CN110360860A - A kind of processing method of soldering formula soaking plate - Google Patents
A kind of processing method of soldering formula soaking plate Download PDFInfo
- Publication number
- CN110360860A CN110360860A CN201910656707.0A CN201910656707A CN110360860A CN 110360860 A CN110360860 A CN 110360860A CN 201910656707 A CN201910656707 A CN 201910656707A CN 110360860 A CN110360860 A CN 110360860A
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- Prior art keywords
- plate
- aluminium
- particulate matter
- processing method
- base composite
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- 238000002791 soaking Methods 0.000 title claims abstract description 44
- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 238000003672 processing method Methods 0.000 title claims abstract description 23
- 239000002131 composite material Substances 0.000 claims abstract description 51
- 239000000945 filler Substances 0.000 claims abstract description 27
- 239000011159 matrix material Substances 0.000 claims abstract description 19
- 238000011049 filling Methods 0.000 claims abstract description 7
- 239000013618 particulate matter Substances 0.000 claims description 53
- 229910052782 aluminium Inorganic materials 0.000 claims description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 26
- 239000004411 aluminium Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 238000005219 brazing Methods 0.000 claims description 17
- 239000007767 bonding agent Substances 0.000 claims description 6
- 239000004088 foaming agent Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 238000005253 cladding Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 18
- 239000010410 layer Substances 0.000 description 16
- 239000007788 liquid Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910000632 Alusil Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/04—Arrangements for sealing elements into header boxes or end plates
- F28F9/16—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
- F28F9/18—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to soaking plate manufacturing technology field, a kind of processing method for specifically disclosing soldering formula soaking plate, comprising the following steps: step S1: stock prepares two plate bodys and filler, and at least one of two plate bodys are aluminium-base composite plate；Step S2: fitting fits two plate bodys；Step S3: soldering；Step S4: filling working medium, the processing method that the present invention uses, at least one in two plate bodys prepared is aluminium-base composite plate, aluminium-base composite plate includes matrix and clad, at least one of two plate bodys have groove, and sealing forms soaking plate after fitting, soldering, filling working medium, and processing method is more convenient, efficient, while reducing the cost of material and processing, the weight of soaking plate is alleviated.
Description
Technical field
The present invention relates to soaking plate manufacturing technology field more particularly to a kind of processing methods of soldering formula soaking plate.
Background technique
Soaking plate is the plank frame being combined by two pieces of metal substrates, and with hollow close between two pieces of metal plates
Closed chamber body.Airtight cavity is in negative pressure state, is filled with phase-change working substance in cavity, also there are portion cavities.When work, pyrotoxin
Soaking plate is transferred heat to, rapid evaporation is steam after the intracorporal liquid refrigerant of closed chamber is heated under subnormal ambient, and fast
Speed is diffused into entire airtight cavity, cold by condensing behind the surface of soaking plate or the radiating fin connecting with soaking plate heat dissipation
The liquid of liquid after solidifying flows back into bottom cycle again, to reach temperature uniforming heat radiation effect.
Existing soaking plate is welded after generalling use two pieces of copper substrate punching presses, and welding process is along two pieces of copper substrates
Joint place carry out, processing trouble, complex process, and high there is also material and processing cost and manufactured soaking plate weight is big
The shortcomings that.
Summary of the invention
It is troublesome that the purpose of the present invention is to solve the processing of copper soaking plate existing in the prior art, complex process,
Material and processing cost are high, and the disadvantage that weight is big, and a kind of processing method of the soldering formula soaking plate proposed.
To achieve the goals above, present invention employs following technical solutions:
A kind of processing method of soldering formula soaking plate, comprising the following steps:
Step S1: stock prepares two plate bodys, and one of plate body is aluminium sheet, another plate body is aluminium-base composite plate, or
Person, two plate bodys are aluminium-base composite plate, and the aluminium-base composite plate includes the cladding of matrix with the surface that described matrix is arranged in
Layer, the fusing point of the clad is lower than described matrix and the fusing point of the aluminium sheet, wherein at least one of two plate bodys tool
It is fluted；
Step S2: fitting fits two plate bodys, and after two plate bodys are bonded, at least one aluminium-base composite plate
Clad is in binding face；
Step S3: soldering will have after reeded aluminium-base composite plate is placed in the lower section of another plate body, to described two plates
The overall structure after closing to be shown consideration for be brazed, brazing temperature is higher than the fusing point of the clad and is lower than the fusing point of described matrix,
And then the clad is melted, fix two plate bodys after the clad is cooling and forms the board-like knot with airtight cavity
Structure；
Step S4: filling working medium.
Preferably, in the step S2, filler is put into the groove, so that after two plate body fittings, it is described to fill out
Object is filled to be between described two plate bodys.
Preferably, the filler includes particulate matter, bonding agent and/or foaming agent, and the fusing point of the particulate matter is higher than pricker
Weld temperature.
Preferably, the filler includes the first particulate matter and the second particulate matter, and the fusing point of first particulate matter is higher than
The fusing point of brazing temperature, second particulate matter is lower than brazing temperature.
Preferably, the partial size of first particulate matter is 25-100 mesh, and the partial size of second particulate matter is 100-200
Mesh.
Preferably, the filler is particulate matter, and the fusing point of the particulate matter is higher than brazing temperature.
Preferably, in the step S2, it is first laid with metal mesh in the groove, then the filler is arranged in institute
It states on metal mesh, the mesh aperture of the metal mesh is less than the partial size of the filler.
Preferably, microflute is provided between two plate bodys in the step S1.
Preferably, the ratio between overall thickness of the thickness of the clad and the aluminium-base composite plate is 5-20%.
Preferably, at least one side far from joint place is provided with heat-conducting layer, the heat-conducting layer in described two plate bodys
Thermal coefficient be greater than described two plate bodys thermal coefficient.
The beneficial effects of the present invention are:
The processing method used in the present invention, at least one in two plate bodys of preparation are aluminium-base composite plate, aluminum-base composite
Plate includes matrix and clad, and at least one of two plate bodys have groove, is sealed after fitting, soldering, filling working medium
Soaking plate is formed, processing method is more convenient, efficient, while reducing the cost of material and processing, alleviates soaking plate
Weight.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the processing method of soldering formula soaking plate proposed by the present invention；
Fig. 2 is to utilize a kind of structural representation of the soaking plate of the processing method production of soldering formula soaking plate provided by the invention
Figure；
Fig. 3 is the structural schematic diagram of two plate bodys in the method provided in embodiment one；
Fig. 4 is the structural schematic diagram of two plate bodys in the method provided in example IV；
Fig. 5 is the structural schematic diagram of two plate bodys in the method provided in embodiment five；
Fig. 6 is the structural schematic diagram of two plate bodys in the method provided in embodiment six；
Fig. 7 is the structural schematic diagram of two plate bodys in the method provided in embodiment seven；
Fig. 8 is the structural schematic diagram of two plate bodys in the method provided in embodiment eight；
Fig. 9 is the structural schematic diagram of two plate bodys in the method provided in embodiment nine.
In figure: 1 plate body, 11 aluminium sheets, 12 aluminium-base composite plates, 2 fillers, 3 matrixes, 4 clads, 5 grooves, 6 airtight cavities,
7 capillary structures, 8 heat-conducting layers, 9 microflutes, 91 first grooves, 92 second grooves, 10 metal meshes.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term used herein is intended merely to the mesh of description specific embodiment
, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more relevant listed items
Any and all combinations.
Please refer to Fig. 1-9, a kind of processing method of soldering formula soaking plate, comprising the following steps:
Please refer to Fig. 1-2, step S1: stock prepares two plate bodys 1, and one of plate body 1 is aluminium sheet 11, another plate
Body 1 is aluminium-base composite plate 12, alternatively, two plate bodys 1 are aluminium-base composite plate 12, the aluminium-base composite plate 12 includes 3 He of matrix
The clad 4 on the surface of described matrix 3 is set, and the fusing point of the clad 4 is lower than described matrix 3 and the aluminium sheet 11
Fusing point, wherein at least one of two plate bodys 1 have groove 5.
It is to be appreciated that the groove 5 can be by being stamped and formed out.
In the aluminium-base composite plate 12, the ratio between overall thickness of the thickness of the clad 4 and aluminium-base composite plate 12 is (that is, aluminium
The clad ratio of base composite plate) it is 5-20%.The described matrix 3 is aluminum or aluminum alloy, and wherein aluminium alloy includes but is not limited to 3 systems
One of aluminium alloy, 6 line aluminium alloys, 7 line aluminium alloys are a variety of, it is preferred to use 3003,3A11,6061,6951,7072.Institute
The material for stating clad 4 is alusil alloy, it is preferred to use 4 be 4004,4045,4047,4343 in silico-aluminum.
Step S2: fitting fits two plate bodys 1, and after two plate bodys 1 are bonded, at least one aluminium-base composite plate
12 clad is in binding face.
Specifically, filler 2, the filler 2 can also be put into the groove 5 before two plate bodys 1 fit
Fusing point be higher than the fusing point of the clad 4, and after two plate bodys 1 are bonded, the filler 2 is in described two plate bodys
Between 1.
The filler 2 can be particulate matter, and the fusing point of the particulate matter is higher than brazing temperature.Alternatively, filler 2 includes
The fusing point of particulate matter and bonding agent and/or foaming agent, the particulate matter is higher than brazing temperature.Alternatively, filler 2 includes first
Grain object and the second particulate matter, the fusing point of first particulate matter are higher than brazing temperature, and the fusing point of second particulate matter is lower than pricker
Weld temperature.
It is to be appreciated that being started the cleaning processing before by two fitting assembly of plate body 1 to two plate bodys 1.
Step S3: soldering, after the aluminium-base composite plate with groove 5 is placed in the lower section of another plate body, to described two
Overall structure after plate body 1 is bonded is brazed, and brazing temperature is higher than the fusing point of the clad 4 and lower than described matrix 3
Fusing point, and then melt the clad 4, fix two plate bodys 1 after the clad 4 is cooling and formed with airtight cavity
6 plank frame.
Step S4: filling working medium welds technique connecting leg and the plank frame, and technique connecting leg and the airtight cavity
6 connections after vacuumizing to the airtight cavity 6 by technique connecting leg, fill phase-change working substance, seal technique connecting leg, sealing
Mode includes but is not limited to extruding sealing and solder up.
Soaking plate prepared by the above method, can be by the side of the plate body 1 in pyrotoxin and the soaking plate with groove 5
Connection.When work, pyrotoxin transfers heat to soaking plate, after the liquid refrigerant in airtight cavity 6 is heated under subnormal ambient
Rapid evaporation is steam, and rapidly diffuses into entire airtight cavity 6, surface or and soaking plate by the other side of soaking plate
It is condensed after the radiating fin heat dissipation of connection, the liquid of condensed liquid flows back into bottom cycle again, to reach temperature uniforming heat radiation effect
Fruit.
Embodiment one:
Referring to figure 3., in the present embodiment, two plate bodys 1 are respectively aluminium sheet 11 and aluminium-base composite plate 12, aluminium-base composite plate 12
On clad 4 be located at close to aluminium sheet 11 side.The filler 2 is particulate matter, specially copper powder and/or ceramic powder
Grain and/or hydrated aluminosilicate, the partial size of particulate matter are 25-100 mesh, and the fusing point of the matrix 3 in the aluminium-base composite plate 12 is
630-660 DEG C, the fusing point of clad 4 is 580-610 DEG C, and the fusing point of the filler 2 in the present embodiment is higher than 800 DEG C, clad 4
50 DEG C lower than the fusing point of matrix 3 of fusing point or so.After carrying out stamped and formed groove 5 to aluminium-base composite plate 12, aluminium sheet 11 is set
In the top of aluminium-base composite plate 12, the particulate matter is put into groove 5, after aluminium sheet 11 and the fitting assembly of aluminium-base composite plate 12
It is sent into about 600 DEG C of furnace and keeps the temperature.Matrix 3 and particulate matter on aluminium sheet 11, aluminium-base composite plate 12 will not at this temperature
Fusing, and the clad 4 on aluminium-base composite plate 12 can then melt.On the one hand, under capillary action, it is located on aluminium-base composite plate 12
It is inhaled into the clad 4 of 11 joint place of aluminium sheet and full of between the matrix 3 on aluminium sheet 11 and aluminium-base composite plate 12, clad 4
Liquid state is formed after fusing, the clad 4 of liquid can be fixed by the aluminium sheet 11 and aluminium-base composite plate 12 after condensing, and makes
The position of respective slot 5 forms the airtight cavity 6 between aluminium sheet 11 and aluminium-base composite plate 12.On the other hand, the general of clad 4
Grain object is fixed on the cell wall of groove 5, and particulate matter forms capillary structure 7, finally obtains soaking plate.
Embodiment two:
The present embodiment and embodiment one the difference is that, the filler 2 further includes bonding agent and/or foaming agent,
The fusing point of the particulate matter is higher than brazing temperature.Wherein the ratio between the volume of 2 entirety of bonding agent and/or foaming agent and filler is 5-
20%.After brazing, the particulate matter cooperation bonding agent and/or foaming agent are more readily formed and are attached to the airtight cavity 6
The sintered particles object of inner surface, and then form capillary structure 7.
Embodiment three:
The present embodiment and embodiment one the difference is that, the filler 2 includes the first particulate matter and the second particle
Object, the fusing point of first particulate matter are higher than brazing temperature, and the fusing point of second particulate matter is lower than brazing temperature.Specifically,
First particulate matter is or mixtures thereof copper powder, aluminium oxide, silica, and the partial size of first particulate matter is 25-100 mesh, is melted
Point is higher than 800 DEG C.Second particulate matter is alusil alloy particle, wherein silicone content 3-10%, the partial size of the second particulate matter are
100-200 mesh, fusing point are 580-620 DEG C, and the volume ratio of first particulate matter and second particulate matter is 3:1-10:1.This
In embodiment, mixed compared with the second particulate matter of the low melting point of small particle with dystectic first particulate matter of greater particle size, through pricker
Postwelding, the second particulate matter is connected between the first particulate matter and the inner wall of airtight cavity, and forms capillary structure.Particularly, originally
Capillary structure 7 formed in embodiment, the surface layer voidage at the inner wall far from airtight cavity 6 is larger, and close to closed
Bottom voidage at the inner wall of cavity 6 is smaller, has better capillary wick ability.
Existing copper soaking plate, using copper powder sintering process, the voidage of sinter layer is in 30-50%；And in the present embodiment
Sinter layer, the voidage of bottom is in 20-40%, and the voidage on surface layer, in 30-70%, this capillary structure is more conducive to
The reflux of condensate liquid.
Example IV:
Referring to figure 4., the present embodiment and embodiment one the difference is that, in step s 2, first in the groove 5
It is laid with metal mesh 10, then the particulate matter is arranged on the metal mesh 10, the mesh aperture of the metal mesh 10 is less than
The partial size of the particulate matter.Specifically, the mesh aperture of metal mesh 10 is in 100-200 mesh, the partial size of filler 2 is in 50-100
Mesh.Since the mesh aperture of the metal mesh 10 is less than the partial size of particulate matter, particulate matter is covered on the top of metal mesh 10
And surrounding.It can not be fitted closely completely between metal mesh 10 and the slot bottom of groove 5, there is certain gap, so that metal mesh
10 top particulate matter capillary structure is formed after oversintering, meanwhile, make during sintering particulate matter by metal mesh 10 with
The slot bottom of groove 5 is fixed.Therefore, in the present embodiment, the mesh of the hole, metal mesh 10 that are formed between sintered particulate matter,
Gap between metal mesh 10 and the slot bottom of the groove 5 collectively forms capillary structure 7, which is different from existing burning
Capillary structure layer, existing sinter layer, and seamed gap layer are tied, the reflux of condensate liquid is more conducive to.
Embodiment five:
Referring to figure 5., the present embodiment and embodiment one the difference is that, omit to put into groove 5 in step S3 and fill out
The step of filling object 2, and microflute 9 is provided between two plate bodys 1 in the step S1, microflute 9 is after two plate bodys 1 are bonded
Form capillary structure 7.Specifically, the side that can be fitted with another plate body 1 in two plate bodys 1 is arranged in the microflute 9.Institute
Stating microflute 9 includes the first recessed 91 slot being disposed therein on a plate body and/or the second groove being arranged on another plate body
92.The groove depth of the microflute 9 is 0.2-2.0 millimeters, and width is 0.2-2.0 millimeters.The length direction of first groove 91 with
The length direction of second groove 92 has angle, and the range of the angle is at 30-90 °.First groove 91 and institute
Reticular structure can be collectively formed by stating the second groove 92, so that soaking plate is at work, the first groove 91 and the second groove
92 can generate capillarity.
Embodiment six:
Please refer to Fig. 6, the present embodiment and embodiment one the difference is that, in present embodiment, two plate bodys 1 are
Aluminium-base composite plate 12, at this point, the clad 4 on two aluminium-base composite plates 12 is oppositely arranged.When being sent into heating furnace, two are wrapped
Cladding layer, cooling after heating, the substrate 3 on two aluminium-base composite plates 12 is fixed under the collective effect of the clad 4 of two sides
Together.
It is to be appreciated that being equally applicable in the present embodiment for the mode that clad is arranged outwardly
Two-embodiment of embodiment five, no longer repeats one by one herein.
Embodiment seven:
Please refer to Fig. 7, the present embodiment and embodiment one the difference is that, in present embodiment, aluminium sheet 11 and aluminium
Groove 5 is provided in base composite plate 12.After aluminium sheet 11 and aluminium-base composite plate 12 are fixed under the action of clad 4, two recessed
Airtight cavity 6 is collectively formed in slot 5
Implement it is to be appreciated that being equally applicable to embodiment two-for the mode that clad is arranged outwardly in the present embodiment
Example six, no longer repeats one by one herein.
Embodiment eight:
Please refer to Fig. 8, the present embodiment and embodiment three the difference is that, in present embodiment, setting fluted 5
The clad 4 of aluminium-base composite plate 12 is oppositely arranged with the substrate 3 of another aluminium-base composite plate 12, in this way, to be not provided with recessed
Clad 4 on the aluminium-base composite plate 12 of slot 5 is arranged outwardly, and the clad 4 being arranged outwardly is used for and other thermal component (examples
Such as, fin) connection.Specifically, the clad 4 being arranged outwardly can be by the thermal component during cooling down after the heating
It fixes on the substrate 3, it is easy to operate, convenient.
Implement it is to be appreciated that being equally applicable to embodiment two-for the mode that clad is arranged outwardly in the present embodiment
Example seven, no longer repeats one by one herein.
Embodiment nine:
Please refer to Fig. 9, the present embodiment and embodiment one the difference is that, at least one in two plate bodys 1 is far from patch
Side at conjunction is provided with heat-conducting layer 8, i.e. aluminium sheet 11 and/or aluminium-base composite plate 12 is provided with heat-conducting layer far from the side of joint place
8.Specifically, the aluminium-base composite plate 12 in the present embodiment is provided with the heat-conducting layer 8 far from the side of aluminium sheet 11.It is understood that
The thickness on ground, the perhaps aluminium-base composite plate 12 of aluminium sheet 11 only has 0.5~2 millimeter and the plane of aluminium sheet 11 or aluminium-base composite plate 12
Length generally reach tens to more than several hundred millimeters, therefore aluminium sheet 11 or aluminium-base composite plate 12 are in the thermal resistance of its short transverse
Much smaller than the thermal resistance of its in-plane.Heat-conducting layer 8 and pyrotoxin or source of heat release mount, so that soaking plate and pyrotoxin after being made
Or the in-plane between source of heat release using heat-conducting layer 8 it is thermally conductive, thermal coefficient is higher, prepared by soaking plate thickness very little,
Influence to heat transfer efficiency, heat dissipation performance can be ignored, and then improve soaking plate heat transfer efficiency and heat dissipation performance.
It is worth noting that, the heat-conducting layer in the present embodiment can be using thermal conductivity ratios plate bodys 1 such as copper, silver, graphenes
The high one or more materials of thermal coefficient be replaced.
It is to be appreciated that the present embodiment is equally applicable to two-embodiment of embodiment eight, no longer repeat one by one herein.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of processing method of soldering formula soaking plate, which comprises the following steps:
Step S1: stock prepares two plate bodys, and one of plate body is aluminium sheet, another plate body is aluminium-base composite plate, alternatively,
Two plate bodys are aluminium-base composite plate, and the aluminium-base composite plate includes the clad of matrix with the surface that described matrix is arranged in,
The fusing point of the clad is lower than described matrix and the fusing point of the aluminium sheet, wherein at least one of two plate bodys have
Groove；
Step S2: fitting fits two plate bodys, and after two plate bodys are bonded, the cladding of at least one aluminium-base composite plate
Layer is in binding face；
Step S3: soldering will have after reeded aluminium-base composite plate is placed in the lower section of another plate body, paste to described two plate bodys
Overall structure after conjunction is brazed, and brazing temperature is higher than the fusing point of the clad and is lower than the fusing point of described matrix, in turn
The clad is melted, fix two plate bodys after the clad is cooling and forms the plank frame with airtight cavity；
Step S4: filling working medium.
2. a kind of processing method of soldering formula soaking plate according to claim 1, which is characterized in that in the step S2,
Filler is put into the groove, so that the filler is between described two plate bodys after two plate body fittings.
3. a kind of processing method of soldering formula soaking plate according to claim 2, which is characterized in that the filler includes
The fusing point of particulate matter, bonding agent and/or foaming agent, the particulate matter is higher than brazing temperature.
4. a kind of processing method of soldering formula soaking plate according to claim 2, which is characterized in that the filler includes
The fusing point of first particulate matter and the second particulate matter, first particulate matter is higher than brazing temperature, the fusing point of second particulate matter
Lower than brazing temperature.
5. a kind of processing method of soldering formula soaking plate according to claim 4, which is characterized in that first particulate matter
Partial size be 25-100 mesh, the partial size of second particulate matter is 100-200 mesh.
6. a kind of processing method of soldering formula soaking plate according to claim 2, which is characterized in that the filler is
The fusing point of grain object, the particulate matter is higher than brazing temperature.
7. a kind of processing method of soldering formula soaking plate according to claim 6, in the step S2, first in the groove
Then interior laying metal mesh the filler is arranged on the metal mesh, the mesh aperture of the metal mesh is less than described
The partial size of filler.
8. a kind of processing method of soldering formula soaking plate according to claim 1, which is characterized in that in the step S1
Microflute is provided between two plate bodys.
9. a kind of processing method of soldering formula soaking plate according to claim 1, which is characterized in that the thickness of the clad
The ratio between degree and the overall thickness of the aluminium-base composite plate are 5-20%.
10. a kind of processing method of soldering formula soaking plate according to claim 1, which is characterized in that described two plate bodys
In at least one side far from joint place be provided with heat-conducting layer, the thermal coefficient of the heat-conducting layer is greater than described two plate bodys
Thermal coefficient.
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