TWI833500B - Two-phase immersion-cooling type heat-dissipation structure having skived fins with high surface roughness - Google Patents

Two-phase immersion-cooling type heat-dissipation structure having skived fins with high surface roughness Download PDF

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TWI833500B
TWI833500B TW111148180A TW111148180A TWI833500B TW I833500 B TWI833500 B TW I833500B TW 111148180 A TW111148180 A TW 111148180A TW 111148180 A TW111148180 A TW 111148180A TW I833500 B TWI833500 B TW I833500B
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spade
fins
immersed
phase
shaped fins
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TW111148180A
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TW202426841A (en
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邱昱維
楊景明
吳俊德
葉子暘
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艾姆勒科技股份有限公司
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Abstract

A two-phase immersion-cooling type heat-dissipation structure having skived fins with high surface roughness is provided. The structure includes an immersion-cooling type substrate and a plurality of skived fins. The substrate has opposite top and bottom surfaces. The bottom surface is used for contacting the heat source immersed in the two-phase coolant, and the top surface is connected with the skived fins. The center line average roughness Ra of the surface of the skived fin is great than 10μm, and the ten point average roughness Rz of the surface of the skived fin is great than 20μm, so that the ratio between the surface area of the skived fins in contact with the two-phase coolant and the volume of the skived fins is greater than 400.

Description

具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構Two-phase immersed heat dissipation structure with spade fins with high roughness surface

本發明涉及一種散熱結構,具體來說是涉及一種具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構。The present invention relates to a heat dissipation structure, and specifically to a two-phase immersed heat dissipation structure with spade-shaped fins having a high roughness surface.

浸沒式冷卻技術是將發熱元件(如伺服器、磁碟陣列等)直接浸沒在不導電的兩相冷卻液(two-phase coolant)中,以透過兩相冷卻液吸熱氣化帶走發熱元件運作所產生之熱能。然而,如何透過浸沒式冷卻技術更加有效地進行散熱一直是業界所需要解決的問題。Immersion cooling technology immerses heating components (such as servers, disk arrays, etc.) directly in a non-conductive two-phase coolant, so that the two-phase coolant absorbs heat and vaporizes it, taking away the heating components for operation. The heat energy generated. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.

有鑑於此,本發明人本於多年從事相關產品之開發與設計,有感上述缺失之可改善,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。In view of this, the inventor has been engaged in the development and design of related products for many years. He felt that the above deficiencies could be improved, so he devoted himself to research and applied academic theories, and finally proposed an invention that is reasonably designed and effectively improves the above deficiencies.

本發明所要解決的技術問題在於,針對現有技術的不足提供一種具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構。The technical problem to be solved by the present invention is to provide a two-phase immersed heat dissipation structure with spade-shaped fins having a high roughness surface in view of the shortcomings of the existing technology.

本發明實施例公開了一種具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,其包括有一浸沒式基板、以及多個鏟型鰭片,所述浸沒式基板具有相背對的上表面與下表面,所述浸沒式基板的下表面用以與浸沒於兩相冷卻液的發熱元件形成接觸,所述浸沒式基板的上表面連接有多個所述鏟型鰭片,且所述鏟型鰭片的表面的中心線平均粗糙度Ra是大於10μm,並且所述鏟型鰭片的表面的十點平均粗糙度Rz是大於20μm,使多個所述鏟型鰭片與所述兩相冷卻液形成接觸的表面積與多個所述鏟型鰭片的體積的比率是大於400以上。An embodiment of the present invention discloses a two-phase immersed heat dissipation structure with spade-type fins on a high-roughness surface, which includes an immersed substrate and a plurality of spade-type fins. The immersed substrate has opposite The upper surface and the lower surface, the lower surface of the immersed substrate is used to form contact with the heating element immersed in the two-phase cooling liquid, the upper surface of the immersed substrate is connected to a plurality of the spade fins, and the The centerline average roughness Ra of the surface of the spade-type fin is greater than 10 μm, and the ten-point average roughness Rz of the surface of the spade-type fin is greater than 20 μm, so that a plurality of the spade-type fins are consistent with the The ratio of the surface area of the two-phase cooling liquid in contact with the volume of the plurality of spade-type fins is greater than 400.

在一優選實施例中,所述鏟型鰭片是針柱狀鰭片、板片狀鰭片的其一。In a preferred embodiment, the spade-shaped fins are one of pin-shaped fins and plate-shaped fins.

在一優選實施例中,所述鏟型鰭片是由銅、銅合金、鋁合金的其一金屬所製成。In a preferred embodiment, the spade-shaped fins are made of one of copper, copper alloy, and aluminum alloy.

在一優選實施例中,所述鏟型鰭片的表面是通過機械加工所形成的粗糙之加工表面。In a preferred embodiment, the surface of the spade-shaped fin is a rough machined surface formed by mechanical processing.

在一優選實施例中,所述鏟型鰭片的表面是通過蝕刻方式所形成的粗糙之蝕刻表面。In a preferred embodiment, the surface of the spade fin is a rough etched surface formed by etching.

在一優選實施例中,所述鏟型鰭片的表面是通過沉積方式所形成的粗糙之沉積表面。In a preferred embodiment, the surface of the spade-shaped fin is a rough deposition surface formed by deposition.

在一優選實施例中,所述鏟型鰭片的尺寸為100~800微米,且與相鄰所述鏟型鰭片之間的鰭片間距為100~500微米。In a preferred embodiment, the size of the spade-shaped fins is 100-800 microns, and the fin spacing between adjacent spade-shaped fins is 100-500 microns.

在一優選實施例中,所述鏟型鰭片的表面的中心線平均粗糙度Ra與所述鰭片間距的比為1:10到1:50的範圍,且所述鏟型鰭片的表面的十點平均粗糙度Rz與所述鰭片間距的比為1:10到1:30的範圍。In a preferred embodiment, the ratio of the centerline average roughness Ra of the surface of the spade-shaped fins to the fin spacing is in the range of 1:10 to 1:50, and the surface of the spade-shaped fins The ratio of the ten-point average roughness Rz to the fin spacing is in the range of 1:10 to 1:30.

在一優選實施例中,具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,更包括:一高導熱結構,其結合至所述浸沒式基板的下表面,使所述浸沒式基板是透過所述高導熱結構與所述發熱元件形成間接接觸,所述高導熱結構內部形成有一真空密閉腔,且所述真空密閉腔中含有液體。In a preferred embodiment, the two-phase immersed heat dissipation structure with spade-type fins with high roughness surfaces further includes: a high thermal conductivity structure, which is combined to the lower surface of the immersed substrate, so that the immersed The substrate is in indirect contact with the heating element through the highly thermally conductive structure. A vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。並且,附圖中相同或類似的部位以相同的標號標示。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following is a description of the relevant implementation modes disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. In addition, the same or similar parts in the drawings are labeled with the same reference numerals. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[第一實施例][First Embodiment]

請參閱圖1至圖2所示,其為本發明的第一實施例,本發明實施例提供一種具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,用於接觸浸沒於兩相冷卻液的發熱元件(熱源)。如圖所示,根據本發明實施例所提供的具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,其包括有一浸沒式基板10、以及多個鏟型鰭片20(skived fins)。Please refer to FIGS. 1 to 2 , which are the first embodiment of the present invention. The embodiment of the present invention provides a two-phase immersed heat dissipation structure with spade-shaped fins with high roughness surfaces for contact and immersion between two Heating element (heat source) of phase coolant. As shown in the figure, a two-phase immersed heat dissipation structure with scooped fins with high roughness surfaces provided according to an embodiment of the present invention includes an immersed substrate 10 and a plurality of skipped fins 20. ).

在本實施例中,浸沒式基板10可採用高導熱性材所製成,例如鋁、銅或其合金。浸沒式基板10可以是非多孔散熱材或是多孔散熱材。較佳來說,浸沒式基板10可以是浸沒於兩相冷卻液900(不導電之電子氟化液)中且孔隙率大於8%的多孔金屬散熱板,使更多的氣泡可生成在多個微孔中,以加強浸沒式散熱效果。In this embodiment, the immersed substrate 10 can be made of a material with high thermal conductivity, such as aluminum, copper or alloys thereof. The immersed substrate 10 may be a non-porous heat dissipation material or a porous heat dissipation material. Preferably, the immersed substrate 10 can be a porous metal heat dissipation plate immersed in the two-phase cooling liquid 900 (non-conductive electronic fluoride liquid) with a porosity greater than 8%, so that more bubbles can be generated in multiple Micro holes to enhance the immersion heat dissipation effect.

在本實施例中,浸沒式基板10具有相背對的上表面101與下表面102。浸沒式基板10的下表面102用以與浸沒於兩相冷卻液的發熱元件800形成接觸,這接觸可以是直接形成接觸或是透過中介層間接形成接觸。浸沒式基板10的上表面101則連接有多個鏟型鰭片20,並且多個鏟型鰭片20是以鏟削成型方式一體成型在浸沒式基板10的上表面101而得以極高密度排列。並且,鏟型鰭片20可以是針柱狀鰭片(pin fin)或是板片狀鰭片(plate fin),並且可以是由銅、銅合金或鋁合金所製成。In this embodiment, the immersed substrate 10 has an upper surface 101 and a lower surface 102 opposite to each other. The lower surface 102 of the immersed substrate 10 is used to make contact with the heating element 800 immersed in the two-phase cooling liquid. The contact may be direct contact or indirect contact through an interlayer. A plurality of spade fins 20 are connected to the upper surface 101 of the immersed substrate 10, and the plurality of spade fins 20 are integrally formed on the upper surface 101 of the immersed substrate 10 by a spade molding method and are arranged in an extremely high density. . Furthermore, the spade fins 20 may be pin fins or plate fins, and may be made of copper, copper alloy or aluminum alloy.

並且,在鏟型鰭片20尺寸較小(厚度T小於800微米)的情況下,鏟型鰭片20與兩相冷卻液900形成接觸的表面積對浸沒式散熱效果的影響會很大,因此鏟型鰭片20的表面201的中心線平均粗糙度Ra(center line average roughness Ra)是要大於10μm,並且鏟型鰭片20的表面201的十點平均粗糙度Rz(ten-point average roughness Rz)是要大於20μm,使多個鏟型鰭片20與兩相冷卻液900形成接觸的表面積與多個鏟型鰭片20的體積的比率(ratio)是大於400以上,以藉由增加表面粗糙度能有效增加形成接觸的表面積,且高粗糙度之表面亦有利於氣泡的生成,更加強浸沒式散熱效果。Moreover, when the size of the shovel-shaped fins 20 is small (the thickness T is less than 800 microns), the surface area of the shovel-shaped fins 20 in contact with the two-phase coolant 900 will have a great impact on the immersion heat dissipation effect. The center line average roughness Ra (center line average roughness Ra) of the surface 201 of the spade type fin 20 is greater than 10 μm, and the ten-point average roughness Rz (ten-point average roughness Rz) of the surface 201 of the spade type fin 20 It is to be greater than 20 μm, so that the ratio (ratio) of the surface area of the plurality of spade-type fins 20 in contact with the two-phase coolant 900 and the volume of the plurality of spade-type fins 20 is greater than 400, so as to increase the surface roughness. It can effectively increase the surface area for contact, and the highly rough surface is also conducive to the generation of bubbles, which further enhances the immersion heat dissipation effect.

更進一步說,在鏟型鰭片20尺寸(厚度T)為100~800微米,且與相鄰鰭片之間的鰭片間距D為100~500微米時,鏟型鰭片20的表面201的中心線平均粗糙度Ra與鰭片間距D的比為1:10到1:50的範圍,且鏟型鰭片20的表面201的十點平均粗糙度Rz與鰭片間距D的比為1:10到1:30的範圍,才能使效果更為顯著。Furthermore, when the size (thickness T) of the spade fin 20 is 100 to 800 microns, and the fin spacing D between adjacent fins is 100 to 500 microns, the surface 201 of the spade fin 20 The ratio of the centerline average roughness Ra to the fin spacing D is in the range of 1:10 to 1:50, and the ratio of the ten-point average roughness Rz of the surface 201 of the spade fin 20 to the fin spacing D is 1: The range of 10 to 1:30 can make the effect more significant.

在本實施例中,鏟型鰭片20的表面201可以是通過機械加工,例如珠擊方式(shot peening)所形成的粗糙之加工表面,也就是可利用硬質砂粒高速撞擊鏟型鰭片20,使鏟型鰭片20形成有預定的表面201。In this embodiment, the surface 201 of the shovel fin 20 can be a rough surface formed by mechanical processing, such as shot peening, that is, hard sand can be used to impact the shovel fin 20 at high speed. The spade fin 20 is formed with a predetermined surface 201 .

在本實施例中,鏟型鰭片20的表面201可以是通過蝕刻方式所形成的粗糙之蝕刻表面。進一步說,鏟型鰭片20的表面201可以是通過物理蝕刻,例如離子蝕刻(ion etching)所形成。另外,鏟型鰭片20的表面201可以是通過化學蝕刻(chemical etching),例如通過化學蝕刻溶液的腐蝕作用所形成,並且可以是通過磷酸系微蝕劑、硫酸系微蝕劑或氯化鐵腐蝕劑進行化學腐蝕所形成。In this embodiment, the surface 201 of the spade fin 20 may be a rough etched surface formed by etching. Furthermore, the surface 201 of the spade fin 20 may be formed by physical etching, such as ion etching. In addition, the surface 201 of the spade fin 20 may be formed by chemical etching, for example, by the corrosion of a chemical etching solution, and may be formed by phosphoric acid-based micro-etching agent, sulfuric acid-based micro-etching agent or ferric chloride. Formed by chemical corrosion with corrosive agents.

在本實施例中,鏟型鰭片20的表面201也可以是通過沉積方式所形成的粗糙之沉積表面。進一步說,鏟型鰭片20的表面201可以是通過液相沉積或氣相沉積(物理或化學氣相沉積)所形成。In this embodiment, the surface 201 of the spade fin 20 may also be a rough deposition surface formed by deposition. Furthermore, the surface 201 of the spade fin 20 may be formed by liquid deposition or vapor deposition (physical or chemical vapor deposition).

[第二實施例][Second Embodiment]

請參閱圖3所示,其為本發明的第二實施例。本實施例與第一實施例大致相同,其差異說明如下。Please refer to Figure 3, which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

在本實施例中,更包括有一高導熱結構30。並且,高導熱結構30是結合至浸沒式基板10的下表面102,使浸沒式基板10是透過高導熱結構30與浸沒於兩相冷卻液900的發熱元件800形成間接接觸。細部來說,高導熱結構30可以是透過焊接、摩擦攪拌接合、膠黏、或擴散接合等方式結合至浸沒式基板10的下表面102。在其他實施例中,浸沒式基板10可以是與高導熱結構30為一體成型。In this embodiment, a high thermal conductivity structure 30 is further included. Furthermore, the high thermal conductivity structure 30 is coupled to the lower surface 102 of the immersed substrate 10 so that the immersed substrate 10 is in indirect contact with the heating element 800 immersed in the two-phase cooling liquid 900 through the high thermal conductivity structure 30 . In detail, the high thermal conductivity structure 30 may be bonded to the lower surface 102 of the immersed substrate 10 through welding, friction stir welding, gluing, or diffusion bonding. In other embodiments, the immersed substrate 10 may be integrally formed with the high thermal conductivity structure 30 .

進一步說,高導熱結構30內部形成有一真空密閉腔301,且真空密閉腔301的腔頂壁與腔底壁還可以形成有燒結體,並且真空閉密腔301中含有適量的液體,所述液體可以是水或丙酮。並且,高導熱結構30的底面可用以接觸浸沒於兩相冷卻液900中的發熱元件800,以使浸沒在兩相冷卻液900中的發熱元件800,除了可以透過兩相冷卻液900吸熱氣化帶走發熱元件800產生之熱能,更可以透過高導熱結構30接觸並吸收發熱元件800產生之熱能,使得真空密閉腔301中內的液體氣化、蒸發為蒸汽,散發至浸沒式基板10並將熱能快速傳給與浸沒式基板10一體成型且以極高密度排列的鏟型鰭片20,並利用兩相冷卻液900吸熱氣化將鏟型鰭片20吸收的熱能帶走,而真空密閉腔301中的蒸汽交出熱能並於腔頂壁冷凝後再回流至腔底壁,如此高速迴圈,就能將發熱元件800產生之熱能快速匯出,進而強化浸沒式散熱效果。Furthermore, a vacuum sealed cavity 301 is formed inside the high thermal conductivity structure 30, and the top wall and bottom wall of the vacuum sealed cavity 301 can also be formed with sintered bodies, and the vacuum sealed cavity 301 contains an appropriate amount of liquid, and the liquid Can be water or acetone. Moreover, the bottom surface of the high thermal conductivity structure 30 can be used to contact the heating element 800 immersed in the two-phase cooling liquid 900, so that the heating element 800 immersed in the two-phase cooling liquid 900 can absorb heat and vaporize through the two-phase cooling liquid 900. The heat energy generated by the heating element 800 is taken away, and the heat energy generated by the heating element 800 can be contacted and absorbed through the high thermal conductivity structure 30, causing the liquid in the vacuum sealed chamber 301 to vaporize and evaporate into steam, which is then distributed to the immersed substrate 10 and The heat energy is quickly transferred to the shovel-shaped fins 20 that are integrally formed with the immersed substrate 10 and arranged at an extremely high density, and the two-phase coolant 900 is used to absorb heat and vaporize to take away the heat energy absorbed by the shovel-shaped fins 20, while the vacuum-tight cavity The steam in 301 surrenders heat energy and condenses on the top wall of the cavity before flowing back to the bottom wall of the cavity. Such a high-speed loop can quickly dissipate the heat energy generated by the heating element 800, thus enhancing the immersion heat dissipation effect.

綜合以上所述,本發明提供的具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,其至少可以通過「浸沒式基板」、「多個鏟型鰭片」、「浸沒式基板具有相背對的上表面與下表面,浸沒式基板的下表面用以與浸沒於兩相冷卻液的發熱元件形成接觸,浸沒式基板的上表面連接有多個鏟型鰭片」、「鏟型鰭片的表面的中心線平均粗糙度Ra是大於10μm,且鏟型鰭片的表面的十點平均粗糙度Rz是大於20μm,使多個鏟型鰭片與兩相冷卻液形成接觸的表面積與多個鏟型鰭片的體積的比率是大於400以上」的技術方案,能有效增加鏟型鰭片與兩相冷卻液形成接觸的表面積,並能利於氣泡的生成,從而得以有效的強化整體浸沒式散熱效果。Based on the above, the two-phase immersed heat dissipation structure with spade fins with high roughness surface provided by the present invention can at least pass through "immersed substrate", "multiple spade fins", "immersed substrate" It has an upper surface and a lower surface that are opposite to each other. The lower surface of the immersed substrate is used to form contact with the heating element immersed in the two-phase cooling liquid. The upper surface of the immersed substrate is connected with a plurality of spade-shaped fins. The centerline average roughness Ra of the surface of the fins is greater than 10 μm, and the ten-point average roughness Rz of the surface of the spade fins is greater than 20 μm, so that the surface area of multiple spade fins is in contact with the two-phase coolant. The technical solution of "the volume ratio of multiple spade fins is greater than 400" can effectively increase the surface area of contact between the spade fins and the two-phase coolant, and can facilitate the generation of bubbles, thereby effectively strengthening the whole Immersion cooling effect.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10:浸沒式基板 101:上表面 102:下表面 20:鏟型鰭片 201:表面 30:高導熱結構 301:真空密閉腔 800:發熱元件 900:兩相冷卻液 T:厚度 D:鰭片間距 10: Immersed substrate 101: Upper surface 102: Lower surface 20:Spade type fins 201: Surface 30: High thermal conductivity structure 301: Vacuum sealed chamber 800: Heating element 900: Two-phase coolant T:Thickness D: Fin spacing

圖1為本發明第一實施例的結構側視示意圖。Figure 1 is a schematic side view of the structure of the first embodiment of the present invention.

圖2為圖1的II部分的放大示意圖。FIG. 2 is an enlarged schematic diagram of part II of FIG. 1 .

圖3為本發明第二實施例的結構側視示意圖。Figure 3 is a schematic side view of the structure of the second embodiment of the present invention.

10:浸沒式基板 10: Immersed substrate

101:上表面 101: Upper surface

102:下表面 102: Lower surface

20:鏟型鰭片 20:Spade type fins

201:表面 201: Surface

800:發熱元件 800: Heating element

900:兩相冷卻液 900: Two-phase coolant

T:厚度 T:Thickness

D:鰭片間距 D: Fin spacing

Claims (7)

一種具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,其包括有一浸沒式基板、以及多個鏟型鰭片,所述浸沒式基板具有相背對的上表面與下表面,所述浸沒式基板的下表面用以與浸沒於兩相冷卻液的發熱元件形成接觸,所述浸沒式基板的上表面連接有多個所述鏟型鰭片,且所述鏟型鰭片的表面的中心線平均粗糙度Ra是大於10μm,並且所述鏟型鰭片的表面的十點平均粗糙度Rz是大於20μm,使多個所述鏟型鰭片與所述兩相冷卻液形成接觸的表面積與多個所述鏟型鰭片的體積的比率是大於400以上;其中,所述鏟型鰭片的尺寸是介於100至800微米,且與相鄰所述鏟型鰭片之間的鰭片間距是介於100至500微米,所述鏟型鰭片的表面的中心線平均粗糙度Ra與所述鰭片間距的比為1:10到1:50的範圍,且所述鏟型鰭片的表面的十點平均粗糙度Rz與所述鰭片間距的比為1:10到1:30的範圍。 A two-phase immersed heat dissipation structure with spade-type fins on a high-roughness surface, which includes an immersed substrate and a plurality of spade-type fins. The immersed substrate has opposite upper and lower surfaces, The lower surface of the immersed substrate is used to make contact with the heating element immersed in the two-phase cooling liquid. A plurality of the spade fins are connected to the upper surface of the immersed substrate, and the spade fins are The centerline average roughness Ra of the surface is greater than 10 μm, and the ten-point average roughness Rz of the surface of the spade-type fins is greater than 20 μm, so that multiple spade-type fins come into contact with the two-phase coolant The ratio of the surface area to the volume of the plurality of spade-shaped fins is greater than 400; wherein the size of the spade-shaped fins is between 100 and 800 microns, and is between adjacent spade-shaped fins. The fin spacing is between 100 and 500 microns, the ratio of the centerline average roughness Ra of the surface of the spade fins to the fin spacing is in the range of 1:10 to 1:50, and the spade The ratio of the ten-point average roughness Rz of the surface of the fins to the fin spacing is in the range of 1:10 to 1:30. 如請求項1所述的具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,其中,所述鏟型鰭片是針柱狀鰭片、板片狀鰭片的其一。 The two-phase immersed heat dissipation structure of spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the spade-shaped fins are one of pin-cylindrical fins and plate-shaped fins. 如請求項1所述的具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,其中,所述鏟型鰭片是由銅、銅合金、鋁合金的其一金屬所製成。 The two-phase immersed heat dissipation structure with spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the spade-shaped fins are made of one of copper, copper alloy, and aluminum alloy. 如請求項1所述的具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,其中,所述鏟型鰭片的表面是通過機械加工所形成的粗糙之加工表面。 The two-phase immersed heat dissipation structure of spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the surface of the spade-shaped fins is a rough processed surface formed by mechanical processing. 如請求項1所述的具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,其中,所述鏟型鰭片的表面是通過蝕刻方式所形成的粗糙之蝕刻表面。 The two-phase immersed heat dissipation structure with spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the surface of the spade-shaped fins is a rough etched surface formed by etching. 如請求項1所述的具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,其中,所述鏟型鰭片的表面是通過沉積方式所形成的粗糙之沉積表面。 The two-phase immersed heat dissipation structure of spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the surface of the spade-shaped fins is a rough deposition surface formed by deposition. 如請求項1所述的具高粗糙度表面之鏟型鰭片的兩相浸沒式散熱結構,更包括:一高導熱結構,其結合至所述浸沒式基板的下表面,使所述浸沒式基板是透過所述高導熱結構與所述發熱元件形成間接接觸,所述高導熱結構內部形成有一真空密閉腔,且所述真空密閉腔中含有液體。 The two-phase immersed heat dissipation structure of spade-type fins with high roughness surfaces as described in claim 1 further includes: a high thermal conductivity structure, which is combined to the lower surface of the immersed substrate to make the immersed The substrate is in indirect contact with the heating element through the highly thermally conductive structure. A vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5726495A (en) * 1992-03-09 1998-03-10 Sumitomo Metal Industries, Ltd. Heat sink having good heat dissipating characteristics
US20190264986A1 (en) * 2018-02-27 2019-08-29 Auras Technology Co., Ltd. Heat dissipation device
TWM614782U (en) * 2021-04-07 2021-07-21 奇鋐科技股份有限公司 Heat sink structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5726495A (en) * 1992-03-09 1998-03-10 Sumitomo Metal Industries, Ltd. Heat sink having good heat dissipating characteristics
US20190264986A1 (en) * 2018-02-27 2019-08-29 Auras Technology Co., Ltd. Heat dissipation device
TWM614782U (en) * 2021-04-07 2021-07-21 奇鋐科技股份有限公司 Heat sink structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
網路文獻 陳建榕 平板型熱交換器鰭片表面特性對冷凝現象影響的熱流分析 元智大學 20021231 https://hdl.handle.net/11296/vm3y3k *

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