200918843 九、發明說明： 【發明所屬之技術領域】 本發明係與導熱装置有關，特別是指一種用於導教震 置之毛細結構’其社錢體之吸附能力極佳，且且討 撓性而可設置於任意形狀之導絲置，極具應用潛力。 【先前技術】 如第一、一 _所示，羽1^*措此41士1»200918843 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat-conducting device, and more particularly to a capillary structure for guiding a shock, which has excellent adsorption capacity and flexibility It can be placed in any shape of guide wire, which has great potential for application. [Prior Art] As shown in the first and first _, Yu 1^* measures this 41 士 1»
^知之‘熱裝置如均熱板1包含 有一上殼2與一下殼3，兮μ 七叫 Μ上、下设之間形成一容室4供工 作流口)充填於其中’該上、下殼内壁設有 一毛細結=用«，並有錄支撐柱6抵頂 於該上、下狀間’支撐桂外周緣亦設有毛細結構7，藉由 水吸熱蒸發、放熱凝結之循環，可將熱由下殼2傳遞至上 殼3，或者由上设3傳遞至下殼2。^知之'Thermal device such as the heat equalizing plate 1 comprises an upper casing 2 and a lower casing 3, and a chamber 4 is formed between the upper and lower sides of the Μμ Μ 供 for the working flow port to be filled therein. The inner wall is provided with a capillary knot = with «, and the support column 6 is placed against the upper and lower sides. The outer periphery of the support is also provided with a capillary structure 7, which can be heated by the heat absorption evaporation and the exothermic condensation cycle. It is transmitted from the lower casing 2 to the upper casing 3 or from the upper casing 3 to the lower casing 2.
毛細結構5, 7可分三種：銅網、燒結銅粉與溝槽，其 15中’燒結銅粉對工作流體之吸附能力較佳，銅網次之，溝 槽最，：然而’溝槽係直接於上、下殼2, 3之内壁加工而 成，最為直接，銅網則利用擴散接合或熱壓等方式與上、 下殼結合，結合之強度尚可，銅粉則需以燒結方式與上、 下殼結合，由於重力作用的關係，銅粉不易穩固地與上殼2 2〇結合，兩者之間常存有縫隙，長久使用後甚至發生銅粉脫 落現象’嚴重影響導熱裝置之效能。 因此，如何兼顧毛細結構對工作流體之吸附能力，以 毛細結構與上、下殼之結合穩定性，一直是業界研發的重 要方向。 200918843 【發明内容】 本發明之一目的在於提供一種用於導熱裝置之毛細結 構，其對工作流體之吸附能力極佳且可與導熱裝置穩固結 5 合。 本發明之另一目的在於提供—種用於導熱裝置之毛細 結構，其具有可撓性而可設置於任意形狀之導熱裝置。 為達成前揭目的，本發明所提供用於導熱裝置之毛細 結構係包含有一具有多數網目之金屬網，以及多數燒結體 1〇设於該金屬網之網目中，各該燒結體係由金屬粉末燒結而 成，藉此，該毛細結構不僅具有可挽性而可與導熱裝置穩 固接合，更對工作流體具有極佳之吸附能力。 【實施方式】 15 為了詳細說明本發明之構造及特點所在，茲舉以下二 較佳實施例並配合圖式說明如后，其中： 第三圖係本發明第一較佳實施例之立體圖； 第四圖係第三圖沿4-4方向之剖視圖； 第五圖係本發明第二較佳實施例之立體圖。 請參閱第三、四圖，本發明第一較佳實施例所 毛細結構10包含有一金屬網20、多數燒結體3〇、一^ 一 ^結層40以及—第二燒結層％，該毛細結構^ ;一導熱裝置之上殼或下殼，亦可設於支撐柱， "又 圖所示之習知結構—般，甚至可用以設於其他形 20 200918843 裝置。 該金屬網20具有多數網目22，該金屬網20係由鋼、 銅合金或其他易導熱之金屬所製成，該金屬網20具有一頂 面24與一底面26。 5 該等燒結體30係設於該金屬網20之網目22中’各該 燒結體30係由金屬粉末燒結而成，該金屬粉末係由銅、銅 合金或其他易導熱之金屬所製成，該等燒結體30係利用燒 結之方式與該金屬網20接合在一起。 該第一燒結層40係覆於該金屬網20之頂面24，該第 10 一燒結層40係由金屬粉末燒結而成，該金屬粉末係由鋼、 銅合金或其他易導熱之金屬所製成，該第一燒結層40係利 用燒結之方式與該金屬網20接合在一起。 該第二燒結層50係覆於該金屬網20之底面26，該第 一燒結層50係由金屬粉末燒結而成，該金屬粉末係由銅、 15銅合金或其他易導熱之金屬所製成，該第二燒結層50係利 用燒結之方式與該金屬網20接合在一起。 舉一實際製造之例如下：先於治具中平舖一層銅粉， 接著將銅網置於銅粉層上，再另取銅粉平舖於該銅網上， 使銅網之網目中皆填滿銅粉，且該銅網實際上係埋入銅粉 20當中，最後，將銅粉、銅網連同治具一起送入高溫爐中進 行燒結，一方面使銅粉燒結在一起，另一方面亦將銅粉與 銅網燒結在一起’即形成本發明之毛細結構1〇，其中，位 於銅網之網目中者即為該等燒結體3〇，位於銅網之頂面者 即為該第一燒結層40，位於銅網之底面者即為該第二燒結 200918843 層50。 由於該等燒結體30、該第一燒結層40與該第二燒結層 50對工作流體之吸附能力極佳，該金屬網20又提供該毛細 、°構10相g之可撓性，使本發明之毛細結構10可設置於 5任思形狀之導熱裝置，例如熱管作邮p㈣與均熱板(哪〇『 chamber)，該毛細結構1〇可利用埶 方式與導熱褒置接合，接合之位置可為外殼： ，支樓柱之外周緣，或其他位置’其接合結構穩固，特別 疋可避免習知結構中銅粉與上殼接合不良之 10提昇產品良率，極具市場潛力。 有效 基於本發明之精神，毛細結構具有多種設計變化方 式丄例如該第-燒結層4G或該第二燒結層5〇可依需要而 不《又或如第五圖所示，係本發明第二較佳實施例所提供 之毛細結構60 ’該毛細結構6〇僅具有一金屬網&與多數 I5燒結體64設於該金屬網62之網目幻中，而無前述實施例 之第燒結層與第二燒結層，藉此，該毛細結構6〇即具有 優異之吸附能力與可撓性。舉凡此等易於思及之結構變 化，均應為本發明之申請專利範圍所涵蓋。 200918843 【圖式簡單說明】 第一圖係習知導熱裝置之立體圖； 第二圖係第一圖沿2-2方向之剖視圖； 第三圖係本發明第一較佳實施例之立體圖； 第四圖係第三圖沿4-4方向之剖視圖； 第五圖係本發明第二較佳實施例之立體圖。 【主要元件符號說明】 1均熱板 2上殼 3下殼 10 10毛細結構 4容室 6支撐柱 5毛細結構 7毛細結構 20金屬網 22網目 26底面 24頂面 15 30燒結體 40第一燒結層 50第二燒與 60毛細結構 62金屬網 64燒結體 63網目 8The capillary structure 5, 7 can be divided into three types: copper mesh, sintered copper powder and groove. The 15 'sintered copper powder has better adsorption capacity to the working fluid, and the copper mesh is the second, the groove is the most, but the 'groove system Directly processed on the inner walls of the upper and lower shells 2, 3, the most direct, the copper mesh is combined with the upper and lower shells by diffusion bonding or hot pressing, and the strength of the bonding is acceptable. The copper powder needs to be sintered. The combination of the upper and lower shells, due to the relationship of gravity, the copper powder is not easy to be firmly combined with the upper shell 2 2〇, there are often gaps between the two, even after the long-term use, the phenomenon of copper powder falling off seriously affects the effectiveness of the heat-conducting device . Therefore, how to balance the adsorption capacity of the capillary structure on the working fluid, the combination of the capillary structure and the upper and lower shells has always been an important direction for the industry. SUMMARY OF THE INVENTION One object of the present invention is to provide a capillary structure for a heat conducting device which has excellent adsorption capacity for a working fluid and can be stably coupled with a heat conducting device. Another object of the present invention is to provide a capillary structure for a heat transfer device which has a heat conductive device which is flexible and can be disposed in any shape. In order to achieve the foregoing object, the capillary structure for a heat conducting device of the present invention comprises a metal mesh having a plurality of meshes, and a plurality of sintered bodies 1 are disposed in a mesh of the metal mesh, each sintering system being sintered by metal powder. Therefore, the capillary structure is not only portable but also can be firmly joined to the heat conducting device, and has an excellent adsorption capacity for the working fluid. [Embodiment] The following is a description of the structure and features of the present invention, and the following description of the preferred embodiment of the present invention; 4 is a cross-sectional view of the third drawing in the direction of 4-4; the fifth drawing is a perspective view of the second preferred embodiment of the present invention. Referring to the third and fourth figures, the capillary structure 10 of the first preferred embodiment of the present invention comprises a metal mesh 20, a plurality of sintered bodies 3, a bonding layer 40, and a second sintered layer %, the capillary structure. ^; The upper or lower shell of a heat-conducting device can also be placed on the support column, and the conventional structure shown in the figure can be used even in other shapes 20 200918843. The metal mesh 20 has a plurality of meshes 22 which are made of steel, copper alloy or other thermally conductive metal having a top surface 24 and a bottom surface 26. 5 The sintered bodies 30 are disposed in the mesh 22 of the metal mesh 20. Each of the sintered bodies 30 is sintered from a metal powder which is made of copper, a copper alloy or other metal which is easily thermally conductive. The sintered bodies 30 are joined to the metal mesh 20 by sintering. The first sintered layer 40 is coated on the top surface 24 of the metal mesh 20, and the 10th sintered layer 40 is formed by sintering a metal powder made of steel, copper alloy or other heat-conductive metal. The first sintered layer 40 is bonded to the metal mesh 20 by sintering. The second sintered layer 50 is coated on the bottom surface 26 of the metal mesh 20, and the first sintered layer 50 is sintered from metal powder, which is made of copper, 15 copper alloy or other heat-conductive metal. The second sintered layer 50 is bonded to the metal mesh 20 by sintering. For example, the actual manufacturing is as follows: a layer of copper powder is laid in the fixture, then the copper mesh is placed on the copper powder layer, and another copper powder is laid on the copper mesh, so that the copper mesh is in the mesh. Filled with copper powder, and the copper mesh is actually buried in the copper powder 20. Finally, the copper powder and the copper mesh are sent together with the jig into a high-temperature furnace for sintering, on the one hand, the copper powder is sintered together, and the other is The copper powder and the copper mesh are also sintered together to form the capillary structure 1 of the present invention, wherein the mesh in the mesh of the copper mesh is the sintered body 3〇, which is located at the top of the copper mesh. The first sintered layer 40, which is located on the bottom surface of the copper mesh, is the second sintered 200918843 layer 50. Since the sintered body 30, the first sintered layer 40 and the second sintered layer 50 have excellent adsorption capacity to the working fluid, the metal mesh 20 provides the flexibility of the capillary and the 10 phase g. The capillary structure 10 of the present invention can be disposed in a heat-conducting device of a shape of 5, for example, a heat pipe for mailing p (four) and a heat-receiving plate (which is a "chamber"), and the capillary structure 1 can be joined to the heat-conductive device by means of a weir, the position of the joint It can be the outer casing: the outer periphery of the branch column, or other locations. The joint structure is stable, especially to avoid the poor bonding of the copper powder and the upper shell in the conventional structure, which has great market potential. Effectively based on the spirit of the present invention, the capillary structure has various design variations, for example, the first sintered layer 4G or the second sintered layer 5 can be used as needed or "as shown in the fifth figure, which is the second aspect of the present invention. The capillary structure 60' provided by the preferred embodiment has only one metal mesh & and a plurality of I5 sintered bodies 64 are disposed in the mesh of the metal mesh 62 without the sintered layer of the foregoing embodiment. The second sintered layer, whereby the capillary structure 6 has excellent adsorption capacity and flexibility. Any such structural changes that are readily conceivable are intended to be covered by the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of a conventional heat conducting device; the second drawing is a cross-sectional view of the first drawing in the direction of 2-2; the third drawing is a perspective view of the first preferred embodiment of the present invention; Figure 3 is a cross-sectional view taken along line 4-4; Figure 5 is a perspective view of a second preferred embodiment of the present invention. [Main component symbol description] 1 soaking plate 2 upper case 3 lower case 10 10 capillary structure 4 chamber 6 support column 5 capillary structure 7 capillary structure 20 metal mesh 22 mesh 26 bottom surface 24 top surface 15 30 sintered body 40 first sintering Layer 50 second firing and 60 capillary structure 62 metal mesh 64 sintered body 63 mesh 8