CN214708414U - Heat dissipation part and temperature equalization plate with same - Google Patents
Heat dissipation part and temperature equalization plate with same Download PDFInfo
- Publication number
- CN214708414U CN214708414U CN202022996602.0U CN202022996602U CN214708414U CN 214708414 U CN214708414 U CN 214708414U CN 202022996602 U CN202022996602 U CN 202022996602U CN 214708414 U CN214708414 U CN 214708414U
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- Prior art keywords
- sheet
- heat
- heat dissipation
- protective layer
- working fluid
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- 239000012530 fluid Substances 0.000 claims abstract description 28
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 4
- 238000007740 vapor deposition Methods 0.000 claims 3
- 239000000843 powder Substances 0.000 abstract description 14
- 229910002804 graphite Inorganic materials 0.000 abstract description 9
- 239000010439 graphite Substances 0.000 abstract description 9
- -1 graphite alkene Chemical class 0.000 abstract description 3
- 239000011241 protective layer Substances 0.000 description 27
- 230000000694 effects Effects 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 5
- 238000009835 boiling Methods 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Abstract
The utility model provides a radiating piece and have temperature-uniforming plate of this radiating piece for solve the graphite or the graphite alkene of current conducting strip and take off the problem of powder. This temperature-uniforming plate includes: a first sheet; a second sheet joined with the first sheet and forming a chamber filled with a working fluid; and at least one heat dissipation piece connected to the first sheet body or/and the second sheet body, wherein the heat dissipation piece comprises a heat conduction sheet which is a graphite sheet or a graphene sheet, and a protection layer connected to the outer surface of the heat conduction sheet, and the thickness of the protection layer is 0.001-0.01 mm.
Description
Technical Field
The present invention relates to a heat dissipation device, and more particularly to a heat dissipation member for dissipating heat from an electronic component and a vapor chamber having the heat dissipation member.
Background
The temperature equalizing plate is a common heat dissipation device which is often applied to the field of heat dissipation, in an electronic product, the existing temperature equalizing plate is combined on the surface of a heating source, the existing temperature equalizing plate is provided with an upper plate body and a lower plate body, the upper plate body and the lower plate body are combined to form a cavity, the cavity is filled with a working fluid, the working fluid can be heated and vaporized by the heating source, the working fluid which forms a gaseous state is evaporated to the heat release side far away from the heating source to release heat and then condensed, and therefore the heat of the heating source can be taken away to achieve the purpose of heat dissipation.
As the command cycle of electronic components increases, the amount of heat released during operation is relatively increased, and the electronic products are thinned and packaged with high density, thereby limiting the heat dissipation space, which raises the requirement for heat dissipation efficiency. In order to enhance the heat dissipation efficiency of the vapor chamber, the conventional vapor chamber utilizes a heat conducting sheet made of graphite or graphene with better heat conductivity to be combined with the upper plate body or/and the lower plate body to achieve the purpose.
However, in the conventional vapor chamber, since the surface of the heat conductive sheet is easily peeled off, the powder is formed and falls off, the powder may cause pollution of a production line, and if the heat conductive sheet is mounted on the outer surface of the vapor chamber, the powder is easily dropped on a circuit board to cause short circuit; if the heat conducting fin is installed in the cavity of the temperature equalizing plate, the powder falls off to reduce the heat conducting effect.
In view of the above, there is still a need for improvement of the conventional vapor chamber.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, an object of the present invention is to provide a heat sink, which can reduce the powder of the heat-conducting strip from dropping off.
The utility model discloses a next purpose provides a radiating piece, can reduce the gross thickness of samming board.
The present invention relates to a directional device, and more particularly to a directional device, such as a directional device, a method, a device, a method, a device and a device, a method, a device and a device.
The components and members described throughout the present invention use the wording "one" or "one" only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.
The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be used for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.
The utility model discloses a heat dissipation piece, include: one heat conducting sheet is a graphite sheet or a graphene sheet; and the protective layer is connected to the outer surface of the heat conducting fin, and the thickness of the protective layer is 0.001-0.01 mm.
The utility model discloses a temperature-uniforming plate, include: a first sheet; a second sheet joined to the first sheet and forming a chamber filled with a working fluid; and at least one heat dissipation member as described above, connected to the first sheet member or/and the second sheet member.
Therefore, the utility model discloses a heat-dissipating piece is usable this protective layer to connect in the surface of this conducting strip to reduce this conducting strip and form the condition that the powder drops because of receiving external force, and the thickness of this protective layer is extremely thin, can heat conduction fast and help to reduce whole samming plate thickness.
Wherein, the protective layer can be formed on the outer surface of the heat conducting sheet in a spraying or impregnating way. Therefore, the protective layer has the effects of being convenient to form and controlling the thickness of the protective layer.
Wherein, the total thickness of the heat conducting sheet and the protective layer can be less than or equal to 0.4 mm. Therefore, the heat-insulating plate has the effect of benefiting the thinning development of the whole heat-insulating plate.
Wherein, the total thickness of the temperature-uniforming plate can be less than or equal to 2 mm. Therefore, the thinned temperature equalizing plate can be applied to small or thin electronic products and has the effect of improving the practicability of the temperature equalizing plate.
Wherein, the chamber can be filled with more than two working fluids with different boiling points. Therefore, the circulation efficiency of gas-liquid phase change can be improved, and the effect of better heat dissipation is achieved.
The vapor chamber may additionally include a capillary structure located in the chamber. Therefore, the heat dissipation efficiency of the heating source is improved.
Drawings
FIG. 1: the utility model discloses the combined section view of the first embodiment;
FIG. 2: the utility model discloses the combined section view of the second embodiment;
FIG. 3: an enlarged view of a portion of the structure in area a of fig. 2;
FIG. 4: a combined cross-sectional view of a third embodiment of the present invention;
FIG. 5: the utility model discloses the combination section view of fourth embodiment.
Description of the reference numerals
[ utility model ] to solve the problems
1: heat sink
11 heat-conducting fin
12 protective layer
2: first sheet
21, containing groove
22: ring edge
3: the second sheet body
31 container
32: ring edge
4: capillary structure
S is a chamber
L working fluid
F1, F2 outer surface
F3 inner surface
G is back adhesive
T is the thickness.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail as follows:
referring to fig. 1, which is a first embodiment of the heat sink of the present invention, the heat sink 1 may include a heat conductive sheet 11, and a protective layer 12 connected to an outer surface F1 of the heat conductive sheet 11.
This conducting strip 11 can be high coefficient of thermal conductivity's graphite flake or graphite alkene piece, and can be any shape, the utility model discloses do not restrict.
The protective layer 12 may be connected to part or all of the outer surface F1 of the heat conductive sheet 11, and in this embodiment, the protective layer 12 may completely cover the outer surface F1 of the heat conductive sheet 11. The protective layer 12 can be formed by spraying or dipping, so that the thickness T of the protective layer 12 can be controlled to be 0.001-0.01 mm, and thus the protective layer 12 can provide protection for the heat conductive sheet 11, and can also have a better heat conduction effect, and the total thickness of the heat conductive sheet 11 and the protective layer 12 can be smaller than or equal to 0.4 mm.
The heat dissipation element of the utility model can be directly attached to a heating source, such as a microprocessor, and the heat generated by the microprocessor can be rapidly transferred to each position of the heat dissipation element for heat diffusion by virtue of the high heat conductivity of the heat dissipation element; or can be combined with a temperature equalizing plate to improve the heat dissipation efficiency. Since the heat conductive sheet 11 can be protected by the protective layer 12, the heat conductive sheet 11 can be prevented from being pulverized and falling off.
Referring to fig. 2 and 3, a second embodiment of the present invention is a vapor chamber having the above heat sink, including a first sheet 2, a second sheet 3 and at least one heat sink 1, wherein the first sheet 2 can be combined with the second sheet 3, and the at least one heat sink 1 can be connected to the first sheet 2 or/and the second sheet 3.
The first sheet body 2 can be made of metal sheets such as copper and aluminum, or made of heat conducting materials such as titanium and stainless steel with better rigidity, so that the problem of deformation when the first sheet body 2 is stressed can be avoided. The first sheet body 2 may have a receiving slot 21, the receiving slot 21 may be formed by stamping, die casting, dry etching, wet etching or plasma etching, but the present invention is not limited thereto, and the periphery of the receiving slot 21 may form a ring edge 22. Preferably, the vessel 21 can be formed by etching, so that the depth of the vessel 21 can be precisely controlled in μm, thereby improving the processing precision.
The second sheet 3 may be made of the same material as or different material from the first sheet 2. The second sheet 3 can be butt jointed with the first sheet 2, so that the second sheet 3 and the first sheet 2 can form a chamber S together, and the chamber S can be filled with a working fluid L to achieve the purpose of heat dissipation by means of evaporation and condensation circulation of the working fluid L. The present invention is not limited to the type of the second sheet body 3, in this embodiment, the second sheet body 3 may also have a containing groove 31, the containing groove 31 may also be formed by etching process, so that the periphery of the containing groove 31 may form an annular edge 32.
The combination mode of this second lamellar body 3 and this first lamellar body 2 the utility model discloses do not put the restriction, for example: the second sheet 3 can be selectively bonded to the first sheet 2 by gluing, inserting, or locking, or alternatively, the first sheet 2 and the second sheet 3 can be clamped by clips. In the present embodiment, the annular edge 22 of the first sheet 2 is selected to be abutted with the annular edge 32 of the second sheet 3, so as to form the chamber S with a larger volume, which has the effect of enhancing the heat dissipation efficiency; and the annular edge 32 of the second sheet 3 is laser welded to the annular edge 22 of the first sheet 2, so that the first sheet 2 and the second sheet 3 can be welded and combined without generating a gap, the chamber S can be sealed, and the structural strength of the vapor chamber can be improved.
The working fluid L may be water, alcohol or other liquid; preferably, the working fluid L may be a non-conductive liquid, and the working fluid L may absorb heat energy from a liquid state and evaporate into a gaseous state, so as to achieve heat energy transfer by using a change mechanism of a gas-liquid phase of the working fluid L. By means of the closed chamber S, the working fluid L can be prevented from being dissipated after being formed into a gaseous state, and the space formed after the working fluid L is compressed into the gaseous state due to the occupation of air in the chamber S is avoided, so that the heat dissipation efficiency is further influenced. In addition, the chamber S may be filled with two or more kinds of working fluids L having different boiling points; therefore, the circulation efficiency of gas-liquid phase change can be improved by means of the difference of the boiling points of different working fluids L.
The at least one heat dissipation element 1 may be connected to the first sheet 2 or/and the second sheet 3, and the connection may be back-glued or transfer-printed to the surface of the first sheet 2 or/and the second sheet 3, in this embodiment, the number of the heat dissipation elements 1 is described as one, and the heat conductive sheet 11 of the heat dissipation element 1 may be connected to the outer surface F2 of the second sheet 3 by a back-glued G; in other embodiments, the heat sink 1 can also be combined with the first sheet 2, but the invention is not limited thereto. In detail, because this conducting strip 11 can be for the heat conductivity coefficient is greater than this first lamellar body 2 and the graphite flake or the graphite alkene piece of this second lamellar body 3, so, even this first lamellar body 2 and this second lamellar body 3's heat energy conduction volume reaches the saturation, also can combine in this first lamellar body 2 or this second lamellar body 3's surface F2 with the help of this radiating piece 1, and promote the utility model discloses the heat conduction efficiency of samming board can promote radiating efficiency's effect.
In addition, the shape of the heat sink 1 is not limited, and the heat sink 1 may be a single sheet or a plurality of sheets, and the temperature equalization plate may be thinned for use in small electronic products.
Specifically, the protective layer 12 of the heat sink 1 may be formed only on the exposed outer surface F1 of the heat conducting sheet 11 bonded to the first sheet 2 or/and the second sheet 3, so that the protective layer 12 will not be formed between the heat conducting sheet 11 and the back adhesive G, the thickness of the protective layer 12 can be reduced, and the total thickness of the temperature equalization plate can be less than or equal to 2 mm.
This temperature-uniforming plate also can set up a capillary structure 4 in this cavity S, this capillary structure 4 can make the working fluid L after condensing gather again and carry out the backward flow, this capillary structure 4 can be arranged in this cavity S and be close to one side of a source that generates heat relatively, so that this heat of the source that generates heat of this absorption of working fluid L, this capillary structure 4 can be for porous mesh structure, structure such as micro-groove or sintering powder, flow because of capillary phenomenon, so as to increase this working fluid L, this capillary structure 4 can be made by a powder sintering (powder sintering process), this powder can be for copper powder or other suitable powder, the utility model discloses not the restriction.
When the temperature equalization plate is used, the heat energy of the heating source can be transmitted by the heat dissipation part 1, by means of the heat conductivity coefficient of the heat dissipation part 1 being larger than the heat conductivity coefficients of the first sheet body 2 and the second sheet body 3, when the heat energy of the heat source is transferred to the heat sink 1, the heat sink 1 can rapidly spread the heat energy of the heat source to the periphery and to the inner surface F3 of the second sheet 3 by heat conduction, and the working fluid L in the chamber S absorbs the heat energy of the heat source, the working fluid L in the chamber S can absorb heat energy from a liquid state and evaporate into a gaseous state, so as to dissipate the absorbed heat energy, and after the dissipation of the heat energy, the working fluid L can be condensed into liquid state again, and is recollected by the capillary structure 4, so that the working fluid L can absorb heat energy to the heating source again, and the operation is repeated, thereby achieving the effect of providing good heat dissipation efficiency. In addition, the chamber S can be filled with two working fluids L with different boiling points, so that the gas-liquid phase circulation speed of the working fluid L can be increased, and a better heat dissipation effect can be provided. Since the heat conductive sheet 11 can be covered by the protective layer 12, the heat conductive sheet 11 is prevented from being broken off due to powder formation.
Please refer to fig. 4, which shows a third embodiment of the present invention, the number of the heat dissipating elements 1 can be two, the heat conducting fins 11 of the two heat dissipating elements 1 can be respectively combined with the outer surfaces F2 of the first sheet body 2 and the second sheet body 3, the protective layer 12 can be formed only on the outer surfaces F1 exposed after the two heat conducting fins 11 are respectively combined with the first sheet body 2 and the second sheet body 3, so that the temperature equalizing board of the present invention can transfer the heat energy of the heat source through the heat dissipating elements 1 located on the first sheet body 2 or the heat dissipating elements 1 located on the second sheet body 3, thereby avoiding the problem of difficult assembly due to directionality.
Referring to fig. 5, it is shown that in the fourth embodiment of the present invention, the at least one heat sink 1 can be connected to the inner surface F3 of the first sheet body 2 or/and the second sheet body 3, in this embodiment, the number of the heat sink 1 can be one, and after the protective layer 12 is used to coat the outer surface F1 of the heat conducting fin 11, the heat sink is combined with the inner surface F3 of the second sheet body 3, and the capillary structure can be omitted, so that the heat sink 1 can be used to transfer heat energy to the working fluid L for heat dissipation, and at the same time, the total thickness of the temperature equalizing plate of the present invention can be further reduced.
To sum up, the utility model discloses a heat-radiating piece, usable this protective layer are connected in the surface of this conducting strip to the powder that reduces this conducting strip drops, and the thickness of this protective layer can be between 0.001 ~ 0.01mm, so, can heat conduction fast and make this temperature-uniforming plate have thinner thickness. In addition, the protective layer is formed on the heat conducting sheet by spraying or soaking, so that the effect of controlling the thickness of the protective layer can be achieved.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention.
Claims (3)
1. A vapor chamber, comprising:
a first sheet;
a second sheet joined to the first sheet and forming a chamber filled with a working fluid; and
at least one heat dissipation piece is connected to the first sheet body or/and the second sheet body, and the heat dissipation piece is provided with a heat conduction sheet, the heat conduction sheet is a graphene sheet, a protection layer is connected to the outer surface of the heat conduction sheet, and the thickness of the protection layer is 0.001-0.01 mm.
2. The vapor-deposition plate of claim 1, wherein the total thickness of the vapor-deposition plate is less than or equal to 2 mm.
3. The vapor-deposition plate of claim 1, further comprising a capillary structure disposed in the chamber.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109216092 | 2020-12-04 | ||
| TW109216092U TWM608731U (en) | 2020-12-04 | 2020-12-04 | Heat sink and vapor chamber with the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214708414U true CN214708414U (en) | 2021-11-12 |
Family
ID=76036720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022996602.0U Active CN214708414U (en) | 2020-12-04 | 2020-12-14 | Heat dissipation part and temperature equalization plate with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN214708414U (en) |
| TW (1) | TWM608731U (en) |
-
2020
- 2020-12-04 TW TW109216092U patent/TWM608731U/en unknown
- 2020-12-14 CN CN202022996602.0U patent/CN214708414U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM608731U (en) | 2021-03-01 |
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