JP2011069552A - Heat exchanger - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To seal thermoelectric elements and microchannels in a relatively simple configuration, enhancing performance and reliability. <P>SOLUTION: A fin group (25) includes: base plates (24) coming into contact with the thermoelectric elements (22); and a plurality of heat release fins (27) provided in the base plates (24) and exchanging heat with flowing air. Since edges in the air flowing direction of the respective base plates (24) are bent to the microchannel (21) side respectively and the tips of the edges are opposed to each other and jointed to each other, seal parts (24a) sealing the microchannels (21) and the thermoelectric elements (22) are formed integrally with the base plates (24). <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heat exchanger.

  Conventionally, a so-called thermoelectric element type heat exchanger in which heat is exchanged between fluids using a thermoelectric element is known. For example, PTL 1 discloses a Peltier heat pump that is a thermoelectric element type heat exchanger. Non-Patent Document 1 discloses a heat exchanger in which Peltier elements are arranged so as to sandwich both sides of a microchannel. In this heat exchanger, when the thermoelectric element is energized, for example, the microchannel side becomes the heat dissipation side and the fin group side becomes the heat absorption side. And the liquid which flows through a microchannel is heated, and the air which distribute | circulates a fin group is cooled.

JP 2008-106958 A ICT'86 “Performance of Cross-Flow Thermoelectric Liquid Coolers”, 6th Int Conf. On Thermoelectrics (ICT'86), 1986, pp.69-73

  By the way, in the conventional heat exchanger, since the thermoelectric element and the microchannel are exposed to the air flowing through the fin group, the thermoelectric element and the microchannel are easily affected by moisture in the air. Therefore, a sealing material such as a heat insulating material is filled in the gap between the pair of fin groups to seal the thermoelectric element and the microchannel, thereby taking heat and moisture prevention measures. Thereby, reliability of heat exchange performance and product quality can be ensured.

  However, performing the work of filling the sealing material at the time of manufacturing the heat exchanger increases the number of work steps, and there is a possibility that the heat exchange performance and reliability cannot be sufficiently ensured.

  The present invention has been made in view of such a point, and an object thereof is to improve performance and reliability by sealing thermoelectric elements and microchannels with a relatively simple configuration.

  In order to achieve the above-described object, according to the present invention, a seal portion is integrally formed at an end edge portion of the fin group base plate in the air flow direction.

  Specifically, the present invention provides a refrigerant pipe (21) through which a refrigerant flows and a pair of thermoelectric elements that extend in a strip shape along the longitudinal direction of the refrigerant pipe (21) and are sandwiched between the refrigerant pipes (21). A heat exchanger including an element (22) and a pair of fin groups (25) provided on a surface opposite to the refrigerant pipe (21) side of each thermoelectric element (22) The solution was taken.

That is, in the first invention, the fin group (25) exchanges heat between the base plate (24) in contact with the thermoelectric element (22) and the air provided and circulated in the base plate (24). A plurality of heat dissipating fins (27)
A seal portion (24a) that extends toward the refrigerant pipe (21) and seals the refrigerant pipe (21) and the thermoelectric element (22) at an edge portion in the air flow direction of each base plate (24) Are integrally formed.

  In the first invention, the fin group (25) includes a base plate (24) and heat radiating fins (27) provided on the base plate (24). The base plate (24) is in contact with the thermoelectric element (22), and heat exchange is performed with the air flowing through the radiation fins (27). A seal portion (24a) is integrally formed at an edge portion of each base plate (24) in the air flow direction. The seal part (24a) extends to the refrigerant pipe (21) side to seal the refrigerant pipe (21) and the thermoelectric element (22).

  With such a configuration, there is no need to use a separate sealing material for sealing the refrigerant pipe (21) and the thermoelectric element (22), and the heat exchanger has a relatively simple configuration and high performance and reliability. Can be produced. In addition, when the base plate (24) of the fin group (25) is formed of a material with high heat transfer performance such as copper or aluminum, the seal portion (24a) can also be used as a heat transfer surface, The exchange performance can be further enhanced. Further, by configuring the seal portion (24a) with a metal member, it is possible to secure moisture resistance and further improve reliability. Furthermore, the space defined by the base plate (24) and the seal part (24a) of the fin group (25), the refrigerant pipe (21), and the thermoelectric element (22) has better heat insulation performance than general sealing materials. Since high air is sealed, heat generated during heat dissipation can be prevented from leaking to the outside, and heat exchange performance can be enhanced.

According to a second invention, in the first invention,
The seal portion (24a) is formed by bending the end edge portion of each base plate (24) toward the refrigerant pipe (21) and joining the ends thereof facing each other. It is characterized by.

  In the second invention, the end edge portion of each base plate (24) is bent toward the refrigerant pipe (21). And the seal | sticker part (24a) is formed because the front-end | tips mutually oppose and are joined.

  With such a configuration, when assembling the heat exchanger, a separate sealing material is used only by joining the tips of the end edges of the base plate (24) of the fin group (25) facing each other. The seal portion (24a) can be easily formed.

According to a third invention, in the first invention,
The seal portion (24a) is further bent so that the end portion of each base plate (24) is bent toward the refrigerant pipe (21) and the tip portion thereof constitutes a flange surface (24b). In addition, the flange surfaces (24b) are formed by being joined to each other.

  In 3rd invention, the edge part of each base board (24) is bend | folded to the refrigerant | coolant pipe | tube (21) side. The front end portion is further bent to form the flange surface (24b). And a sealing part (24a) is formed by joining flange surfaces (24b) mutually.

  With such a configuration, when the heat exchanger is assembled, the flange surfaces (24b) of the base plate (24) of the fin group (25) can be easily joined to each other without using a separate sealing material. The seal portion (24a) can be formed on the surface. Further, since the flange surfaces (24b) formed on the edge portions of the base plate (24) are joined to each other, a sufficient joining area can be taken and joining reliability and sealing performance can be improved.

According to a fourth invention, in the first invention,
The seal portion (24a) is formed by bending the end portion of each base plate (24) toward the refrigerant pipe (21) side and overlapping each other when viewed from the air flow direction. It is characterized by that.

  In 4th invention, the edge part of each base board (24) is bend | folded to the refrigerant pipe (21) side. And a seal | sticker part (24a) is formed by overlapping seeing from an air distribution direction and mutually joining.

  With this configuration, when assembling the heat exchanger, the tip of the base plate (24) of the fin group (25) is overlapped as viewed from the air flow direction and joined to each other. The seal portion (24a) can be easily formed without using. Furthermore, even if there is a slight error in the bending dimensions of the edge of the base plate (24), the edges of the base plate (24) can be slid to overlap each other to absorb the dimensional error. Thus, no gap is formed between the fin group (25) and the thermoelectric element (22), and heat exchange efficiency can be ensured. Further, a sufficient bonding area can be taken, and the bonding reliability and sealing performance can be improved.

According to a fifth invention, in any one of the first to fourth inventions,
The thermoelectric element (22)
A first insulating substrate (A) and a second insulating substrate (B) laminated together;
A plurality of first electrodes formed on the surface of the first insulating substrate (A) on the second insulating substrate (B) side and spaced apart from each other in the longitudinal direction of the first insulating substrate (A). (2) and
The first insulating substrate (A) is formed on both surfaces of the first insulating substrate (A) so as to be adjacent to the first electrodes (2) and spaced apart from the first electrode (2). A plurality of second electrodes (3) whose both surfaces are connected by through holes (7) extending in the thickness direction of
Through-holes formed on both surfaces of the second insulating substrate (B) at intervals in the longitudinal direction of the second insulating substrate (B) and extending in the thickness direction of the second insulating substrate (B) A plurality of third electrodes (8) having both surfaces connected by holes (7) and having a surface on the first insulating substrate (A) side connected to the first electrode (2);
On the surface of the first insulating substrate (A) on the second insulating substrate (B) side, the first electrode (2) and the second electrode (3) adjacent to the first electrode (2) The first conductive thermoelectric material (5) and the second conductive thermoelectric material (6) formed in a thin film so as to be in contact with each other are provided.

  In the fifth invention, when a current is passed in the in-plane direction of the first conductive type thermoelectric material (5) and the second conductive type thermoelectric material (6) formed into a thin film, the first electrode (2) and the first conductive type At the interface between the thermoelectric material (5) and the second conductivity type thermoelectric material (6) and at the interface between the second electrode (3) and the first conductivity type thermoelectric material (5) and the second conductivity type thermoelectric material (6) The Peltier effect generates heat and heat. That is, a temperature difference corresponding to both ends of the first conductivity type thermoelectric material (5) and the second conductivity type thermoelectric material (6). As a result, for example, the first electrode (2) becomes a heat absorption side electrode, and the second electrode (3) becomes a heat dissipation side electrode.

  In the first insulating substrate (A), the surface on the second insulating substrate (B) side of the second electrode (3) and the opposite surface are connected by the through hole (7). Heat is radiated from the surface side of the first insulating substrate (A).

  On the other hand, since the third electrode (8) formed on the surface of the second insulating substrate (B) on the first insulating substrate (A) side is connected to the first electrode (2), the third electrode (8) is the endothermic electrode. In the second insulating substrate (B), the surface on the first insulating substrate (A) side of the third electrode (8) and the surface opposite thereto are connected by the through hole (7). Heat is absorbed from the surface side of the second insulating substrate (B).

  Thereby, a heat exchanger using a thermoelectric element (22) of a type that radiates heat from one surface of the first insulating substrate (A) and absorbs heat from one surface of the second insulating substrate (B) is realized. The That is, in the first insulating substrate (A) and the second insulating substrate (B), heat absorption and heat dissipation occur on the substrate surface side excluding the opposing surfaces.

  Thus, in order to form the first conductive thermoelectric material (5) and the second conductive thermoelectric material (6) in a thin film only between the first insulating substrate (A) and the second insulating substrate (B). Easy to manufacture. Moreover, since a current is caused to flow in the in-plane direction of the first conductive type thermoelectric material (5) and the second conductive type thermoelectric material (6) formed into a thin film to cause a temperature difference, the distance from the low temperature side to the high temperature side is The temperature difference increases. In addition, since the first conductive thermoelectric material (5) and the second conductive thermoelectric material (6) are provided between the first insulating substrate (A) and the second insulating substrate (B), Compared with the case where the first conductive thermoelectric material (5) and the second conductive thermoelectric material (6) are provided on the surface, the first conductive thermoelectric material (5) and the second conductive thermoelectric material even when bending force is applied. The tensile stress or compressive stress acting on (6) is reduced, making it difficult to break.

  According to the present invention, it is not necessary to use a separate sealing material to seal the refrigerant pipe (21) and the thermoelectric element (22), and a heat exchanger with high performance and reliability is manufactured with a relatively simple configuration. can do. In addition, when the base plate (24) of the fin group (25) is formed of a material with high heat transfer performance such as copper or aluminum, the seal portion (24a) can also be used as a heat transfer surface, The exchange performance can be further enhanced. Further, by configuring the seal portion (24a) with a metal member, it is possible to secure moisture resistance and further improve reliability.

  Furthermore, the space defined by the base plate (24) and the seal part (24a) of the fin group (25), the refrigerant pipe (21), and the thermoelectric element (22) has better heat insulation performance than general sealing materials. Since high air is sealed, heat generated during heat dissipation can be prevented from leaking to the outside, and heat exchange performance can be enhanced.

It is a front view which shows roughly the structure of the heat exchanger which concerns on Embodiment 1 of this invention. (A) is a longitudinal cross-sectional view of a heat exchanger, (b) is XX sectional drawing of (a). It is YY sectional drawing of FIG. It is a cross-sectional view between insulating substrates of thermoelectric elements. It is a top view which shows the structure of a thermoelectric element. It is a longitudinal cross-sectional view which shows the structure of a thermoelectric element. It is a FIG. 3 equivalent view of the heat exchanger which concerns on this modification. FIG. 4 is a view corresponding to FIG. 3 of the heat exchanger according to the second embodiment. FIG. 4 is a view corresponding to FIG. 3 of a heat exchanger according to Embodiment 3.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following embodiments are essentially preferable examples, and are not intended to limit the scope of the present invention, its application, or its use.

Embodiment 1
1 is a front view schematically showing the configuration of a heat exchanger according to Embodiment 1 of the present invention, FIG. 2 is a cross-sectional view showing the configuration of the heat exchanger, and FIG. 3 is a YY cross-sectional view of FIG. is there. As shown in FIGS. 1 to 3, the heat exchanger (10) is a gas cooler that cools air (hereinafter referred to as target air) as a target fluid, and includes a plurality of heat exchange modules (20), an inlet, A side header (35) and an outlet side header (36) are provided.

  The heat exchange module (20) includes a microchannel (21) as a refrigerant tube through which a refrigerant flows, a pair of thermoelectric elements (22) disposed so as to sandwich the microchannel (21), and a pair of fin groups (25 ).

  The microchannel (21) is composed of a porous flat tube having a plurality of microchannels (21a) inside. The microchannel (21) is formed in a rectangular body that is flat in the flow direction of the target air. The microchannel (21) is formed so that the microchannels (21a) are arranged in a line in the flow direction of the target air.

  The thermoelectric element (22) is formed in a strip shape extending in the longitudinal direction of the microchannel (21) (that is, the vertical direction in FIGS. 1 and 2A). Each thermoelectric element (22) is arranged so as to sandwich the microchannel (21) from the flat surface side. The detailed configuration of the thermoelectric element (22) will be described later.

  Each of the thermoelectric elements (22) is shorter than the microchannel (21) and overlaps at other than both ends of the microchannel (21). That is, the thermoelectric element (22) does not overlap at both ends of the microchannel (21). Furthermore, the width of each thermoelectric element (22) is substantially equal to the width of the microchannel (21) (the width of the microchannel (21) is slightly longer).

  The said fin group (25) is provided in the flat surface on the opposite side to the microchannel (21) side of each thermoelectric element (22). Each fin group (25) includes a base plate (24) in contact with the thermoelectric element (22) and a plurality of heat dissipating fins (27) that exchange heat between the air provided in the base plate (24) and flowing therethrough. It is comprised by what is called a corrugated fin formed by. Note that corrugated fins generally have a small fin thickness, a low fin height, and a narrow fin pitch.

  In the fin group (25), the surface of the base plate (24) opposite to the radiating fin (27) side is bonded to the flat surface of the thermoelectric element (22). The length of the base plate (24), that is, the length of the fin group (25) is shorter than the length of the microchannel (21) and slightly longer than the length of the thermoelectric element (22). The width of the base plate (24), that is, the width of the fin group (25) is longer than the width of the thermoelectric element (22).

  Sealing portions (which extend to the microchannel (21) side and seal the microchannel (21) and the thermoelectric element (22) at the edge portions in the air circulation direction of the base plate (24) of the fin group (25) 24a) is integrally formed. Specifically, the seal portion (24a) is such that the end edge portion of each base plate (24) is bent toward the microchannel (21) side and the tips thereof are opposed to each other and bonded by an adhesive or the like. It is formed with.

  With such a configuration, it is not necessary to use a separate sealing material in order to seal the microchannel (21) and the thermoelectric element (22) against the circulating air, and a relatively simple configuration. A heat exchanger (10) with high performance and reliability can be produced. In addition, by forming the base plate (24) of the fin group (25) with a material with high heat transfer performance such as copper or aluminum, the seal part (24a) can also be used as a heat transfer surface, and heat exchange performance Can be further enhanced. Further, by configuring the seal portion (24a) with a metal member, it is possible to secure moisture resistance and further improve reliability.

  Further, the end edge of the fin group (25) in the longitudinal direction of the base plate (24) is filled with a sealing material (26), and a gap between the microchannel (21) and the base plate (24) is formed. It is blocked.

  In the heat exchange module (20), the microchannel (21) and the thermoelectric element (22) are joined by an adhesive. Further, the thermoelectric element (22) and the base plate (24) of the fin group (25) are joined together by an adhesive. Here, a heat conductive type adhesive is used. Accordingly, the microchannel (21), the thermoelectric element (22), and the fin group (25) are integrally formed to constitute the heat exchange module (20). A plurality of heat exchange modules (20) are juxtaposed in a direction orthogonal to the flow direction of the target air.

  Each of the inlet side header (35) and the outlet side header (36) is constituted by a circular pipe extending in a direction orthogonal to the direction of flow of the target air. The inlet side header (35) is connected to one end side (the upper side of FIG. 2A) which is the inlet end of the microchannel (21) of each heat exchange module (20). The outlet side header (36) is connected to the other end side (the lower side of FIG. 2A) which is the outlet end of the microchannel (21) of each heat exchange module (20). The inlet end and the outlet end of the microchannel (21) protrude and open into the inlet header (35) and the outlet header (36). That is, each heat exchange module (20) is connected in parallel to the inlet side header (35) and the outlet side header (36).

  Although not shown, the inlet header (35) is provided with a refrigerant inlet through which refrigerant flows from the outside, and the outlet header (36) is provided with a refrigerant outlet through which refrigerant flows out.

  The inlet header (35) is configured such that the refrigerant flowing from the outside is distributed and flows into the micro flow path (21a) of the micro channel (21) of each heat exchange module (20). The outlet header (36) is configured such that the refrigerant that has flowed out of the microchannels (21a) of the microchannels (21) merges and flows out.

  Lids (35a, 36a) are attached to both end openings of the inlet side header (35) and the outlet side header (36). The heat exchanger (10) includes a side plate (37) attached to the lids (35a, 36a) of the inlet side header (35) and the outlet side header (36) with an adhesive. That is, the side plate (37) constitutes the right side piece and the left side piece of the heat exchanger (10) when viewed from the air flow direction. In the heat exchanger (10), the gap between the fin groups (25) constitutes the air circulation part (16).

  The heat exchanger (10) is provided with a header heat insulating material (31), a side plate heat insulating material (32), and a pipe heat insulating material (33). Specifically, a header heat insulating material (31) is wound around the outer peripheral surfaces of the inlet header (35) and the outlet header (36). A side plate heat insulating material (32) is attached to the inner side surface of the side plate (37) (that is, the surface in contact with the air circulation part (16)). Moreover, the heat insulating material for pipes (33) is provided in the front side (lower side in FIG. 3) and the rear side (upper side in FIG. 3) of the thermoelectric element (22) in the distribution direction of the target air. That is, the front surface and the rear surface of the microchannel (21) and the thermoelectric element (22) are covered with the heat insulating material for pipe (33) so as not to touch the target air.

-Configuration of thermoelectric element-
4 is a cross-sectional view between the insulating substrates of the thermoelectric element, FIG. 5 is a plan view, and FIG. 6 is a vertical cross-sectional view. As shown in FIGS. 4 to 6, the thermoelectric element (22) is configured by laminating a first insulating substrate (A) and a second insulating substrate (B).

  A plurality of heat absorption side electrodes (2), heat radiation side electrodes (3), p-type thermoelectric materials (5) and n-type thermoelectric materials (6) are formed on the upper surface of the first insulative substrate (A) in a strip shape. Is formed. These are the heat dissipation side electrode (3), n-type thermoelectric material (6), heat absorption side electrode (2), p type thermoelectric material (5), heat dissipation side electrode (3), ..., p type thermoelectric material (5) The heat radiation side electrodes (3) are arranged in this order. Electric wires (17, 18) are connected to the heat radiation side electrodes (3) at both ends. Each of the p-type thermoelectric material (5) and the n-type thermoelectric material (6) is formed into a thin film by a method such as vapor deposition so as to be in contact with the adjacent electrodes (2, 3).

  Thus, the p-type thermoelectric material (5) and the n-type thermoelectric material (6) are provided between the first insulating substrate (A) and the second insulating substrate (B) (that is, the p-type thermoelectric material ( 5) and the n-type thermoelectric material (6) are sandwiched between the first insulating substrate (A) and the second insulating substrate (B)), so that the p-type thermoelectric material (5) and the n-type thermoelectric material ( Compared to the case where 6) is provided on the end face of the heat exchange module (20), the p-type thermoelectric material (5) and the n-type thermoelectric material (when the bending force acts on the thermoelectric element (22) on the surface ( Bending stress acting on 6) can be reduced. Therefore, the p-type thermoelectric material (5) and the n-type thermoelectric material (6) can be prevented from being damaged, and a highly reliable thermoelectric element (22) can be provided.

  On both surfaces of the first insulating substrate (A), a plurality of strip-shaped heat radiation side electrodes (3) are formed (see FIG. 5). Each of the heat dissipating side electrodes (3) formed on the upper surface of the first insulating substrate (A) is connected to the corresponding heat dissipating side electrode (3) on the lower surface of the first insulating substrate (A) by a through hole (7). It is connected to the. The through hole (7) is formed, for example, by filling a hole formed in the substrate (A) with a paste.

  In addition, the said heat absorption side electrode (2) comprises the 1st electrode which concerns on this invention. The heat radiation side electrode (3) constitutes the second electrode according to the present invention. The p-type thermoelectric material (5) and the n-type thermoelectric material (6) constitute the first conductivity type thermoelectric material and the second conductivity type thermoelectric material according to the present invention, respectively.

  On the other hand, a plurality of strip-like heat absorption side electrodes (8) are formed on both surfaces of the second insulating substrate (B) (see FIGS. 4 and 5). Each of the heat absorption side electrodes (8) formed on the upper surface of the second insulating substrate (B) is provided with a corresponding heat absorption side electrode (8) on the lower surface of the second insulating substrate (B) by a through hole (7). It is connected to the.

  The heat absorption side electrode (8) formed on the lower surface of the second insulating substrate (B) is bonded to the heat absorption side electrode (2) formed on the upper surface of the first insulating substrate (A). Connected through. The bonding layer (12) needs to have heat conductivity, and may be a heat conductive adhesive or the like having no conductivity in addition to a conductive material such as solder. When a non-conductive material is used, no current flows through each heat absorption side electrode (8) and through hole (7) of the substrate (B), and only heat flows. In addition, the heat absorption side electrode (8) comprises the 3rd electrode which concerns on this invention.

  The first insulating substrate (A) and the second insulating substrate (B) are preferably insulating and highly heat-insulating. This is to prevent heat leakage from the heat dissipation side (high temperature side) to the heat absorption side (low temperature side). For example, it is conceivable to use glass, resin, foamed resin, or the like.

  Each of the electrodes (2, 3, 8) is preferably formed of a material having low electrical resistance and high thermal conductivity (for example, copper, aluminum, etc.). Also, in order to improve the bonding with the p-type thermoelectric material (5) and n-type thermoelectric material (6) and to increase the durability, the electrodes (2, 3, 8) are plated with nickel or gold. It is desirable to apply.

  In addition, as shown in FIG. 6, the first insulating substrate (A) is provided with a heat radiation side heat transfer plate (13) through an insulating layer (11). On the other hand, a heat absorption side heat transfer plate (14) is provided on the second insulating substrate (B) via an insulating layer (11). In addition, the bottom surface of the second insulating substrate (B) has a groove shape to avoid heat conduction between the p-type thermoelectric material (5), the n-type thermoelectric material (6), and the heat radiation side electrode (3). The space (15) is formed.

  The thermoelectric element (22) absorbs heat at the interface between each endothermic electrode (2) and each thermoelectric material (5,6) by passing a current through the electric wire (17,18) between the endothermic electrodes (3). Is generated, and heat is generated at the interface between each heat radiation side electrode (3) and each thermoelectric material (5, 6). As a result, a temperature difference corresponding to both ends of each thermoelectric material (5, 6) occurs.

  In this way, current flows in the in-plane direction of the thermoelectric material (5, 6) formed into a thin film to generate a temperature difference, so the distance from the low temperature side to the high temperature side can be increased, and the temperature difference is increased. Can be taken. Specifically, the thickness of each thermoelectric material (5, 6) is t, the width is W (see FIG. 4), the length is L (see FIG. 6), and the length of the junction with each electrode (2, 3). As Lc (see FIG. 6), since the current flows in the in-plane direction of the thin film, the temperature difference is also applied in the in-plane direction. be able to. In addition, by making W significantly larger than t (for example, about 1000 times) and L being about 10 times t, for example, the element form factor (L / tW) can be made equivalent to that of a normal Peltier module. Can do. Therefore, characteristics (resistance, heat absorption, efficiency, etc.) similar to those of a normal Peltier module can be obtained. Furthermore, by making t a thin film of about 10 μm, W is extremely larger than t (for example, about 1000 times), and L is about 10 times t, for example, the volume of thermoelectric material (LtW) is reduced to a normal Peltier. The volume of the thermoelectric material used for the module can be reduced to about 1/100. As a result, resource saving and cost reduction and environmental compatibility are greatly improved.

  It should be noted that the junction surface between each electrode (2, 3) and each thermoelectric material (5, 6) has a loss by reducing the electrical resistance and thermal resistance of the junction and reducing the current density and thermal density of the periphery. It is desirable to make it large (specifically, Lc> t). However, if it is too large, the material is wasted, so there is an optimum value. For the same reason, it is desirable that the thickness of each electrode (2, 3) is larger than the thickness of each thermoelectric material (5, 6).

  In the thermoelectric element (22), the heat radiation side electrodes (3) formed on both surfaces of the first insulating substrate (A) are connected to each other by the through holes (7). And radiate heat from the heat-dissipation side heat transfer plate (13). Further, in the thermoelectric element (22), the heat absorption side electrodes (8) on both surfaces of the second insulating substrate (B) are connected to each other by the through holes (7) and the heat absorption side electrodes on the upper surface of the first insulating substrate (A). Since it is connected to (2) via the bonding layer (12), it absorbs heat from the heat absorption side electrode (8) and the heat absorption side heat transfer plate (14) on the upper surface of the second insulating substrate (B).

  In the heat exchanger (10), the microchannel (21) is provided on the heat radiating side heat transfer plate (13) side to become a heating surface, and the fin group (25) is provided on the heat absorption side heat transfer plate (14) side. It is a cooling surface. Thereby, the microchannel (21) becomes the heat dissipation side, and the fin group (25) becomes the heat absorption side.

  The refrigerant (liquid) that has flowed into the inlet header (35) flows into the microchannel (21) of each heat exchange module (20). On the other hand, the target air flows into the fin group (25) of each heat exchange module (20). The refrigerant flowing into the microchannel (21) is dissipated from the thermoelectric elements (22) on both sides and evaporates. The target air flowing through the fin group (25) is absorbed by the fins and cooled to a predetermined temperature. The cooled target air is supplied to the user side.

-Effect of Embodiment 1-
As described above, according to the heat exchanger (10) according to the first embodiment, the tips of the end edges of the base plate (24) of the fin group (25) face each other when the heat exchanger is assembled. Thus, the sealing portion (24a) for sealing the refrigerant pipe (21) and the thermoelectric element (22) can be easily formed without using a separate sealing material simply by bonding with an adhesive or the like. Thereby, a heat exchanger with high performance and reliability can be manufactured with a relatively simple configuration. In addition, by forming the base plate (24) of the fin group (25) with a material with high heat transfer performance such as copper or aluminum, the seal part (24a) can also be used as a heat transfer surface. The performance can be further enhanced. Further, by configuring the seal portion (24a) with a metal member, it is possible to secure moisture resistance and further improve reliability.

  Furthermore, the space defined by the base plate (24) and seal part (24a) of the fin group (25), the microchannel (21), and the thermoelectric element (22) is more thermally insulated than a general sealant. Since high air is sealed, heat generated during heat dissipation can be prevented from leaking to the outside, and heat exchange performance can be enhanced.

<Modification>
FIG. 7 is a view corresponding to FIG. 3 of a heat exchanger according to a modification of the present invention. As shown in FIG. 7, the heat exchange module (20) includes a microchannel (21), a thermoelectric element (22), and a fin group (25). The thermoelectric element (22) is formed of a flexible material and is bonded along the side surface of the microchannel (21) as well as the flat surface of the microchannel (21). Covers the whole.

  With this configuration, the entire surface of the microchannel (21) is covered with the thermoelectric element (22), so that heat generated during heat dissipation can be prevented from leaking to the outside, and the heat insulation performance can be further enhanced. .

  Filling the space defined by the base plate (24) and the seal portion (24a) of the fin group (25) with the microchannel (21) and the thermoelectric element (22) is filled with a foaming heat insulating material. Thus, the heat insulation performance may be further improved.

<< Embodiment 2 >>
FIG. 8 is a view corresponding to FIG. 3 of the heat exchanger according to Embodiment 2 of the present invention. Since the difference from the first embodiment is that the flange surface (24b) is formed on the seal portion (24a), the same parts as those of the first embodiment are denoted by the same reference numerals, and the differences are as follows. Only explained.

  As shown in FIG. 8, the edge part of the air distribution direction in the base plate (24) of each fin group (25) is bent to the microchannel (21) side. The tip portion is further bent inward (in the direction toward the microchannel (21)), and this bent portion constitutes the flange surface (24b). And the seal | sticker part (24a) is formed by making the flange surfaces (24b) of each fin group (25) oppose and joining with an adhesive agent etc.

  With such a configuration, when the heat exchanger (10) is assembled, the flange surfaces (24b) of the base plate (24) of the fin group (25) are joined to each other with an adhesive or the like. The seal portion (24a) can be easily formed without using a material. Further, since the flange surfaces (24b) formed on the edge portions of the base plate (24) are joined to each other, a sufficient joining area can be taken and joining reliability and sealing performance can be improved.

  In the second embodiment, the edge of the base plate (24) is bent inward to form the flange surface (24b), but outward (in the direction opposite to the microchannel (21)). The flange surface (24b) may be formed by bending.

<< Embodiment 3 >>
FIG. 9 is a view corresponding to FIG. 3 of the heat exchanger according to Embodiment 3 of the present invention. As shown in FIG. 9, the edge part of the air distribution direction in the base plate (24) of each fin group (25) is bent to the microchannel (21) side. And the edge part of each base board (24) overlaps seeing from an air circulation direction, and it mutually joins with an adhesive agent etc., and the seal | sticker part (24a) is formed.

  With such a configuration, when assembling the heat exchanger (10), the tips of the base plates (24) of the fin group (25) are overlapped as seen from the air flow direction and joined together, The seal portion (24a) can be easily formed without using a separate sealing material. Furthermore, even if there is a slight error in the bending dimension of the edge of the base plate (24), the edge error of the base plate (24) can be slid and overlapped to absorb the dimensional error. Thus, no gap is formed between the base plate (24) of the fin group (25) and the thermoelectric element (22), and heat exchange efficiency can be ensured. Further, a sufficient bonding area can be taken, and the bonding reliability and sealing performance can be improved.

<< Other Embodiments >>
The present invention may be configured as follows with respect to the embodiment.

  For example, in the above-described embodiment, the heat exchanger (10) as a gas cooler that cools the target air has been described. However, the present invention can also be applied as a gas heater that heats the target air. In that case, by applying a reverse current to the thermoelectric element (22), the microchannel (21) side becomes the heat absorption side, and the fin group (25) side becomes the heat dissipation side. Thus, the target air is radiated and heated by the fin group (25).

  Moreover, in the said embodiment, although the gas (air) which distribute | circulates the fin group (25) is utilized, you may make it utilize the liquid (refrigerant) which flows through a microchannel (21).

  Moreover, the heat exchanger (10) comprised by the one heat exchange module (20) may be sufficient, omitting the said inlet side header (35) and the outlet side header (36).

  In the embodiment, a fin type other than the corrugated fin may be used for the fin group (25), or a pipe having one flow path instead of the microchannel (21) may be used as the refrigerant pipe.

  Moreover, in the said embodiment, although the gas (air) which distribute | circulates the fin group (25) is made to cool or heat, it is not limited to this form. For example, in the heat exchanger (10) of the present invention, a load is connected in place of the power source of the thermoelectric element (22), and heat is input from the outside to the heat absorption side to dissipate the heat from the heat dissipation side. When the temperature is higher than the temperature on the heat dissipation side, a power generation module using the Seebeck effect can be obtained.

  In the above embodiment, the end portion of the base plate (24) of the fin group (25) is bent to form the seal portion (24a) integrally with the base plate (24). For example, the sealing portion (24a) may be formed integrally with the base plate (24) by cutting an aluminum material.

  As described above, the present invention is extremely useful because it has a relatively simple configuration and can provide a highly practical effect of enhancing performance and reliability by sealing thermoelectric elements and microchannels. Industrial applicability is high.

2 Endothermic electrode (first electrode)
3 Heat dissipation side electrode (second electrode)
5 p-type thermoelectric material (first conductivity type thermoelectric material)
6 n-type thermoelectric material (second conductivity type thermoelectric material)
7 Through hole
8 Endothermic electrode (third electrode)
10 Heat exchanger
21 Microchannel (refrigerant tube)
22 Thermoelectric element
24 Base plate
24a Seal part
24b Flange surface
25 fins
27 Radiation fin
A 1st insulating substrate
B Second insulating substrate

Claims (5)

A refrigerant pipe (21) through which refrigerant flows, a pair of thermoelectric elements (22) extending in a strip shape along the longitudinal direction of the refrigerant pipe (21) and arranged to sandwich the refrigerant pipe (21), A heat exchanger comprising a pair of fin groups (25) provided on a surface opposite to the refrigerant pipe (21) side of the thermoelectric element (22),
The fin group (25) includes a plurality of radiating fins (27) for exchanging heat between a base plate (24) in contact with the thermoelectric element (22) and air provided in the base plate (24). )
A seal portion (24a) that extends toward the refrigerant pipe (21) and seals the refrigerant pipe (21) and the thermoelectric element (22) at an edge portion in the air flow direction of each base plate (24) A heat exchanger characterized in that is integrally formed. In claim 1,
The seal portion (24a) is formed by bending the end edge portion of each base plate (24) toward the refrigerant pipe (21) and joining the ends thereof facing each other. A heat exchanger characterized by In claim 1,
The seal portion (24a) is further bent so that the end portion of each base plate (24) is bent toward the refrigerant pipe (21) and the tip portion thereof constitutes a flange surface (24b). In addition, the heat exchanger is formed by joining the flange surfaces (24b) to each other. In claim 1,
The seal portion (24a) is formed by bending the end portion of each base plate (24) toward the refrigerant pipe (21) side and overlapping each other when viewed from the air flow direction. A heat exchanger characterized by that. In any one of claims 1 to 4,
The thermoelectric element (22)
A first insulating substrate (A) and a second insulating substrate (B) laminated together;
A plurality of first electrodes formed on the surface of the first insulating substrate (A) on the second insulating substrate (B) side and spaced apart from each other in the longitudinal direction of the first insulating substrate (A). (2) and
The first insulating substrate (A) is formed on both surfaces of the first insulating substrate (A) so as to be adjacent to the first electrodes (2) and spaced apart from the first electrode (2). A plurality of second electrodes (3) whose both surfaces are connected by through holes (7) extending in the thickness direction of
Through-holes formed on both surfaces of the second insulating substrate (B) at intervals in the longitudinal direction of the second insulating substrate (B) and extending in the thickness direction of the second insulating substrate (B) A plurality of third electrodes (8) having both surfaces connected by holes (7) and having a surface on the first insulating substrate (A) side connected to the first electrode (2);
On the surface of the first insulating substrate (A) on the second insulating substrate (B) side, the first electrode (2) and the second electrode (3) on both sides of the first electrode (2) A heat exchanger comprising: a first conductivity type thermoelectric material (5) and a second conductivity type thermoelectric material (6) formed in a thin film so as to be in contact with each other.

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