CN106659090A - Heat pipe conduction heat sink - Google Patents
Heat pipe conduction heat sink Download PDFInfo
- Publication number
- CN106659090A CN106659090A CN201710032678.1A CN201710032678A CN106659090A CN 106659090 A CN106659090 A CN 106659090A CN 201710032678 A CN201710032678 A CN 201710032678A CN 106659090 A CN106659090 A CN 106659090A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- hole
- porous
- groove
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 239000011148 porous material Substances 0.000 claims description 26
- 238000007789 sealing Methods 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat pipe conduction heat sink comprising a porous heat pipe and a heat sink, wherein the porous heat pipe is provided with a plurality of micro channel holes, a groove is formed in the bottom of the heat sink, a plurality through holes are formed in the bottom of the groove, one end of the porous heat pipe is hermetically inserted in the groove, the other end of the porous heat pipe is sealed, one of the ends of the plurality through holes communicates with the plurality of micro channel holes, and the other ends of the plurality through holes are sealed. According to the heat pipe conduction heat sink provided by the invention, the bottom of the heat sink has properties similar to those of the porous heat pipe. Compared with the adhesion mode in the prior art, the heat resistance between the porous heat pipe and the porous heat pipe can be reduced to a relatively low level, so that the heat dissipation efficiency is greatly improved. Under the same heat dissipation efficiency, the area of the heat sink, or the flow of a cold medium can be reduced, which is conducive to reducing the cost and is conducive to realizing the miniaturization of the heat pipe conduction heat sink.
Description
Technical field
The invention belongs to thermal management technology field, more particularly to a kind of heat pipe for conductive heat dissipation device.
Background technology
In fields such as electric automobile, industrial electronic, consumer electronics, machine room, data servers, equipment or device are in work
Substantial amounts of heat can be produced when making, if this heat can not be scattered away in time, can make equipment temperature or environment temperature it is continuous on
Rise, high temperature can badly influence the operation stability of equipment and life-span, it is therefore desirable to carry out various heat managements so that equipment is suitable
It is operated within the temperature range of conjunction.Heat management is comprising heat transfer and radiates, and one of which heat transfer unit (HTU) is porous heat pipe.Porous heat
Pipe is a kind of heat-transfer device, is not a kind of heat abstractor, heat pipe is applied into radiating aspect, it is necessary in the radiating of heat pipe
End is installed by certain heat abstractor.
As shown in figure 1, at present using major way be to realize heat by the way of radiating end is pasted by heat conductive silica gel 1a
There is larger thermal resistance in the combination of pipe 2a and fin 3a (including fin, heat-conducting plate etc.), this kind of mode so that the efficiency of radiating
Substantially reduce, be to improve the flow that radiating efficiency needs to increase the area of fin or increase refrigerant.
The content of the invention
The technical problem to be solved is, for existing heat loss through conduction device, in radiating end heat conductive silica gel to be passed through
The mode of stickup realizes the combination of heat pipe and fin so that the defect that the efficiency of radiating is substantially reduced, there is provided a kind of heat pipe is passed
Lead heat abstractor.
The present invention solve the technical scheme that adopted of above-mentioned technical problem for：
A kind of heat pipe for conductive heat dissipation device, including porous heat pipe and radiator are provided, the porous heat pipe has multiple micro-
Access opening, the bottom of the radiator is provided with groove, and the bottom of the groove is provided with multiple through holes, one end of the porous heat pipe
Sealing is plugged in the groove, and the other end closing of the porous heat pipe, one end of the plurality of through hole is micro- logical with the plurality of
Road hole connects, and the other end of the plurality of through hole is interconnected or closes.
Alternatively, the shape of cross section of the groove is consistent with the shape of cross section of the porous heat pipe, the groove it is transversal
Face is slightly larger in dimension than the cross sectional dimensions of the porous heat pipe.
Alternatively, the radiator is fin, liquid cool-heat-exchanger, cooled plate, copper coin or aluminium sheet.
Alternatively, it is close by welding or gluing mode between porous heat pipe one end periphery and the inwall of the groove
Envelope connection.
Alternatively, the plurality of through hole is provided with sealing hole relative to the side of the groove, seals in the sealing hole and inserts
Connect a sprue.
Alternatively, it is tightly connected by welding or gluing mode between the inwall of the sprue and the sealing hole,
So that the other end of the plurality of through hole to be closed.
Alternatively, it is provided with dentalation on the madial wall of the microchannel pore.
Alternatively, the plurality of microchannel pore is corresponded with the plurality of through hole and connected.
Alternatively, the plurality of microchannel pore connection corresponding with one through hole.
Alternatively, one microchannel pore connection corresponding with the plurality of through hole.
Heat pipe for conductive heat dissipation device of the invention, the bottom of radiator is provided with groove, and trench bottom is provided with multiple logical
Hole, porous heat pipe one end sealing be plugged in groove, one end of multiple through holes connects with multiple microchannel pores, multiple through holes it is another
One end is interconnected or closes.So, the bottom of radiator has the characteristic similar to porous heat pipe.Relative to prior art
Adhesive means, the thermal resistance between radiator and porous heat pipe can be reduced to relatively low level so that the efficiency of radiating is carried significantly
Rise.And under identical radiating efficiency, the area of radiator or the flow of reduction refrigerant can be reduced, be conducive to the drop of cost
It is low, and beneficial to realizing the miniaturization of the heat pipe for conductive heat dissipation device.
Description of the drawings
Fig. 1 is the schematic perspective view of existing heat pipe for conductive heat dissipation device；
Fig. 2 is the schematic diagram of the heat pipe for conductive heat dissipation device that one embodiment of the invention is provided；
Fig. 3 is the exploded view of the heat pipe for conductive heat dissipation device that one embodiment of the invention is provided；
Fig. 4 is the schematic diagram (perspective) of its porous heat pipe of the heat pipe for conductive heat dissipation device of one embodiment of the invention offer；
Fig. 5 is the end view of its porous heat pipe of the heat pipe for conductive heat dissipation device of one embodiment of the invention offer；
Fig. 6 is the enlarged drawing in Fig. 5 at a；
Fig. 7 is the schematic diagram (side perspective) of the heat pipe for conductive heat dissipation device that one embodiment of the invention is provided；
Fig. 8 is the exploded view (side perspective) of the heat pipe for conductive heat dissipation device that one embodiment of the invention is provided；
Fig. 9 is the schematic diagram of its radiator (fin) of the heat pipe for conductive heat dissipation device of one embodiment of the invention offer.
Reference in specification is as follows：
1st, porous heat pipe；11st, microchannel pore；111st, dentalation；
2nd, radiator；21st, groove；22nd, through hole；23rd, sealing hole；
3rd, sprue.
Specific embodiment
In order that technical problem solved by the invention, technical scheme and beneficial effect become more apparent, below in conjunction with
Drawings and Examples, are described in further detail to the present invention.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
As shown in figs. 2-9, the heat pipe for conductive heat dissipation device that one embodiment of the invention is provided, including porous heat pipe 1 and radiating
Device 2, the porous heat pipe 1 has multiple microchannel pores 11, and the bottom of the radiator 2 is provided with groove 21, the bottom of the groove 21
Portion is provided with multiple through holes 22, and one end (radiating end) sealing of the porous heat pipe 1 is plugged in the groove 21, the porous heat
The other end (heat absorbing end) closing of pipe 1, one end of the plurality of through hole 22 connects with the plurality of microchannel pore 11, the plurality of
The other end of through hole 22 is interconnected or closes.
In the present embodiment, the other end (heat absorbing end) of the porous heat pipe 1 is by welding lid cap closure, or flattens weldering
Connect closing.The other end of porous heat pipe 1 can reserve a chamber connected with the other end of multiple through holes 22 after block closing
Room, so that the other end in multiple logical 22 holes is interconnected.Certainly, block can also close the other end in multiple logical 22 holes.
In the present embodiment, the shape of cross section of the groove 21 is consistent with the shape of cross section of the porous heat pipe 1, the groove
21 cross sectional dimensions is slightly larger than the cross sectional dimensions of the porous heat pipe 1, so that porous heat pipe 1 can with gap insert institute
In stating groove 21.One end of porous heat pipe 1 is inserted after the groove 21, in one end periphery of the porous heat pipe 1 and the groove 21
It is tightly connected by welding or gluing mode between wall.
In the present embodiment, as shown in Fig. 5 and Fig. 9, porous heat pipe 1 is that microchannel porous is flat in flat, i.e. porous heat pipe 1
Load a certain amount of cold-producing medium in pipe, porous heat pipe 1 as working media.Cold-producing medium has lower boiling characteristic, to absorb
Can vaporize during the heat of heater element.
In the present embodiment, as shown in Fig. 2 and Fig. 9, the radiator 2 is fin.However, in other embodiments, radiating
Device can also adopt liquid cool-heat-exchanger, cooled plate, copper coin or aluminium sheet etc., and other can distribute the element of heat.
As shown in Fig. 2-3, Fig. 7-8, the plurality of through hole 22 is provided with sealing hole 23, institute relative to the side of the groove 21
State the sealing sprue 3 of grafting one in sealing hole 23.By welding or gluing between the inwall of the sprue 3 and the sealing hole 23
Mode be tightly connected, the other end of the plurality of through hole 22 is closed.
Certainly, the other end of the plurality of through hole 22 also can directly be closed by way of gluing or welding.
As shown in fig. 6, being provided with dentalation 111 on the madial wall of the microchannel pore 11.On the one hand, dentalation
111 contacts area that in the case where the aperture of microchannel pore 11 does not increase, can increase cold-producing medium and microchannel pore 11, enter one
Step lifts heat conduction efficiency.On the other hand, the dentalation 111 of the madial wall of microchannel pore 11 is similar to capillary structure so that
Microchannel pore 11 forms similar pore, is conducive to the cold-producing medium for liquefying to be back to heat absorbing end by radiating end, to form circulation.
In the present embodiment, the single tooth of dentalation 111 is curved, the undulate channel-shaped of whole dentalation 111.
However, in other embodiments, the single tooth of dentalation 111 can also be other shapes, such as triangle, ladder
Shape etc..
Also, in other embodiments, it is also possible to without dentalation 111, i.e., the madial wall light of described microchannel pore 11
It is sliding.
In the present embodiment, the plurality of microchannel pore 11 is corresponded with the plurality of through hole 22 and connected.Corresponding one
Microchannel pore 11 and a through hole 22 are on same straight line, and shape is consistent.
However, in other embodiments, or, the connection corresponding with through hole 22 of the plurality of microchannel pore 11.
For example, two microchannel pores 11 connection corresponding with through hole 22.
Also, in other embodiments, or, one microchannel pore 11 it is corresponding with multiple through holes 22 connection.
For example, a microchannel pore 11 connection corresponding with two through holes 22.
Its operation principle of the heat pipe for conductive heat dissipation device of above-described embodiment is as follows：
The heat absorbing end of porous heat pipe 1 accesses a heater element, and the heat of heater element is conducted to porous heat pipe 1, so that
Refrigerant heats vaporization in the heat absorbing end of porous heat pipe 1, forms gas, absorbs substantial amounts of heat in vaporescence, gas from
Many microchannel pores 11 of heat absorbing end Jing of porous heat pipe 1 enter the radiating end of porous heat pipe 1, and by multiple through holes 22 and radiating
The bottom contact of device 2, gas cooling liquefies and discharges heat.Heat is distributed by radiator 2.Then, the liquid refrigerating after cooling
Agent is back to the heat absorbing end of porous heat pipe 1.The heat of heater element repeatedly, is conducted it by so circulation by porous heat pipe 1
Afterwards, Jing radiators 2 are distributed.
Heat pipe for conductive heat dissipation device according to the above embodiment of the present invention, the bottom of radiator is provided with groove, and trench bottom sets
Multiple through holes are equipped with, one end sealing of porous heat pipe is plugged in groove, and one end of multiple through holes connects with multiple microchannel pores, many
The other end of individual through hole is interconnected or closes.So, the bottom of radiator has the characteristic similar to porous heat pipe.Relative to
The adhesive means of prior art, the thermal resistance between radiator and porous heat pipe can be reduced to relatively low level so that radiating
Efficiency is greatly promoted.And under identical radiating efficiency, the area of radiator or the flow of reduction refrigerant can be reduced, favorably
In the reduction of cost, and beneficial to realizing the miniaturization of the heat pipe for conductive heat dissipation device.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (10)
1. a kind of heat pipe for conductive heat dissipation device, it is characterised in that including porous heat pipe and radiator, the porous heat pipe has many
Individual microchannel pore, the bottom of the radiator is provided with groove, and the bottom of the groove is provided with multiple through holes, the porous heat pipe
One end sealing is plugged in the groove, the closing of the other end of the porous heat pipe, one end of the plurality of through hole with it is the plurality of
Microchannel pore is connected, and the other end of the plurality of through hole is interconnected or closes.
2. heat pipe for conductive heat dissipation device according to claim 1, it is characterised in that the shape of cross section of the groove with it is described
The shape of cross section of porous heat pipe is consistent, and the cross sectional dimensions of the groove is slightly larger than the cross sectional dimensions of the porous heat pipe.
3. heat pipe for conductive heat dissipation device according to claim 1, it is characterised in that the radiator is that fin, liquid are cold and hot
Exchanger, cooled plate, copper coin or aluminium sheet.
4. heat pipe for conductive heat dissipation device according to claim 1, it is characterised in that porous heat pipe one end periphery and institute
State and be tightly connected by welding or gluing mode between the inwall of groove.
5. heat pipe for conductive heat dissipation device according to claim 1, it is characterised in that the plurality of through hole is relative to the groove
Side be provided with sealing hole, in the sealing hole seal the sprue of grafting one.
6. heat pipe for conductive heat dissipation device according to claim 5, it is characterised in that in the sprue and the sealing hole
It is tightly connected by welding or gluing mode between wall, the other end of the plurality of through hole is closed.
7. heat pipe for conductive heat dissipation device according to claim 1, it is characterised in that set on the madial wall of the microchannel pore
It is equipped with dentalation.
8. the heat pipe for conductive heat dissipation device according to claim 1-7 any one, it is characterised in that the plurality of microchannel
Hole corresponds with the plurality of through hole and connects.
9. the heat pipe for conductive heat dissipation device according to claim 1-7 any one, it is characterised in that the plurality of microchannel
Hole connection corresponding with one through hole.
10. the heat pipe for conductive heat dissipation device according to claim 1-7 any one, it is characterised in that one micro- logical
The connection corresponding with the plurality of through hole of road hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710032678.1A CN106659090A (en) | 2017-01-16 | 2017-01-16 | Heat pipe conduction heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710032678.1A CN106659090A (en) | 2017-01-16 | 2017-01-16 | Heat pipe conduction heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106659090A true CN106659090A (en) | 2017-05-10 |
Family
ID=58840819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710032678.1A Pending CN106659090A (en) | 2017-01-16 | 2017-01-16 | Heat pipe conduction heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106659090A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509366A (en) * | 2017-08-30 | 2017-12-22 | 中国电子科技集团公司第二十九研究所 | A kind of conformal heat exchanger based on porous flat pipe |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2484512Y (en) * | 2001-06-04 | 2002-04-03 | 超众科技股份有限公司 | heat sink |
| CN2724202Y (en) * | 2004-08-27 | 2005-09-07 | 英业达股份有限公司 | Heat pipe cooling device |
| CN101105377A (en) * | 2007-07-27 | 2008-01-16 | 株洲南车时代电气股份有限公司 | Large power plate integral type phase change heat-radiation method and heat radiator |
| CN101510533A (en) * | 2009-03-24 | 2009-08-19 | 赵耀华 | Novel microelectronic device radiator |
| CN101754654A (en) * | 2008-12-08 | 2010-06-23 | 富准精密工业(深圳)有限公司 | Heat transfer substrate and heat dissipation device provided with same |
| CN201837956U (en) * | 2010-11-17 | 2011-05-18 | 赵耀华 | External radiator of notebook computer and portable small heat emitting machine |
| CN103997877A (en) * | 2014-05-07 | 2014-08-20 | 江苏科技大学 | High-thermal-flux-density temperature-equalization heat-dissipation device |
| CN106033749A (en) * | 2015-03-13 | 2016-10-19 | 上海交通大学 | Parallel Parallel Microchannel Multi-Chip Heat Sink |
| CN206517722U (en) * | 2017-01-16 | 2017-09-22 | 深圳市迈安热控科技有限公司 | Heat pipe for conductive heat dissipation device |
-
2017
- 2017-01-16 CN CN201710032678.1A patent/CN106659090A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2484512Y (en) * | 2001-06-04 | 2002-04-03 | 超众科技股份有限公司 | heat sink |
| CN2724202Y (en) * | 2004-08-27 | 2005-09-07 | 英业达股份有限公司 | Heat pipe cooling device |
| CN101105377A (en) * | 2007-07-27 | 2008-01-16 | 株洲南车时代电气股份有限公司 | Large power plate integral type phase change heat-radiation method and heat radiator |
| CN101754654A (en) * | 2008-12-08 | 2010-06-23 | 富准精密工业(深圳)有限公司 | Heat transfer substrate and heat dissipation device provided with same |
| CN101510533A (en) * | 2009-03-24 | 2009-08-19 | 赵耀华 | Novel microelectronic device radiator |
| CN201837956U (en) * | 2010-11-17 | 2011-05-18 | 赵耀华 | External radiator of notebook computer and portable small heat emitting machine |
| CN103997877A (en) * | 2014-05-07 | 2014-08-20 | 江苏科技大学 | High-thermal-flux-density temperature-equalization heat-dissipation device |
| CN106033749A (en) * | 2015-03-13 | 2016-10-19 | 上海交通大学 | Parallel Parallel Microchannel Multi-Chip Heat Sink |
| CN206517722U (en) * | 2017-01-16 | 2017-09-22 | 深圳市迈安热控科技有限公司 | Heat pipe for conductive heat dissipation device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509366A (en) * | 2017-08-30 | 2017-12-22 | 中国电子科技集团公司第二十九研究所 | A kind of conformal heat exchanger based on porous flat pipe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |
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| RJ01 | Rejection of invention patent application after publication |