CN109654929B - Efficient heat storage device and manufacturing method thereof - Google Patents
Efficient heat storage device and manufacturing method thereof Download PDFInfo
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- CN109654929B CN109654929B CN201910147265.7A CN201910147265A CN109654929B CN 109654929 B CN109654929 B CN 109654929B CN 201910147265 A CN201910147265 A CN 201910147265A CN 109654929 B CN109654929 B CN 109654929B
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- temperature
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- change material
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/0034—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using liquid heat storage material
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/0056—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using solid heat storage material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
The invention provides a high-efficiency heat storage device and a manufacturing method thereof, wherein the high-efficiency heat storage device comprises a heat conduction shell, wherein a temperature equalization cavity, a high-temperature heat storage cavity and a low-temperature heat storage cavity are sequentially stacked from top to bottom in the heat conduction shell, a gas-liquid phase change material is filled in the temperature equalization cavity, a high-melting-point solid-liquid phase change material is filled in the high-temperature heat storage cavity, and a first heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the high-temperature heat storage cavity; the low-temperature heat storage cavity is filled with a low-melting-point solid-liquid phase change material, and a second heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the low-temperature heat storage cavity. When the electronic element works, heat is firstly transferred to the temperature equalizing cavity and the upper wall and the lower wall of the temperature equalizing cavity, when the gas-liquid phase-change material is subjected to phase change gasification, the heat generated by the electronic element absorbed by the gas is rapidly diffused to the whole temperature equalizing cavity, and at the moment, the solid-liquid phase-change material can simultaneously absorb the heat released by gas liquefaction in the temperature equalizing cavity on the whole partition surface, so that heat conduction and heat accumulation of the invention are developed.
Description
Technical Field
The invention relates to the technical field of heat storage devices, in particular to a high-efficiency heat storage device and a manufacturing method thereof.
Background
Modern electronic components are moving at explosive speeds towards high-density, micro-volume system integration, and thus high power consumption or high heat flux density forms a tripping stone for stable system operation and improved performance. How to manage high heat flux density in a small space has become a key issue for improving the performance of electronic components.
Particularly, in some application fields of short-time high-power electronic components, such as lasers, missiles and the like, a large amount of heat can be generated in a short time, but enough space and weight resources are not provided for heat sinks to conduct away the heat, so that a device capable of rapidly and efficiently storing the heat is needed to solve the problem of overtemperature of the electronic components.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a high-efficiency heat storage device and a manufacturing method thereof.
The utility model provides a high-efficient heat accumulation device which characterized in that: the heat-conducting shell comprises a heat-conducting shell body, wherein a temperature equalizing cavity, a high-temperature heat storage cavity and a low-temperature heat storage cavity are sequentially arranged in the heat-conducting shell body in a stacked manner from top to bottom; the high-temperature heat storage cavity is filled with a first solid-liquid phase-change material, and a first heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the high-temperature heat storage cavity; the low-temperature heat storage cavity is filled with a second solid-liquid phase-change material, and a second heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the low-temperature heat storage cavity; the temperature equalizing cavity is filled with a gas-liquid phase change material, the gasification temperature of the gas-liquid phase change material is higher than the melting point temperature of the first solid-liquid phase change material, and the melting point temperature of the first solid-liquid phase change material is higher than the melting point temperature of the second solid-liquid phase change material.
The working principle of the invention is as follows: the electronic element is attached to the outer surface of the upper inner wall of the temperature equalizing cavity, when the electronic element works, the liquid phase change is carried out in the temperature equalizing cavity to be gaseous, the heat generated by the electronic element absorbed by the gas during the phase change gasification is rapidly diffused to the whole temperature equalizing cavity, the temperature of the whole temperature equalizing cavity is almost in an isothermal state, and the whole temperature of the temperature equalizing cavity and the upper wall and the lower wall of the temperature equalizing cavity are increased; then the high-melting-point solid-liquid phase change material in the high-temperature heat storage cavity begins to melt after reaching the melting point, but the heat conduction coefficient of the solid-liquid phase change material is extremely low (about 0.2-0.5W/m DEG C), so that heat cannot be quickly transferred to the low-melting-point phase change material, and the phase change material cannot be fully utilized; through the inner wall that adopts cavity in first heat conduction buckled plate, second heat conduction buckled plate and the heat conduction casing, can also begin to melt the heat absorption when high-melting point phase change material melts the heat absorption, reach the effect of heat absorption simultaneously.
The method further comprises the following steps: the heat conduction shell comprises a cover plate, a baffle plate, a high-temperature cavity shell and a low-temperature cavity shell which are arranged up and down and are in sealing and fixed connection, wherein a uniform-temperature cavity is formed between the cover plate and the baffle plate, a high-temperature heat storage cavity is formed between the baffle plate and the high-temperature cavity shell, and a low-temperature heat storage cavity is formed between the high-temperature cavity shell and the low-temperature cavity shell; the split structure is convenient for assembly and fixed connection.
The method further comprises the following steps: a liquid suction core is clamped between the upper inner wall and the lower inner wall of the temperature equalizing cavity, supporting columns are uniformly distributed, the supporting columns penetrate through the liquid suction core, the supporting columns are sleeved with compression rings, and the compression rings are abutted between the liquid suction core and the lower wall of the temperature equalizing cavity; the contact between the liquid suction core and the upper wall of the temperature equalizing cavity is more uniform, and the contact thermal resistance between the upper wall of the temperature equalizing cavity and the liquid suction core is reduced.
The method further comprises the following steps: the upper end of the support column is integrally arranged with the upper wall of the temperature equalizing cavity, a boss is integrally arranged on the end face of the lower end of the support column, and the boss and the lower wall of the temperature equalizing cavity are welded by vacuum brazing; solder is paved on the lower end surface of the boss and then welded with the lower wall of the uniform temperature cavity, so that the solder can be effectively prevented from contacting with the liquid suction core.
The method further comprises the following steps: the heat conduction shell, the first heat conduction corrugated plate and the second heat conduction corrugated plate are all made of aluminum alloy materials, the liquid absorption cores are formed by silk screen composite sintering with different pore diameters, and the liquid absorption cores are made of stainless steel, copper alloy and aluminum alloy.
The method further comprises the following steps: the upper wall surface and the side wall surface of the uniform temperature cavity are both positioned in the lower surface of the cover plate, the lower wall surface and the side wall surface of the high temperature heat storage cavity are both positioned in the upper surface of the high temperature cavity shell, and the lower wall surface and the side wall surface of the low temperature heat storage cavity are both positioned in the upper surface of the low temperature cavity shell.
A method of manufacturing a high-efficiency heat storage device, based on which the method is characterized by comprising the steps of:
filling holes are reserved on the cover plate, the high-temperature cavity shell and the low-temperature cavity shell;
vacuumizing the temperature equalizing cavity, and filling the gas-liquid phase change material into the temperature equalizing cavity after the requirement of a specified vacuum degree is met;
heating the high-melting-point solid-liquid phase-change material to a liquid state, filling the high-temperature heat storage cavity, and heating the low-melting-point solid-liquid phase-change material to a liquid state, and filling the low-temperature heat storage cavity;
and extruding, welding and sealing the filling hole.
The invention has the beneficial effects that:
(1) The liquid suction core of the temperature equalizing cavity is compressed by the compression ring, so that the contact area between the liquid suction core and the upper wall of the temperature equalizing cavity is increased, meanwhile, the compression force is more uniform, the compression degree is better, the contact thermal resistance between the upper wall of the temperature equalizing cavity and the liquid suction core is reduced, and the heat transfer efficiency is improved.
(2) The support column is provided with the boss, the solder foil is paved between the top surface of the boss and the partition plate for vacuum brazing, and a gap exists between the boss and the liquid suction core, so that the problem that the solder foil flows into the liquid suction core to cause the liquid suction core to lose efficacy during welding can be effectively avoided.
(3) When the electronic element works, the temperature equalizing cavity is firstly subjected to liquid phase change to be gaseous, the heating value of the gas absorbing electronic element is rapidly diffused to the whole temperature equalizing cavity during phase change gasification, the temperature of the whole temperature equalizing cavity is almost isothermal, the whole temperature of the temperature equalizing cavity and the upper wall and the lower wall of the temperature equalizing cavity are increased, at the moment, the high-temperature heat storage layer reaches the melting point, and the high-melting-point solid-liquid phase change material begins to melt, but the heat conduction coefficient of the solid-liquid phase change material is extremely low, so that the heat cannot be rapidly transferred to the low-melting-point solid-liquid phase change material, and the phase change material cannot be fully utilized. The aluminum alloy material is clamped between the high-melting-point solid-liquid phase-change material and the low-melting-point solid-liquid phase-change material, and meanwhile, the heat conduction corrugated plates of the aluminum alloy are welded in the high-temperature heat storage cavity and the low-temperature heat storage layer cavity, so that the heat storage efficiency and capacity of the device are improved by utilizing the advantage of high heat conduction coefficient (about 160W/m DEG C) of the aluminum alloy, and the low-melting-point solid-liquid phase-change material can begin to melt and absorb heat while the high-melting-point solid-liquid phase-change material melts and absorbs heat, so that the effect of absorbing heat simultaneously is achieved, the problem that the solid-liquid phase-change heat storage material cannot be fully utilized is solved.
(4) When the electronic element works, heat is firstly transferred to the temperature equalizing cavity and the upper wall and the lower wall of the temperature equalizing cavity, when the gas-liquid phase change material is subjected to phase change gasification, the heat generated by the gas absorbing electronic element is rapidly diffused to the whole temperature equalizing cavity, the temperature of the whole temperature equalizing cavity is almost in an isothermal state, and at the moment, the high-melting-point solid-liquid phase change material can simultaneously absorb the heat released by gas liquefaction in the temperature equalizing cavity on the whole partition surface, so that the utilization rate of the phase change material is improved.
Drawings
FIG. 1 is a split block diagram of the present invention;
FIG. 2 is a schematic view of the structure of the end cap of the present invention;
fig. 3 is a schematic view of the structure of a wick according to the present invention;
FIG. 4 is a schematic view of the structure of the compression ring of the present invention;
FIG. 5 is a schematic view of a separator plate according to the present invention;
fig. 6 is a schematic structural view of a heat-conducting corrugated plate according to the present invention;
fig. 7 is a schematic structural view of a heat accumulation chamber housing in the present invention.
In the figure, 1, a cover plate; 11. a support column; 111. a boss; 2. a wick; 3. a clamp ring; 4. a partition plate; 5. a first heat conductive corrugated plate; 6. a high temperature chamber housing; 7. a second heat conductive corrugated plate; 8. a low temperature chamber housing; 9. and (5) filling the hole.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings. It should be noted that, in the examples of the present invention, terms of left, middle, right, upper, lower, etc. are merely relative concepts or references to normal use states of the product, and should not be construed as limiting.
As shown in fig. 1, the efficient heat storage device comprises a heat conduction shell, wherein a temperature equalization cavity, a high-temperature heat storage cavity and a low-temperature heat storage cavity are sequentially stacked from top to bottom in the heat conduction shell, the temperature equalization cavity is a vacuum cavity and is filled with a gas-liquid phase change material, and the gas-liquid phase change material can be water, methanol, ethanol or acetone. A liquid suction core 2 is clamped between the upper inner wall and the lower inner wall of the temperature equalizing cavity; the high-temperature heat storage cavity is filled with a high-melting-point solid-liquid phase change material, and a first heat conduction corrugated plate 5 is clamped between the upper inner wall and the lower inner wall of the high-temperature heat storage cavity; the low-temperature heat storage cavity is filled with a low-melting-point solid-liquid phase change material, a second heat conduction corrugated plate 7 is clamped between the upper inner wall and the lower inner wall of the low-temperature heat storage cavity, and the first heat conduction corrugated plate 5 and the second heat conduction corrugated plate 7 are identical in structure as shown in fig. 6; the heat conduction shell comprises a cover plate 1, a partition plate 4, a high-temperature cavity shell 6 and a low-temperature cavity shell 8 which are arranged up and down and are in sealing and fixed connection, wherein a uniform temperature cavity is formed between the cover plate 1 and the partition plate 4, a high-temperature heat storage cavity is formed between the partition plate 4 and the high-temperature cavity shell 6, a low-temperature heat storage cavity is formed between the high-temperature cavity shell 6 and the low-temperature cavity shell 8, and the partition plate 4 is a plane plate in combination with the illustration of fig. 5.
The solid-liquid phase change material can be an inorganic phase change material, an organic phase change material, a composite phase change material and liquid metal, wherein the inorganic phase change material comprises crystal water, salts, molten salts and metal; the organic phase change material comprises paraffin, the melting point of the high-melting-point solid-liquid phase change material is 50-80 ℃, and the melting point of the low-melting-point solid-liquid phase change material is 20-60 ℃; the gasification temperature of the gas-liquid phase change material is higher than the melting point temperature of the high-melting-point solid-liquid phase change material, and meanwhile, the melting point temperature of the high-melting-point solid-liquid phase change material is higher than the melting point temperature of the low-melting-point solid-liquid phase change material, and the gas-liquid phase change material, the high-melting-point solid-liquid phase change material and the low-melting-point solid-liquid phase change material have a coupling relationship.
Referring to fig. 2, support columns 11 are uniformly distributed in the temperature equalizing cavity, the support columns 11 penetrate through the liquid suction core 2, the upper end and the lower end of each support column 11 are fixedly connected with the cover plate 1 and the partition plate 4 respectively, the support columns 11 are sleeved with compression rings 3, the compression rings 3 are located between the liquid suction core 2 and the partition plate 4, the structure of the compression rings 3 is shown in fig. 4, and the structure of the liquid suction core 2 is shown in fig. 3; the upper end of the support column 11 and the cover plate 1 are integrally arranged, a boss 111 is integrally arranged on the end face of the lower end of the support column 11, and the boss 111 and the partition plate 4 are welded by vacuum brazing. The upper wall surface and the side wall surface of the temperature equalizing cavity are both positioned in the lower surface of the cover plate 1, namely a first groove is formed in the lower surface of the cover plate, the bottom surface and the side surface of the first groove are the upper wall surface and the side wall surface of the temperature equalizing cavity respectively, and the upper surface of the cover plate 1 is an electronic component mounting position; as shown in fig. 7, the high-temperature heat storage cavity shell and the low-temperature heat storage cavity shell have the same structure, the lower wall surface and the side wall surface of the high-temperature heat storage cavity are both positioned in the upper surface of the high-temperature cavity shell 6, namely, the upper surface of the high-temperature cavity shell 6 is provided with a second groove, the bottom surface and the side surface of the second groove are respectively the lower wall surface and the side wall surface of the high-temperature heat storage cavity, and the lower surface of the high-temperature cavity shell 6 is a plane; the lower wall surface and the side wall surface of the low-temperature heat storage cavity are both positioned in the upper surface of the low-temperature cavity shell 8, namely, a third groove is formed in the upper surface of the low-temperature cavity shell 8, the bottom surface and the side surface of the third groove are respectively the lower wall surface and the side wall surface of the low-temperature heat storage cavity, and the lower surface of the low-temperature cavity shell 8 is a plane.
The heat conducting shell, the first heat conducting corrugated plate 5 and the second heat conducting corrugated plate 7 are made of aluminum alloy materials, the liquid absorbing cores 5 are formed by wire mesh composite sintering of different aperture rates, and the liquid absorbing cores 5 are made of stainless steel, copper alloy, aluminum alloy and the like.
A method for manufacturing a high-efficiency heat storage device, based on which the method comprises the steps of:
step 1: preparing the cover plate, the partition plate, the high-temperature cavity shell, the low-temperature cavity shell, the liquid suction core, the compression ring, the first heat conduction corrugated plate and the second heat conduction corrugated plate; wherein the compression ring is a metal ring, and the material of the compression ring is aluminum alloy, stainless steel and the like; step 2: filling holes are reserved on the cover plate, the high-temperature cavity shell and the low-temperature cavity shell; step 3: assembling all the components in the step 1, and performing vacuum brazing according to requirements, wherein the vacuum brazing temperature is 600-610 ℃, so that the uniform temperature cavity, the high-temperature heat storage cavity and the low-temperature heat storage cavity are formed; step 4: checking the pressure resistance of the uniform temperature cavity, the high temperature heat storage cavity and the low temperature heat storage cavity; step 5: vacuumizing the uniform temperature cavity to reach a specified vacuum degree, wherein the vacuum degree is generally 1.33X10 -3 Pa, filling the gas-liquid phase change material into the temperature equalizing cavity, wherein the liquid filling amount is about 25% of the volume of the temperature equalizing cavity; step 6: heating the high-melting-point solid-liquid phase-change material to a liquid state, filling the high-temperature heat storage cavity, and heating the low-melting-point solid-liquid phase-change material to a liquid state, and filling the low-temperature heat storage cavity; step 7: and extruding, welding and sealing the filling hole.
In the step 1, allowance is reserved on the outer sides of the cover plate, the partition plate, the high-temperature cavity shell and the low-temperature cavity shell; processing for the shape; in the step 3, before assembly, the cover plate, the partition plate, the high-temperature cavity shell, the low-temperature cavity shell, the compression ring, the first heat-conducting corrugated plate and the second heat-conducting corrugated plate are subjected to oxidation film removal, oil removal and drying, and the liquid absorption core is dried.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A thermal storage device characterized in that: the heat-conducting shell comprises a heat-conducting shell body, wherein a temperature equalizing cavity, a high-temperature heat storage cavity and a low-temperature heat storage cavity are sequentially arranged in the heat-conducting shell body in a stacked manner from top to bottom; the high-temperature heat storage cavity is filled with a first solid-liquid phase-change material, and a first heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the high-temperature heat storage cavity; the low-temperature heat storage cavity is filled with a second solid-liquid phase-change material, and a second heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the low-temperature heat storage cavity; the temperature equalizing cavity is filled with a gas-liquid phase change material, the gasification temperature of the gas-liquid phase change material is higher than the melting point temperature of the first solid-liquid phase change material, and the melting point temperature of the first solid-liquid phase change material is higher than the melting point temperature of the second solid-liquid phase change material.
2. The thermal storage device according to claim 1, wherein: the heat conduction shell comprises a cover plate, a partition plate, a high-temperature cavity shell and a low-temperature cavity shell which are arranged up and down and are in sealing and fixed connection, wherein a uniform-temperature cavity is formed between the cover plate and the partition plate, a high-temperature heat storage cavity is formed between the partition plate and the high-temperature cavity shell, and a low-temperature heat storage cavity is formed between the high-temperature cavity shell and the low-temperature cavity shell.
3. A thermal storage device according to claim 1 or 2, wherein: the liquid suction core and the support columns are uniformly distributed between the upper inner wall and the lower inner wall of the temperature equalizing cavity, the support columns penetrate through the liquid suction core, the support columns are sleeved with compression rings, and the compression rings are abutted between the liquid suction core and the lower wall of the temperature equalizing cavity.
4. A thermal storage apparatus according to claim 3, wherein: the upper end of the support column and the upper wall of the temperature equalizing cavity are integrally arranged, a boss is integrally arranged on the end face of the lower end of the support column, and the boss and the lower wall of the temperature equalizing cavity are welded by vacuum brazing.
5. The thermal storage device according to claim 4, wherein: the heat conduction shell, the first heat conduction corrugated plate and the second heat conduction corrugated plate are all made of aluminum alloy materials, the liquid absorption cores are formed by silk screen composite sintering with different pore diameters, and the liquid absorption cores are made of stainless steel, copper alloy and aluminum alloy.
6. A method of manufacturing a heat storage device, based on the high-efficiency heat storage device according to claim 5, comprising the steps of:
filling holes are reserved on the cover plate, the high-temperature cavity shell and the low-temperature cavity shell;
vacuumizing the temperature equalizing cavity, and filling the gas-liquid phase change material into the temperature equalizing cavity after the requirement of a specified vacuum degree is met;
heating the high-melting-point solid-liquid phase-change material to a liquid state, filling the high-temperature heat storage cavity, and heating the low-melting-point solid-liquid phase-change material to a liquid state, and filling the low-temperature heat storage cavity;
and extruding, welding and sealing the filling hole.
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| CN110584877B (en) * | 2019-10-15 | 2023-08-08 | 南京泰立瑞信息科技有限公司 | Passive constant temperature system and constant temperature preparation device thereof |
| CN112888267B (en) * | 2021-02-05 | 2022-09-20 | 华南理工大学 | Ultrathin flexible vapor chamber and manufacturing method thereof |
| CN113074570A (en) * | 2021-03-12 | 2021-07-06 | 上海卫星工程研究所 | Composite phase-change flat heat pipe for satellite |
| CN113710062A (en) * | 2021-08-24 | 2021-11-26 | 电子科技大学 | Multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device |
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| CN109654929A (en) | 2019-04-19 |
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