WO2018153111A1

WO2018153111A1 - Connected body vapour chamber heat sink and electronic device

Info

Publication number: WO2018153111A1
Application number: PCT/CN2017/106549
Authority: WO
Inventors: 刘腾跃; 池善久; 曾文辉
Original assignee: 华为技术有限公司
Priority date: 2017-02-27
Filing date: 2017-10-17
Publication date: 2018-08-30
Also published as: CN106887419A; CN106887419B

Abstract

Disclosed are a connected body vapour chamber heat sink and an electronic device. The connected body vapour chamber heat sink is used for providing heat dissipation for at least two heat-emitting elements on a single board. The connected body vapour chamber heat sink comprises a first heat-dissipating plate (10), a second heat-dissipating plate (20) and a connecting part (30), wherein a first vapour chamber (11) is provided in the first heat-dissipating plate, a second vapour chamber (21) is provided in the second heat-dissipating plate, a channel (31) is provided in the connecting part, and the channel communicates between the first vapour chamber and the second vapour chamber. The connecting part can deform under force, meaning that the relative height between the first heat-dissipating plate and the second heat-dissipating plate changes to suit different mounting tolerances between heat-emitting elements, thereby realising a uniform temperature between heat-emitting elements.

Description

Vapor chamber radiator and electronic device

This application claims the priority of the Chinese Patent Application, filed on Feb. 27, 2017, with the application number of 201710107840.1, entitled "Vapor Cavity Heatsink and Electronic Device", the entire contents of which are incorporated herein by reference. In the application.

Technical field

The present invention relates to the field of heat sinks, and more particularly to a vapor chamber junction heat sink and an electronic device using the vapor chamber junction heat sink.

Background technique

As the CPU performance of devices such as servers, routers, and transport networks increases, the power consumption of chips and boards increases gradually. It is necessary to use a Vapour Chamber (VC) heat sink with higher heat dissipation performance. The number of scenes in the chip layout has increased. How to achieve the average temperature of multiple chips on a single board and reduce the temperature of the bottleneck device is the research focus of the VC heat sink.

Summary of the invention

The technical problem to be solved by the embodiments of the present invention is to provide a vapor cavity connected heat sink, which realizes heat dissipation for a plurality of heat-generating components on a single board, can achieve uniform temperature, and can adapt to heat-emitting elements of different heights.

In a first aspect, an embodiment of the present invention provides a vapor chamber junction heat sink for providing heat dissipation for at least two heat generating components on a single board, the vapor chamber joint heat sink including a first heat sink and a second a heat dissipation plate and a connecting portion, a first vapor chamber is disposed in the first heat dissipation plate, a second vapor chamber is disposed in the second heat dissipation plate, a passage is disposed in the connecting portion, and the passage is connected to the first vapor Between the cavity and the second vapor chamber, the connecting portion is deformed by force, so that the relative height between the first heat sink and the second heat sink is changed to accommodate installation between different heat generating components tolerance.

The first heat dissipation plate and the second heat dissipation plate are both vapor chamber (VC) substrates, and the first vapor chamber and the second vapor chamber are both VC chambers. In the embodiment of the invention, the two vapor chambers are connected to each other, so that the first heat dissipation plate and the first heat dissipation plate The second heat dissipating plate is combined into an integrated heat sink. When the first heat dissipating plate and the second heat dissipating plate respectively correspond to different heating elements, the heat generated by the heating element in the working state is also different, and the vapor chamber connecting body heat sink can Achieve uniform temperature between the heating elements. In the case where the heights of the heating elements are different, the deformation of the connecting portion can also make the first heat dissipating plate and the second heat dissipating plate of the vapor chamber conjoined heat sink can simultaneously adapt to the heating elements of different heights, thereby solving the problem of the mounting height tolerance. Can improve heat dissipation efficiency.

In one embodiment, the connecting portion is a plate-like structure, and the connecting portion includes a bent portion. Specifically, a direction in which the connecting portion extends between the first heat dissipation plate and the second heat dissipation is a longitudinal direction, and a direction perpendicular to the length of the connection portion is a width direction, and in the width direction, The dimension of the connecting portion in the width direction is smaller than the dimension of the connecting portion in the longitudinal direction. The heating element can be a chip disposed on a single board. The structure in which the connecting portion is narrowed between the first heat dissipating plate and the second heat dissipating plate is to reduce the strength of the connecting portion and increase the flexibility thereof, so as to avoid the excessive strength of the vapor cavity conjoined radiator provided by the embodiment of the present invention. The board is deformed during the installation process. The provision of the bending section facilitates the connection to have an elastic deformation capability (i.e., flexibility), in particular, by the deformation of the joint material itself to form an elastically absorbing mounting tolerance between the different height heating elements.

In one embodiment, the first heat dissipation plate is provided with a first opening, the first opening allows the first vapor chamber to communicate with the outside; the second heat dissipation plate is provided with a second opening, the second The opening causes the second vapor chamber to communicate with the outside, the two ends of the passage are respectively aligned with the first opening and the second opening, and two ends of the connecting portion are respectively welded to the first heat dissipation plate And the second heat sink. That is, the entire heat sink is integrally welded, and the middle joint portion is bowed, and the material deformation is used to provide elasticity. At the same time, the evaporation chamber is connected by capillary, which ensures that the gas and liquid in the steam chamber can circulate.

The inner wall of the first vapor chamber is provided with a first copper powder layer, the inner wall of the second vapor chamber is provided with a second copper powder layer, and the inner wall of the passage is provided with a third copper powder layer, the third copper Two ends of the powder layer are respectively connected to the first copper powder layer and the second copper powder layer to provide a liquid reflux capillary force, such that the first vapor chamber, the channel and the second vapor chamber A gas-liquid two-phase cycle is formed. The third copper powder layer on the inner wall of the channel not only provides the capillary force of liquid reflow, but also enhances the strength, preventing the joints from being squeezed by the outside air during high temperature operation, so that the two ends cannot heat each other (ie, can not reach the temperature uniformity) effect). Therefore, the setting of the third copper powder layer increases the uniform temperature performance. The third copper powder layer may cover all the areas of the inner wall of the channel, and a plurality of strip-shaped third copper powder layers arranged at intervals may be disposed on the inner wall of the channel.

In one embodiment, a copper pillar is disposed in the first vapor chamber, and the copper pillar is connected between the top wall and the bottom wall of the first heat dissipation plate to increase the strength of the first heat dissipation plate. A copper post is disposed in the intermediate portion of the first heat sink to support the top and bottom walls of the first heat sink in an intermediate region within the first vapor chamber.

In one embodiment, the connecting portion is a heat pipe structure, and the connecting portion includes a bent portion.

In one embodiment, two ends of the connecting portion are respectively inserted into the first vapor chamber and the second vapor chamber, and an inner wall of the first vapor chamber is provided with a first copper powder layer, and the second a second copper powder layer is disposed on an inner wall of the vapor chamber, a sintered copper layer is disposed at both ends of the connecting portion, and the sintered copper layer at both ends of the connecting portion and the first copper powder layer and the first Two copper powder layers are lapped. Specifically, the two separate evaporation chamber heat sinks are respectively opened at both ends for welding the bent heat pipes. The heat pipe is wicked to the evaporation chamber to form a communication of the steam chamber. The overlap of the heat pipe is mainly to solve the problem that the integral welded portion of the heat sink bridge portion may be too high and cannot float.

In one embodiment, the connecting portion further includes two sealing reinforcing rings, and the sealing reinforcing ring is fixed at a connection between the connecting portion and the first heat dissipation plate and the second heat dissipation plate. Sealing the upper and lower openings of the reinforcing ring is beneficial for soldering.

In one embodiment, the vapor chamber junction heat sink further includes a first bracket for supporting the first heat dissipation plate, a second bracket for supporting the second heat dissipation plate, and a connection therebetween a slider, the first bracket and the second bracket are independent of each other, the first bracket includes a first connecting portion, the second bracket includes a second connecting portion, and the slider is slidably connected To the second connecting portion, after the first connecting portion and the second connecting portion are spliced, the first connecting portion and the second connecting portion are simultaneously connected by the slider to realize the first A connection of a bracket and the second bracket.

In a second aspect, an embodiment of the present invention provides an electronic device, including a single board, at least two heat generating components disposed on the single board, and a vapor chamber connected heat sink according to the foregoing.

By implementing the vapor cavity junction heat sink provided by the embodiment of the invention, heat dissipation can be provided for at least two heat generating components on the single board at the same time, and the first steam cavity of the first heat dissipation plate and the second heat dissipation plate are second through the connection portion. The vapor chambers are connected to each other to achieve a uniform temperature between the heating elements. And when the height of the heating element is different, the deformation of the connecting portion makes The vapor chamber junction heat sink can simultaneously match heating elements of different heights. Therefore, the vapor cavity joint heat sink provided by the embodiment of the invention simultaneously solves the problem of uniform temperature and mounting height tolerance of a plurality of heat generating components sharing one heat sink.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background art, the drawings to be used in the embodiments of the present invention or the background art will be described below.

1 is a perspective view of a vapor chamber connected radiator according to an embodiment of the present invention;

Figure 2 is a front elevational view of the vapor chamber junction heat sink shown in Figure 1;

Figure 3 is a bottom plan view of the vapor chamber junction heat sink shown in Figure 1;

4 is a perspective view of a vapor chamber connected radiator according to an embodiment of the present invention;

5 is a cross-sectional view showing a vapor chamber connected radiator according to an embodiment of the present invention;

6 is a schematic view of a reinforcing bracket in a vapor chamber connected radiator according to an embodiment of the present invention;

7 is a schematic view showing a connection structure of a connecting portion of a vapor chamber connected radiator and a first heat dissipation plate according to an embodiment of the present invention;

Fig. 8 is a cross-sectional view showing the connection structure of the connecting portion and the first heat radiating plate shown in Fig. 7.

detailed description

The embodiments of the present invention are described below in conjunction with the accompanying drawings in the embodiments of the present invention.

The embodiment of the invention provides a vapor chamber connected radiator, which is applied in an electronic device, and the electronic device can be a server, a router, a transmission network, etc., and the CPU performance in the electronic device is gradually improved, and the chip and the single in the electronic device The power density of the board is also gradually increasing. The chip on the board is a heating element, and the heat sink needs to be uniformly cooled.

Referring to FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , a vapor chamber connected radiator provided by an embodiment is provided for providing heat dissipation for at least two heating elements on a single board. The device includes a first heat dissipation plate 10, a second heat dissipation plate 20, and a connecting portion 30. The first heat dissipation plate 10 and the second heat dissipation plate 20 are connected together through the connecting portion 30 to form a connected heat sink. The heat dissipation fins 40 may be disposed on the top surfaces of the first heat dissipation plate 10 and the second heat dissipation plate 20, and the heat dissipation fins 40 are fixed to the top surface of the first heat dissipation plate 10 and the top surface of the second heat dissipation plate 20 by soldering. The bottom surfaces of the first heat dissipation plate 10 and the second heat dissipation plate 20 are for contacting with a heat generating component (not shown). Of course, the first heat dissipation plate 10 and the heat generating component and the second heat dissipation plate 20 and the heat generating component may be disposed. A thermally conductive medium, such as a thermal paste, to enhance thermal conductivity.

Referring to FIG. 5, a first vapor chamber 11 is disposed in the first heat dissipation plate 10, a second vapor chamber 21 is disposed in the second heat dissipation plate 20, and a passage 31 is disposed in the connecting portion 30. Between the first vapor chamber 11 and the second vapor chamber 21, when the temperature of the heat generating component corresponding to the first heat sink 10 and the second heat sink 20 is different, the first vapor chamber 11, the passage 31 and the second vapor chamber 21 is connected to each other such that a refrigerant medium filled therein is heated to form a gas-liquid two-phase circulation between the first vapor chamber 11 and the second vapor chamber 21, and a temperature equalization effect is achieved between the heating elements at different temperatures. . The connecting portion 30 is deformed by force such that the relative height between the first heat sink 10 and the second heat sink 20 is changed to accommodate mounting tolerances between different heat generating components. The vapor chamber radiator radiator inlet may be disposed on the first heat sink 10 or the second heat sink 20 for injecting a refrigerant medium.

The first heat dissipation plate 10 and the second heat dissipation plate 20 are both vapor chamber (VC) substrates, and the first vapor chamber 11 and the second vapor chamber 21 are both VC chambers. In the embodiment of the invention, the two vapor chambers are connected to each other, so that A heat sink 10 and a second heat sink 20 are combined into an integrated heat sink. When the first heat sink 10 and the second heat sink 20 respectively correspond to different heat generating components, the heat generated by the heat generating component is different. The vapor chamber junction heat sink can achieve the uniform temperature between the heating elements. In the case where the heights of the heating elements are different, the deformation of the connecting portion 30 can also make the first heat dissipating plate 10 and the second heat dissipating plate 20 of the vapor chamber conjoined heat sink simultaneously adapt to the heating elements of different heights, thereby solving the mounting height tolerance. The problem can improve the heat dissipation efficiency.

The first heat dissipation plate 10 and the second heat dissipation plate 20 are integrally welded by two upper and lower metal substrates, wherein the cavity (ie, the first vapor chamber 11 and the second vapor chamber 21) is evacuated and injected into a refrigerant medium (for example, water). . When the heating element is operated, the refrigerant medium loves heat to become steam, and the heat is dissipated through the top layer (which can be dissipated through the heat sink 40, or through other heat dissipation structures such as cold pipes), so that the vapor-liquid two-phase conversion of the refrigerant medium. Due to the difference in temperature between the first vapor chamber 11 and the second vapor chamber 21, the refrigerant medium in the two chambers can form a gas-liquid two-phase circulating flow between the first vapor chamber 11 and the second vapor chamber 21, The uniform temperature between different heating elements is realized, and the temperature of the high-temperature heating element can be more effectively reduced.

In the embodiment shown in FIGS. 4 and 5, the connecting portion 30 is a plate-like structure, and the connecting portion 30 includes a bent portion 32 formed such that the connecting portion 30 has an arch shape. The bent section 32 can be curved or otherwise have a curved shape. The purpose of the setting of the bending section 32 is to improve the elastic deformation of the connecting portion 30. Under the action of an external force, the connecting portion 30 can be deformed by deformation from the material, thereby changing the first heat radiating plate 10 and the second heat radiating plate 20. The difference in height between the two. The portion of the connecting portion 30 that is close to the first heat radiating plate 10 and the portion of the connecting portion 30 that is close to the second heat radiating plate 10 are flat. a direction in which the connecting portion 30 extends between the first heat dissipation plate 10 and the second heat dissipation is a longitudinal direction, and a direction perpendicular to the length of the connecting portion 30 is a width direction, and in the width direction, The dimension of the connecting portion 30 in the width direction is smaller than the dimension of the connecting portion 30 in the longitudinal direction. The structure in which the connecting portion 30 is narrowed between the first heat dissipating plate 10 and the second heat dissipating plate 20 is to reduce the strength of the connecting portion 30 and increase the flexibility thereof, so as to avoid the strength of the vapor chamber conjoined radiator provided by the embodiment of the present invention. Too high, causing the board to deform during the installation process. The provision of the bent sections facilitates the connection to have an elastic deformation capability (i.e., flexibility), specifically, the deformation of the material itself by the connection portion 30 to form elastically absorb the mounting tolerances between the different height heating elements.

In one embodiment, the first heat dissipation plate 10 is provided with a first opening, the first opening allows the first vapor chamber 11 to communicate with the outside; and the second heat dissipation plate 20 is provided with a second opening. The second opening is such that the second vapor chamber communicates with the outside, the two ends of the channel 31 are respectively aligned with the first opening and the second opening, and the two ends of the connecting portion 30 are respectively soldered to the The first heat dissipation plate 10 and the second heat dissipation plate 20 are described. The first opening may be disposed on a side, a top surface, a bottom surface or other surface of the first heat dissipation plate 10; the second opening may also be disposed on a side edge, a top surface, a bottom surface or other surface of the second heat dissipation plate 20 . That is, the connecting portion 30 is connected between the side of the first heat dissipation plate 10 and the side of the second heat dissipation plate 20. In other embodiments, the connection portion may also be connected to the top surface of the first heat dissipation plate and the second heat dissipation plate. Between the tops of 20.

In one embodiment, a capillary structure is provided through the inner walls of the first vapor chamber 11 and the second vapor chamber 21 and the passage 31, and the circulating flow of the refrigerant medium (the gas-liquid two phases in the evaporation chamber) is driven by the capillary force. Specifically, the inner wall of the first vapor chamber 11 is provided with a first copper powder layer, the inner wall of the second vapor chamber 21 is provided with a second copper powder layer, and the inner wall of the channel 31 is provided with a third copper powder. a layer, the two ends of the third copper powder layer are respectively connected to the first copper powder layer and the second copper powder layer to provide a liquid return capillary force, such that the first vapor chamber 11, the channel 31 and A gas-liquid two-phase circulation is formed between the second vapor chambers 21. The third copper powder layer on the inner wall of the channel 31 not only can provide the capillary force of the liquid returning, but also has the function of strengthening the strength, preventing the joint portion 30 from being squeezed and deformed by the outside air during the high temperature operation, so that the two ends cannot heat each other (ie, cannot The average temperature effect). Therefore, the setting of the third copper powder layer increases the uniform temperature performance. The third copper powder layer may cover all the areas of the inner wall of the channel 31, and a plurality of strip-shaped third copper powder layers arranged at intervals may be disposed on the inner wall of the channel 31.

In one embodiment, a copper pillar 15 is disposed in the first vapor chamber 11, and the copper pillar 15 is connected between the top wall and the bottom wall of the first heat dissipation plate 10 to increase the first heat dissipation. Plate 10 strength. A copper post 15 is disposed in an intermediate portion of the first heat sink 10 to support the top and bottom walls of the first heat sink 10 in an intermediate region within the first vapor chamber 11. Similarly, a copper post 25 is also disposed in the second vapor chamber 21, and the structure and function of the copper post 25 are the same as those of the copper post 15.

Referring to FIG. 7 and FIG. 8 , in one embodiment, the connecting portion 30 is a heat pipe structure, and the connecting portion 30 includes a bent portion (the bending of the heat pipe structure refers to the connecting portion of the plate-like structure of the foregoing embodiment). Bent structure).

In one embodiment, after the heat pipe is flattened, the two ends of the heat pipe are respectively connected into the first vapor chamber 11 and the second vapor chamber 21, and two ends of the connecting portion 30 are respectively inserted into the first vapor chamber. 11 and the second vapor chamber 21, the inner wall of the first vapor chamber 11 is provided with a first copper powder layer, and the inner wall of the second vapor chamber 21 is provided with a second copper powder layer, and the connecting portion 30 The sintered copper layer 33 is provided at both ends of the connecting portion 30, and the sintered copper layer 33 at both ends of the connecting portion 30 is overlapped with the first copper powder layer and the second copper powder layer, respectively. Specifically, the copper outer skin of both ends of the sintered heat pipe 30 is peeled off, and the inner sintered copper layer 33 is exposed at both ends of the heat pipe, and the sintered copper layer 33 is inserted into the first vapor chamber 11 (and the second vapor chamber 21). It is ensured that the sintered copper layer 33 of the heat pipe and the first copper powder layer (and the second copper powder layer in the second vapor chamber 21) in the first vapor chamber 11 are overlapped.

In one embodiment, the connecting portion 30 further includes two sealing reinforcing rings 34 fixed to the connecting portion 30 and the first heat dissipation plate 10 and the second heat dissipation. At the junction of the plates 20, FIGS. 7 and 8 only schematically show the connection structure between the hot tubular connecting portion 30 and the first heat radiating plate 10.

Referring to FIG. 6 and FIG. 1-3, the vapor chamber connected radiator further includes a reinforcing bracket 50, and the reinforcing bracket 50 includes a first bracket 51 for supporting the first heat dissipation plate 10 for supporting the a second bracket 52 of the second heat dissipation plate 20 and a slider 55 connected therebetween, the first bracket 51 and the second bracket 52 being independent of each other, the first bracket 51 including the first a connecting portion 53, the second bracket 52 includes a second connecting portion 54, the slider 55 is slidably coupled to the second connecting portion 54, the first connecting portion 53 and the second connecting portion 54 After the splicing, the first connecting portion 53 and the second connecting portion 54 are simultaneously connected by the slider 55 to realize the connection of the first bracket 51 and the second bracket 52.

The first bracket 51 and the second bracket 52 are both frame-shaped and hollow inside. The edge position of the first heat dissipation plate 10 is fixed to the first bracket 51, and the region for heat dissipation in the middle of the first heat dissipation plate 10 contacts the heat generating component through the first bracket 51.

The number of the first connecting portion 53 and the second connecting portion 54 are both two and are distributed on both sides of the connecting portion 30. The first bracket 51 and the second bracket 52 can be used separately or separately, and the first connecting portion 53 and the second connecting portion 54 can be connected together by a 55-slider to form a reinforcing bracket for use. The distance between the combined first bracket 51 and the second bracket 52 can be adjusted, and the first bracket 51 and the second can be changed as long as the size of the gap between the first connecting portion 53 and the second connecting portion 54 is changed. The distance between the brackets 52. Therefore, the reinforcing bracket 50 can be adapted to a plurality of sizes of heat sinks.

By implementing the vapor chamber junction heat sink provided by the embodiment of the invention, heat can be provided to at least two heat generating components on the single board at the same time, and the first steam chamber 11 and the second heat sink of the first heat sink 10 are connected through the connecting portion 30. 20 The second vapor chamber 21 is in communication to achieve a uniform temperature between the heat generating elements. Moreover, when the height of the heating element is different, the deformation of the connecting portion 30 enables the vapor chamber connected heat sink to simultaneously match the heating elements of different heights. Therefore, the vapor cavity joint heat sink provided by the embodiment of the invention simultaneously solves the problem of uniform temperature and mounting height tolerance of a plurality of heat generating components sharing one heat sink.

The above embodiment is described by taking two heat dissipating plates as an example. Of course, the embodiment of the present invention may further include three or more heat dissipating plates, and the adjacent two heat dissipating plates are connected by a connecting portion, and the heat dissipating plates are designed as In the VC substrate, the vapor chambers of the VC substrates are also communicated with each other through the passages of the respective connecting portions to form an integral chamber to achieve uniform temperature between the plurality of heat generating elements.

Claims

A vapor chamber connected radiator for providing heat dissipation for at least two heat generating components on a single board, wherein the vapor chamber connected heat sink comprises a first heat sink, a second heat sink and a connecting portion, a first vapor chamber is disposed in the first heat dissipation plate, a second vapor chamber is disposed in the second heat dissipation plate, a channel is disposed in the connecting portion, and the channel communicates with the first vapor chamber and the second Forming a joint space between the vapor chambers, and the refrigerant medium circulates in the gas-liquid two-phase in the joint space to achieve uniform temperature of the first heat dissipation plate and the second heat dissipation plate, and the connection portion is subjected to The force can be deformed such that the relative height between the first heat sink and the second heat sink changes to accommodate mounting tolerances between different heat generating components.
A vapor chamber conjoined heat sink according to claim 1, wherein said connecting portion is a plate-like structure, and said connecting portion comprises a bent portion.
The vapor chamber junction heat sink according to claim 2, wherein said first heat dissipation plate is provided with a first opening, said first opening is such that said first vapor chamber communicates with the outside; said second The heat dissipating plate is provided with a second opening, the second opening is such that the second vapor chamber communicates with the outside, and the two ends of the channel are respectively aligned with the first opening and the second opening, the connecting portion Both ends are respectively soldered to the first heat dissipation plate and the second heat dissipation plate.
The vapor chamber junction heat sink according to claim 3, wherein the inner wall of the first vapor chamber is provided with a first copper powder layer, and the inner wall of the second vapor chamber is provided with a second copper powder layer. The inner wall of the channel is provided with a third copper powder layer, and two ends of the third copper powder layer are respectively connected to the first copper powder layer and the second copper powder layer to provide liquid reflow capillary force, so that A gas-liquid two-phase circulation is formed between the first vapor chamber, the passage, and the second vapor chamber.
A vapor chamber junction heat sink according to claim 4, wherein said first vapor chamber is provided with a copper post connected between the top wall and the bottom wall of said first heat sink To increase the strength of the first heat sink.
A vapor chamber conjoined heat sink according to claim 1, wherein said connecting portion is a heat pipe structure, and said connecting portion comprises a bent portion.
A vapor chamber conjoined radiator according to claim 6, wherein both ends of said connecting portion are respectively inserted into said first vapor chamber and said second vapor chamber, and an inner wall of said first vapor chamber a first copper powder layer is disposed, a second copper powder layer is disposed on an inner wall of the second vapor chamber, a sintered copper layer is disposed at both ends of the connecting portion, and the sintered copper layers at both ends of the connecting portion are respectively Bonding with the first copper powder layer and the second copper powder layer.
The vapor chamber conjoined heat sink according to claim 6, wherein the connecting portion further comprises two sealing reinforcing rings, and the sealing reinforcing ring is fixed to the connecting portion and the first heat dissipating a junction of the plate and the second heat sink.
The vapor chamber conjoined radiator of claim 1 further comprising: for supporting said first a first bracket of a heat dissipation plate, a second bracket for supporting the second heat dissipation plate, and a slider connected therebetween, the first bracket and the second bracket being independent of each other The first bracket includes a first connecting portion, the second bracket includes a second connecting portion, the slider is slidably coupled to the second connecting portion, the first connecting portion and the second connection After the splicing, the first connecting portion and the second connecting portion are simultaneously connected by the slider to realize the connection between the first bracket and the second bracket.
The electronic device is characterized in that it comprises a single board, at least two heat generating elements provided on the single board, and a vapor chamber joint radiator according to any one of claims 1 to 9.