1296039 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱模組，尤其指具有加工容易 且節省製造成本之熱管之散熱模組。 【先前技術】 曰隨著技術的進步，電子元件單位面積上的電晶體數 1越來越多，造成其工作時發熱量的增加。另一方面， 7子70件的工作頻率也越來越高，電晶體工作時開/關 一(〇n/〇ff )轉換所造成的熱量（switch loss)，亦是電子 凡件發熱1增加的原因。若未能適當的處理這些熱量， 成晶片運算速度的降低，嚴重者甚至影響到晶片 ί加強電子元件之散熱效果，$見行的做法大多 f 源处以放熱器將熱導出，經由散熱器之鰭片（^ iη) 以自然或強制對流方式將熱散逸至環境中。 由：熱曰官(heat piPe)可在很小的截面積與溫度差 源供靡的熱傳送—段可觀的距離，且不需外加電 ϋ w "運作，在無須動力提供和空間利用經濟性的 埶，各式熱管已是電子散熱產品中廣為應用的傳 ;;面示音；。了參考第1圖，其為習知之柱狀型熱管之 复另一柱狀型之熱管ι〇係由其一端封閉且 密=之熱管本體12與一上蓋u結合後所形成 在閉中空腔體。 且由氕12係為一鍛造而成之内部中空之罐體， 之内辟上° 2以及底部124所組成。在熱管本體12 土 （亦即是側壁部122之内表面以及底部124之 1296039 内表面上）分別設置有毛細結構16a、16b，且於上蓋14 中央一般會外接一注水管18,工作流體评係藉由注水管 18充填至熱冑1G内部且藉由注水管18絲管10内部 抽真空，藉以完成熱管10之製作。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module having a heat pipe that is easy to process and saves manufacturing costs. [Prior Art] With the advancement of technology, the number of transistors per unit area of electronic components is increasing, causing an increase in heat generation during operation. On the other hand, the working frequency of 70 pieces of 7 sub-pieces is also getting higher and higher, and the switch loss caused by the switching of the on/off one (〇n/〇ff) during the operation of the transistor is also an increase in the heating of the electronic parts. s reason. If the heat is not properly processed, the speed of the wafer processing is reduced, and the serious effect even affects the heat dissipation effect of the electronic components. The practice of most of the f sources is to use a heat sink to heat the heat through the fins of the heat sink. The film (^ iη) dissipates heat into the environment in a natural or forced convection manner. By: heat piPe can transmit heat at a small cross-sectional area and temperature difference source - a considerable distance without the need for external power w " operation, without power supply and space utilization economy Sexual flaws, all kinds of heat pipes have been widely used in electronic heat dissipation products; Referring to Fig. 1, which is a columnar heat pipe of the prior art, another column-shaped heat pipe is formed by a closed end of the closed heat medium body 12 and a heat pipe body 12 combined with an upper cover u. . And the 氕12 series is a forged inner hollow tank body, which is composed of a bottom 2 and a bottom 124. The capillary structure 16a, 16b is disposed on the inner surface of the heat pipe body 12 (i.e., the inner surface of the side wall portion 122 and the inner surface of the bottom portion 124, 1296039), and a water injection pipe 18 is generally connected to the center of the upper cover 14, and the working fluid is evaluated. The heat pipe 10 is completed by filling the inside of the hot 胄 1G by the water injection pipe 18 and evacuating the inside of the wire pipe 10 by the water injection pipe 18.
然而，上述之熱管本體12通常使用鍛造加工，不 僅其加工費用高昂，其廢料率也相當高（一般會超過 50%)，造成零件的加工成本很高。另外，熱管本體12 與上蓋14的結合、上蓋14與注水管18的結合皆需使用 填充焊料來加以焊接，其成本亦高，進而影塑整口 的競爭力與利潤。 9 另外，對於使用粉末燒結方式製作毛細結構16a、 16b的柱狀型之熱管1 〇而言，受限於燒結模具及製程因 素’底部124上之毛細結構16b與侧壁部122上之毛細 結構16a係共同填粉燒結而成，但在上蓋14之内表面= 通常沒有另外設置毛細結構，使得凝結於上蓋14處的工 作流體無法回流，造成上蓋14處變成無效的冷凝端 '，影 響熱管10内工作流體質量的變動，進而影響熱管1〇之 傳熱效率及整體熱阻。 承上所述，如何製作一成本低廉、製程簡單的柱狀 型熱管，且能夠解決上述之問題並增加熱管之熱交換面 積進而提升整體散熱效能，實乃一重要課題。 【發明内容】 因此，為解決上述問題，本發明係提出一種散熱模 組及其熱管，其不僅能夠解決習知柱狀型熱管廢料率高 的問題，不僅可減少焊接次數，簡化組裝過程，具有=However, the above-described heat pipe body 12 is usually forged, which is not only expensive to process, but also has a high scrap rate (generally more than 50%), resulting in high processing costs for parts. In addition, the combination of the heat pipe body 12 and the upper cover 14, and the combination of the upper cover 14 and the water injection pipe 18 are required to be welded by using a filler solder, which is also costly, thereby competing for the competitiveness and profit of the entire mouth. In addition, for the columnar heat pipe 1 制作 which is formed by the powder sintering method to form the capillary structures 16a, 16b, it is limited by the sintering mold and the process factor 'the capillary structure 16b on the bottom portion 124 and the capillary structure on the side wall portion 122 16a is formed by co-filling and sintering, but the inner surface of the upper cover 14 is generally not provided with a capillary structure, so that the working fluid condensed at the upper cover 14 cannot be recirculated, causing the upper cover 14 to become an ineffective condensation end, affecting the heat pipe 10 The variation of the internal working fluid quality, which in turn affects the heat transfer efficiency and overall thermal resistance of the heat pipe. As mentioned above, how to make a column-type heat pipe with low cost and simple process, and solve the above problems and increase the heat exchange area of the heat pipe to improve the overall heat dissipation performance is an important issue. SUMMARY OF THE INVENTION Therefore, in order to solve the above problems, the present invention provides a heat dissipation module and a heat pipe thereof, which can not only solve the problem of high column-type heat pipe waste rate, but also reduce the number of welding times and simplify the assembly process.
1296039 敎其之間早的優點之外，更可有效地增加柱狀型 …、熱父換面積進而提升整體散熱效能。 根據本發明的目的，提一 體與-底座。熱管本體星有一頂t熱吕本 /日,丨辟如/丨 八有頂#以及一壤設於頂部之 和側壁部與頂部係一體成型，且頂部更向外突出 广^體成型有—注水管。底座係與頂部相對設置，其中 氐上具ί㈤陷部’例如是-環狀凹槽或-下陷凹台， 體之側壁部之末端插入後’使底座與熱管本 ，口：後共同形成一封閉空間。其中於凹陷部旁侧更具 有一環狀突出區’當熱管本體之侧壁部之末端插入底座 ，&再對環狀突出區加工使其填人凹陷部與側 一部之間’使底座與熱管本體緊密接合。於凹陷部及埶 ^體之側壁部間更可塗佈有i膏（soldering paste) 或八他銲料，以焊接或熔接的方式結合熱管本體與底 座，以形成一密閉之中空腔體。 如上述之熱官，其中底座除了是具有平坦之底座内 表面之外j亦可以是具有一非平坦之底座内表面，且底 座内表面係朝向頂部。且熱管更包括第一毛細結構、第 二毛細結構以及工作流體。第一毛細結構設置於熱管本 ，之侧壁部内表面與頂部内表面上，而第二毛細結構則 設置於底座内表面上，且第二毛細結構與第一毛細結構 相連’而工作流體則充填於該熱管内。 底座除了是具有平坦之底座内表面之外，亦可以是 於底座内表面係形成有至少一凸塊，凸塊於底座内表面 上之截面开> 狀為半球形、弧形、三角形、矩形、方形或 梯形，且凸塊於底座内表面上係構成一棋盤式圖案、一 1296039 行列，案、一對稱式圖案或一非對稱式圖案。 第一毛細結構係鋪設於底座内表面， 結構面向頂部係形成—平面或—凹凸不平的細 厚度，且第-厚度係大於第二厚第二 座内表面之輪廓而設置，第二毛細：= =等厚度。熱管本體之侧壁部係呈- 官本體與底座之材f係為—高熱傳導材料，如 、，°銀、鋁或其合金。第一毛細結構盥第二毛如社 材質包括選自塑膠、金屬、人全、夕2 7 、、、田、、、°構之 埴Ϊ族群其中之一，且設置之方法係選自燒結、黏著、 體積所組成之族群其中之-或其結合。工作流 媒、右：合物、純水、醇類、酮類、液態金屬、二L 媒、有機化合物或其混合物之一。 飞 孰管气本發明的另—目的’提出-種散熱模組，包括 座、。片。熱管包括-熱管本體與-底 ==::係二成型’且頂部更向外突出二 有44 ;极ί係與頂部相對設置，其中底座具 =管本體结合後共同形成-封閉=二： ΐ端區，當熱管本體之側壁部之 入〔 陷邛後，再對環狀突出區加工使其填 底絲齡本《密接合。、 (solde : ”、、官本體之側壁部間更可塗佈有-錫膏 ring paste)或其他輝料，以焊接或熔接的方式結 1296039 合熱管本體與底座，以形成一密閉之中空腔體。 祚曰散片係以鋁擠成型、沖壓或其他加工方式f 二係為水平間隔分佈、垂直間隔分佈上 置於孰^ 射狀分佈或其他分佈方式。散熱鰭片設 ::、二卜並，管相連接，且連接方式係選自焊接、 人& *、黏著所組成之族群其中之一。例如，％敎 熱管細熱鑲方式進純合以及/或卡固。另^ 二二「之間更具有—錫f (s〇ideri叫 、-導熱貧(grease)，或一可充當導熱介面之材 if之散熱模組，熱管可透過—基座或是直接與 :、、:、，觸，用以將熱源發散的熱直接傳導至散熱鰭 :’如中央處理器、電晶體、舰器、高階繪圖= ==應器、行車控制系統、多媒體電子機構、無 台或高階遊戲機等。再者，上述之散熱模組 、二：風扇組接，用以促進由散熱模組所導出的熱更加 迅迷逸散。 為讓本發明之上述和其他目的、特徵、和優點能更 …員易懂，下文特舉一較佳實施例，並配合所附圖式， 作詳細說明如下： 【實施方式】 以下將參照招關圖式，說明依本發明之散熱模組及 /、熱管之實施例。 明參照第2圖，其為依照本發明較佳實施例之一種 1296039 柱狀型熱管之示意圖。本發明之柱狀型熱管2〇，係包括 一熱管本體22以及一底座24。熱管本體以具有一頂 224以及一環設於頂部224之側壁部222，且側壁22 與頂部224係一體成型’熱管本體22之側壁部222 一空心柱狀。熱管本體22之頂部m更向外突出且二 成型有一注水管226，而底座24係與熱 部224相對設置。 股“之了頁 之孰：m第广2二4圖’第3圖與第4圖為第2圖 之熱官本體22與底座24組裝前後之剖面示意圖。於第 座24可以為圓形、方形或其他幾何形狀，且 可^管本體22之侧壁部222之末端插入後槽使I2座 24與熱管本體22結合後得以共同形成—封閉空間吏_ 如^圖與第3圖所示，於環狀凹槽如旁側更具 有衣狀犬出區244,當熱管本體22之侧壁部222 = 24之環狀凹槽242後，再使用例如是沖壓、 壓杈4方式，對環狀突出區244加工 242與側壁部222之間的 -真入^狀凹槽 本體，密接合，如第4圖隙所中示㈣使底座24與熱管 槽242及熱管本體之側壁部222間更可塗 接的方或其他銲料，以焊接或熔 =方式—熱官本體與底座24，以形成—密閉之中空 或者’第2圖中之底座24 r ju、 了是環狀凹槽的形式之外’除 昭筮R闰 ^ ^ 1力J Μ馮一下陷凹台。請參 圖中，i座54上Hi中底座的另—種實施例。於第5 底座54上所形成之凹陷部，係一下陷凹台⑽， 1296039 進行嵌合以及/或卡固。另外，散熱鰭片62a與熱管20 之間更塗佈有一錫膏（soldering paste)、一導熱膏 (grease)，或一可充當導熱介面之材料。 ； 多個散熱鰭片62a係呈放射狀分佈於熱管2〇外並 與熱管20相連，且熱管20係被套設於多個散熱鰭片62a 之間。或者，如第6B圖所示，多個散熱鰭片62b係以水 平間隔分佈之方式套設於熱管20外，且多個散熱鰭片 62b之間彼此平行。然散熱鰭片62a或62b之分佈方式 _ 僅為舉例，本發明並不限制於此，散熱鰭片62a、62b 的排列方式亦可以是垂直間隔分佈、斜向間隔分佈或其 他分佈方式。 然而 不赞明並非限制於此，第2圖中之底座24 除了是具有平坦之底座内表面241之外，亦可以是具有 了非平坦之底座内表面，例如請參照第7A〜7c圖，其為 第2圖中之底座之各種示意圖。於第7Α〜7(：圖中，底座 74之内表面741係朝向第2圖之熱管本體22之頂部 底座内表面741係形成有至少一凸塊743，凸 :氐座内表面741上之截面形狀為矩 =的”形、方形或梯形等其他形狀。在此，需 , Γ疋凸塊743形成於底座内表面741的型熊 與個數並不限制，可為多個凡由 僅由單一 Μ (如第7β圖所示），或 743 rf: λ, ^弟A、7C圖所示）構成，且多個凸 圖案、-掛猶4 R安i 構成其盤式圖案、-行列 、子知式圖案或一非對稱式圖案。1296039 In addition to its early advantages, it can effectively increase the columnar shape, and the hot parent exchange area to improve the overall heat dissipation performance. In accordance with the purpose of the present invention, an integral body and a base are provided. The main body of the heat pipe has a t-hot Lvben/day, a 丨 如 如 / 丨 有 顶 top # and a soil on the top and the side wall and the top are integrally formed, and the top is more outwardly protruding and formed. Water pipe. The base system is disposed opposite to the top portion, wherein the 氐 (5) recessed portion is, for example, an annular groove or a recessed concave table, and the end of the side wall portion of the body is inserted to make the base and the heat pipe, and the mouth: the rear form a closed space. There is an annular protruding area on the side of the concave portion. When the end of the side wall portion of the heat pipe body is inserted into the base, the annular protruding portion is processed to fill the gap between the concave portion and the side portion. Closely engaged with the heat pipe body. Further, a soldering paste or a stellite solder may be applied between the depressed portion and the sidewall portion of the body, and the heat pipe body and the bottom seat are welded or welded to form a sealed hollow body. As described above, the base may have a non-flat base inner surface in addition to the flat inner surface of the base, and the inner surface of the base faces the top. And the heat pipe further comprises a first capillary structure, a second capillary structure and a working fluid. The first capillary structure is disposed on the inner surface of the side wall portion and the top inner surface of the heat pipe, and the second capillary structure is disposed on the inner surface of the base, and the second capillary structure is connected to the first capillary structure and the working fluid is filled In the heat pipe. In addition to the inner surface of the base having a flat base, the base may be formed with at least one protrusion on the inner surface of the base, and the cross section of the protrusion on the inner surface of the base is hemispherical, curved, triangular, and rectangular. , square or trapezoidal, and the bumps on the inner surface of the base form a checkerboard pattern, a 1296039 row, a case, a symmetrical pattern or an asymmetric pattern. The first capillary structure is laid on the inner surface of the base, and the structure faces the top to form a flat or uneven thickness, and the first thickness is larger than the contour of the second thick inner surface of the second seat, and the second capillary:= = equal thickness. The side wall portion of the heat pipe body is a high heat conductive material such as , silver, aluminum or an alloy thereof. The first capillary structure 盥 毛 社 社 社 社 社 社 包括 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 盥 、 、 、 、 、 、 Among the groups of adhesions and volumes - or combinations thereof. Work medium, right: one of a compound, pure water, an alcohol, a ketone, a liquid metal, a two-L medium, an organic compound or a mixture thereof. The other purpose of the invention is to provide a heat dissipation module comprising a seat. sheet. The heat pipe includes - the heat pipe body and the bottom ==:: two forming 'and the top is more outwardly protruding from the two with 44; the extreme is set opposite to the top, wherein the base is = the pipe body is combined to form - closed = two: ΐ In the end zone, when the side wall portion of the heat pipe body is in the trapped state, the annular projecting zone is processed to fill the bottom wire. (solde: "," the sidewall of the body body may be coated with a solder paste or other glow material, and the 1296039 heat pipe body and the base are welded or welded to form a closed cavity. The 祚曰 片 系 以 以 以 以 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝 铝And, the tubes are connected, and the connection method is selected from one of the group consisting of welding, human & *, and adhesion. For example, the % heat pipe is hot and inlaid into a homozygous and/or stuck. "There is more between - tin f (s〇ideri called, - heat-depleted (grease), or a heat-dissipating module that can act as a heat-conducting interface if the heat pipe can pass through - the base or directly with:,,:, , the touch, used to transmit the heat radiated by the heat source directly to the heat sink fins: 'such as central processing unit, transistor, ship, high-order drawing ===the device, driving control system, multimedia electronic mechanism, no stage or high-end game machine Etc. Further, the above heat dissipation module, two: fan group The above-mentioned and other objects, features, and advantages of the present invention are more readily understood. The following is a preferred embodiment of the present invention. The drawings will be described in detail as follows: [Embodiment] Hereinafter, embodiments of a heat dissipation module and/or a heat pipe according to the present invention will be described with reference to a schematic drawing. Referring to FIG. 2, it is a comparison with the present invention. A schematic diagram of a 1296039 columnar heat pipe of the preferred embodiment. The columnar heat pipe of the present invention comprises a heat pipe body 22 and a base 24. The heat pipe body has a top 224 and a ring disposed on the side wall of the top 224. 222, and the side wall 22 and the top portion 224 are integrally formed. The side wall portion 222 of the heat pipe body 22 has a hollow column shape. The top portion m of the heat pipe body 22 protrudes outwardly and two water injection pipes 226 are formed, and the base portion 24 and the heat portion 224 are formed. Relative setting. The stock of "the page of the page: m wide 2 2 4" 'Fig. 3 and 4 is the cross-sectional view of the front and rear of the hot body 22 and the base 24 of the second figure. Round, square or other geometry And the end of the side wall portion 222 of the main body 22 is inserted into the rear groove to form the I2 seat 24 and the heat pipe body 22 together to form a closed space 吏_ as shown in Fig. 3 and Fig. 3, in the annular groove If the side of the heat pipe body 22 is 222 = 24 annular groove 242, the annular protrusion 244 is processed 242 by using, for example, stamping and pressing. The inner surface of the groove portion between the side wall portion 222 and the side wall portion 222 is tightly joined, as shown in FIG. 4 (4), the side of the base 24 and the heat pipe groove 242 and the side wall portion 222 of the heat pipe body are more smeared or Other solders, in the form of welding or fusion = the body of the heat and the base 24 to form a closed hollow or the base of the second figure 24 r ju, which is in the form of an annular groove.闰 ^ ^ 1 force J Μ Feng fell into the recessed platform. Referring to the figure, another embodiment of the base of Hi in the i-seat 54 is shown. The recess formed on the fifth base 54 is recessed (10), 1296039 is fitted and/or clamped. In addition, a heat sink fin 62a and a heat pipe 20 are further coated with a soldering paste, a thermal grease, or a material that can serve as a heat conducting interface. The plurality of heat dissipation fins 62a are radially distributed outside the heat pipe 2 and connected to the heat pipe 20, and the heat pipe 20 is sleeved between the plurality of heat dissipation fins 62a. Alternatively, as shown in Fig. 6B, the plurality of heat dissipating fins 62b are sleeved outside the heat pipe 20 in a horizontally spaced manner, and the plurality of fins 62b are parallel to each other. However, the distribution pattern of the heat dissipating fins 62a or 62b is merely an example, and the present invention is not limited thereto. The arrangement of the heat dissipating fins 62a, 62b may also be a vertical spacing distribution, an oblique spacing distribution or the like. However, it is not limited thereto, and the base 24 in FIG. 2 may have a flat base inner surface 241 in addition to the flat base inner surface 241. For example, refer to FIGS. 7A to 7c. It is a variety of schematic diagrams of the base in Figure 2. At 7th to 7th (the figure, the inner surface 741 of the base 74 faces the top base inner surface 741 of the heat pipe body 22 of FIG. 2, at least one bump 743 is formed, and the convex: the cross section on the inner surface 741 of the sley The shape is a shape such as a shape, a square shape, or a trapezoidal shape. In this case, the number of bears and the number of the type of bears formed on the inner surface 741 of the base is not limited, and may be a single Μ (as shown in Fig. 7β), or 743 rf: λ, ^ brother A, 7C shown in the figure), and a plurality of convex patterns, - hangs 4 R An i to form its disc pattern, - row, sub A knowing pattern or an asymmetric pattern.
17月參照第2圖，埶營更白把楚 ^ AM J.HT 26a、第二毛細結構2 ”、、s更匕括第一毛細結構 bb以及一充填於熱管20内部之工 12 (S ) 1296039 内^^細結構2以設置於熱管本體22之側壁 構26b則^署#;頂部224之内表面上，而第二毛細結 ，26b則设置於底座24之内表面 = 構26b與第一毛細結構26a相連。 且弟一毛細結 毛二dl圖第其Jf】圖中之底座及其上之 表面W之輪“設置第著底座内 2座I4/僅、㈣出單-凸請之二不同、弟 上之^ ^參照第_，其為第2圖中之底座及其 於ϊΐ、ΓΓ 一示意圖。第二毛細結構26b係鋪設 f底座84之内表面84卜俾使第二毛細結構26b面向第 2圖之熱管本體22之頂部224而形成一平 f構26b於垂直於底座84之方向上具有一第一厚产耵 第：’且第-厚度H1係大於第二厚度；。 二：度】1為位於底座内表面841$具有凸塊843處上 6b之厚度’而第二厚度H2則為位於 底座内表面841且具有 26b之厚度。-有凸塊843處上方之第二毛細結構 麻广Λ 2參照第2 W ’ #熱f Μ實際在使用時，係以 用Ϊ將孰二2了熱管Μ下方之熱源(未繪示)接觸， —、…源所產生的熱直接導離熱源。或者，熱管別 (未管2°下方並位於熱源上方之外部基座 細結構26b(即蒸發端)中:二 ”、、’、產生的熱而變成氣態之工作流體，並在壓差的 13 1296039 影響下自然流向冷凝端，然後於遠離熱源一端之毛細結 構26a(即冷凝端）中釋出潛熱後轉變為液態之工作^ ，，再藉由毛細結構26b所提供之毛細力而流回至蒸= 端，如此循環不已地將熱持續帶離熱源，以達到散熱的 功效。 熱官本體22與底座24之材質係為一高埶傳導材 料，如銅、銀、銘或其合金。第一毛細結構26:、與= 毛細結構26b之材質包括選自塑膠、金屬、合金、多孔 性非金屬材料所組成之族群其中之一，且設置之 選自燒結、黏著、填充及沈積所組成之族群其中之一或 其結合:工作流體w係為無機化合物、純水、醇類、嗣 類、液痛、金>|、冷媒、有機化合物或其混合物之一。 由於熱管本體20與底座24係二獨立之元件，底座 24之内表© 241可輕易加工成不平坦之表面’使得底座 24與毛細結構26b之間的接觸面積增加 昇 管2〇之散熱性能。再者，設置於底座内表面2411= 與;熱管本體20上之毛細結構26a分開設 ^因此可輕易在凹凸不平之底座24上設置單一或不同 厗度之毛細結構26b’藉以增加毛 升工作流體之蒸發效率，進而搓昇^ J人：面積以k 散熱性能。 進而“幵熱官2〇於蒸發端處之 承上所述’本發明之散熱模 部、頂部及注水管-體成型之熱管本體::上;= 的問題，更可減少焊接===熱管廢料率高 低廉、製程簡單的優點。 i裝^ ’具有成本 1296039 > & 2者，由於熱管本體與底座係二獨立之元件，底座 Φ可輕易加工成不平坦之表面，使得底座與毛細 間的接觸面積增加，可有效地增加柱狀型熱管之 t換面錢而㈣整體散熱效能。料，設置於底座 面上之毛細結構係與熱管本體上之毛細結構分開設 ，因此可輕易在凹凸不平之底座上設置單一或不同厚 :之毛細結構，藉以增加毛細結構之表面積以提升工作 〜體之蒸發效率，進而提昇齡於蒸發端處之散熱性能。 以上所述僅為舉例性，而非為限制性者。任何未脫 離本毛明之精神與範_，而對其進行之等效修改或變 更，均應包含於後附之申請專利範圍中。 【圖式簡單說明】 ，1圖為習知之柱狀型熱管之剖面示意圖。 一弟2圖為依照本發明較佳實施例之一種柱狀型熱管 之示意圖。 ”、、 、弟3、4圖為弟2圖之熱管本體22與底座24組裝 前後之剖面示意圖。 ，5圖是為第2圖中底座的另一種實施例。 第6A、6B圖為將本發明較佳實施例之柱狀型熱管 應用於散熱模組之二示意圖。 第7A〜7C圖為第2圖中之底座之各種示意圖。 第8A、8B圖為第2圖中之底座及其上之毛細結構 之^不意圖。 【主要元件符號說明】 10、20 ·•熱管 12、22 :熱管本體In July, referring to Figure 2, the camp is whiter, the AM J.HT 26a, the second capillary structure 2", and the s include the first capillary structure bb and a work 12 (S) filled in the heat pipe 20. 1296039 The inner structure 2 is disposed on the inner surface of the heat pipe body 22, and the second capillary junction 26b is disposed on the inner surface of the base 24 = the structure 26b and the first The capillary structure 26a is connected. And the brother of a capillary knot two dl diagrams its Jf] the base in the figure and the surface of the wheel W" "set the second base of the base I4 / only, (four) out single - convex second ^^, the reference to the first _, which is the base in Figure 2 and its schematic diagram. The second capillary structure 26b lays the inner surface 84 of the base 84. The second capillary structure 26b faces the top 224 of the heat pipe body 22 of FIG. 2 to form a flat f structure 26b having a first direction perpendicular to the base 84. A thick calf: 'and the first thickness H1 is greater than the second thickness; Two degrees: 1 is the thickness 6 on the inner surface of the base 841$ with the bump 843 and the second thickness H2 is located on the inner surface 841 of the base and has a thickness of 26b. - There is a second capillary structure above the bump 843. The reference to the 2nd W' #热f Μ is actually used to contact the heat source (not shown) below the heat pipe Ϊ The heat generated by the source of -, ... is directly directed away from the heat source. Or, the heat pipe (not under the 2 ° below and located in the external base fine structure 26b (ie, the evaporation end) above the heat source: two",, ', the generated heat becomes the gaseous working fluid, and at the pressure difference of 13 Under the influence of 1296039, it naturally flows to the condensing end, and then releases the latent heat into the capillary structure 26a (ie, the condensing end) away from the end of the heat source, and then converts it into a liquid state, and then flows back to the capillary force provided by the capillary structure 26b. Steaming = end, so that the heat is continuously carried away from the heat source to achieve the heat dissipation effect. The material of the thermal body 22 and the base 24 is a high-conductivity conductive material such as copper, silver, Ming or its alloy. Capillary structure 26: and = The material of the capillary structure 26b comprises one of a group selected from the group consisting of plastic, metal, alloy, and porous non-metallic materials, and is selected from the group consisting of sintering, adhesion, filling, and deposition. One of them or a combination thereof: the working fluid w is one of an inorganic compound, pure water, an alcohol, a hydrazine, a liquid pain, a gold, a refrigerant, an organic compound or a mixture thereof. Since the heat pipe body 20 and the base 24 are two The vertical component, the inner surface of the base 24, 241 can be easily processed into an uneven surface, so that the contact area between the base 24 and the capillary structure 26b increases the heat dissipation performance of the riser 2〇. Furthermore, it is disposed on the inner surface 2411 of the base. = and; the capillary structure 26a on the heat pipe body 20 is opened; therefore, a single or different capillary structure 26b' can be easily disposed on the uneven base 24 to increase the evaporation efficiency of the hair working fluid, thereby increasing Person: The area is heat-dissipating in k. Further, the problem of the heat-dissipating part, the top and the water-injection pipe-body forming heat pipe body of the present invention is: It can also reduce the advantages of welding === heat pipe scrap rate is high and low, and the process is simple. i installed ^ has cost 1296039 > & 2, because the heat pipe body and the base are two independent components, the base Φ can be easily processed into no The flat surface makes the contact area between the base and the capillary increase, which can effectively increase the t-shaped face of the column-shaped heat pipe and (4) the overall heat dissipation performance. The capillary structure and the heat pipe body disposed on the base surface The capillary structure is opened, so that a single or different thick capillary structure can be easily arranged on the uneven base, thereby increasing the surface area of the capillary structure to improve the evaporation efficiency of the work body, thereby improving the heat dissipation at the evaporation end. The above description is intended to be illustrative only and not limiting, and any equivalent modifications and alterations may be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a conventional columnar heat pipe. Fig. 2 is a schematic view of a columnar heat pipe according to a preferred embodiment of the present invention. ”, 、, brother 3, 4 The figure is a schematic cross-sectional view of the heat pipe body 22 and the base 24 before and after assembly. Figure 5 is another embodiment of the base in Figure 2. 6A and 6B are schematic views showing the application of the columnar heat pipe of the preferred embodiment of the present invention to the heat dissipation module. Figures 7A to 7C are various schematic views of the base in Figure 2. Figs. 8A and 8B are views of the base of Fig. 2 and the capillary structure thereon. [Main component symbol description] 10, 20 ·• Heat pipe 12, 22: Heat pipe body
15 1296039 122、222 :侧壁部 124 :底部 14 :上蓋 16a、16b :毛細結構 18、226 :注水管 224 :頂部 24、54、74、84 :底座 241、741、841 :底座内表面 242 :環狀凹槽（凹陷部） 243、743、843 :凸塊 244 :環狀突出區 26a :第一毛細結構 26b :第二毛細結構 542 ··下陷凹台（凹陷部） 60A、60B :散熱模組 62a、62b :散熱鰭片 W :工作流體15 1296039 122, 222: side wall portion 124: bottom portion 14: upper cover 16a, 16b: capillary structure 18, 226: water injection pipe 224: top 24, 54, 74, 84: base 241, 741, 841: base inner surface 242: Annular groove (recessed portion) 243, 743, 843: Bump 244: Annular protruding portion 26a: First capillary structure 26b: Second capillary structure 542 · Sinking recess (recessed portion) 60A, 60B: Heat sink Group 62a, 62b: heat sink fin W: working fluid