CN112839498A - Aluminum brazing type soaking plate - Google Patents

Aluminum brazing type soaking plate Download PDF

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Publication number
CN112839498A
CN112839498A CN202110295629.3A CN202110295629A CN112839498A CN 112839498 A CN112839498 A CN 112839498A CN 202110295629 A CN202110295629 A CN 202110295629A CN 112839498 A CN112839498 A CN 112839498A
Authority
CN
China
Prior art keywords
heat
apron
plate
conducting plate
evaporation layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110295629.3A
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Chinese (zh)
Inventor
魏远海
韦祥益
许国尚
李文用
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANNING BALING Tech Inc
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NANNING BALING Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANNING BALING Tech Inc filed Critical NANNING BALING Tech Inc
Priority to CN202110295629.3A priority Critical patent/CN112839498A/en
Publication of CN112839498A publication Critical patent/CN112839498A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309Evaporators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model provides an aluminium formula soaking pit of brazing, including the heat-conducting plate, the apron, imbibition core and evaporation layer, the imbibition core pastes the heat-conducting plate, the imbibition core is pasted to the evaporation layer, the evaporation layer is pushed down to the apron, the apron pastes tight heat-conducting plate all around, the apron middle part is equipped with a plurality of apron bumps toward the heat-conducting plate direction and hugs closely the heat-conducting plate, the imbibition core is opened there is the imbibition core that is bigger than the apron bump and is dodged the hole, the evaporation layer is opened there is the evaporation layer that is bigger than the apron bump and is dodged the hole, the. The invention has compact structure, good strength, uniform heat transfer and high efficiency.

Description

Aluminum brazing type soaking plate
Technical Field
The invention relates to the field of heat transfer devices, in particular to an aluminum brazing type vapor chamber, which is suitable for the fields of electronic chip heat dissipation, LED heat dissipation and battery heat dissipation.
Background
The vapor chamber is a vacuum cavity with a fine structure inside, realizes rapid heat transfer by filling working medium inside for cyclic evaporation and condensation, and is widely applied to the fields of electronic chip heat dissipation, LED heat dissipation, mobile phone heat dissipation and the like.
The existing vapor chamber is usually made of copper, and the chamber is connected and sealed in a diffusion welding mode, so that the material cost and the process cost are very high, and the production efficiency is low; another common vapor chamber has an inflation structure, no wick inside, and low heat transfer efficiency.
Disclosure of Invention
The invention aims to provide an aluminum brazing type soaking plate which is compact in structure, good in strength, uniform in heat transfer and high in efficiency.
The technical scheme adopted by the invention is as follows: the utility model provides an aluminium formula soaking pit of brazing, including the heat-conducting plate, the apron, imbibition core and evaporation layer, the imbibition core pastes the heat-conducting plate, the imbibition core is pasted to the evaporation layer, the evaporation layer is pushed down to the apron, the apron periphery pastes tight heat-conducting plate, the apron middle part is equipped with a plurality of apron bump toward the heat-conducting plate direction and hugs closely the heat-conducting plate, the imbibition core is opened there is the imbibition core that is greater than the apron bump and is dodged the hole, the evaporation layer is opened there is the evaporation layer that is greater than the apron bump and is.
The cover plate and the heat conducting plate are made of aluminum.
The heat conducting plate is rolled with a plurality of heat conducting plate salient points along the cover plate direction to be abutted and attached with the cover plate salient points.
The periphery of the cover plate, the salient points of the cover plate and the heat conducting plate are tightly attached to form a whole through high-temperature brazing.
The sum of the thicknesses of the evaporation layer and the liquid absorption core is equal to the gap between the cover plate and the middle part of the heat conduction plate.
The evaporation layer and the liquid absorption core are made of any one of integrated foaming metal, single-layer woven wire mesh, multi-layer metal woven wire mesh and sintered metal powder.
The evaporation layer has pores larger than the pores of the wick.
The invention has the outstanding technical effects that:
1. the liquid absorption core can quickly and uniformly absorb liquid-phase media at any position of the heat conduction plate to the whole liquid absorption core due to the capillary adsorption effect, and the heat transfer efficiency is high.
2. Simple process, compact structure, high compressive strength and low cost.
Drawings
FIG. 1 is a schematic structural view of an aluminum brazed soaking plate according to the present invention.
FIG. 2 is a schematic partial cross-sectional view of an aluminum brazed soaking plate according to the present invention.
Fig. 3 is another partial cross-sectional view of an aluminum brazed soaking plate according to the present invention.
Labeled as: heat-conducting plate 1, cover plate 2, wick 3, evaporation layer 4, heat-conducting plate bumps 11, cover plate bumps 21, solder layer 22, filling port 23, wick avoiding hole 31, evaporation layer avoiding hole 41.
Detailed Description
The technical constitution of the present invention will be described in further detail below with reference to the drawings and examples.
It should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" in the description of the present invention are to be construed broadly, and may be, for example, fixedly, detachably, or integrally, mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 to 2, the aluminum brazing type soaking plate of the present invention comprises a heat conducting plate 1, a cover plate 2, a liquid absorbing core 3 and an evaporation layer 4, and the specific structure and connection relationship are as follows:
wick 3 pastes heat-conducting plate 1, evaporation layer 4 pastes wick 3, apron 2 pushes down evaporation layer 4, apron 2 pastes tight heat-conducting plate 1 all around, apron 2 middle part is equipped with a plurality of apron bumps 21 towards heat-conducting plate 1 direction and hugs closely heat-conducting plate 1, wick 3 division has the wick that is bigger than apron bump 21 to dodge hole 31, evaporation layer 4 is opened has the evaporation layer that is bigger than apron bump 21 to dodge hole 41, apron 2 is equipped with filler mouth 23, the face of apron 2 and the laminating of heat-conducting plate 1 is equipped with solder layer 22.
As shown in fig. 3, the heat-conducting plate 1 is rolled toward the cover plate 2 to form heat-conducting plate protrusions 11 and cover plate protrusions 21 which are butted against each other.
The periphery of the cover plate 2, the cover plate salient points 21 and the heat conducting plate 1 are tightly attached to form a whole through high-temperature brazing.
The sum of the thicknesses of the evaporation layer 4 and the liquid absorption core 3 is equal to the gap between the cover plate 2 and the middle part of the heat conduction plate 1.
The working principle and the process are as follows:
as shown in fig. 1, when the temperatures of the heat-conducting plate 1 are inconsistent, the evaporation rate of the high-temperature region is high, and the evaporation rate of the low-temperature region is low, due to the capillary adsorption effect of the liquid-absorbing core 3, the liquid-phase medium fills the liquid-absorbing core 3 and is rapidly supplemented to the high-temperature region, so that the temperature of the high-temperature region is reduced, the temperature uniformity of the heat-conducting plate 1 is ensured, the liquid-phase medium at any position of the heat-conducting plate can be rapidly and uniformly adsorbed to the whole liquid-absorbing core.

Claims (7)

1. An aluminum brazing type soaking plate is characterized in that: including the heat-conducting plate, the apron, imbibition core and evaporation layer, the imbibition core pastes the heat-conducting plate, the evaporation layer pastes the imbibition core, the evaporation layer is pushed down to the apron, the peripheral tight heat-conducting plate that pastes of apron, the apron middle part is equipped with a plurality of apron bump toward the heat-conducting plate direction and hugs closely the heat-conducting plate, the imbibition core is opened there is the imbibition core bigger than the apron bump and is dodged the hole, the evaporation layer is opened there is the evaporation layer bigger than the apron bump and is dodged the hole, the apron is.
2. The aluminum brazed soaking plate according to claim 1, wherein the cover plate and the heat conducting plate are made of aluminum.
3. The aluminum brazing soaking plate according to claim 1, wherein the heat conducting plate is rolled with a plurality of heat conducting plate salient points along the cover plate direction to be butted and attached with the cover plate salient points.
4. The aluminum-brazed soaking plate as in claim 1, wherein the periphery of the cover plate, the salient points of the cover plate and the heat conducting plate are tightly adhered to form a whole by high-temperature brazing.
5. The aluminum brazed soaking plate according to claim 1, wherein the sum of the thicknesses of the evaporation layer and the wick is equal to the gap between the cover plate and the middle of the heat conductive plate.
6. The aluminum brazed soaking plate according to claim 1, wherein the evaporation layer and the wick are made of any one of a single-layer woven metal, a single-layer woven wire mesh, a multi-layer woven metal wire mesh, or sintered metal powder.
7. The aluminum brazed heat spreader plate of claim 1, wherein the evaporation layer has larger pores than the pores of the wick.
CN202110295629.3A 2021-03-19 2021-03-19 Aluminum brazing type soaking plate Pending CN112839498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110295629.3A CN112839498A (en) 2021-03-19 2021-03-19 Aluminum brazing type soaking plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110295629.3A CN112839498A (en) 2021-03-19 2021-03-19 Aluminum brazing type soaking plate

Publications (1)

Publication Number Publication Date
CN112839498A true CN112839498A (en) 2021-05-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110295629.3A Pending CN112839498A (en) 2021-03-19 2021-03-19 Aluminum brazing type soaking plate

Country Status (1)

Country Link
CN (1) CN112839498A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113606970A (en) * 2021-07-27 2021-11-05 华南理工大学 Ultrathin soaking plate and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113606970A (en) * 2021-07-27 2021-11-05 华南理工大学 Ultrathin soaking plate and preparation method thereof

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