CN2501188Y

CN2501188Y - Heat exchanger of liquid-vapour phase latent heat

Info

Publication number: CN2501188Y
Application number: CN 01263627
Authority: CN
Inventors: 赖耀惠; 刘克平
Original assignee: Tai Sol Electronics Co Ltd
Current assignee: Tai Sol Electronics Co Ltd
Priority date: 2001-09-12
Filing date: 2001-09-12
Publication date: 2002-07-17
Anticipated expiration: 2011-09-12

Abstract

Disclosed is a heat exchanger for liquid-vapor equilibrium latent heat which comprises a heat conductor having a closed accommodating chamber therein and heat conductive medium filled in the accommodating chamber. The accommodating chamber of the heat conductor is defined by at least a first inner wall surface and a second inner wall surface which is relatively close to the first inner wall surface. Furthermore, the first inner wall surface and the second inner wall surface form two rough surfaces densely covered with tiny salient points respectively, thus the accommodating chamber forms dense capillary channels therein.

Description

The heat exchanger of liquid vapour phase latent heat

[technical field]

The utility model relates to a kind of heat exchanger of liquid vapour phase latent heat.

[background technology]

Because the running clock pulse as electronic chip products such as central processing units has more and more fast trend, and the volume of whole electronic product requires on the contrary and must be designed towards compact aspect, therefore as widely apply notebook computer or other similar electronic products of electronic component such as chip, because the restriction of product inner space and the radiating requirements of electronic component, must possess has high efficiency heat abstractor internal electronic element could be got rid of because of the heat that working at high speed produced, and keeps serviceability so as to keeping the certain operating temperature of electronic component.

As shown in Figures 1 and 2, to be a kind of known applications in notebook computer or space limited and need the heat exchanger of the electronic product of heat radiation.Described heat exchanger has a heat pipe 5 that is hollow form and is made by the thermal conductivity good metal, be filled with flowable refrigerant material in the heat pipe 5, and heat pipe 5 has a first end 51 and a second end 52 opposite with first end 51, and the end of first end 51 and the second end 52 is closed state and keeps the refrigerant material inner and do not leak.Connect one first heat-conducting seat 6 at heat pipe 5 near the position of first end 51, make the bottom surface 61 of first heat-conducting seat 6 can attach contact one by heat-generating electronic elements on the formed thermal source, heat pipe 5 then can be connected with one second heat-conducting seat 7 near the position of the second end 52, make that second heat-conducting seat 7 can be in order to be connected with a heat abstractor, the heat transferred that thermal source can be produced by first heat-conducting seat 6 is to the first end 51 of heat pipe 5, and heat pipe 5 by the refrigerant material of inside with the second end 52 of heat transferred to heat pipe 5, carry out heat exchange by second heat-conducting seat 7 with air by the second end 52 of heat pipe 5 again and heat is left, wherein, refrigerant material in the heat pipe 5 can form gaseous state and also move toward the second end 52 of low-temp low-pressure after first end 51 absorbs heat, and the refrigerant material of gaseous state can be condensed into liquid state after the second end 52 discharges latent heat and be back to first end 51 and absorb hot once more, can constitute the circulation that a heat is transmitted by flowing of refrigerant material in the heat pipe 5 like this, yet this circulation is a kind of ideal state basically, still has many factors can influence heat transfer efficiency in practical application.For example, consider the flowability of refrigerant material in the heat pipe 5, generally heat pipe 5 can be made the pipe of circular cross-section, but the circular heat pipe 5 of this kind is circular cause because of first end 51 and the second end 52 cross sections, make that the contact area of it and first heat-conducting seat 6 or second heat-conducting seat 7 is too little, so that heat-transfer effect is not good, therefore can form the heat pipe 5 that the cross section is a flat as shown in the figure, though but therefore it strengthened the contact area of conducting heat, but because reduced cross-sectional area makes the refrigerant material be difficult for flow, cause the transitivity variation of heat and influence the heat radiation circulation of refrigerant material.In addition, based on required on the electronic component integral layout position, the position of thermal source may have certain distance apart with the position that is fit to heat radiation, and for avoiding other electronic components, the shape of heat pipe 5 is not often to use the preferable straight tube mode of refrigerant flow of matter to dispose, and must make heat pipe 5 bendings connecting thermal source and heat abstractor, in case and heat pipe 5 has crooked shape, must influence the flowability of inner refrigerant material, nature is had a greatly reduced quality to due radiating effect.

Can't take into account based on existing heat exchanger the refrigerant material flowability, heat pipe heat conductivity and be vulnerable to alteration of form and influence shortcoming such as radiating efficiency, be necessary to develop a kind of heat exchanger that can overcome above-mentioned shortcoming in fact.

[utility model content]

The purpose of this utility model is to provide a kind of heat exchanger of liquid vapour phase latent heat, and it has desirable heat transfer efficiency and is not subjected to alteration of form and influences the heat exchanger of the liquid vapour phase latent heat of thermal diffusivity.

The heat exchanger of liquid vapour phase latent heat of the present utility model, comprise that the heat carrier and that has the sealing room in is filled in the interior heat transfer medium of room of described heat carrier, be characterized in: the room of described heat carrier is defined by second internal face that one first internal face and is pressed close to described first internal face relatively, and described first internal face and described second internal face respectively form a face of slightly making that is densely covered with tiny protruding point, make to be formed with intensive capillary channel in the described room.

Adopt such scheme, heat transfer medium can conduct to the heat of heat carrier and form steam state by absorbing thermal source, and then move to the low-temp low-pressure place with heat release to be reduced to liquid state, be back to the high temperature place by formed capillary channel in the room again, to constitute a heat conduction circulation that repeats.It has desirable heat transfer efficiency and is not subjected to alteration of form and influences thermal diffusivity.

[description of drawings]

Be elaborated below by preferred embodiment and accompanying drawing heat exchanger to liquid vapour phase latent heat of the present utility model, in the accompanying drawing:

Fig. 1 is a kind of schematic perspective view of existing heat exchanger;

Fig. 2 is the schematic perspective view of the heat exchanger reverse side of Fig. 1;

Fig. 3 is the three-dimensional exploded view of a preferred embodiment of the heat exchanger of liquid vapour phase latent heat of the present utility model;

Fig. 4 is a cross-sectional schematic after the combination of described preferred embodiment;

Fig. 5 is the schematic diagram that the preferred embodiment of Fig. 3 has additional two another preferred embodiments of passage;

Fig. 6 is that the embodiment of Fig. 5 makes up the back cross-sectional schematic.

[embodiment]

Consult Fig. 3 and 4, a preferred embodiment of the heat exchanger of liquid vapour phase latent heat of the present utility model comprises a heat carrier 1 and a heat transfer medium 2.Can the temperature of thermal source 3 be reduced in order to contact a thermal source 3 by heat carrier 1.

Described heat carrier 1, inside has the room 10 of a sealing, and in the present embodiment, heat carrier 1 can be matched with the

first half housings

11 and 12 involutory compositions of the second half housings below being positioned at by the first half housings 11 and that be positioned at the top, and has first internal face 110 that concaves slightly on the first half housings 11, then relatively also has second internal face 120 that concaves slightly on the second half housings 12, after the first half housings 11 and the second half housing 12 relative tight engagement, first internal face 110 and second internal face 120 can define the space of room 10.In addition, respectively form a matsurface that is densely covered with tiny protruding point on the surface of first internal face 110 and second internal face 120, with second internal face 120 is example, utilize tiny metal particle to be evenly distributed on the surface of second internal face 120 in advance, make metallic be sintered to fix on the surface of second internal face 120 after making the second half housings 12 through a high temperature stove and accessory again, make the surface of second internal face 120 form a matsurface, make in the same way, also can make first internal face 110 of the first half housings 11 form identical matsurface.As shown in Figure 4, when the first half housings 11 with can make after the second half housings 12 are involutory first internal face 110 and second internal face 120 relative approaching, cause the rough surface with tiny protruding point of first internal face 110 and second internal face 120 to form interlaced phenomenon, can therefore constitute intensive capillary channel in the room 10.

Described heat transfer medium 2 is to be filled in the room 10 of heat carrier 1, and flows in the formed capillary channel in room 10.And heat transfer medium 2 can use the refrigerant material that is easy to absorb heat with heat release.

As shown in Figures 3 and 4, during application, heat carrier 1 can be made into any required shape and not necessarily be defined as graphic in approximate rectangular shape, the visible electronic arrangements of components is required and design, the bottom (i.e. the lower surface of the second half housings 12) that makes heat carrier 1 is in order to contact thermal source 3, and the top of heat carrier 1 (i.e. the upper surface of the first half housings 11) can be in order to connect as heat abstractors such as radiating fin 4, the heat transferred that is produced when thermal source 3 is during to heat carrier 1, heat transfer medium 2 in the room 10 of heat carrier 1 can be rapidly with heat absorption, at this moment, heat transfer medium 2 forms steam state because of absorbing heat, the trend that the heat transfer medium 2 of steam state has past low-temp low-pressure place to flow because of physical characteristic, the heat transfer medium 2 that is steam state will flow on the heat carrier 1 near the position (as the sensing of Fig. 3 solid arrow) with heat abstractor 4, and the heat transfer medium 2 of vaporization is condensed into liquid state after by heat abstractor 4 latent heat own being discharged again, become liquid heat transfer medium 2 and produce capillarity because of capillary channels intensive in the room 10 and the adhesive force of heat transfer medium 2 material molecules, make heat transfer medium 2 borrow capillary channel to be back to position (as the sensing of Fig. 4 dotted line arrow) rapidly near thermal source 4, like this, 2 heat absorptions form the characteristic that flows to the low-temp low-pressure place that has that steam state produced based on heat transfer medium on the one hand, liquid heat transfer medium 2 is refluxed easily fill up heat transfer medium 2 because of forming the space that steam state moves the back generation, two kinds of effects can cause quite rapid and continual heat transfer cycle under the reciprocal effects, the heat exchanger effectiveness that it produced well imagine will be more known the heat pipe mode significantly improve.In addition, owing to adopt room 10 interior first internal faces 110 and second internal face 120 to help the circulation of heat transfer medium 2 because of the formed capillary channel of matsurface, so therefore the variation of heat carrier 1 shape can effectively avoid the shortcoming of existing heat pipe because of the crooked heat transfer medium flows reduction that causes of shape to the almost not influence of heat transfer medium 2 flowabilities.

In addition, for further promoting flowing of heat carrier 1 interior heat transfer medium 2, as Fig. 5 and shown in Figure 6, can on heat carrier 1, be provided with at least one passage 13 that is connected with room 10, passage 13 can be located on first internal face 110 or second internal face 120 all can, and the position of visual thermal source 3 and heat abstractor 4 is disposed, effect as existing heat pipe so that being provided, heat transfer substance 2 main flow paths is arranged, be on second internal face 120, to be provided with two passages 13 in this example, 13 in each passage still is communicated with by the capillary channel in the room 10, can arrive heat abstractors 4 (as the sensing of Fig. 5 solid arrow) fast by thermal source 3 through passage 13 after making heat transfer substance 2 form steam states, locate (as the sensing of Fig. 5 dotted line arrow) to produce ringing fast via what capillarity was back to thermal source 3 again and be condensed into liquid heat transfer substance 2.

Comprehensive the above, the utility model mainly is to utilize first internal face 110 and second internal face, 120 formed matsurfaces in the room 10, relative to the capillary channel that is constituted by first internal face 110 with second internal face 120, make in room 10 heat transfer medium 2 that flows produce the flow phenomenon of latent heat physical change because of heat absorption and heat release, more can further form effectively circulation, can therefore improve the heat exchanger effectiveness of heat exchanger integral body by the capillarity of capillary channel.

Claims

1, a kind of heat exchanger of liquid vapour phase latent heat comprises that the heat carrier and that has the sealing room in is filled in the interior heat transfer medium of room of described heat carrier, is characterized in that:

The room of described heat carrier is defined by second internal face that one first internal face and is pressed close to described first internal face relatively, and described first internal face and described second internal face respectively form a face of slightly making that is densely covered with tiny protruding point, make to be formed with intensive capillary channel in the described room.

2, the heat exchanger of liquid vapour phase latent heat as claimed in claim 1 is characterized in that:

Described first internal face and described second internal face are to utilize metal dust sticky cloth formed matsurface on the surface equably.

3, the heat exchanger of liquid vapour phase latent heat as claimed in claim 1 is characterized in that:

Described heat conductor further is provided with at least one passage that supplies heat transfer medium flows and be connected with described room.

4, the heat exchanger of liquid vapour phase latent heat as claimed in claim 1 is characterized in that:

Described heat conductor is made up by the second half housings that one the first half housing and matches with described the first half housings, and described first internal face is to be positioned on described the first half housings, and described second internal face then is positioned on described the second half housings.

5, the heat exchanger of liquid vapour phase latent heat as claimed in claim 1 is characterized in that:

Described heat transfer medium is a refrigerant material.