CN209820237U - High-efficient heat accumulation device - Google Patents
High-efficient heat accumulation device Download PDFInfo
- Publication number
- CN209820237U CN209820237U CN201920249010.7U CN201920249010U CN209820237U CN 209820237 U CN209820237 U CN 209820237U CN 201920249010 U CN201920249010 U CN 201920249010U CN 209820237 U CN209820237 U CN 209820237U
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- temperature
- phase change
- cavity
- change material
- liquid phase
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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Abstract
The utility model provides a high-efficiency heat storage device, which comprises a heat conduction shell, wherein a uniform temperature cavity, a high-temperature heat storage cavity and a low-temperature heat storage cavity are sequentially stacked in the heat conduction shell from top to bottom, a gas-liquid phase change material is filled in the uniform temperature cavity, a high-melting-point solid-liquid phase change material is filled in the high-temperature heat storage cavity, and a first heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the high-temperature heat storage cavity; the low-temperature heat storage cavity is filled with a low-melting-point solid-liquid phase change material, and a second heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the low-temperature heat storage cavity. Electronic component during operation, the heat at first transmits for samming chamber and its upper and lower wall, and when gas-liquid phase change material phase transition gasification, gaseous absorption electronic component calorific capacity spreads whole samming chamber rapidly, and at this moment solid-liquid phase change material can absorb the heat that gas liquefaction emits in the samming chamber simultaneously on whole baffle face, shows the utility model discloses a heat conduction and heat accumulation.
Description
Technical Field
The utility model relates to a heat accumulation device's technical field, concretely relates to high-efficient heat accumulation device.
Background
Modern electronic components are moving at explosive speeds towards high density, micro-volume system integration, and thus high power consumption or high heat flux density becomes a stumbling block for stable system operation and performance enhancement. How to manage high heat flux density in a narrow space has become a key issue for improving the performance of electronic components.
Particularly, in some application fields of short-time high-power electronic components, such as lasers and missiles, a large amount of heat often occurs in a short time, but there is not enough space and weight resources to arrange a heat sink to conduct away the heat, so that a device capable of storing heat quickly and efficiently is urgently needed to solve the problem of over-temperature of the electronic components.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a high-efficient heat accumulation device.
An efficient heat storage device, characterized in that: the heat-conducting shell comprises a heat-conducting shell body, and a uniform temperature cavity, a high-temperature heat storage cavity and a low-temperature heat storage cavity which are sequentially stacked in the heat-conducting shell body from top to bottom; a first solid-liquid phase change material is filled in the high-temperature heat storage cavity, and a first heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the high-temperature heat storage cavity; a second solid-liquid phase change material is filled in the low-temperature heat storage cavity, and a second heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the low-temperature heat storage cavity; the temperature equalizing cavity is filled with a gas-liquid phase change material, the gasification temperature of the gas-liquid phase change material is higher than the melting point temperature of the first solid-liquid phase change material, and the melting point temperature of the first solid-liquid phase change material is higher than the melting point temperature of the second solid-liquid phase change material.
The utility model discloses a theory of operation: the outer surface of the upper inner wall of the temperature-equalizing cavity is attached with an electronic element, when the electronic element works, liquid phase change is carried out in the temperature-equalizing cavity to be gaseous, gas absorbs the heat of the electronic element during phase change gasification and rapidly diffuses to the whole temperature-equalizing cavity, the temperature of the whole temperature-equalizing cavity is almost in an isothermal state, and the integral temperature of the temperature-equalizing cavity and the upper wall and the lower wall of the temperature-equalizing cavity is increased; then the high-melting-point solid-liquid phase-change material in the high-temperature heat storage cavity begins to melt after reaching the melting point, but the heat conductivity coefficient of the solid-liquid phase-change material is extremely low (about 0.2-0.5W/m DEG C), so that heat cannot be quickly transferred to the low-melting-point phase-change material, and the phase-change material cannot be fully utilized; through the inner wall of cavity in adopting first heat conduction buckled plate, second heat conduction buckled plate and the heat conduction casing, can also begin to melt the heat absorption at low melting point phase change material when high melting point phase change material melts the heat absorption, reach the endothermic effect simultaneously.
Further comprises the following steps: the heat conducting shell comprises a cover plate, a partition plate, a high-temperature cavity shell and a low-temperature cavity shell which are arranged up and down and fixedly connected in a sealing mode, a temperature equalizing cavity is formed between the cover plate and the partition plate, a high-temperature heat storage cavity is formed between the partition plate and the high-temperature cavity shell, and a low-temperature heat storage cavity is formed between the high-temperature cavity shell and the low-temperature cavity shell; the split structure is convenient for assembly and fixed connection.
Further comprises the following steps: liquid absorption cores and supporting columns are clamped between the upper inner wall and the lower inner wall of the temperature-equalizing cavity, the supporting columns penetrate through the liquid absorption cores, pressing rings are sleeved on the supporting columns, and the pressing rings abut against the liquid absorption cores and the lower wall of the temperature-equalizing cavity; the contact between the liquid absorption core and the upper wall of the temperature-equalizing cavity is more uniform, and the thermal contact resistance between the upper wall of the temperature-equalizing cavity and the liquid absorption core is reduced.
Further comprises the following steps: the upper end of the supporting column is integrally arranged with the upper wall of the temperature-equalizing cavity, a boss is integrally arranged on the end face of the lower end of the supporting column, and the boss and the lower wall of the temperature-equalizing cavity are welded by vacuum brazing; solder is laid on the lower end face of the boss and then welded with the lower wall of the temperature equalizing cavity, so that the solder can be effectively prevented from contacting the liquid absorbing core.
Further comprises the following steps: the upper wall surface and the side wall surface of the uniform temperature cavity are both located in the lower surface of the cover plate, the lower wall surface and the side wall surface of the high-temperature heat storage cavity are both located in the upper surface of the high-temperature cavity shell, and the lower wall surface and the side wall surface of the low-temperature heat storage cavity are both located in the upper surface of the low-temperature cavity shell.
Further comprises the following steps: heat conduction casing, first heat conduction buckled plate and second heat conduction buckled plate are aluminum alloy material, the wick forms for the compound sintering of silk screen of different aperture rates, the material of wick is stainless steel, copper alloy, aluminum alloy etc..
The utility model has the advantages that:
(1) the liquid absorption core of the uniform temperature cavity is compressed by the compression ring, so that the contact area between the liquid absorption core and the upper wall of the uniform temperature cavity is increased, meanwhile, the compression force is more uniform, the compression degree is better, the thermal contact resistance between the upper wall of the uniform temperature cavity and the liquid absorption core is reduced, and the heat transfer efficiency is improved.
(2) The design has the boss on the support column, lays the solder foil between boss top surface and the baffle and carries out vacuum brazing, has the space between boss and the imbibition core, and solder foil flows into the imbibition core when can effectively avoiding welding, leads to the problem that the imbibition core became invalid.
(3) When the electronic element works, firstly, the temperature equalizing cavity carries out liquid phase change to be gaseous, when the electronic element is gasified through phase change, gas absorbs the heat of the electronic element and quickly diffuses to the whole temperature equalizing cavity, the temperature of the whole temperature equalizing cavity is almost in an isothermal state, the integral temperature of the temperature equalizing cavity and the upper wall and the lower wall of the temperature equalizing cavity are raised, at the moment, the high-temperature heat storage layer reaches a melting point, the high-melting-point solid-liquid phase change material starts to melt, but because the heat conductivity coefficient of the solid-liquid phase change material is extremely low, the heat can not be quickly transferred to the low-melting. Aluminium alloy material is pressed from both sides between high melting point solid-liquid phase change material and the low melting point solid-liquid phase change material, the heat conduction buckled plate of aluminium alloy has all been welded to high temperature heat accumulation chamber and low temperature heat accumulation layer chamber simultaneously, utilize the advantage of aluminium alloy high thermal conductivity (about 160W/m DEG C), can melt endothermic while high melting point solid-liquid phase change material melts endothermic low melting point solid-liquid phase change material also begins to melt endothermic, reach the effect of endothermic simultaneously, solve the problem that solid-liquid phase change heat accumulation material often can not make full use of, improve the heat storage efficiency and the ability of device.
(4) When the electronic element works, heat is firstly transferred to the temperature equalizing cavity and the upper wall and the lower wall of the temperature equalizing cavity, when the gas-liquid phase change material is subjected to phase change gasification, the heat generated by the gas absorption electronic element is rapidly diffused to the whole temperature equalizing cavity, the temperature of the whole temperature equalizing cavity is almost in an isothermal state, and at the moment, the high-melting-point solid-liquid phase change material can simultaneously absorb the heat generated by gas liquefaction in the temperature equalizing cavity on the whole partition plate surface, so that the utilization rate of the phase change material is improved.
Drawings
FIG. 1 is a view showing a structure of the present invention;
fig. 2 is a schematic structural view of the end cap of the present invention;
fig. 3 is a schematic structural view of a wick according to the present invention;
fig. 4 is a schematic structural view of the middle pressing ring of the present invention;
FIG. 5 is a schematic structural view of the middle partition plate of the present invention;
fig. 6 is a schematic structural view of a heat-conducting corrugated plate according to the present invention;
fig. 7 is a schematic structural diagram of the medium thermal storage cavity casing of the present invention.
In the figure, 1, a cover plate; 11. a support pillar; 111. a boss; 2. a wick; 3. a compression ring; 4. a partition plate; 5. a first thermally conductive corrugated plate; 6. a high temperature chamber housing; 7. a second thermally conductive corrugated plate; 8. a cryogenic chamber housing; 9. and (4) a filling hole.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings. It should be noted that the terms of orientation such as left, middle, right, up and down in the examples of the present invention are only relative to each other or are referred to the normal use status of the product, and should not be considered as limiting.
As shown in fig. 1, the efficient heat storage device comprises a heat conduction shell, wherein a uniform temperature cavity, a high temperature heat storage cavity and a low temperature heat storage cavity are sequentially stacked in the heat conduction shell from top to bottom, the uniform temperature cavity is a vacuum cavity and is filled with a gas-liquid phase change material, and the gas-liquid phase change material can be water, methanol, ethanol and acetone. A liquid absorption core 2 is clamped between the upper inner wall and the lower inner wall of the temperature equalizing cavity; the high-temperature heat storage cavity is filled with a high-melting-point solid-liquid phase change material, and a first heat conduction corrugated plate 5 is clamped between the upper inner wall and the lower inner wall of the high-temperature heat storage cavity; the low-temperature heat storage cavity is filled with a low-melting-point solid-liquid phase change material, a second heat conduction corrugated plate 7 is clamped between the upper inner wall and the lower inner wall of the low-temperature heat storage cavity, and as shown in fig. 6, the first heat conduction corrugated plate 5 and the second heat conduction corrugated plate 7 have the same structure; the heat conduction casing is including setting up from top to bottom and sealed fixed connection's apron 1, baffle 4, high temperature chamber casing 6 and low temperature chamber casing 8 form between apron 1 and the baffle 4 the samming chamber forms between baffle 4 and the high temperature chamber casing 6 the high temperature heat accumulation chamber form between high temperature chamber casing 6 and the low temperature chamber casing 8 the low temperature heat accumulation chamber combines shown in figure 5, baffle 4 is the plane board.
The solid-liquid phase change material can be an inorganic phase change material, an organic phase change material, a composite phase change material and liquid metal, wherein the inorganic phase change material comprises crystallized water, salt, molten salt and metal, the organic phase change material comprises paraffin, the melting point of the high-melting-point solid-liquid phase change material is 50 ℃ ~ 80 ℃, the melting point range of the low-melting-point solid-liquid phase change material is 20 ℃ ~ 60 ℃, the gasification temperature of the gas-liquid phase change material is higher than the melting point temperature of the high-melting-point solid-liquid phase change material, and the melting point temperature of the high-melting-point solid-liquid phase change material is higher than the melting point temperature of the low-melting-point solid-liquid phase change material, and the inorganic phase.
Referring to fig. 2, support columns 11 are uniformly distributed in the temperature equalizing cavity, the support columns 11 penetrate through the liquid absorbing core 2, the upper end and the lower end of each support column 11 are respectively fixedly connected with the cover plate 1 and the partition plate 4, the support columns 11 are sleeved with compression rings 3, the compression rings 3 are located between the liquid absorbing core 2 and the partition plate 4, the structure of each compression ring 3 is shown in fig. 4, and the structure of the liquid absorbing core 2 is shown in fig. 3; the upper end of the support column 11 and the cover plate 1 are integrally arranged, a boss 111 is integrally arranged on the end face of the lower end of the support column 11, and the boss 111 and the partition plate 4 are welded through vacuum brazing. The upper wall surface and the side wall surface of the temperature equalizing cavity are both positioned in the lower surface of the cover plate 1, namely, a first groove is formed in the lower surface of the cover plate, and the bottom surface and the side surface of the first groove are respectively the upper wall surface and the side wall surface of the temperature equalizing cavity, and the upper surface of the cover plate 1 is an electronic element mounting position; as shown in fig. 7, the high-temperature heat storage chamber shell and the low-temperature heat storage chamber shell have the same structure, the lower wall surface and the side wall surface of the high-temperature heat storage chamber are both located in the upper surface of the high-temperature chamber shell 6, that is, the upper surface of the high-temperature chamber shell 6 is provided with a second groove, the bottom surface and the side surface of the second groove are respectively the lower wall surface and the side wall surface of the high-temperature heat storage chamber, and the lower surface of the high-temperature chamber shell 6 is a plane; the lower wall surface and the side wall surface of the low-temperature heat storage cavity are both located in the upper surface of the low-temperature cavity shell 8, namely, a third groove is formed in the upper surface of the low-temperature cavity shell 8, the bottom surface and the side surface of the third groove are respectively the lower wall surface and the side wall surface of the low-temperature heat storage cavity, and the lower surface of the low-temperature cavity shell 8 is a plane.
Wherein, heat conduction casing, first heat conduction buckled plate 5 and second heat conduction buckled plate 7 are aluminum alloy material, wick 5 forms for the compound sintering of silk screen of different aperture rates, and wick 5's material is stainless steel, copper alloy, aluminum alloy etc..
The manufacturing method of the utility model is based on the high-efficient heat accumulation device, including the following steps:
step 1, preparing the cover plate, the partition plate, the high-temperature cavity shell, the low-temperature cavity shell, the liquid absorption core, the compression ring, the first heat conduction corrugated plate and the second heat conduction corrugated plate, wherein the compression ring is a metal ring and is made of aluminum alloy, stainless steel and the like, step 2, reserving filling holes in the cover plate, the high-temperature cavity shell and the low-temperature cavity shell, step 3, assembling the components in the step 1, carrying out vacuum brazing according to requirements, wherein the vacuum brazing temperature is 600 ℃ and ~ 610 ℃, so that the uniform temperature cavity, the high-temperature heat storage cavity and the low-temperature heat storage cavity are formed, step 4, checking the pressure resistance of the uniform temperature cavity, the high-temperature heat storage cavity and the low-temperature heat storage cavity, and step 5, vacuumizing the uniform temperature cavity, and after the specified vacuum degree requirement is met, the vacuum degree generally requires 1.33 x 10-3Pa, filling the gas-liquid phase change material into the temperature-equalizing cavity, wherein the filling amount of liquid is about 25% of the volume of the temperature-equalizing cavity; step 6: heating the high-melting-point solid-liquid phase change material to a liquid state, filling the high-temperature heat storage cavity with the high-melting-point solid-liquid phase change material, and filling the low-melting-point solid-liquid phase change material into the high-temperature heat storage cavityThe point solid-liquid phase change material is heated to a liquid state and then is filled into the low-temperature heat storage cavity; and 7: and extruding, welding and sealing the filling hole.
In the step 1, allowances are reserved on the outer sides of the cover plate, the partition plate, the high-temperature cavity shell and the low-temperature cavity shell; processing for the shape; in step 3, before the assembly, it is right apron, baffle, high temperature chamber casing, low temperature chamber casing, clamp ring, first heat conduction buckled plate and second heat conduction buckled plate go on going off the oxidation film, deoiling and drying, it is right wick liquid is dried.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. An efficient heat storage device, characterized in that: the heat-conducting shell comprises a heat-conducting shell body, and a uniform temperature cavity, a high-temperature heat storage cavity and a low-temperature heat storage cavity which are sequentially stacked in the heat-conducting shell body from top to bottom; a first solid-liquid phase change material is filled in the high-temperature heat storage cavity, and a first heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the high-temperature heat storage cavity; a second solid-liquid phase change material is filled in the low-temperature heat storage cavity, and a second heat conduction corrugated plate is clamped between the upper inner wall and the lower inner wall of the low-temperature heat storage cavity; the temperature equalizing cavity is filled with a gas-liquid phase change material, the gasification temperature of the gas-liquid phase change material is higher than the melting point temperature of the first solid-liquid phase change material, and the melting point temperature of the first solid-liquid phase change material is higher than the melting point temperature of the second solid-liquid phase change material.
2. A high efficiency thermal storage apparatus according to claim 1, wherein: the heat conduction casing is including setting up from top to bottom and sealed fixed connection's apron, baffle, high temperature chamber casing and low temperature chamber casing form between apron and the baffle the samming chamber form between baffle and the high temperature chamber casing high temperature heat accumulation chamber forms between high temperature chamber casing and the low temperature chamber casing low temperature heat accumulation chamber.
3. A high-efficiency thermal storage device according to claim 1 or 2, characterized in that: the temperature-equalizing chamber is characterized in that a liquid suction core and support columns are clamped between the upper inner wall and the lower inner wall of the temperature-equalizing chamber, the support columns penetrate through the liquid suction core, compression rings are sleeved on the support columns, and the compression rings are abutted between the liquid suction core and the lower wall of the temperature-equalizing chamber.
4. A high efficiency thermal storage apparatus according to claim 3, wherein: the upper end of the supporting column and the upper wall of the uniform temperature cavity are integrally arranged, a boss is integrally arranged on the end face of the lower end of the supporting column, and the boss and the lower wall of the uniform temperature cavity are welded in a vacuum brazing mode.
5. A high efficiency thermal storage apparatus according to claim 4, wherein: heat conduction casing, first heat conduction buckled plate and second heat conduction buckled plate are aluminum alloy material, the wick forms for the compound sintering of silk screen of different aperture rates, the material of wick is stainless steel, copper alloy, aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920249010.7U CN209820237U (en) | 2019-02-27 | 2019-02-27 | High-efficient heat accumulation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920249010.7U CN209820237U (en) | 2019-02-27 | 2019-02-27 | High-efficient heat accumulation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209820237U true CN209820237U (en) | 2019-12-20 |
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ID=68873895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920249010.7U Withdrawn - After Issue CN209820237U (en) | 2019-02-27 | 2019-02-27 | High-efficient heat accumulation device |
Country Status (1)
| Country | Link |
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| CN (1) | CN209820237U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109654929A (en) * | 2019-02-27 | 2019-04-19 | 新乡市特美特热控技术股份有限公司 | A kind of high-efficiency thermal storage device and its manufacturing method |
| CN112672604A (en) * | 2020-12-22 | 2021-04-16 | Oppo（重庆）智能科技有限公司 | Vapor chamber, case, and electronic device |
-
2019
- 2019-02-27 CN CN201920249010.7U patent/CN209820237U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109654929A (en) * | 2019-02-27 | 2019-04-19 | 新乡市特美特热控技术股份有限公司 | A kind of high-efficiency thermal storage device and its manufacturing method |
| CN109654929B (en) * | 2019-02-27 | 2023-08-15 | 新乡市特美特热控技术股份有限公司 | Efficient heat storage device and manufacturing method thereof |
| CN112672604A (en) * | 2020-12-22 | 2021-04-16 | Oppo（重庆）智能科技有限公司 | Vapor chamber, case, and electronic device |
| CN112672604B (en) * | 2020-12-22 | 2023-04-21 | Oppo（重庆）智能科技有限公司 | Vapor chamber, shell and electronic device |
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| GR01 | Patent grant | ||
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| AV01 | Patent right actively abandoned |
Granted publication date: 20191220 Effective date of abandoning: 20230815 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20191220 Effective date of abandoning: 20230815 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |