CN101819001A - Superconducting element structure - Google Patents
Superconducting element structure Download PDFInfo
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- CN101819001A CN101819001A CN200910118659A CN200910118659A CN101819001A CN 101819001 A CN101819001 A CN 101819001A CN 200910118659 A CN200910118659 A CN 200910118659A CN 200910118659 A CN200910118659 A CN 200910118659A CN 101819001 A CN101819001 A CN 101819001A
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Abstract
The invention discloses a superconducting element structure which is used for heat radiation of an electronic element. A superconducting element comprises a shell and a plurality of sintered cylinders, wherein the shell comprises an upper plate sheet and a lower seat, a layer of metal film is respectively electro-statically coated on the inner surfaces of the upper plate sheet and the lower seat, and the upper plate sheet and the lower seat are mutually combined to form a containing space; the sintered cylinders are placed in the containing space, the sintered cylinders are punched by utilizing metal powders which are further sintered to be cylindrical, and the surface of each cylinder is provided with a capillary structure. Because a working fluid flows in the containing space and is matched with the capillary structures to form two-phase flow circulation, compared with the prior art, the heat conductivity and the heat radiation property of the integral superconducting element can be greatly enhanced, meanwhile, the production cost is lowered, and the economic benefit is enhanced.
Description
Technical field
The relevant a kind of heat dissipation element of the present invention is particularly about a kind of superconducting element structure that is applicable to electronic element radiating.
Background technology
Electronic product is all with lightweight, the slim design focal point that turns to now, when electronic component dimensions is moved towards microminiaturization, functional orientation, the caloric value of its unit are is also more and more high, tradition cooperates fan dissipation in the radiating mode of air with radiating fin, can not satisfy the demand of electronic component now, so radiating efficiency has become the key factor of life-span, reliability and the stability of decision electronic product.Heat pipe (Heat Pipe), be to absorb heat by the phase change between workflow body fluid gas phase (phase change), and with gas molecule transmission heat, thereby can obtain the high coefficient of heat conduction, has goodish heat-transfer effect, be widely used in the hot conduction of electronics field now, as heat radiation of computer central interior processor or light emitting diode etc.But because the capillary structure (wick structure) of heat pipe must be attached at whole inside heat pipe tube wall, though the capillary force that it provides working media liquid to reflux, but also become the main source of flow pressure drop in the flow resistance of its capillary structure inside, so cause its performance under some operational scenario, to have the situation of successively decreasing significantly.Temperature-uniforming plate (vapor chamber) then is that heat pipe is conducted the heat conduction that further becomes face by the heat of point, has more high efficiency thermal conduction characteristic, one of heat conducting element that may be widely applied future.
TaiWan, China letters patent number M345222 number, it is a kind of temperature-uniforming plate and supporting construction thereof, it mainly lays capillary structure with an enclosure interior, in interior filling working fluid, and in housing, lay the wave sheet, offer perforation respectively between this wave sheet Wave crest and wave trough, working fluid flow through septal pathways and perforation are to promote the heat conduction efficiency of temperature-uniforming plate; Yet, it is still not really desirable to take a broad view of its heat conduction efficiency of this creation, and laying sandwich construction, as upper strata capillary structure, lower floor's capillary structure, wave sheet etc., increase production cost and built-up time relatively, if can propose a kind of superconducting element structure of high heat conduction efficiency at above-mentioned disappearance, believe to have more economic benefit, also be fit to a large amount of production.
In view of this, the present invention is directed to above-mentioned problem, propose a kind of superconducting element structure, to overcome known shortcoming.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of superconducting element structure, makes working fluid produce the two-phase flow circulation, reaches the purpose of a large amount of heat radiations.
For solving the problems of the technologies described above, the present invention is a kind of superconducting element structure, be used for the heat radiation of electronic component, comprise: a housing, it comprises a upper sheet space and a seat, this upper sheet space and this inner surface of following utilize electrostatic applications, make its lining layer of metal film, this upper sheet space and this following formation one accommodation space that is bonded to each other; A plurality of sintering cylinders place in this accommodation space, and this sintering cylinder utilizes the metal dust punching press, and then sinters bar shape into, and this damaged surface has capillary structure.
Superconducting element structure simple structure of the present invention, suitable a large amount of production, and make working fluid produce the two-phase flow circulation, can promote radiating efficiency.
Description of drawings
Fig. 1 is a decomposition texture schematic diagram of the present invention;
Fig. 2 is another visual angle decomposition texture schematic diagram of the present invention;
Fig. 3 is a combining structure schematic diagram of the present invention;
Fig. 4 is a cutaway view of the present invention;
Fig. 5 is a superconducting component heat radiation schematic diagram of the present invention.
Description of reference numerals
The 10-superconducting component; The 10a-evaporation ends; The 10b-condensation end; The 12-housing; The 14-upper sheet space; 142-upper sheet space pellicular front; Following of 16-; The following pellicular front of 162-; The 164-filler opening; The 17-accommodation space; 18-sintering cylinder; The 20-electronic component; The 30-heat sink.
The specific embodiment
Fig. 1 is a decomposition texture schematic diagram of the present invention, as shown in the figure, superconducting component 10 comprises a housing 12, housing 12 further comprises a upper sheet space 14 and a seat 16, the inner surface that upper sheet space 14 reaches following 16 utilizes electrostatic applications, make its lining layer of metal film, form pellicular front 162, metallic film is a copper powder, be coated on electrostatic applications on upper sheet space 14 and following 's 16 the inner surface, metallic film further is a kind of capillary structure, please consult Fig. 2 simultaneously, Fig. 2 is another visual angle decomposition texture schematic diagram of the present invention, as shown in the figure, figure can more clearly observe in upper sheet space 14 inner surfaces thus, have a upper sheet space pellicular front 142, upper sheet space pellicular front 142 is identical with a following pellicular front 162, all is to utilize electrostatic applications, the metal dust coating is reached following 16 inner surface in upper sheet space 14, and a upper sheet space pellicular front 14 and a following pellicular front 162 are a kind of careful capillary structure; Please get back to Fig. 1, upper sheet space 14 reaches following 16 each other can be in conjunction with forming an accommodation space 17, and superconducting component 10 comprises a plurality of sintering cylinders 18, places in the accommodation space 17, sintering cylinder 18 utilizes the metal dust punching press, this metal dust can be copper powder, forms porous structure behind the punching press sintering, and then moulds into bar shape, damaged surface tool capillary structure, housing 12 also has a filler opening 164, and accommodation space 17 can be vacuumized, or fill fluid.
Fig. 3 is a combining structure schematic diagram of the present invention, and as shown in the figure, upper sheet space 14 reaches following 16 and combined, forms accommodation space 17, and sintering cylinder 18 has been installed, and regularly arranged being fixed in the accommodation space 17; One working fluid 40, fill in accommodation space 17, and can in accommodation space 17, flow, and via the phase change transporting heat energy, working fluid 40 is pure water or ultra-pure water, be a kind of heat transfer medium, meet heat and produce phase change, and the heat energy that electronic component 20 is produced evenly is sent to housing 12, and housing 12 be the copper metal material, the filler opening by the housing 12, accommodation space 17 can be vacuumized, filler opening 164 also can be filled working fluid 40 to accommodation space 17 by the outside, and behind upper sheet space 14 and following 16 joint, its engagement edge can be fixed by solder joints.Be clear view internal structure of the present invention more, it is made cutaway view along A-A ', do explanation following.
Fig. 4 is a cutaway view of the present invention, by A-A ' figure clear view internal structure of the present invention more, please be simultaneously with reference to Fig. 5, Fig. 5 is a superconducting component heat radiation schematic diagram of the present invention, as shown in the figure, superconducting component 10 places between an electronic component 20 and the heat sink 30, and contact with electronic component 20, owing to the quite high pyroconductivity that has of superconducting component 10 of the present invention, the heat energy that electronic component 20 is produced can be conducted by superconducting component 10 and scatter fast, and contacts with heat sink 30 simultaneously, can more effective enhancement integral heat sink, heat sink 30 is the radiating fin of aluminium material further, is positioned on the outer surface of this housing, and contacts with this housing.Please get back to Fig. 4, as shown in the figure, superconducting component 10 contact heat source side are evaporation ends 10a, another opposite end is condensation end 10b, if thermal source is an electronic component 20, be positioned at the below of superconducting component 10, the working fluid of evaporation ends 10a flashes to steam state because of heat absorption, and saturated vapor a rises, and diffuses to whole condensation end 10b rapidly, condensation end 10b also contacts with heat sink 30 among Fig. 1, heat sink 30 is positioned on the outer surface of housing 12, and contacts with housing 12, but the heat energy of while absorption condensation end 10b, then please get back to Fig. 5, after the heat energy of condensation end 10b is absorbed, can make saturated vapor a be liquefied as working fluid b once again, working fluid b also can be along the upper sheet space pellicular front 142 on the housing, capillary structure on following seat pellicular front 162 and the column structure 18, the formation two-phase flow circulates, and reaches the effect of continuous absorption heat energy and heat radiation.
The present invention mainly utilizes traditional electrostatic applications mode that is different from, inner surface lining layer of metal film with housing, this metallic film further is a kind of thin layer with capillary structure, be matched with the sintering cylinder of the stamping of powder that has in the accommodation space, the sintering damaged surface has capillary structure, by working fluid in accommodation space, cooperate this capillary structure, the circulation of formation two-phase flow, can effectively promote the heat conductivity and the thermal diffusivity of whole superconducting component, compared to known technology better hot transfer efficiency is arranged, also comparatively meet economic benefit simultaneously, be fit to a large amount of production.
The above description of this invention is illustrative, and nonrestrictive, and those skilled in the art is understood, and can carry out many modifications, variation or equivalence to it within spirit that claim limits and scope, but they will fall within the scope of protection of the present invention all.
Claims (10)
1. a superconducting element structure is used for the heat radiation of electronic component, it is characterized in that, this superconducting element structure comprises:
One housing, it comprises a upper sheet space and a seat, this upper sheet space and this inner surface of following utilize electrostatic applications lining layer of metal film, this upper sheet space and this following formation one accommodation space that is bonded to each other;
A plurality of sintering cylinders place in this accommodation space, and this sintering cylinder utilizes the metal dust punching press, and then sinters bar shape into, and this damaged surface has capillary structure; And
One working fluid is filled in this accommodation space, and can flow in this accommodation space, meets heat and produces phase transformation.
2. superconducting element structure as claimed in claim 1 is characterized in that, this working fluid is pure water or ultra-pure water.
3. superconducting element structure as claimed in claim 1, wherein this working fluid is a kind of heat transfer medium.
4. superconducting element structure as claimed in claim 1 is characterized in that, this housing is the copper metal material.
5. superconducting element structure as claimed in claim 1 is characterized in that this housing has a filler opening.
6. superconducting element structure as claimed in claim 1 is characterized in that, this metallic film is a copper powder.
7. superconducting element structure as claimed in claim 1 is characterized in that, this metallic film is a kind of capillary structure.
8. superconducting element structure as claimed in claim 1 is characterized in that, this metal dust is a copper powder, forms porous structure behind the punching press sintering.
9. superconducting element structure as claimed in claim 1 is characterized in that this superconducting element structure more comprises a heat sink, and it is positioned on the outer surface of this housing, and contacts with this housing.
10. superconducting element structure as claimed in claim 1 is characterized in that, after this upper sheet space and this time seated connection closed, its engagement edge was fixed by solder joints.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910118659A CN101819001A (en) | 2009-02-27 | 2009-02-27 | Superconducting element structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910118659A CN101819001A (en) | 2009-02-27 | 2009-02-27 | Superconducting element structure |
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| CN101819001A true CN101819001A (en) | 2010-09-01 |
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| CN200910118659A Pending CN101819001A (en) | 2009-02-27 | 2009-02-27 | Superconducting element structure |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102774067A (en) * | 2011-05-10 | 2012-11-14 | 陈文进 | Method for manufacturing soaking plate |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
| TWI507653B (en) * | 2013-08-23 | 2015-11-11 | Asia Vital Components Co Ltd | Heat dissipation unit |
| CN106941769A (en) * | 2016-11-16 | 2017-07-11 | 林进东 | A kind of good radiator structure part of combination property and its preparation technology |
| WO2017215143A1 (en) * | 2016-06-17 | 2017-12-21 | 上海嘉熙科技有限公司 | Electric controller based on thermally superconductive heat dissipating plate and air conditioner outdoor unit |
| TWI639078B (en) | 2017-08-01 | 2018-10-21 | 啓碁科技股份有限公司 | Electronic device |
| CN109654929A (en) * | 2019-02-27 | 2019-04-19 | 新乡市特美特热控技术股份有限公司 | A kind of high-efficiency thermal storage device and its manufacturing method |
| CN109883225A (en) * | 2019-01-03 | 2019-06-14 | 奇鋐科技股份有限公司 | Radiator |
| US11092383B2 (en) | 2019-01-18 | 2021-08-17 | Asia Vital Components Co., Ltd. | Heat dissipation device |
-
2009
- 2009-02-27 CN CN200910118659A patent/CN101819001A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102774067A (en) * | 2011-05-10 | 2012-11-14 | 陈文进 | Method for manufacturing soaking plate |
| CN104053335B (en) * | 2013-03-13 | 2020-08-25 | 联想(北京)有限公司 | Heat radiator for electronic equipment |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
| TWI507653B (en) * | 2013-08-23 | 2015-11-11 | Asia Vital Components Co Ltd | Heat dissipation unit |
| WO2017215143A1 (en) * | 2016-06-17 | 2017-12-21 | 上海嘉熙科技有限公司 | Electric controller based on thermally superconductive heat dissipating plate and air conditioner outdoor unit |
| CN106941769A (en) * | 2016-11-16 | 2017-07-11 | 林进东 | A kind of good radiator structure part of combination property and its preparation technology |
| CN106941769B (en) * | 2016-11-16 | 2019-12-27 | 林进东 | Heat dissipation structural part with good comprehensive performance and preparation process thereof |
| TWI639078B (en) | 2017-08-01 | 2018-10-21 | 啓碁科技股份有限公司 | Electronic device |
| CN109883225A (en) * | 2019-01-03 | 2019-06-14 | 奇鋐科技股份有限公司 | Radiator |
| CN109883225B (en) * | 2019-01-03 | 2021-08-24 | 奇鋐科技股份有限公司 | Heat sink device |
| US11092383B2 (en) | 2019-01-18 | 2021-08-17 | Asia Vital Components Co., Ltd. | Heat dissipation device |
| CN109654929A (en) * | 2019-02-27 | 2019-04-19 | 新乡市特美特热控技术股份有限公司 | A kind of high-efficiency thermal storage device and its manufacturing method |
| CN109654929B (en) * | 2019-02-27 | 2023-08-15 | 新乡市特美特热控技术股份有限公司 | Efficient heat storage device and manufacturing method thereof |
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Open date: 20100901 |