201003023 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種環狀加熱管線的蒸發器，其中包 括-個冷凝機，-個蒸氣傳輸線路，以及體傳輸線 路’本發明X其是有關於-種在燒結芯(sinteredwick)和加 熱板之間具有增加接觸面積的蒸發器。 【先前技術】 電子零件’諸如用在各種電子設備(例如，電腦）的中 央處理器或是半導體晶片，會在運轉時產生大量的孰。 此類的電子設備通常被設計在室溫以告 操作-個電子設備時所產生的熱無法被有效二：，= 電子設備的效能會嚴重的惡化，並且在某些案例中，電子 設備本身也會受損。 為了冷卻由各種電子零件所產生的熱，許多方法已經 ，展出來’例如_散熱器的熱傳導方法、湘自然敎對 衫氣熱細的方法、顺摘強制熱對 =利用液__綠、或是浸人式㈣黯㈣冷卻的方 然而現今許多的電子產品都是輕薄式。運轉時產生執 j子零件之_安裝間距持續地縮小，導致熱無法適當' ttr並且因為電子零件的高度整合和高效能，電子零 生的熱#會持續地增加，因此以上所述的冷卻方I 無法有效的冷卻電子零件。 |々丟 作為-個解決上述問題的一個薪新科技，本發明揭示 3 201003023 3i7U2pil 了-種可以冷卻具有高單位密度的電子零件的相變熱 傳輸系統。一個熱虹吸管(thermo-syphon)和一個圓筒弋的 熱導管系統即為此種相變熱傳輸系統的例子。 3^ 、 根據熱虹吸管系統，冷卻是利用一種藉由液體· 變和工作流體的特定重力差異的自然循環方法。在^ 圓筒式熱導管1GG，如圖丨所示，冷卻藉由—種利用植入 導管内部表面的燒結芯所產生的毛細管錢力來使 體循環而達成。當熱從熱源101傳送出來時，在燒結芯 中的工作流體被氣化並且以一種蒸氣流的方式，由多〜個箭 頭103所指示的方向移動。當熱被一個散熱器ι〇4所散1 時，這個工作流體被轉換回液態，並且沿著—個多個箭頭 1〇5指不的方向在燒結芯巾移動，由麵完成在熱導管_ 種的循環。 然而，在這兩種系統中的組成元件的位置是有限制 的，也就是錢虹吸管⑽巾，需要-餘置高於氣化裝 ^的冷凝裝置。軸這個問題在熱導管⑽的例子中沒有 这麼嚴重，但是當冷凝裝置低域化裝， ，能力會相當程度地惡化。因此，像這樣的限lit 用上述的冷卻系統使不能以輕薄的方式來製造 因為蒸氣和液體在熱虹吸管系統或是圓筒式熱 2⑼中的線性導管中以相反的方向流動，所以蒸氣和 =人Hi會在導管的中間相互混合。另—個問題是氣浪 “有可靶會使實際傳輸的熱量小於理論上能傳輸的熱 201003023 J l / vxuix 量。 a 一個核狀加熱管線(loop heat pipe，LHP)系統已被認為 f了個可以解決這些問題的理想熱傳輸系統，這些問題也 就是上述，置上的限制以及蒸氣和液體之間混合的問題。 LHP系，疋—種由美國NASA發展出來的毛細管式幫浦環 狀加，s 線(capillary pumped 1〇〇p heat pipe, CLp)技術用 =冷部大讀人造衛星的軌設備或電子設備生成的熱 一^專?第671Q41號，標題為％狀熱管線”，揭示了 狀加熱管線系統的技術。® 2根據這種傳統 T術’說明了一個環狀加熱管線系、统110。這個傳統的 f狀加熱管線系統包括了 -個冷凝II H2—個蒸發器 X及個瘵氣線路116和一個液體線路ία，這些元 元整的迴路。蒸氣線路116和液體線路118在 性埶其雄二？ 間相連接。和圖1中的傳統線 疋’在這個環狀加熱管線系統⑽中，-個燒結芯m只被钱錢發^㈣。 系統在★胃，认被稱做是環狀加熱管線 ^(section)，〇 的意義。 7姨盗和冷凝器部，個別也都具有相同 運用丄1〇以下列所述的方式運轉。_ 個加教板^2 ί燒結芯120的蒸發器114底部的一 、 在此時，因為傳輸到跟加熱板接觸的燒為 201003023 3l/U2plt 芯120的熱’燒結芯120會被工作液體所浸透(satumted)。 並且這些熱會氣化工作流體，導致工作流體轉變成氣熊。 蒸氣沿著連接蒸發器114 一邊的蒸氣線路116，往冷凝器 112移動。當洛氣通過冷凝器112,熱在外部被散失以致蒸 氣被液化。這個被液化的工作流體在冷凝器112的一邊， 沿著液體線路118往蒸發器114移動。上述的過程被重複 進行時，熱源就會被冷卻。 在浸透燒結芯120的工作流體的氣化過程中，請參閲 圖4 _所示在® 3 t賴結芯〗20(為了解釋上的方便而 旋轉了 180度），面對加熱板122的燒結芯12〇的一個表 面126包括了 一個緊鄰加熱板122的接觸表面12仙，以 及多個當作蒸氣排放的微通路126a。因此，燒結芯12〇 藉由緊鄰加熱板122的接觸表面126b來接收熱，導致接 收的熱使浸透在燒結芯12〇中的工作流體氣化。生成的蒸 氣沿著連接蒸發器114的一邊的蒸氣線路116而往冷凝器 112移動，同時穿過形成在面對燒結芯12〇的表面 微通道126a。 ％ 另一方面，接收從熱源，例如一個電子零件，發出 的熱的蒸發器的效能是取決於從熱源到加熱板的埶如右 效的被傳輸到燒H在這個連接中，—種接觸、傳導= (conductance)是直接影響熱在熱源和加熱板之間傳輪的— 項因素。 接觸傳導性是有_當—個金屬的表面和另 相接觸且熱麵個金相傳輸時發生的她。這個接觸傳 201003023 λ I \/^.pxx 導性和在兩個金屬間的接觸面積是成正比的。也就是當接 觸面積增加時，接觸傳導性也會增加，並且當接觸傳導性 增加時，熱傳輸也會進一步地增加。 然而，在傳統的環狀加熱管線系統中的蒸發器，接觸 傳導性會相對地小，主要是因為由於蒸汽通路的存在，也 就是微通道，導致在燒結芯和加熱板間的接觸面積降低。 也就是如圖5所示’在燒結芯120上的微通道126a在由圖 3松切面的方向旋轉90度的方向中和加熱板丨22麵接，由 於微通道126a的關係’連接加熱板〗22的燒結芯12〇的表 面積126b降低，導致被傳輸的熱量因此而縮減。 【發明内容】 為了解決上述或是其他的問題，本發明提供了 一種環 狀加熱管線用的蒸發器，這個蒸發器藉由增加在金屬燒二 芯和加熱板間的接觸面積，以提升其接觸傳導性。 根據本發明的概念’這個環狀加熱管線的蒸發器包括： 一個蒸發器部，具有一個藉由燒結金屬粉末&而形成的 、 燒結芯，其中，穿過多個在燒結芯中的孔洞的工作流體被 加熱以致工作流體的相(phase)被轉換成氣態。 一個冷凝器部，其中，從蒸發器傳輸過來的工作流體 的相從氣態被轉換為液態。 一個蒸氣傳輪線路，在蒸發器部和冷凝器部之間連接 著’用以傳輸被蒸發器部相(phase)變為氣態的工作流體 冷凝器部；以及 ^ 201003023 31/U2pn 一個液體傳輸線路，在冷凝器部和蒸發器部之間連接 著，用以傳輸被冷凝器部相(phase)變為液態的工作流體到 蒸發器部， 其中蒸發器部包括： 一個加熱板，由金屬形成並且從熱源接收熱； 一個燒結芯，與加熱板的一個表面耦接並接收熱； ，多個溝槽’形成在和燒結芯接觸的加熱板的表面，並 且當工作流體的相被燒結芯轉換成氣態時，此多個溝槽能 被當作通路而使氣體經由氣態傳輸線路而被排出， 其中這些溝槽在加熱板的一個侧表面中形成，每一個 溝槽具有—健部表面和兩侧表面，並戏結芯被部分 地植入在每個溝槽裡，這樣就能至少接觸到每個溝槽的兩 個側表面的一部分。 植入至每個溝槽的燒結芯的一部份可為植入部，植入 1兩個側表面和每個溝槽的兩個侧表201003023 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an evaporator for an annular heating line including a condenser, a vapor transmission line, and a body transmission line 'The present invention X is It relates to an evaporator having an increased contact area between a sintered core and a heating plate. [Prior Art] Electronic parts such as a central processor or a semiconductor wafer used in various electronic devices (e.g., computers) generate a large amount of defects during operation. Such electronic devices are usually designed to operate at room temperature to prevent the heat generated by an electronic device from being effective 2:, = the performance of the electronic device will be seriously deteriorated, and in some cases, the electronic device itself Will be damaged. In order to cool the heat generated by various electronic parts, many methods have been exhibited, such as the heat transfer method of the radiator, the method of the natural heat of the jacket, the forced heat pair, the liquid __ green, or It is a dip-type (four) 黯 (four) cooling. However, many of today's electronic products are thin and light. _ The installation pitch is continuously reduced during operation, resulting in a heat that cannot be properly adjusted. Because of the high integration and high performance of electronic components, the electronic zero heat will continue to increase, so the above-mentioned cooling side I cannot effectively cool electronic parts. As a new technology for solving the above problems, the present invention discloses that a phase change heat transfer system capable of cooling electronic parts having a high unit density can be cooled. An example of such a phase change heat transfer system is a thermo-syphon and a cylindrical heat pipe system. 3^ According to the thermosiphon system, cooling is a natural circulation method that utilizes a specific gravity difference between the liquid and the working fluid. In the cylindrical heat pipe 1GG, as shown in Fig. ,, the cooling is achieved by circulating the body by the capillary force generated by the sintered core implanted on the inner surface of the pipe. When heat is transferred from the heat source 101, the working fluid in the sintered core is vaporized and moved in a direction indicated by the plurality of arrows 103 in a vapor flow. When the heat is dissipated by a heat sink ι〇4, the working fluid is converted back to the liquid state, and moves along the direction of the multiple arrows 1〇5 in the direction of the sintered core towel, which is completed by the surface in the heat pipe _ Kind of cycle. However, the position of the constituent elements in the two systems is limited, that is, the money siphon (10) towel, which requires a condensing device that is higher than the gasification device. This problem of the shaft is not as severe in the example of the heat pipe (10), but when the condensing device is low-profile, the capacity is considerably deteriorated. Therefore, such a limit lit by the above-described cooling system cannot be manufactured in a thin and light manner because the vapor and the liquid flow in opposite directions in the thermosiphon system or the linear duct in the cylindrical heat 2 (9), so the vapor and = Human Hi will mix with each other in the middle of the catheter. Another problem is that the airwave "has a target that will cause the actual heat transfer to be less than the theoretical heat that can be transmitted 201003023 J l / vxuix. a A loop heat pipe (LHP) system has been considered f An ideal heat transfer system that can solve these problems. These problems are the above-mentioned restrictions and the problem of mixing between vapor and liquid. LHP series, a kind of capillary pump ring developed by NASA in the United States. , s line (capillary pumped 1〇〇p heat pipe, CLp) technology = cold generated by the orbital equipment or electronic equipment of the large-scale artificial satellite, No. 671Q41, titled "%-shaped heat pipeline", reveals The technology of the heating pipeline system. ® 2 illustrates an annular heating line system, system 110, according to this conventional technique. This conventional f-shaped heating line system includes a condensing II H2 - an evaporator X and a helium line 116 and a liquid line ία, which are integrated circuits. The vapor line 116 and the liquid line 118 are in a state of sex. Interphase connection. And the conventional line 图' in Fig. 1 in this annular heating line system (10), a sintered core m is only issued by money (4). The system is in the stomach of the stomach, which is called the ring heating line ^(section), the meaning of 〇. 7 The bandit and condenser parts, each of which has the same operation, operate in the manner described below. _ 教教板^2 ί The bottom of the evaporator 114 of the sintered core 120, at this time, because the heat is sent to the hot plate 201003023 3l / U2plt core 120 hot 'sintered core 120 will be the working liquid Satumed. And these heat will vaporize the working fluid, causing the working fluid to turn into a gas bear. The vapor moves along the vapor line 116 connected to one side of the evaporator 114 to the condenser 112. When the gas passes through the condenser 112, the heat is dissipated outside so that the vapor is liquefied. This liquefied working fluid moves on one side of the condenser 112 along the liquid line 118 to the evaporator 114. When the above process is repeated, the heat source is cooled. In the gasification process of the working fluid saturated with the sintered core 120, please refer to FIG. 4_ shown in the ® 3 t ray core 20 (rotated 180 degrees for convenience of explanation), facing the heating plate 122 One surface 126 of the sintered core 12A includes a contact surface 12' adjacent to the heating plate 122, and a plurality of microchannels 126a that serve as vapor discharges. Therefore, the sintered core 12 receives heat by being in close proximity to the contact surface 126b of the heating plate 122, causing the received heat to vaporize the working fluid saturated in the sintered core 12b. The generated vapor moves toward the condenser 112 along the vapor line 116 connected to one side of the evaporator 114 while passing through the surface microchannel 126a formed facing the sintered core 12A. % On the other hand, the efficiency of the evaporator that receives heat from a heat source, such as an electronic component, depends on the right source from the heat source to the heating plate being transferred to the H in this connection, contact, Conduction = (conductance) is a factor that directly affects the transfer of heat between the heat source and the heating plate. Contact conductivity is what happens when the surface of a metal is in contact with another surface and the hot surface is transported by a metallurgical phase. This contact is transmitted by 201003023 λ I \/^.pxx and is proportional to the contact area between the two metals. That is, when the contact area is increased, the contact conductivity is also increased, and as the contact conductivity is increased, the heat transfer is further increased. However, in an evaporator in a conventional annular heating line system, the contact conductivity is relatively small, mainly because of the reduced contact area between the sintered core and the heating plate due to the presence of the vapor passage, i.e., the microchannel. That is, as shown in FIG. 5, the microchannel 126a on the sintered core 120 is in contact with the heating plate 22 in the direction rotated by 90 degrees in the direction of the loose surface of Fig. 3, due to the relationship of the microchannel 126a 'connecting the heating plate〗 The surface area 126b of the sintered core 12 of 22 is lowered, resulting in a reduction in the amount of heat transferred. SUMMARY OF THE INVENTION In order to solve the above or other problems, the present invention provides an evaporator for an annular heating line, which enhances contact by increasing the contact area between the metal-fired two-core and the heating plate. Conductivity. According to the concept of the invention, the evaporator of the annular heating line comprises: an evaporator portion having a sintered core formed by sintering a metal powder & wherein the passage through a plurality of holes in the sintered core The fluid is heated such that the phase of the working fluid is converted to a gaseous state. A condenser portion in which a phase of a working fluid transferred from the evaporator is converted from a gaseous state to a liquid state. a vapor transfer line connecting a working fluid condenser portion for transferring a phase of the evaporator to a gaseous state between the evaporator portion and the condenser portion; and ^ 201003023 31/U2pn a liquid transmission line Connected between the condenser portion and the evaporator portion for transporting the working fluid which is changed to a liquid state by the condenser portion to the evaporator portion, wherein the evaporator portion comprises: a heating plate formed of metal and Receiving heat from a heat source; a sintered core coupled to one surface of the heating plate and receiving heat; a plurality of grooves 'formed on a surface of the heating plate in contact with the sintered core, and when the phase of the working fluid is converted into a sintered core In the gaseous state, the plurality of grooves can be regarded as passages for discharging gas through the gaseous transmission line, wherein the grooves are formed in one side surface of the heating plate, each groove having a surface and a side surface The surface, and the core of the knot, are partially implanted in each of the grooves so as to at least contact a portion of the two side surfaces of each of the grooves. A portion of the sintered core implanted into each of the grooves may be an implant portion, implanting 1 side surface and two side tables of each groove
2的下表面是向下凸出狀、向内凹陷： 其中一個。 J -個包含—個下平板部，其具有圓盤的形狀和 周圍部延伸出來的内壁部，燒結芯可以 内壁部i内部茅面：的上表面的内部表面，以及加熱板的 件被提供在加熱___ 這個遮蓋構件她接。 讀㈣輸線路和 為讓本發月之上述特徵和優點能更明顯易懂，下文特 201003023 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 這些為了說明本發明實施例的附圖是為了能獲得對本 發明、其優點、和藉由實施而能達成目標有更充足的認識。 因此本發明將會藉由解釋本發明的較佳實施例及參考的附 圖來做詳細的敘述。參考圖中的符號代表相對應的元件。 本發明是有關於一個環狀加熱管線系統用的蒸發器， 此系統包括一個冷凝器、一個蒸氣傳輸線路、以及一個液 體傳輸線路。圖6根據本發明的一個實施例說明了一個環 狀加熱管線系統的結構。在圖6中，環狀加熱管線系統包 括了一個蒸發器1、一個冷凝器210、一個蒸氣傳輸線路 220、以及一個液體傳輸線路230。 冷凝器210把從蒸發器1接收的氣態工作流體的相 (phase)轉換成液態。冷凝器210從工作流體得到熱，並且 把熱排到外面的空氣。 蒸斤傳輸線路220是管線構件的一部分，其和蒸發号 1和冷凝器210相連接，用以供應已被蒸發器丨^(phase) 變成氣態的蒸氣給冷凝器210。液體傳輸線路230是管線 構件的一部分，其和冷凝器21〇和蒸發器1相連接，用以 供應被冷凝器210相變成液態的液體給蒸發器1 · 對於冷凝器210’蒸汽傳輸線路220,以及液體傳輸線 路230的—般運作過程跟在背景部份說明的部份是相同 的。本發明主要的物件’蒸發器1、冷凝器21〇、液體傳輸 9 201003023 5 ινυ^ριΐ 錢⑽輸祕咖，妓雜純管線系統 7中圖以的-個橫切面視圖。在圖 20。當浸透在燒結心^金屬粉末燒融而成的燒結芯 作流體的相會轉換絲作流體被加熱時，工 燒結芯20、以及多個1包括一個加熱板10、 .溝槽30。加熱板1〇以金屬形成並且 熱源例如為在運轉過程中生熱的電子零件。The lower surface of 2 is convex downward and inwardly recessed: one of them. J - comprising a lower flat portion having a shape of a disc and an inner wall portion extending from a peripheral portion, the inner surface of the upper surface of the inner surface of the inner wall portion i, and the inner surface of the upper surface, and the member of the heating plate being provided Heating ___ This cover member is connected. Read (4) transmission lines and in order to make the above features and advantages of the present month more obvious and easy to understand, the following examples are given in the following 201003023, and are described in detail below with reference to the drawings. [Embodiment] The drawings for the purpose of illustrating the embodiments of the present invention are intended to provide a better understanding of the invention, its advantages, and The invention will be described in detail by the preferred embodiments of the invention and the accompanying drawings. The symbols in the reference figures represent corresponding components. DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an evaporator for an annular heating line system comprising a condenser, a vapor transmission line, and a liquid transfer line. Figure 6 illustrates the construction of a toroidal heating line system in accordance with one embodiment of the present invention. In Fig. 6, the annular heating line system includes an evaporator 1, a condenser 210, a vapor transmission line 220, and a liquid transmission line 230. The condenser 210 converts the phase of the gaseous working fluid received from the evaporator 1 into a liquid state. The condenser 210 receives heat from the working fluid and discharges the heat to the outside air. The sump transmission line 220 is a part of the line member which is connected to the evaporation number 1 and the condenser 210 for supplying the vapor which has been converted into a gaseous state by the evaporator to the condenser 210. The liquid transport line 230 is part of a line member that is coupled to the condenser 21A and the evaporator 1 for supplying liquid that is phase-converted by the condenser 210 to the evaporator 1 for the condenser 210's vapor transmission line 220, The general operation of the liquid transport line 230 is the same as that described in the background section. The main object of the present invention 'evaporator 1, condenser 21 〇, liquid transport 9 201003023 5 ινυ^ριΐ money (10) lost secret coffee, noisy pure pipeline system 7 in the middle of the picture - a cross-sectional view. In Figure 20. The sintered core 20, and the plurality 1 includes a heating plate 10, a groove 30, when the sintered core which is soaked in the sintered core metal powder is heated as a fluid. The heating plate 1 is formed of metal and the heat source is, for example, an electronic component that generates heat during operation.
们之-實施例中，加熱板i 12和-個側壁部14 ^下扳。P Η從下板部12的周圍2具:圓盤形狀。侧壁部 可以I +别士 a圍 延伸。下板部12和侧壁部14 了 =疋-體成型或是分開製造後再耦接。下板部12的下表 面接觸熱源並且從熱源魏熱，輪到下板部12的 由熱傳導性而被傳輸到連接下板部12的側壁部14:、、、藉 在本發明之-實施例中，—遮蓋構件10被放置於加熱 10的側壁部14的上處末端。液體傳輸線路23〇和遮宴 構件16相連接，導致從冷凝器21G傳輸出來的液態工作^ 體流進蒸發器1的内部。液體傳輸線路23〇所連接的入= W在蒸發器1的遮蓋構件16中形成’如此使工作流體可 以流進蒸發器1。蒸氣傳輸線路220所連接的出口 18在加 熱板10中形成，如此使蒸氣可以被排出。 在本發明之一實施例中，加熱板1〇的下板部12具有 圓盤形狀，並且側壁部14具有包圍下板部12的形狀。 蓋構件16具有圓盤形狀並且被設置於加熱板1〇的頂部 201003023 蒸發器i具有中空的圓柱形狀。然而本發明並不偈限在上 明。例如下板部可以具有—個多邊形的平板狀，像 燒^芯20和下板部12的上部表面相耦接並從此處接 結芯2〇孔洞中的液態工作流體被所接收的熱氣 成u氧。燒結芯20藉由燒結一種金屬粉末而形成。 ^ 20*中形成大量的空間或是孔洞，如此使液態的工作流體 二該燒結芯2〇。溝槽30在加熱板10和燒結芯20 隻^ 個表面中形成，其功用在作為蒸氣的通路，此 =乳^〇結芯2G中發生相變並經由蒸氣傳輸線路22〇而從 此，因為溝槽3〇和出口 18的連接，蒸氣 ?、、、氣傳輸線路220而從蒸發器丨中排出。 之—f施例中，在下板部12的上表面處以直 顯_二’ θ 30疋相互分開並平行的。每個空間（圖上未 母個溝槽30的兩末端部的周圍形成。並且溝槽30 ⑽的周圍處形成。穿過溝槽30並且和出口 18 在側壁部14中形成。因此從加熱板10的 形成二的溝槽30i成的蒸氣流向下板部的周圍部所 而站:山工0，然後朝向蒸氣傳輪線路220以經由出口 π 成的一二^時’從加熱板10的側壁部14中的溝槽30生 穿人溝槽3G㈣間，然後朝向蒸氣傳輸 琛路220以經由出口 18而傳送。 H)的m3G具有下表面32和侧表面34並且在加熱板 的一側表面上形成。在本發明之一實施例中，加熱板1〇 201003023 /υζριι 的“-個表©”和“内部側表面，，具有相_意義，並且所指 的是下板部12的上表面以及儀部14的㈣表面。因此， 溝槽30在⑽i表φ巾形成或是側表面巾形成。也就是，溝 槽30在下板部12力上表面以及加熱板1〇的侧壁部14的 内部表面中形成。 燒結芯20和加熱板1〇白勺内側表面相耗接來接收熱。 特別的是’燒結S 20是部分植人聽個溝槽％，如此可 以至少接觸到每個溝槽3G的兩個側表24的—部份。在本 =月之f施例中’燒結芯2〇的一部份植入至每個溝槽 30，此一部份稱之為植入部η。 志j入部22的表面24的兩個側表面24和溝槽30的側 的上部相接觸。植人部22植人在每個溝槽％約每 ，度的1/3深處。植人部22的下表面26具有 ί =狀。植入至每個溝槽％的植入部22的植入長度t =植？ 22的兩個側表面的長度來界定 22 ===個側表鳴並假設植™ 和^—些因素時，植人部22的植入長度丈 ^ ^ >狀是可以相互改變的，該些因素例如加埶 之㈣翻面積、有使㈣㈣的㈣ 大小工作流體能被氣化時所在的表面積 t可二1=的因―長度 12 201003023 ^ ί I \>Λ.^ΧΧ 入綠的二直入她有所改變時，植 植入部22b的一個凸起。如圖8中所示， 邓的tri入部22c的植入長度t，其相對於溝槽 表面34是幾乎和每個溝槽3Q的高度相同，並且植 2" 下表面是向内凹陷。植入部22c的下表面 使燒料2G的兩侧表面24和加熱板1〇 =槽3G的兩個侧表面34之_接觸面積最大化，並且 使溝槽30當作-個蒸氣通路，也同時有助於 的下表面26c的面積。 在本發明之一實施例中的加熱管線系統的蒸發器中， 因為燒結芯20的植入部22植人至加熱板1()中的每個溝槽 3〇裡且和每個溝槽30的兩個侧表面相接觸，所以接觸面 積會增加。接觸面積的增加可以參考圖11及圖12。 —圖11是用以說明燒結芯20d和加熱板10互相耦接的 個狀fe的橫切面。圖12是一加熱板1〇的透視圖，其中 ^ 有夕個溝槽30d形成。在圖11和圖12中，為了計算的方 便，假設燒結芯20d和加熱板1〇並不是圓環狀的而是矩 型，η個溝槽在加熱板1〇中形成，其中n是一個整數，並 且母個溝槽具有相同的長度，並且植入部的下表面是平坦 的。因此，因為燒結芯20d和溝槽30d的形狀與圖γ中所 不的並不相同，所以對於燒結芯2〇d和溝槽30d的元件符 號’一個後綴(suffix)字母“d”被加在標號後。 在圖11和圖12中’參考符號的意義如下所示。 13 201003023 j i /υ/ριι wf:加熱寬度 W:溝槽寬度 Η:溝槽高度 L:溝槽長度 η:溝槽數量 rtw:植入部的浸透比例In the embodiment, the heating plate i 12 and the side wall portions 14 are pulled down. P Η has a disk shape from the periphery of the lower plate portion 12. The side wall section can extend around I + 士士. The lower plate portion 12 and the side wall portion 14 are formed by 疋-body molding or separately manufactured and then coupled. The lower surface of the lower plate portion 12 contacts the heat source and is heated from the heat source to the side wall portion 14 of the lower plate portion 12 which is thermally conductively transferred to the lower plate portion 12: The cover member 10 is placed at the upper end of the side wall portion 14 of the heating 10. The liquid transport line 23 is connected to the banquet member 16, causing the liquid working body transported from the condenser 21G to flow into the interior of the evaporator 1. The inlet = W to which the liquid transfer line 23 is connected is formed in the covering member 16 of the evaporator 1 so that the working fluid can flow into the evaporator 1. The outlet 18 to which the vapor transmission line 220 is connected is formed in the heating plate 10 so that the vapor can be discharged. In an embodiment of the invention, the lower plate portion 12 of the heating plate 1 has a disk shape, and the side wall portion 14 has a shape surrounding the lower plate portion 12. The cover member 16 has a disk shape and is disposed on the top of the heating plate 1〇 201003023 The evaporator i has a hollow cylindrical shape. However, the invention is not limited to the above. For example, the lower plate portion may have a polygonal flat plate shape, and the upper surface of the sintered core 20 and the lower plate portion 12 are coupled to each other and the liquid working fluid in the core 2 is connected thereto by the received hot gas. oxygen. The sintered core 20 is formed by sintering a metal powder. ^ 20* forms a large amount of space or holes, so that the liquid working fluid 2 is sintered. The groove 30 is formed in only one surface of the heating plate 10 and the sintered core 20, and functions as a passage for the vapor, which changes phase in the milk core 2G and passes through the vapor transmission line 22, since the groove The connection of the tank 3〇 and the outlet 18, and the vapor/, and gas transmission lines 220 are discharged from the evaporator crucible. In the embodiment, the upper surface of the lower plate portion 12 is separated and parallel with each other by a straight_two' θ 30 。. Each space (the periphery of both end portions of the un-groove 30 on the drawing is formed and formed at the periphery of the groove 30 (10). The groove 30 is formed and the outlet 18 is formed in the side wall portion 14. Therefore, from the heating plate The vapor flow formed by the groove 30i of the second groove 10 is located at the peripheral portion of the lower plate portion and stands at the side of the heating plate 10, and then toward the vapor transfer line 220 to pass through the outlet π. The groove 30 in the portion 14 is inserted between the human groove 3G (four) and then conveyed toward the vapor transmission manifold 220 via the outlet 18. The m3G of H) has a lower surface 32 and a side surface 34 and is on one side surface of the heating plate form. In an embodiment of the present invention, the "plates" and "internal side surfaces" of the heating plate 1〇201003023 /υζριι have a phase meaning, and refer to the upper surface of the lower plate portion 12 and the instrument portion. The (four) surface of 14. Therefore, the groove 30 is formed in the (10) i table or the side surface towel. That is, the groove 30 is in the upper surface of the lower plate portion 12 and the inner surface of the side wall portion 14 of the heating plate 1 The sintered core 20 and the inner surface of the heating plate 1 are consumed to receive heat. In particular, the sintered S 20 is partially implanted with a groove %, so that at least two of each groove 3G can be contacted. Part of the side table 24. In the example of the present invention, a portion of the sintered core 2 is implanted into each of the grooves 30, and this portion is referred to as an implant portion η. The two side surfaces 24 of the surface 24 of the inlet portion 22 are in contact with the upper portion of the side of the groove 30. The implant portion 22 is implanted at a depth of about 1/3 of each groove, and the implant portion 22 is The lower surface 26 has an ί = shape. The implantation length t of the implant portion 22 implanted to each of the grooves % = the length of the two side surfaces of the implant 22 to define 22 === side tables It is assumed that the implant lengths of the implanted parts 22 can be changed from each other, such as the twisted area (4), the size of the (four) (four), and the size of the work. The surface area t where the fluid can be vaporized can be two 1 = the length of the length 12 201003023 ^ ί I \>Λ.^ΧΧ The green into the two, when she changes, a bulge of the implanted portion 22b As shown in Fig. 8, the implantation length t of the tri-inlet portion 22c of Deng is almost the same as the height of each groove 3Q with respect to the groove surface 34, and the lower surface of the implant 2" is inwardly recessed. The lower surface of the inlet portion 22c maximizes the contact area of the both side surfaces 24 of the burning material 2G and the two side surfaces 34 of the heating plate 1 〇 = the groove 3G, and makes the groove 30 be a vapor passage, and at the same time The area of the lower surface 26c that contributes. In the evaporator of the heating line system in one embodiment of the invention, since the implant portion 22 of the sintered core 20 is implanted into each of the grooves in the heating plate 1 () 3 且 and in contact with the two side surfaces of each of the grooves 30, so the contact area will increase. The increase in contact area can be 11 and FIG. 12. Fig. 11 is a cross-sectional view of a shape fe which is coupled to each other by the sintered core 20d and the heating plate 10. Fig. 12 is a perspective view of a heating plate 1,, wherein The groove 30d is formed. In Fig. 11 and Fig. 12, for the convenience of calculation, it is assumed that the sintered core 20d and the heating plate 1 are not annular but rectangular, and n grooves are formed in the heating plate 1? n is an integer, and the mother grooves have the same length, and the lower surface of the implant portion is flat. Therefore, since the shapes of the sintered core 20d and the groove 30d are not the same as those in the figure γ, The element symbol 'a suffix' letter "d" for the sintered core 2〇d and the groove 30d is added after the label. The meaning of the 'reference symbol' in Figs. 11 and 12 is as follows. 13 201003023 j i /υ/ριι wf: heating width W: groove width Η: groove height L: groove length η: number of grooves rtw: penetration ratio of the implant
Af:接觸面積 rw:植入長度的比例 A:蒸氣氣化面積Atw:浸透面積 At:總面積 W’xL=A’，WxL=A，At=n(A，+A) 當加熱面積和總面積的比例是rw=W/W，， nA7At=nWX/n(W’L+WL)=W’/(W’/W)=l/(l+rw)。如果燒結 芯20d以長度t的深度被植入至每個溝槽30d並且植入部 的兩側表面是對稱的，則接觸面積所增加的量如下所示。 當rtw=2t/W，Atw=2tL=rtwWL。因此，接觸面積為 Abn(W'L)+n(rtwWL)=nL(W，+rtwW)。所以當燒結芯 2〇d 插 入每個溝30d時’加熱面積增加的比例為Μ,/Αρ nL(W^rtwW)/nL(W^W)=(W^rtwW)/(W^W)=(l+rtwrw)/(l+r w) 〇 一般來說，溝槽3(M的大小和數量是根據系統的規格 來決疋的。因為接觸面積的增加降低了熱通量(w/m2)的 值，所以較佳是能使接觸面積增加。如果接觸長度比例〜 為0.5，當浸透比例rtw增加為ο.!%時，接肺積比例 則增加到G.7-G.83。和以下這個當浸透比例為G時的例子 相比，則接觸面積比例從〇·67增加了 〇〇3_〇17至 201003023 0.7-0.83。因此當浸透比例〜為i，也就是㈣ 則接觸面積可對應於植入面積而更大。 戍更夕， 可以和屬10的-個側表面相麵接的方法 芯20，然後把声㈣^起的方法，以及一種形成燒結 妓如才和形成有溝槽30的加熱板10搞 接起來的輕接方法。搞接方法 :、、 屬耦接法。 匕括簡早加壓輕接法以及金 至於在同時燒結法中，多個 成’而且因為考慮到植入部的植入冓長槽度在和== 7-9 Ϊ，因31:幵華的固體材料。也就是，在圖 中α為考慮到母一個溝槽中 溝槽的一部分填充了昇華的固體材:二 安置夹具並以燒結芯的厚度來和其他的夹且 、二=夾具是和金屬粉末封裝在-起並在預設i 加熱—段時間’其溫度和時間是根據要燒 ^ 叙末來決定。當燒結該金屬粉末搞、 接。並且者泰雇 隻屬私末和加熱板耦 ㈣㈣I 的同時’填充在溝槽裡的昇華 :體材枓會開始昇華並排出。因此，當一個空的空= 』望的形狀時，植人至每—個 二 會形成所射的形狀。 收、〜、的植入部 簡單的加壓搞接法中’一個預先製造好的金屬紗 心s和加熱板接觸，然後一預定的負 '、° 使此燒結芯與加熱板雛。在金屬輕接方法中，,一=先 15 201003023Af: contact area rw: ratio of implant length A: vapor gasification area Atw: impregnation area At: total area W'xL=A', WxL=A, At=n(A, +A) When heating area and total The ratio of the area is rw=W/W, and nA7At=nWX/n(W'L+WL)=W'/(W'/W)=l/(l+rw). If the sintered core 20d is implanted into each of the grooves 30d at a depth t of the length and the both side surfaces of the implant portion are symmetrical, the amount by which the contact area is increased is as follows. When rtw = 2t / W, Atw = 2tL = rtwWL. Therefore, the contact area is Abn(W'L)+n(rtwWL)=nL(W, +rtwW). Therefore, when the sintered core 2〇d is inserted into each groove 30d, the ratio of the increase in the heating area is Μ, /Αρ nL(W^rtwW)/nL(W^W)=(W^rtwW)/(W^W)= (l+rtwrw)/(l+rw) 〇 In general, the size and number of grooves 3 (M is determined according to the specifications of the system. Because the increase in contact area reduces the heat flux (w/m2) The value is preferably such that the contact area is increased. If the contact length ratio is 0.5, when the saturation ratio rtw is increased to ο.!%, the ratio of the lung volume is increased to G.7-G.83. Compared with the example when the penetration ratio is G, the contact area ratio increases from 〇·67 to 〇〇3_〇17 to 201003023 0.7-0.83. Therefore, when the penetration ratio is i, that is, (4), the contact area can correspond. It is larger in the implantation area. In the case of the 夕, the core 20 can be attached to the side surface of the genus 10, and then the method of sounding (four) and the formation of a sintered slab and a groove are formed. The light connection method of the heating plate 10 of 30. The connection method is: , and is a coupling method. The method includes a simple early press and a light connection method, and the gold is in the simultaneous sintering method, and a plurality of In order to take into account the implantation of the implant, the long groove is at == 7-9 Ϊ, because 31: 幵华的固体材料. That is, in the figure, α is a part of the groove in consideration of the groove in the mother groove. Sublimated solid material: two placement fixtures and the thickness of the sintered core and other clamps, and the second fixture is packaged with the metal powder and heated at the preset i-stage time. The temperature and time are based on It is decided to burn the metal powder. When the metal powder is sintered, it is only the private and the heating plate coupling (4) (4) I while sublimating in the groove: the body material will begin to sublimate and drain. When an empty space = the shape of the shape, the implanted person will form the shape of the shot. Each of the implants is replaced by a simple press-fit method. The yarn core s is in contact with the heating plate, and then the predetermined sintered core and the heating plate are formed by a predetermined negative ', °. In the metal light connection method, one = first 15 201003023
Jl/U2pit 製造好的金屬燒結芯會和加熱板接觸，並再—次地加熱炉 結（或一次燒結）以便使燒結芯和加熱板麵接。任何一j固上The metal sintered core produced by Jl/U2pit is brought into contact with the heating plate, and the furnace junction (or one sintering) is heated again to make the sintered core and the heating plate face-to-face. Any one
述的方法都可以適當地被選作用來耦接該燒結芯至加 熱板10的側表面。 U 如上所述’關於本發明中之環狀加熱管線系统的_ 器，因為在加熱板和燒結芯之間的接觸面積和傳統技術相 比是增加的’所以接觸傳導性也會增加。也就是，在傳统 技術中，加熱板和燒結芯是相互接_，除了相對於個 用來當作蒸氣通道的溝槽寬度賴應的—麵面以外 本發明中的紐器’因魏結芯的—部分是植人至每一個 溝槽裡，並且和每-個溝槽的兩侧表面相接觸，所以 加熱板和燒結芯之間的接觸面積會增加。 並且，關於本發明中之環狀加歸線系統的基發器， 因為植入至每-個賴中的燒結糾植 狀會在加熱板和燒料之_翻面積增 ==形成’則一個蒸氣通道的截面積和氣二： 了乂額外地調整’以便使適合環境下的最佳效率可以達成。' 外’根據同時燒結法，因為製造方法簡單，所以f 的成本低。特別的是，因為在燒結芯和加^ 行的，所以接觸狀態會被改進以 a 而且，藉由填充至溝槽中的昇華物質 ί此:外’二吉:的植入部份可以形成任何的形狀。 和上述的同時燒中植當ί結芯和加熱板_時， 匕，燒結芯和金屬加熱板之間的麵 201003023 接狀會稍微地退化。缺而因 溝槽接的:所以 ==接觸面積會增加。並且，燒二::: 可以機械性地加卫成所需要的形狀。 植入σΡ 基發於本發明中有關環狀加熱管線系統用的 二^口⑽父於傳、统的技術，因為燒結芯和加 接觸面積增加，所以該接觸料性會增加。‘、、、曰、 本發:然以實施例揭露如上’然其並非用以限定 太^ 關技術領域巾具㈣常知識者，在不脫離 心範圍内’當可作些許之更動與潤飾，故本 ί圖式簡ί二當視後附之申請專利範圍所界定者為準。 圖1說明一個傳統圓筒式加熱管線的運作。 圖2說明一個傳統環狀加熱管線的概念。 圖3是圖2中傳統蒸發器的橫切面視圖。 圖4疋圖3中燒結芯旋轉度後的透視圖。 的橫中燒結芯—個部分和傳統蒸發器的加熱板 狀加t疋根據本發_實施例巾的—個包括蒸發器的環 …、官線系統的透視圖。 圖7是圖6中蒸發器的橫切面視圖。 圖8、圖9、圖1〇是根據本發明的實施例中，圖7 現、、、°芯的橫切面視圖。 17 201003023 3I7U2pit 圖11是說明燒結芯和加熱板耦接在一起的狀態的橫 切面視圖。 圖12是形成有一溝槽的加熱板的透視圖。 【主要元件符號說明】 10、122 :加熱板 12 :加熱板下板部 14 :加熱板侧壁部 16 :遮蓋構件 17 :入口 18 :出口 20、20d、102、120 :燒結芯 22、22a、22b、22c :燒結芯植入部 24 :燒結芯的兩個侧表面 26、26a、26b、26c :燒結芯植入部的下表面 30、30d :溝槽 32 :溝槽下表面 34 :溝槽侧表面 100 :圓筒式熱導管 101 :熱源 103、105 :多個箭頭 104 :散熱器 110 :環狀加熱管線系統 112、210 :冷凝器 114 :蒸發器 18 201003023 ^ X ! 116 :蒸氣線路 118 :液體線路 126 :燒結芯表面 126a :燒結芯微通路 126b :燒結芯的加熱板接觸表面 220 :蒸氣傳輸線路 230 :液體傳輸線路 19The method described can be suitably selected to couple the sintered core to the side surface of the heating plate 10. U As described above, with respect to the annular heating line system of the present invention, the contact conductivity is also increased because the contact area between the heating plate and the sintered core is increased as compared with the conventional art. That is, in the conventional art, the heating plate and the sintered core are connected to each other, except for the surface of the present invention which is dependent on the width of the groove used as the vapor passage. Part of it is implanted into each of the grooves and is in contact with both side surfaces of each groove, so the contact area between the heating plate and the sintered core is increased. Moreover, with regard to the base hair styling system of the ring-shaped returning line system of the present invention, since the sintering entanglement shape implanted into each of the slabs is increased in the heating plate and the burning material, the area is increased by == The cross-sectional area of the vapor channel and the gas two: 乂 additional adjustment 'to achieve the best efficiency in the right environment can be achieved. The 'outer' is based on the simultaneous sintering method, and since the manufacturing method is simple, the cost of f is low. In particular, since the core is sintered and added, the contact state is improved by a and, by sublimating the substance into the groove, the outer portion of the implant can form any shape. At the same time as the above-mentioned simultaneous firing, when the core and the heating plate _, the surface between the sintered core and the metal heating plate 201003023 will be slightly degraded. Missing due to the groove connection: so == contact area will increase. Also, the burnt two::: can be mechanically added to the desired shape. Implantation of σ Ρ is based on the technique of the invention for the annular heating pipeline system. Since the sintered core and the contact area are increased, the contact property is increased. ',, 曰, 本发: However, the above example is disclosed as the above. However, it is not intended to limit the knowledge of the technical field (4), who can make some changes and refinements without leaving the heart. Therefore, the scope of the patent application is subject to the definition of the patent application. Figure 1 illustrates the operation of a conventional cylindrical heating line. Figure 2 illustrates the concept of a conventional annular heating line. Figure 3 is a cross-sectional view of the conventional evaporator of Figure 2. Figure 4 is a perspective view of the sintered core after rotation of the core. The transversely-sintered core-parts and the heating plate of the conventional evaporator are added to the perspective of the ring system of the present invention, including the evaporator, and the official line system. Figure 7 is a cross-sectional view of the evaporator of Figure 6. 8, 9, and 1 are cross-sectional views of the core of Fig. 7, in accordance with an embodiment of the present invention. 17 201003023 3I7U2pit Figure 11 is a cross-sectional view showing the state in which the sintered core and the heating plate are coupled together. Figure 12 is a perspective view of a heating plate formed with a groove. [Description of main component symbols] 10, 122: heating plate 12: heating plate lower plate portion 14: heating plate side wall portion 16: cover member 17: inlet 18: outlets 20, 20d, 102, 120: sintered cores 22, 22a, 22b, 22c: sintered core implant portion 24: two side surfaces 26, 26a, 26b, 26c of the sintered core: lower surface 30, 30d of the sintered core implant portion: groove 32: groove lower surface 34: groove Side surface 100: cylindrical heat pipe 101: heat source 103, 105: plurality of arrows 104: heat sink 110: annular heating line system 112, 210: condenser 114: evaporator 18 201003023 ^ X ! 116 : vapor line 118 Liquid line 126: sintered core surface 126a: sintered core microchannel 126b: heated plate contact surface 220 of sintered core: vapor transmission line 230: liquid transmission line 19