integral type structure, and different with embodiment one is that the piece that do not dam on capillary wick is to adapt to the needs of two surface heating elements.
Claims (9)
1. large power plate integral type phase change heat-radiation method, it is characterized in that: the principle of using phase-change heat, the radiator that the mode of employing plate integral type phase change heat-radiation is dispelled the heat, and increase capillary wick at the evaporator section of plate integral type lumen of radiator, in the uniform vertical slot that has of the heating region at element place, the liquid refrigerant film that the inner chamber heating surface that exposes by narrow groove forms is realized phase-change heat-exchange efficiently at capillary wick.
2. large power plate integral type phase change heat-radiation method as claimed in claim 1, it is characterized in that: described phase-change heat-exchange is to adopt the vertical plate integral type radiator of placing, increase capillary wick by evaporator section in the lumen of radiator bottom, and capillary wick is in the regional uniform vertical slot of opening at element place, moisture by capillary wick, the inner chamber heating surface that exposes at narrow groove forms the liquid refrigerant film, this layer liquid refrigerant film absorbs heat from heating surface, directly enter the radiator cavity after being phase-changed into gaseous working medium, by lumen of radiator top condensation segment exothermic phase liquefy working medium, flow back to evaporator section from vertical little shape groove of lumen of radiator surface distributed, realize circulating phase-change heat.
3. large power plate integral type phase change heat-radiation method as claimed in claim 1 or 2, it is characterized in that: described phase-change heat-exchange is: for the situation of single face pyrotoxin, 3 backflows of lumen of radiator are dammed and import the heating face of evaporator section, with heat-transfer path fall cause minimum, by lumen of radiator top condensation segment exothermic phase liquefy working medium, flow back to evaporator section from vertical little shape groove of lumen of radiator surface distributed and realize phase-change heat efficiently.
4. radiator of realizing the described large power plate integral type phase change heat-radiation method of claim 1, comprise heat radiator body, radiating fin and copper coin table top, it is characterized in that: described radiator is the plate integral type structure, heat radiator body is a cavity structure, at the vertical micro-groove of radiator body cavity structure inner surface distribution, return flow line for liquid refrigerant has increased capillary wick at evaporator section.
5. radiator as claimed in claim 4 is characterized in that: the inner chamber lower end of described radiator body is an evaporator section, and the inner chamber upper end is a condensation segment, the vertical placement.
6. radiator as claimed in claim 4 is characterized in that: described capillary wick is a cavity body structure, or the cavity body structure of an opening, is formed by metal powder sintered.
7. radiator as claimed in claim 4 is characterized in that: the height and position in described capillary wick counter element heating is evenly equipped with vertical slot.
8. radiator as claimed in claim 4 is characterized in that: described vertical slot groove width 0.8～1.5mm.
9. radiator as claimed in claim 4 is characterized in that: the radiator to single face heating is provided with the piece that dams on described capillary wick, and the piece that dams forms the three faces structure of damming in the heat radiator body inner chamber, and with backflow working medium importing heating face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100354523A CN100557367C (en) | 2007-07-27 | 2007-07-27 | A kind of large power plate integral type phase change heat-radiation method and radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100354523A CN100557367C (en) | 2007-07-27 | 2007-07-27 | A kind of large power plate integral type phase change heat-radiation method and radiator |
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| Publication Number | Publication Date |
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| CN101105377A true CN101105377A (en) | 2008-01-16 |
| CN100557367C CN100557367C (en) | 2009-11-04 |
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| CNB2007100354523A Expired - Fee Related CN100557367C (en) | 2007-07-27 | 2007-07-27 | A kind of large power plate integral type phase change heat-radiation method and radiator |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474404A (en) * | 2013-09-29 | 2013-12-25 | 张馨元 | Loop parallel type heat pipe radiator |
| CN102065984B (en) * | 2008-05-05 | 2014-09-03 | 康奈尔大学 | High performance wick |
| CN104279887A (en) * | 2014-09-29 | 2015-01-14 | 河北贵鸿能环冷却科技有限公司 | Improved radiator structure |
| CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
| CN107947437A (en) * | 2017-12-14 | 2018-04-20 | 上海电机学院 | A kind of new-energy automobile motor based on phase change radiator structure |
| CN110678044A (en) * | 2019-09-30 | 2020-01-10 | 常州恒创热管理有限公司 | Air-cooled plate type phase change radiator |
| CN113285138A (en) * | 2021-04-16 | 2021-08-20 | 武汉理工大学 | Automobile battery liquid cooling heat dissipation device based on steam cavity heat dissipation technology |
-
2007
- 2007-07-27 CN CNB2007100354523A patent/CN100557367C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102065984B (en) * | 2008-05-05 | 2014-09-03 | 康奈尔大学 | High performance wick |
| CN103474404A (en) * | 2013-09-29 | 2013-12-25 | 张馨元 | Loop parallel type heat pipe radiator |
| CN104279887A (en) * | 2014-09-29 | 2015-01-14 | 河北贵鸿能环冷却科技有限公司 | Improved radiator structure |
| CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
| CN107947437A (en) * | 2017-12-14 | 2018-04-20 | 上海电机学院 | A kind of new-energy automobile motor based on phase change radiator structure |
| CN110678044A (en) * | 2019-09-30 | 2020-01-10 | 常州恒创热管理有限公司 | Air-cooled plate type phase change radiator |
| CN113285138A (en) * | 2021-04-16 | 2021-08-20 | 武汉理工大学 | Automobile battery liquid cooling heat dissipation device based on steam cavity heat dissipation technology |
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| Publication number | Publication date |
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| CN100557367C (en) | 2009-11-04 |
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Granted publication date: 20091104 Termination date: 20200727 |