TWI307399B - Heat dissipation module and heat pipe thereof - Google Patents

Heat dissipation module and heat pipe thereof Download PDF

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Publication number
TWI307399B
TWI307399B TW094130972A TW94130972A TWI307399B TW I307399 B TWI307399 B TW I307399B TW 094130972 A TW094130972 A TW 094130972A TW 94130972 A TW94130972 A TW 94130972A TW I307399 B TWI307399 B TW I307399B
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TW
Taiwan
Prior art keywords
heat
heat pipe
item
heat dissipation
dissipation module
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Application number
TW094130972A
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Chinese (zh)
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TW200712406A (en
Inventor
min hui Yu
Horng Jou Wang
Chi Feng Lin
Chin Ming Chen
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Delta Electronics Inc
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Priority to TW094130972A priority Critical patent/TWI307399B/en
Priority to US11/491,896 priority patent/US20070056712A1/en
Publication of TW200712406A publication Critical patent/TW200712406A/en
Application granted granted Critical
Publication of TWI307399B publication Critical patent/TWI307399B/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

1307399 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱模組，尤其指具有高效能熱 管之散熱模組。 【先前技術】 隨者工業技術不斷地精進，各種電子產品無不朝著 體積小、重量輕與低耗電的方向發展。由於電子元件的 能量使用效率並非百分之百，因此會有許多功率被浪費 而轉換成熱能，這些熱能會使系統内的溫度上升。當系 統的溫度超過電子元件容許的操作溫度時，電子元件的 物理性質就會隨著周圍環境溫度升高而改變，使系統的 功月b失常，產生運作錯誤或使功能終止。而且，當系統 内的溫度愈升愈高時，系統的故障率也會隨之提高。 、若想讓系統有較高的可靠度，就要使系統能=持 在適當之操作溫度範圍。為加強電子元件之散敎 :行的做法大多為在熱源處以散熱器將熱 f)以自然或強制對流方式將熱散= 之下由:么管=，)可在很小的截面積與溫度差 源二段可觀的距離，且不需外加電 考量之下，埶管已是雷和工間利用經濟性的 件之一。疋電子政熱產品中廣為應用的傳熱元 請參考圖1，其係為習知熱管 W是一密介映辨如此 面不意圖。教管 在閉令工腔體，在管壁11上設有毛細結構^ 1307399 ^熱管10内具有工作流體。熱管ι〇 並在壓因吸熱而蒸發成氣：， ，咖二==然;=端; :體=細結r之毛細⑽回== 再#% ’以達到散熱之效果。 绩邱，請Γ夺參考圖1及圖2,圖2為们之敎管令之广 之示意圓。由於習知熱管1〇之毛細結 端一致的厚度’毛細結構12愈厚，雖可增加塞發 泡G 量’但卻容易造成相變化時蒸氣 :不广能降低。若毛細結構12愈薄，雖 氣泡如何解決由於毛細結構厚度所帶來之蒸 提升敫At進而有效地增加熱管之熱交換面積以 k升整體散熱效能，實乃—重要課題。 【發明内容】 组及：:其述問題’本發明係提出-種散熱模 W埶：：二Ϊ習知蒸氣泡阻塞的問題並能有效地 曰*、:、& ”、、父換面積及提升整體散熱效能。 為達上述目的’本發明提出一種熱管，包括一殼 體、-毛細結構以及—工作流體。其中，殼體係具有一 1307399 各置空間及一底部，底部 表面係面向容置〜有一非平坦之表面’且此 上，而工作产體“0植€、·、田結構係設置於底部之表面 邗机體係充填於殼體内。 根據本發明的另一目的， -熱管以及至少一散教鍵片的么出-種散熱模組’包括 結構及-工：ί;二 ί:門底:f;有一非平坦之表面，且此表 毛、，'田、、、α構係設置於表面上，而工作流體係充埴 ^體内°散熱‘鰭片係設置於熱管外並與熱管連結。' 呈有本發明之散熱额及其熱管，其殼體係 底部，使得殼體與毛細結構之間的 有助於提昇㈣之散熱性能。除此之外， 同之厘：於表面上而形成一平面之毛細結構’其具有不 °又〔於厚度較小之部份，可以使工作流體較易自 、、，田結構蒸發並脫離毛細結構，進而避免底部與毛細結 、間的沸騰與蒸氣泡產生的阻塞問題；於厚度較大之部 ^，則可提供足夠的液態之卫作流體，以補充至厚度較 主的。卩伤，並且避免乾涸現象的發生。另外，對於沿著 =體底面之表面之輪靡而設置之毛細結構，可增加容置 空間與毛細結構之接觸面積，即增加了蒸發面積，也 助於熱管之效率提昇。 為讓本發明之上述和其他目的、特徵、和優點能更 明顯易懂，下文特舉一較佳實施例，並配合 作詳細說明如下： 【實施方式】 1307399 以下將參照相關圖式，說明依本發明之散熱模組及 其熱管之實施例。 請同時參照圖3A與圖3B，圖3A為本發明較佳實施 例之熱管示意圖，而圖3B為圖3A之虛線部份D之示意 圖本發明之熱管20係以一平板狀熱管為例，包括一殼 體21、一毛細結構22以及一工作流體w。殼體2ι係^ =了容置空間211及一底部212。本實施例中，係以^ 二〜平板狀之殼體21為例。其中，殼體21之材質係為 高熱傳導材料，例如為銅、銀、鋁或其合金，故當殼 體21之底部212與熱源（未繪示）接觸時，可快速將熱源 ，熱量傳導至他處。容置空間211為—密閉空間/而'底 部212具有一表面213’且表面213係面向容置空間211。 底部212所具有之表面213係一非平坦之表面，也 就是說，底部212係具有不同厚度。表面213係形成有 至少一凸塊214,且多個凸塊214於表面213上係構成 一棋盤式圖案、一行列圖案（pattern in a r〇w)、一對 稱式圖案或一非對稱式圖案。於圖3B中，表面213係為 一由多個成方柱狀的凸塊214所構成一棋盤式圖案，且 表面213之截面形狀係呈方形或矩形。 、 毛細結構22係設置於底部212之表面213上。以 圖3B為例，毛細結構22係鋪設於底部212之表面213， 俾使毛細結構22面向容置空間211係形成一平面，也就 是說，殼體21之底部212與毛細結構22之厚度和為相 同。如此一來，毛細結構22於垂直於底部212之方向， 具有一第一厚度H1與一第二厚度H2,其中，第一厚度 H1係大於第二厚度H2。在此，需特別說明，此處所指之 1307399 = = = 2之設計，係針對蒸發端A處而 仝：π w t、田口構22之材質包括選自塑谬、金屬、合 社構^材料所組叙鱗其巾之―，而毛細 13之方法係選自燒結，著、填充、 自燒結（sinter)、黏著、填充、另、+ ^苒^之形狀係遠 中之-或其結合。真充及沈積所組成之族群其 工作流體W係充填於殼體21内 如是無機化合物、純水、醇類、嶋、液態金作屬=例 有機化合物或其混合物之一。當埶 ’: 令、 時，靠近熱源一端（即基 之、、/ 0权置於熱源上 流體吸收由熱源所產生的二之構工=工作 於遠離熱源-端(即冷凝端B)之毛=2;=潛： 後轉變為液態之工作流體，再藉由毛細 t 毛細力而流回至蒸發端A，如此循 耠供之 離熱源’以達到散熱的功效。、已地將熱持續帶 由於殼體2i之底部212具有不平坦之 得殼體21與毛細結構22之間的接觸面 使 提昇熱管20之散熱性能。再者，由：:σ助於 不同之厚度，於厚度較小之 可以使工作流體較易自毛細結構方)’ 構.進而避免底部2❹毛並脫離毛細結 氣泡所產生的阻塞問題。另一方面°構22間的彿騰與蒸 部份（即非具有凸塊214處）=度較大之H1 工作汽俨，αS r 貝1可^供足夠的液態之 9 1307399 然而，本發明並不限定於此，毛細蛀 於底部212之表面213上， 構=22除鋪設 間二U形成一平面之外，二毛構; ，而設置’使得毛細結構22 了:者表？3 :，亦即’毛細結構22於表面213上具有相 f社例如’如圖4與圖5所示，位於凸塊214, Η2，。厚产Η1，Η9,…構22 ，則具有厚度 者所需 與尽度Η2可以相等或不等，端視使用 由於毛細結構22㈣著表面213:之輪廊 置，如此一來，可增加容置空間與毛細結 :積】即增加了蒸發面積)’有助於 ： 二另外，同樣，’底部212，之表面213,係4= 缸处姐:可使仔殼體與毛細結構之間的接觸面積增加， 故月昇熱管之散熱性能。1307399 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module having a high efficiency heat pipe. [Prior Art] With the continuous improvement of industrial technology, various electronic products are developing in the direction of small size, light weight and low power consumption. Since the energy efficiency of electronic components is not 100%, many of the power is wasted and converted into heat, which causes the temperature inside the system to rise. When the temperature of the system exceeds the allowable operating temperature of the electronic component, the physical properties of the electronic component change as the ambient temperature increases, causing the system's power cycle b to malfunction, causing operational errors or terminating the function. Moreover, as the temperature in the system increases, the failure rate of the system increases. If you want to make the system more reliable, you must enable the system to maintain the proper operating temperature range. In order to enhance the divergence of electronic components: the practice of the line is mostly to use heat sinks at the heat source to heat the heat f) in a natural or forced convection manner = under the tube:, the tube can be used in a small cross-sectional area and temperature The difference between the two sources is a considerable distance, and without the need for external electrical considerations, the fistula is one of the pieces of economic use of mines and workshops.传热 The heat transfer element widely used in e-government thermal products. Please refer to Figure 1, which is a schematic diagram of the conventional heat pipe W. The teaching tube is provided with a capillary structure on the pipe wall 11 in the closed working chamber. 1307399 ^The working pipe has a working fluid. The heat pipe ι〇 is evaporated into gas by the endothermic heat: , , coffee 2 == 然; = end; : body = fine knot r capillary (10) back == then #% ‘ to achieve the effect of heat dissipation. Ji Qiu, please forgive the reference to Figure 1 and Figure 2, Figure 2 is the outline of the wide range of orders. Since the thickness of the capillary end of the conventional heat pipe is the same, the thicker the capillary structure 12 is, the higher the volume of the hair bubble can be increased, but the vapor is easily changed when the phase is changed: the width is not wide. If the capillary structure 12 is thinner, how the bubble solves the steaming lift 敫At due to the thickness of the capillary structure and effectively increases the heat exchange area of the heat pipe to achieve an overall heat dissipation performance, which is an important issue. SUMMARY OF THE INVENTION Group and ::: The problem of the present invention is proposed by the present invention - a type of heat dissipation mold W:: two problems of conventional vapor bubble blocking and can effectively 曰*,:, & And improving the overall heat dissipation performance. To achieve the above object, the present invention provides a heat pipe comprising a casing, a capillary structure and a working fluid, wherein the casing has a space of 1307399 and a bottom, and the bottom surface is facing. ~ There is a non-flat surface 'and this, while the working body "0 plant, ·, field structure is set at the bottom of the surface of the machine system is filled in the shell. According to another object of the present invention, the heat pipe and the at least one dissipating key piece of the heat dissipation module include a structure and a work surface: a; a bottom surface: f; a non-flat surface, and The table hair, the 'field,', and alpha structures are placed on the surface, and the workflow system is filled with the body. The heat sinking fins are disposed outside the heat pipe and connected to the heat pipe. 'The heat dissipation of the present invention and its heat pipe are provided, and the bottom of the casing is such that the heat dissipation between the casing and the capillary structure contributes to the improvement (4). In addition, the same as: the formation of a flat capillary structure on the surface 'has not been (and the smaller thickness part, can make the working fluid easier, the field structure evaporates and leaves the capillary The structure, in turn, avoids the problem of blockage between the bottom and the capillary, between the boiling and the vapor bubbles; in the thicker part, it can provide sufficient liquid fluid to supplement the thickness of the main. Bruises and avoids the occurrence of dryness. In addition, for the capillary structure disposed along the rim of the surface of the bottom surface of the body, the contact area between the accommodating space and the capillary structure can be increased, that is, the evaporation area is increased, and the efficiency of the heat pipe is also improved. The above and other objects, features and advantages of the present invention will become more apparent and understood. An embodiment of the heat dissipation module and heat pipe of the present invention. 3A and 3B, FIG. 3A is a schematic view of a heat pipe according to a preferred embodiment of the present invention, and FIG. 3B is a schematic view of a broken line portion D of FIG. 3A. The heat pipe 20 of the present invention is exemplified by a flat heat pipe, including A housing 21, a capillary structure 22 and a working fluid w. The housing 2 is equipped with a housing space 211 and a bottom portion 212. In the present embodiment, the housing 21 of the second to flat shape is taken as an example. The material of the casing 21 is a high thermal conductive material, such as copper, silver, aluminum or an alloy thereof. When the bottom 212 of the casing 21 is in contact with a heat source (not shown), the heat source and the heat can be quickly transferred to He is at the office. The accommodating space 211 is a closed space/the bottom portion 212 has a surface 213' and the surface 213 faces the accommodating space 211. The bottom portion 212 has a surface 213 that is a non-flat surface, that is, the bottom portion 212 has a different thickness. The surface 213 is formed with at least one bump 214, and the plurality of bumps 214 are formed on the surface 213 to form a checkerboard pattern, a pattern in a r〇w pattern, a symmetrical pattern or an asymmetric pattern. In Fig. 3B, the surface 213 is a checkerboard pattern formed by a plurality of square-shaped bumps 214, and the surface 213 has a square or rectangular cross-sectional shape. The capillary structure 22 is disposed on the surface 213 of the bottom portion 212. Taking FIG. 3B as an example, the capillary structure 22 is laid on the surface 213 of the bottom portion 212, so that the capillary structure 22 faces the accommodating space 211 to form a plane, that is, the thickness of the bottom portion 212 of the casing 21 and the capillary structure 22 and For the same. As such, the capillary structure 22 has a first thickness H1 and a second thickness H2 in a direction perpendicular to the bottom portion 212, wherein the first thickness H1 is greater than the second thickness H2. Here, it is necessary to specify that the design of 1307399 = = = 2 referred to here is for the evaporation end A. The material of π wt and Taguchi 22 includes materials selected from plastics, metals, and materials. The group refers to the scale of the towel, and the method of the capillary 13 is selected from the group consisting of sintering, filling, filling, self-sintering, adhesion, filling, and the shape of the + ^ 苒 ^ - or a combination thereof. The group consisting of true charge and sedimentation is filled with a working fluid W in the casing 21, such as an inorganic compound, pure water, an alcohol, a hydrazine, a liquid gold, an organic compound or a mixture thereof. When 埶': 令,, near the end of the heat source (ie, the base, / / 0 is placed on the heat source, the fluid absorbs the structure of the heat generated by the heat source = works away from the heat source - end (ie, the condensation end B) =2;=Dive: Afterwards, it is converted into a liquid working fluid, and then flows back to the evaporation end A by the capillary t capillary force, so that it is cooled away from the heat source to achieve the heat dissipation effect. Since the bottom portion 212 of the casing 2i has an uneven contact surface between the casing 21 and the capillary structure 22, the heat dissipation performance of the heat pipe 20 is improved. Further, the: σ contributes to different thicknesses, and the thickness is small. It can make the working fluid easier to get from the capillary structure, and thus avoid the blocking problem caused by the bottom 2 bristles and the detachment of the capillary bubbles. On the other hand, the Fteng and steamed parts of the 22-section (ie, without the bumps 214) = the H1 working steam with a large degree, the αS r shell 1 can supply enough liquid 9 1307399 However, the present invention The hair is not limited to this, and the capillary is on the surface 213 of the bottom portion 212, and the structure = 22 is formed by a two-fibrous structure except for the laying of the two U-U; and the setting of the capillary structure 22 is as follows: 3: That is, the capillary structure 22 has a phase on the surface 213, for example, as shown in Figs. 4 and 5, and is located at the bumps 214, Η2. Thick production Η1, Η9, ... structure 22, the thickness and the required degree Η2 can be equal or unequal, the end use is due to the capillary structure 22 (four) surface 213: the wheel corridor, so that the increase can be accommodated Space and capillary knot: product] increases the evaporation area) 'Help: 2 In addition, the same, 'bottom 212, surface 213, system 4 = cylinder sister: can make the contact between the shell and the capillary structure The area is increased, so the heat dissipation performance of the monthly heat pipe.

再者，殼體底部212’ <截面形狀係不受限制，除 疋圖3B肖® 4中所示之方形或矩形之外，亦可以是三 开(（如目5所示）、半球形（如圖6所示）、弧形（如 f 7所不）、或梯形（如圖8所示），而且截面形狀也可 為不連續之圖案或一曲面。 另外，圖3A中之熱管2〇係以一空心平板狀之殼體 d為例，然殼體亦可以是其他形狀，可依據欲應用之熱 ，之形狀來做設計。故殼體之底部可為圓形、方形、或 /、他幾何形狀。請參照圖9，其係本發明較佳實施例之 主狀型熱官之示意圖。熱管30係包括一殼體31、一毛 ⑤ 1307399 以及一工作流體。其中，毛細結構32及工作 "L體係與第一實施例中之毛細結構22及工作流體具有 相同之技術特徵及功效，於此不再贅述。 、 殼體31係呈一空心柱狀且具有一容置空間3 3一::二2 ’底· 312係具有一非平坦之表面313,表面 313係面向容置空間311。其中，殼體31更具有一蓋板Furthermore, the bottom portion 212' of the housing is not limited in shape, and may be three-open (as shown in item 5), hemispherical, in addition to the square or rectangle shown in Figure 3B. (as shown in Figure 6), curved (such as f 7), or trapezoidal (as shown in Figure 8), and the cross-sectional shape can also be a discontinuous pattern or a curved surface. In addition, the heat pipe 2 in Figure 3A The raft is made of a hollow flat shell d, but the shell can also be of other shapes, which can be designed according to the shape of the heat to be applied. Therefore, the bottom of the shell can be round, square, or / Referring to Fig. 9, which is a schematic diagram of a main type of heat officer according to a preferred embodiment of the present invention, the heat pipe 30 includes a casing 31, a hair 5 1307399 and a working fluid, wherein the capillary structure 32 The working "L system has the same technical features and functions as the capillary structure 22 and the working fluid in the first embodiment, and will not be described here. The housing 31 has a hollow column shape and has an accommodating space 3 3:: 2 2 ' bottom · 312 series has a non-flat surface 313, surface 313 is facing the space 311. The housing 31 has a cover plate

3/4及一側壁315,侧壁315係環設於底部si?，蓋板314 係相對底部312而設。於空心柱狀之殼體31中，熱管 之蒸發端係位於底部312之處，而冷凝端則位糾則辟 315之處。由於殼體31之底部312係具有一非平坦之表 面313 ’可增加底部312與毛細結構32之接觸面積，進 而提幵熱管30之效能，另外，若毛細結構犯係以非平 面方式設置於底部312之表面313上時，可增加毛细紝 構32與容置空間311之接觸面積，進而提昇熱管3〇: 效能。 接著，請參照圖10,其為本發明較佳實施例之散熱 模組之示意圖。散熱模組40包括一熱管50以及至少二 散熱鰭片60。熱管50係包括一殼體51、一毛細結構52 及一工作流體W。其中，熱管50係可與圖3A之熱管2〇 以及圖9之熱管30具有相同之技術特徵，於此不再贅述。 於圖10中，係以一平板狀型熱管5〇為例，亦即， 殼體51呈空心平板狀。當然，殼體51也可以是如圖“ 或圖12所示而成柱狀型。散熱鰭片6〇係以鋁擠成型製 造，且設置於熱管50外並與熱管5〇相連。散熱鰭片6〇 與熱管50之連接方式係選自焊接、嵌合、卡固、黏著所 組成之族群其中之一。散熱鰭片6〇與熱管5〇可直接接 1307399 觸，或於散熱鰭片60與埶管5Q $ „ s γ + ( — ing paste)、一導二^之間更可塗佈有-锡膏 熱介面之材料。 導…、θ (grease)，或一可充當導 散熱H片6〇係、設置於平板狀熱管⑽之上方 6〇，，‘ 60，1，或m ’熱’5〇,係套設於散熱鰭片 —二 、3，且散熱鰭片與熱管係以熱鑲方式進 仃嵌5以及/或卡固。散熱鰭片6〇、6〇，、⑼， 列方式例如是水平間隔分佈、 ' 分佈、放.分佈，或其他分佈佈、斜向間隔 喻亍尤散熱模組4〇係可應用於-熱源(未 之美Ας你、、g係與熱源直接接觸或是藉由一外部 金；接觸。如圖10所示，基座“系-實心 座之另一側則與一熱源接觸，藉由基 ::二之，’再傳導至散熱.鰭片60。熱源係一發 高硬ΓΓ央處理器、電晶體，器、 ?!源供應器、行車控制系統、多媒 散熱模戲機等。另外， 如所導出的熱更::速接，用以促進由散熱模組 且有^W本号χ明之散熱模組及其熱管，其殼體係 接：：=古面之底部，使得殼體與毛細結構之間的 增Γ有助於提昇熱管之散熱性能。除此之外， 同而形成一平面之毛細結構，其具有不 之厚度，於厚度較小之部份，可錢卫作流體較易自 12 ⑤ 1307399 並脫離毛細結構，進而避免底部與毛一 ===，塞問題;於厚度較=; 薄的部份，並且避免二以補充至厚度較 ==之接觸面積’即增加二:有置 助於熱官之效率提昇。 b负 籬太Γ上所輕為舉㈣，㈣為㈣冰者。任何未脫 更==神與範4，而對其進行之等效修改或變 更，均應包έ於後附之申請專利範圍中。 【圖式簡單說明】 圖1為習知熱管之剖面示意圖。 圖2為圖1之熱管中之虛線部份c之示意圖。 圖3A為本發明較佳實施例之熱管示意圖。 圖3B為圖3A之虛線部份D之示意圖。 圖4及圖5為圖3B之毛細結構之另兩種示意圖。 圖。圖6至圖8係熱管之殼體，其各種截面形狀之示意 圖9為本發明較佳實施例之柱狀型熱管之示意圖。 圖10為本發明較佳實施例之散熱模組之示意圖。 圖」1熊12為本發明較佳實施例之另兩種散熱模 組之示意圖。 、 【主要元件符號說明】 10、20、30、50、50’ ：熱管 11 :管壁 … 12、22、22 、32、52 :毛細結構 13 ⑤ 1307399 21、31、51 :殼體 211、 311 :容置空間 212、 212’ 、312、512 :底部 213、 213’ 、313 :表面 214、 214’ ：凸塊 314 :蓋板 315 :侧壁 40 :散熱模組 60, 60’ ：散熱鰭片 A :蒸發端 B :冷凝端 G :蒸氣泡 H1 :第一厚度 H2 :第二厚度 S :基座 W :工作流體3/4 and a side wall 315, the side wall 315 is looped at the bottom si?, and the cover 314 is disposed opposite to the bottom 312. In the hollow cylindrical casing 31, the evaporation end of the heat pipe is located at the bottom 312, and the condensation end is located at 315. Since the bottom portion 312 of the casing 31 has a non-flat surface 313', the contact area between the bottom portion 312 and the capillary structure 32 can be increased, thereby improving the efficiency of the heat pipe 30, and if the capillary structure is disposed in a non-planar manner at the bottom. When the surface 313 of the 312 is used, the contact area between the capillary structure 32 and the accommodating space 311 can be increased, thereby improving the heat pipe 3: performance. Next, please refer to FIG. 10, which is a schematic diagram of a heat dissipation module according to a preferred embodiment of the present invention. The heat dissipation module 40 includes a heat pipe 50 and at least two heat dissipation fins 60. The heat pipe 50 includes a housing 51, a capillary structure 52, and a working fluid W. The heat pipe 50 can have the same technical features as the heat pipe 2A of FIG. 3A and the heat pipe 30 of FIG. 9, and details are not described herein again. In Fig. 10, a flat heat pipe 5 is used as an example, that is, the casing 51 has a hollow flat plate shape. Of course, the housing 51 may also be in the form of a column as shown in FIG. 12 or the heat dissipation fins 6 are made of aluminum extrusion, and are disposed outside the heat pipe 50 and connected to the heat pipe 5〇. The connection between the 6〇 and the heat pipe 50 is selected from the group consisting of welding, fitting, clamping, and adhesion. The heat sink fins 6〇 and the heat pipe 5〇 can be directly connected to the 1307399 contact, or the heat dissipation fins 60 and The material of the solder paste thermal interface can be coated between the 5Q $ „ s γ + ( — ing paste) and the first lead. Guide, θ (grease), or one can act as a heat-dissipating H-piece 6 、, set above the flat heat pipe (10) 6 〇,, ' 60, 1, or m 'hot '5 〇, set to heat Fins—two, three, and the fins and heat pipes are inserted into the splicing 5 and/or stuck in a hot-fit manner. The fins 6〇, 6〇, and (9), for example, are horizontally spaced, 'distributed, placed, distributed, or other distributed cloth, obliquely spaced, and the heat dissipation module 4 can be applied to the heat source ( The beauty is not in contact with you, the g system is in direct contact with the heat source or by an external gold; contact. As shown in Figure 10, the pedestal "the other side of the solid seat is in contact with a heat source, by: Second, 're-transfer to heat dissipation. Fin 60. The heat source is a high-hardness central processor, transistor, device, source supply, driving control system, multi-media heat-dissipating machine, etc. The derived heat is more:: quick-connecting, which is used to promote the heat-dissipating module and the heat pipe of the heat-dissipating module, and the heat-insulating module and the heat pipe thereof are connected by the shell::= the bottom of the ancient surface, so that the shell and the capillary structure The increase between the two helps to improve the heat dissipation performance of the heat pipe. In addition, it forms a flat capillary structure with a thickness that is less than the thickness. 12 5 1307399 and detached from the capillary structure, thereby avoiding the bottom and the hair one ===, the plug problem; the thickness is lower than; The part, and avoiding the second to add to the thickness of the contact area == increase two: there is an increase in the efficiency of the hot official. b. The negative fence is too light (4), (4) for (four) ice. Any unresolved == God and Fan 4, and equivalent modifications or changes to them shall be included in the scope of the patent application attached. [Simplified Schematic] Figure 1 is a schematic cross-sectional view of a conventional heat pipe Fig. 2 is a schematic view of a broken line portion c in the heat pipe of Fig. 1. Fig. 3A is a schematic view of a heat pipe according to a preferred embodiment of the present invention. Fig. 3B is a schematic view of a broken line portion D of Fig. 3A. Fig. 4 and Fig. 5 are views. Figure 2 to Figure 8 are schematic diagrams of various cross-sectional shapes of a housing of a heat pipe according to a preferred embodiment of the present invention. Figure 10 is a schematic view of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of two other heat dissipation modules according to a preferred embodiment of the present invention. [Description of main component symbols] 10, 20, 30, 50, 50' : heat pipe 11 : pipe wall ... 12, 22, 22, 32, 52: capillary structure 13 5 1307399 21, 31, 5 1 : Housings 211, 311: accommodating spaces 212, 212', 312, 512: bottom 213, 213', 313: surfaces 214, 214': bumps 314: cover 315: side walls 40: heat dissipation module 60 , 60' : heat sink fin A: evaporation end B: condensation end G: vapor bubble H1: first thickness H2: second thickness S: base W: working fluid

Claims (1)

1307399 十、申請專利範圍： 1、一種熱管，包括： 非平挺之T面具f一容置空間及-底部，該底部具有 非千：_之表面，且該表㈣©向該容置空間. 一毛細結構，設置於該表面上；以及 工作流體，充填於該殼體内。 其中該容 其中該殼 其中該高 其中該殼 ® * 2/如申請專利範圍第1項所述之熱管 置二間為一密閉空間。/ 减之I暂：申請專利範圍第1項所述之熱管 "材質係為一高熱傳導材料。 埶傳二:::專利範圍第3項所述之熱管 '、、、傅導材抖係為銅、銀、|g或其合金〜 體俾i?:申1專利範圍第1項所述之熱管 你呈空心平板狀。 1項所述之熱管，其中該殼 6項所述之熱管，其中該殼 該側壁係環設於該底部，該 6'如申請專利範圍第 體係呈一空心柱狀。 雜# θ7、如申請專利範圍第 二更，、有一蓋板及—側壁， 盖板係相對該底部而設。 體底：之tit利細1項所述之熱管，其中該殼 形或梯J 為半球形、弧形、三角形、矩形、方 部可二：申=範圍第1項所述之熱管，其中該底 方形或其他幾何形狀。 表面二:⑵:圍第1項所述之熱管，其中該 15 Ϊ307399 也凸^申請專利範11第10項所述之熱f，其中該 二=圖ί;上係構成一棋盤式圖案、-行列圖案、 才稱式圖案或一非對稱式圖案。 <,，!_2如申請專利範圍第1項所述之熱管，並中該 空鋪;:該表面’俾使該毛細結構面向該容置 毛細申請專利範圍第12項所述之熱管，其中該 垂直於該底部方向，係具有-第-厚度與-予又且5亥第一厚度係大於該第二厚度。 主* 〃如申請專利範圍第1項所述之熱管，其中該 沿著該表面之輪廓而設置，該構且 有相等厚度或不等厚度。 馎货”、 丄5、如申請專利範圍第工項所述之熱管，古亥 i::構之材質包括選自塑膠、金屬、合金、多;:性非 金屬材料所組成之族群其中之一。V ^、如申請專利範圍第丨項所述之熱管，i中該 t、、'σ構設置於該表面之方法係選自燒結、黏著、填充、 及沈積所組成之族群其中之一或其結合。y 、 17、 如申請專利範圍第丨項所述之熱管，其 工作流體係為益機彳卜人从 ,. 屬、AM 物屯水、醇類、酮類、液態金 屬、冷媒、有機化合物或其混合物之一。 18、 一種散熱模組，包括： μ熱^，包括一殼體、一毛細結構及一工作流體， 該；體具有：容置空間及-底部，該底部具有-非:坦 二=该表面係面向該容置空間，該毛細結構設置 ;“ 而该工作流體充填於該殼體内；以及 1307399 至^政熱鰭片，設置於該熱管外並與該熱管相連 接。 詈二，專利範圍第18項所述之散熱模組，其 中j令置工間為一密閉空間。 μ上Ht請專利範®第18項所述之散熱模組，其 中Μ Τι 負係為—高熱傳導材料。 A J二ί中請專利範圍第18項所述之散熱模組，其 中a =2、、、材料係為鋼、銀、鋁或其合金。 殼體範圍第18項所述之熱管’其中該 殼體利範圍第18項所述之熱管’其中該 中該】4體更18項所述之散熱模組，其 ^ 盍板及一侧壁，該侧壁係環設於該底 部，該盍板係相對該底部而設。 中广ΐ申請專利範圍第18項所述之散熱模組，其 Γ:;=截面形狀為半球形、弧形、三角Μ 中該底邱專利範圍帛18項所述之散熱模組，其 中^可為圓形、方形或其他幾何形狀。 中該表面係明專利範圍第18項所述之散熱模組，其 f表面係形成有至少一凸塊。 中該二塊專利範圍第27項所述之散熱模組，其 举、二係構成一祺盤式圖案、-行列圖 / 0冉式圖案或一非對稱式圖案。/ 9、如中請專利範圍第18項所述之散熱模組，其 1307399 容置空鋪=該表面’俾使該毛細結構面向該 ，該二⑽熱模組，其 與-:二厚度，且該第於:厚度 *該毛細結二項所述之散熱模組，其 係具有相等之輪廊而設置，該毛細結構 中該:利範圍第18項所述之散熱模組，其 性非金屬材料所組成之族群其中之—金屬、口金、多孔 中該二第18項所述之散熱模組，其 填充、及該表面之方法係選自燒結、黏著、 及，所組成之族群其中之一或其結合。 中該工作利範圍第18項所述之散熱模組，其 :金屬物、純水鲁^ M有機化合物或其混合物之一。 二熱所述之散熱模組，其 向間r、放二千間 中該些:熱項所述之散熱模組’其 散孰專利範圍第18項所述之散熱模組，其 合、卡固1著所組成之料_、喪 38'如申請專利範圍第37項所述之散熱模組，其 18 1307399 中該些散熱鰭片與該熱管係以熱鑲方式進行嵌合以及/ 戒卡固。 39、如申請專利範圍第18項所述之散熱模組，其 中該些散熱鰭片與該熱管之間更具有一錫膏（s〇ldeH^ paste)、一導熱貧（grease)，或一可充當導熱介面之 料。 40 '如申請專利範圍第18項所述之散熱模組，豆 中該熱管可透過一基座或是直接與，原摘，用以將 該熱源發散的熱直接傳導至該些散熱鰭片。 41、如申請專利範圍第40項所述之散熱模組，直 中該基座係一實心金屬塊體。 八 ^2、如申請專利範圍第40項所述之散熱模組，其 中心"、、源係一發熱之電子元件。 + 如申請專利範圍第42項所述之散熱模組，其 子7〇件為中央處理器、電晶體、伺服器、高階繪 硬碟、電源供應器、行車控制系統、多媒體電子 、無線通信基地台或高階遊戲機等。 血一 如申叫專利範圍第18項所述之散熱模組，係 n1 a組接，用以促進由該散熱模組所導出的熱更加 迅迷逸散。 19 ⑤1307399 X. Patent application scope: 1. A heat pipe, comprising: a non-flat T-mask f-accommodating space and a bottom, the bottom has a non-thousand: _ surface, and the table (four) © to the accommodation space. a capillary structure disposed on the surface; and a working fluid filled in the housing. Wherein the shell of the shell is the height of the shell ® * 2 / the heat pipe set according to claim 1 is a closed space. / Reduction of I temporarily: The heat pipe " material mentioned in the first paragraph of the patent application is a high thermal conductivity material.埶传二::: The heat pipe ', , and Fu guide material described in item 3 of the patent scope is copper, silver, |g or its alloy~ body 俾i?: the first paragraph of the patent scope of claim 1 The heat pipe is in the form of a hollow plate. The heat pipe of claim 1, wherein the heat pipe of the casing, wherein the side wall of the shell is disposed at the bottom, the 6' is in the form of a hollow column as in the patent application system. Miscellaneous # θ7, as in the second part of the patent application, has a cover plate and a side wall, and the cover plate is disposed opposite to the bottom portion. The heat pipe according to the item of the item: wherein the shell shape or the ladder J is a hemispherical shape, an arc shape, a triangle shape, a rectangular shape, and a square portion. Bottom square or other geometric shape. Surface 2: (2): The heat pipe described in Item 1, wherein the 15 Ϊ 307 399 is also convexly applied to the heat f described in Item 10 of the Patent Model 11, wherein the second line is a checkerboard pattern, A row or column pattern, a nickname pattern or an asymmetric pattern. <,, !_2, as in the heat pipe of the first aspect of the patent application, and the empty pipe; the surface '俾" is such that the capillary structure faces the heat pipe described in claim 12 of the accommodating capillary, wherein The direction perpendicular to the bottom direction has a -th thickness and a further thickness and the first thickness is greater than the second thickness. The heat pipe of claim 1, wherein the heat pipe is disposed along the contour of the surface and has an equal thickness or an unequal thickness.馎 ” , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , V ^, as in the heat pipe described in the scope of claim 2, wherein the method of setting the t, and 'σ structures on the surface is selected from one of the group consisting of sintering, adhesion, filling, and deposition or The combination of y, 17, and the heat pipe described in the scope of the patent application, the workflow system is a machine, a genus, an AM material, an alcohol, a ketone, a liquid metal, a refrigerant, One of the organic compounds or a mixture thereof. 18. A heat dissipation module comprising: μ heat, comprising a casing, a capillary structure and a working fluid, the body having: an accommodation space and a bottom, the bottom having - Non-tank=the surface is facing the accommodating space, the capillary structure is disposed; “the working fluid is filled in the casing; and the 1307399-to-hot fin is disposed outside the heat pipe and is opposite to the heat pipe connection. Second, the heat dissipation module described in item 18 of the patent scope, wherein j is a closed space. On the Ht, please refer to the heat dissipation module described in Item 18 of the Patent Model®, in which Μ Τι is a high thermal conductivity material. The heat dissipation module described in claim 18, wherein a = 2, the material is steel, silver, aluminum or an alloy thereof. The heat pipe of item 18 of the housing range, wherein the heat pipe described in item 18 of the housing range is the heat dissipation module of the item 18, and the side plate and a side wall thereof The side wall loop is disposed at the bottom portion, and the seesaw is disposed opposite to the bottom portion. The heat dissipation module described in Item No. 18 of the patent application scope of Zhong Guangyu, the following:: = the shape of the cross section is hemispherical, curved, triangular, and the heat dissipation module described in the 18th patent scope of the bottom, wherein ^ Can be round, square or other geometric shapes. The surface of the heat dissipation module of claim 18, wherein the surface of the f is formed with at least one bump. The heat dissipation module according to item 27 of the two patent scopes, wherein the second system constitutes a disc pattern, a row/column pattern, a zero pattern or an asymmetric pattern. / 9, as claimed in claim 18 of the scope of the heat dissipation module, the 1307399 accommodates the empty shop = the surface '俾 such that the capillary structure faces the, the two (10) thermal module, and -: two thickness, And the heat dissipation module of the thickness of the capillary node is provided with an equal number of corridors, and the heat dissipation module according to the item 18 of the range of the capillary structure is not The heat-dissipating module of the above-mentioned item 18 of the group consisting of metal materials, metal, gold, and porous, the method of filling and the surface is selected from the group consisting of sintering, adhesion, and One or a combination thereof. The heat dissipation module according to Item 18 of the working scope, wherein: one of a metal substance, a pure water, an organic compound or a mixture thereof. The heat-dissipating module described in the second heat, the inter-r and r-th of the two-seat: the heat-dissipating module of the hot item, the heat-dissipating module described in item 18 of the Japanese patent range, the combination and the card Solid material 1 _, funeral 38', as claimed in claim 37 of the heat-dissipation module, in the 18 1307399, the heat-dissipating fins and the heat pipe are fitted in a hot-fit manner and / card solid. 39. The heat dissipation module of claim 18, wherein the heat dissipation fins and the heat pipe further have a solder paste (great) or a heat dissipation (grease) Acts as a material for the thermal interface. 40' The heat-dissipating module of claim 18, wherein the heat pipe can be directly transmitted through a pedestal or directly to the heat radiated from the heat source to the heat-dissipating fins. 41. The heat dissipation module of claim 40, wherein the base is a solid metal block.八^2, as claimed in claim 40, the center of the heat dissipation module, the center of the "," source is a heating electronic component. + For example, the heat dissipation module described in item 42 of the patent scope is a central processing unit, a transistor, a servo, a high-end hard disk, a power supply, a driving control system, a multimedia electronic, and a wireless communication base. Taiwan or high-end game consoles, etc. The heat module described in Item 18 of the patent application is a combination of n1 a to promote the heat released by the heat dissipation module to be more quickly dissipated. 19 5
TW094130972A 2005-09-09 2005-09-09 Heat dissipation module and heat pipe thereof TWI307399B (en)

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US20080087403A1 (en) * 2006-10-12 2008-04-17 Inventec Corporation Liquid-gas circulation heat-dissipating unit
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
US20120024500A1 (en) * 2010-06-18 2012-02-02 Gatekeeper Laboratories Pte Ltd Thermosyphon for cooling electronic components
DE102011080782B4 (en) * 2011-08-10 2014-09-04 Eberspächer Exhaust Technology GmbH & Co. KG Latent heat storage and catalyst
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JP5759606B1 (en) * 2014-09-30 2015-08-05 株式会社フジクラ heat pipe
WO2016051569A1 (en) * 2014-10-02 2016-04-07 富士通株式会社 Evaporator, cooling device, and electronic device
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