TWI823668B - Two-phase immersion cooling compound heat-dissipating device - Google Patents
Two-phase immersion cooling compound heat-dissipating device Download PDFInfo
- Publication number
- TWI823668B TWI823668B TW111142489A TW111142489A TWI823668B TW I823668 B TWI823668 B TW I823668B TW 111142489 A TW111142489 A TW 111142489A TW 111142489 A TW111142489 A TW 111142489A TW I823668 B TWI823668 B TW I823668B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- fins
- porous layer
- heat source
- area
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract description 7
- 238000007654 immersion Methods 0.000 title abstract description 7
- 150000001875 compounds Chemical class 0.000 title abstract 2
- 230000017525 heat dissipation Effects 0.000 claims description 61
- 239000002131 composite material Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000005242 forging Methods 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 39
- 230000006911 nucleation Effects 0.000 description 7
- 238000010899 nucleation Methods 0.000 description 7
- 239000002826 coolant Substances 0.000 description 6
- 239000000110 cooling liquid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明涉及一種散熱裝置，具體來說是涉及一種兩相浸沒式複合型散熱裝置，其同時具有表面多孔層與鰭片。 The present invention relates to a heat dissipation device, specifically to a two-phase immersed composite heat dissipation device, which has a surface porous layer and fins at the same time.
浸沒式冷卻(immersion cooling)技術是將發熱元件(如伺服器、磁碟陣列等)直接浸沒在不導電的冷卻液中，以透過冷卻液吸熱氣化帶走發熱元件運作所產生之熱能。並且，若是採用散熱鰭片配合冷卻液，則會缺乏能夠產生氣泡的成核點。若是採用多孔結構配合冷卻液，儘管能夠增加產生氣泡的成核點，但其垂直方向的熱傳導的劣勢會造成熱性能下降。因此，如何透過浸沒式冷卻技術更加有效地進行散熱一直是業界所需要解決的問題。 Immersion cooling technology is to immerse heating components (such as servers, disk arrays, etc.) directly in non-conductive coolant, so that the heat energy generated by the operation of the heating components can be taken away through the coolant absorbing heat and vaporizing it. Moreover, if cooling fins are used with coolant, there will be a lack of nucleation points that can generate bubbles. If a porous structure is used with coolant, although it can increase the nucleation points for generating bubbles, its disadvantage in vertical heat conduction will cause a decrease in thermal performance. Therefore, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.
有鑑於此，本發明人本於多年從事相關產品的開發與設計，有感上述缺失的可改善，乃特潛心研究並配合學理的運用，終於提出一種設計合理且有效改善上述缺失的本發明。 In view of this, the inventor has been engaged in the development and design of related products for many years. He felt that the above deficiencies could be improved, so he devoted himself to research and applied academic theory, and finally proposed an invention that is reasonably designed and effectively improves the above deficiencies.
本發明所要解決的技術問題在於，針對現有技術的不足提供一種兩相浸沒式複合型散熱裝置，以解決上述的缺失。 The technical problem to be solved by the present invention is to provide a two-phase immersed composite heat dissipation device to solve the deficiencies of the existing technology.
為了解決上述的技術問題，本發明所採用的其中一技術方案 是，提供一種兩相浸沒式複合型散熱裝置，其包括一散熱基底、複數個鰭片及一表面多孔層。該散熱基底具有第一表面及第二表面，該第一表面被設置用以接觸熱源，該第二表面與該第一表面相對且遠離該熱源，其中該散熱基底對應於該熱源的投影區域定義為高溫區域，在該高溫區域的外圍為低溫區域。複數個鰭片與該熱源相對，且設置於該散熱基底的該第二表面的該高溫區域內。該表面多孔層位於該散熱基底的該低溫區域的範圍內。 In order to solve the above technical problems, one of the technical solutions adopted by the present invention is Yes, a two-phase immersed composite heat dissipation device is provided, which includes a heat dissipation base, a plurality of fins and a surface porous layer. The heat dissipation base has a first surface and a second surface. The first surface is configured to contact the heat source. The second surface is opposite to the first surface and away from the heat source. The heat dissipation base defines a projection area corresponding to the heat source. It is a high-temperature area, and the periphery of this high-temperature area is a low-temperature area. A plurality of fins are opposite to the heat source and are disposed in the high temperature area of the second surface of the heat dissipation base. The surface porous layer is located within the low temperature region of the heat dissipation substrate.
在一優選實施例中，所述複數個鰭片的材料為銅、或銅合金、或鋁合金製成。 In a preferred embodiment, the plurality of fins are made of copper, copper alloy, or aluminum alloy.
在一優選實施例中，所述複數個鰭片以其中下列一項的製造方式而成：彎折成型，鍛壓成型、擠壓成型、或粉末燒結。 In a preferred embodiment, the plurality of fins are made by one of the following manufacturing methods: bending molding, forging molding, extrusion molding, or powder sintering.
在一優選實施例中，所述複數個鰭片的高度大於3公厘且孔隙率小於15%。 In a preferred embodiment, the height of the plurality of fins is greater than 3 mm and the porosity is less than 15%.
在一優選實施例中，所述複數個鰭片覆蓋所述熱源正上方的90%區域。 In a preferred embodiment, the plurality of fins cover 90% of the area directly above the heat source.
在一優選實施例中，所述表面多孔層的材料為銅、或銅合金、或鋁合金、或石墨、或銀製成。 In a preferred embodiment, the surface porous layer is made of copper, copper alloy, aluminum alloy, graphite, or silver.
在一優選實施例中，所述表面多孔層分佈於所述第二表面，並且覆蓋所述複數個鰭片以外的70%表面積。 In a preferred embodiment, the surface porous layer is distributed on the second surface and covers 70% of the surface area other than the plurality of fins.
在一優選實施例中，所述表面多孔層分佈於所述第一表面，並且覆蓋所述熱源正投影以外的20%表面積。 In a preferred embodiment, the surface porous layer is distributed on the first surface and covers 20% of the surface area outside the orthographic projection of the heat source.
在一優選實施例中，所述表面多孔層的厚度小於1.2公厘且孔隙率大於40%。 In a preferred embodiment, the thickness of the surface porous layer is less than 1.2 mm and the porosity is greater than 40%.
在一優選實施例中，所述表面多孔層以其中下列一項的製造方式而成：金屬網、藥水腐蝕、粉末燒結配合造孔劑、藥水沉積、電鍍、氣相 沉積、或機械加工。 In a preferred embodiment, the surface porous layer is made by one of the following manufacturing methods: metal mesh, liquid corrosion, powder sintering with pore-forming agent, liquid deposition, electroplating, gas phase deposition, or machining.
本發明的其中一有益效果在於，本發明所提供的兩相浸沒式複合型散熱裝置，其能透過「複數個鰭片，與該熱源相對，且設置於該散熱基底的該第二表面的該高溫區域內」與「表面多孔層，位於該散熱基底的低溫區域的範圍內」結合而成複合型散熱裝置，其中採用「表面多孔層」的多孔結構配合冷卻液，能夠增加產生氣泡的成核點，同時「散熱鰭片」能提升垂直方向的熱傳導性能，從而得以有效的強化整體浸沒式散熱效果。 One of the beneficial effects of the present invention is that the two-phase immersed composite heat dissipation device provided by the present invention can be opposed to the heat source through a plurality of fins, and is disposed on the second surface of the heat dissipation base. "In the high-temperature region" and "the surface porous layer, located within the low-temperature region of the heat dissipation substrate" are combined to form a composite heat dissipation device. The porous structure of the "surface porous layer" is used in conjunction with the coolant to increase the nucleation of bubbles. At the same time, the "heat dissipation fins" can improve the heat conduction performance in the vertical direction, thereby effectively enhancing the overall immersion heat dissipation effect.
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本發明加以限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.
100、100a:散熱裝置 100, 100a: cooling device
10:散熱基底 10:Heat dissipation base
11:第一表面 11: First surface
12:第二表面 12: Second surface
20:鰭片 20:fins
30、40、30a、40a:表面多孔層 30, 40, 30a, 40a: Surface porous layer
9:熱源 9:Heat source
A1:高溫區域 A1: High temperature area
A2:低溫區域 A2: Low temperature area
圖1為本發明第一實施例的兩相浸沒式複合型散熱裝置的前視示意圖。 Figure 1 is a schematic front view of a two-phase immersed composite heat dissipation device according to the first embodiment of the present invention.
圖2為本發明第一實施例的兩相浸沒式複合型散熱裝置的俯視示意圖。 FIG. 2 is a schematic top view of a two-phase immersed composite heat dissipation device according to the first embodiment of the present invention.
圖3為本發明第一實施例的兩相浸沒式複合型散熱裝置的仰視示意圖。 Figure 3 is a schematic bottom view of the two-phase immersed composite heat dissipation device according to the first embodiment of the present invention.
圖4為本發明第二實施例的兩相浸沒式複合型散熱裝置的前視示意圖。 Figure 4 is a schematic front view of a two-phase immersed composite heat dissipation device according to the second embodiment of the present invention.
圖5為本發明第二實施例的兩相浸沒式複合型散熱裝置的俯視示意圖。 FIG. 5 is a schematic top view of a two-phase immersed composite heat dissipation device according to the second embodiment of the present invention.
以下是通過特定的具體實施例來說明本發明所公開的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。 The following is a specific example to illustrate the disclosed embodiments of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.
[第一實施例] [First Embodiment]
參閱圖1至圖3所示，本發明第一實施例提供一種兩相浸沒式複合型散熱裝置100，用於接觸浸沒於兩相冷卻液中的發熱元件(熱源)。其中所謂「複合型」是指複合了鰭片以及表面多孔層。更具體的說，本實施例提供一種具高孔隙率之實體與具高熱導率之鰭片的兩相浸沒式複合型散熱結構，其包括一散熱基底10、複數個鰭片20及一個以上的表面多孔層(30、40)。 Referring to FIGS. 1 to 3 , a first embodiment of the present invention provides a two-phase immersed composite heat dissipation device 100 for contacting a heating element (heat source) immersed in a two-phase cooling liquid. The so-called "composite type" refers to the combination of fins and surface porous layer. More specifically, this embodiment provides a two-phase immersed composite heat dissipation structure with high porosity solids and high thermal conductivity fins, which includes a heat dissipation base 10, a plurality of fins 20 and more than one Surface porous layer (30, 40).
散熱基底10可採用高導熱性材所製成，例如銅、銅合金或鋁合金。進一步說，散熱基底10可呈板狀且具有彼此背對的第一表面11及第二表面12。第一表面11被設置用以接觸熱源9。第二表面12與第一表面11相對且遠離該熱源9。熱源9是浸沒於兩相冷卻液(圖略)，上述「接觸」可以是直接接觸或是透過中介層(圖略)形成間接接觸(熱接觸)。 The heat dissipation substrate 10 can be made of a material with high thermal conductivity, such as copper, copper alloy or aluminum alloy. Furthermore, the heat dissipation substrate 10 may be plate-shaped and have a first surface 11 and a second surface 12 facing away from each other. The first surface 11 is arranged to contact the heat source 9 . The second surface 12 is opposite to the first surface 11 and away from the heat source 9 . The heat source 9 is immersed in the two-phase cooling liquid (not shown), and the above-mentioned "contact" can be direct contact or indirect contact (thermal contact) through an intermediary layer (not shown).
如圖1所示，為便於描述，其中散熱基底10對應於熱源9的投影區域定義為高溫區域A1，在高溫區域A1的外圍為低溫區域A2。 As shown in FIG. 1 , for convenience of description, the projected area of the heat dissipation substrate 10 corresponding to the heat source 9 is defined as a high-temperature area A1 , and the periphery of the high-temperature area A1 is a low-temperature area A2 .
複數個鰭片20與熱源9相對，且設置於散熱基底10的第二表面12的高溫區域A1內。換句話說，散熱基底10的第二表面12連接有多個高熱導率的鰭片20。鰭片20可以是由銅、銅合金、鋁或鋁合金等金屬所製成，並且鰭片20可以是以彎折成型，鍛壓成型、擠壓成型、或粉末燒結等方式所形成。 並且，鰭片20可以是針柱狀鰭片(pin fin)或片狀鰭片(plate fin)，鰭片20的高度較佳是大於3公厘(mm)，此外，鰭片20的熱導率較佳可以是大於300W/m.K。另外，該些鰭片20的孔隙率較佳是小於15%，因為超過15%會使得鰭片20的熱導率過低且機械強度較不足。孔隙是由於金屬粉末燒結而產生的孔洞，孔隙率(porosity)是指由孔隙的體積與材料總體積的比率。再者，本實施例的該些鰭片20覆蓋於熱源9正上方的90%區域。本實施例中，鰭片20覆蓋於第二表面12的面積還大於熱源9正上方的面積。 The plurality of fins 20 are opposite to the heat source 9 and are disposed in the high-temperature area A1 of the second surface 12 of the heat dissipation base 10 . In other words, a plurality of fins 20 with high thermal conductivity are connected to the second surface 12 of the heat dissipation substrate 10 . The fins 20 may be made of metal such as copper, copper alloy, aluminum or aluminum alloy, and the fins 20 may be formed by bending, forging, extrusion, or powder sintering. Moreover, the fins 20 can be pin fins or plate fins. The height of the fins 20 is preferably greater than 3 millimeters (mm). In addition, the thermal conductivity of the fins 20 is The rate may preferably be greater than 300W/m.K. In addition, the porosity of the fins 20 is preferably less than 15%, because exceeding 15% will cause the thermal conductivity of the fins 20 to be too low and the mechanical strength to be insufficient. Porosity is the hole produced by the sintering of metal powder, and porosity refers to the ratio of the volume of pores to the total volume of the material. Furthermore, the fins 20 of this embodiment cover 90% of the area directly above the heat source 9 . In this embodiment, the area covered by the fins 20 on the second surface 12 is larger than the area directly above the heat source 9 .
本發明為了能更強化浸沒式散熱效果，具有一個以上的表面多孔層(30、40)，表面多孔層(30、40)位於散熱基底10的低溫區域A2的範圍內，是高孔隙率之實體。表面多孔層(30、40)可以是分佈於第一表面11、或第二表面12，或者兩個表面都有。表面多孔層(30、40)的材料為銅、或銅合金、或鋁合金、或石墨、或銀製成。 In order to further enhance the immersion heat dissipation effect, the present invention has more than one surface porous layer (30, 40). The surface porous layer (30, 40) is located within the low-temperature area A2 of the heat dissipation base 10 and is an entity with high porosity. . The surface porous layer (30, 40) may be distributed on the first surface 11, the second surface 12, or both surfaces. The surface porous layer (30, 40) is made of copper, copper alloy, aluminum alloy, graphite, or silver.
如圖1所示，具體的說，其中表面多孔層30分佈於散熱基底10的第二表面12，並且覆蓋該些鰭片20以外的70%表面積。此外，本實施例的散熱基底10的第一表面11也有表面多孔層40。其中表面多孔層40在第一表面11且覆蓋熱源9正投影以外至少20%的表面積。再者，表面多孔層(30、40)的孔隙率須大於鰭片20的孔隙率。進一步說，表面多孔層(30、40)的孔隙率可以是大於20%，甚至到70%。較佳的，其中表面多孔層(30、40)的孔隙率大於40%。另外，表面多孔層(30、40)的厚度(或稱高度)較佳低於1.2公厘(mm)，上述結構的優點在於，形成更能產生氣泡的成核點。 As shown in FIG. 1 , specifically, the surface porous layer 30 is distributed on the second surface 12 of the heat dissipation substrate 10 and covers 70% of the surface area other than the fins 20 . In addition, the first surface 11 of the heat dissipation substrate 10 of this embodiment also has a surface porous layer 40 . The surface porous layer 40 is on the first surface 11 and covers at least 20% of the surface area outside the orthographic projection of the heat source 9 . Furthermore, the porosity of the surface porous layer (30, 40) must be greater than the porosity of the fins 20. Furthermore, the porosity of the surface porous layer (30, 40) may be greater than 20%, or even 70%. Preferably, the porosity of the surface porous layer (30, 40) is greater than 40%. In addition, the thickness (or height) of the surface porous layer (30, 40) is preferably less than 1.2 millimeters (mm). The advantage of the above structure is that it forms a nucleation point that is more capable of generating bubbles.
本實施例具體舉例說明表面多孔層的製造方法如下，其中表面多孔層(30、40)的製造方式可以是，金屬網、藥水腐蝕、粉末燒結配合造孔劑、藥水沉積、電鍍、氣相沉積、或機械加工。 This embodiment specifically illustrates the manufacturing method of the surface porous layer as follows. The surface porous layer (30, 40) can be manufactured by metal mesh, liquid corrosion, powder sintering with pore-forming agent, liquid deposition, electroplating, and vapor deposition. , or mechanical processing.
其中，表面多孔層(30、40)以藥水腐蝕的製造方法中，其中腐 蝕劑較佳為磷酸系微蝕劑(Micro-Etchant)、硫酸系微蝕劑、或氧化鐵腐蝕劑。 Among them, in the manufacturing method of corroding the surface porous layer (30, 40) with chemical solution, the corrosion The etchant is preferably a phosphoric acid-based micro-etchant, a sulfuric acid-based micro-etchant, or an iron oxide etchant.
其中表面多孔層(30、40)是以粉末燒結而成，其中粉末粒徑的平均粒徑介於30微米至800微米之間。 The surface porous layer (30, 40) is made of powder sintered, and the average particle size of the powder is between 30 microns and 800 microns.
綜上，本實施例的兩相浸沒式複合型散熱裝置100，接觸浸沒在兩相冷卻液中的熱源(發熱元件)，熱源所產生的熱能可以散發至散熱基底10，並將熱能快速傳給散熱基底10上的鰭片20與高孔隙率的表面多孔層(30、40)，並利用兩相冷卻液吸熱氣化將高熱導率的鰭片20與高孔隙率的表面多孔層(30、40)吸收的熱能帶走。 In summary, the two-phase immersed composite heat dissipation device 100 of this embodiment contacts the heat source (heating element) immersed in the two-phase cooling liquid. The heat energy generated by the heat source can be dissipated to the heat dissipation base 10 and the heat energy can be quickly transferred to the heat dissipation base 10 . The fins 20 and the high-porosity surface porous layer (30, 40) on the heat dissipation substrate 10 are used to absorb heat and vaporize the two-phase cooling liquid to combine the high thermal conductivity fins 20 and the high-porosity surface porous layer (30, 40). 40) The absorbed heat energy is taken away.
本發明可以結合兩者的優勢，其中高溫、高瓦數的應用適合利用鰭片的高表面積特性散熱。低溫、低瓦數的應用適合利用多孔表面層的高密度成核點散熱。將鏟型鰭片散布於高瓦區(高溫區域A1)，而多孔表面層散佈於低瓦區(低溫區域A2)，提供一種高效能散熱器。此外，本發明還可以搭配均溫板，將熱平均傳導到多孔表面層，以協助低溫成核。 The present invention can combine the advantages of both, in which high-temperature, high-wattage applications are suitable for utilizing the high surface area characteristics of fins for heat dissipation. Low-temperature, low-wattage applications are suitable for utilizing the high density of nucleation sites in porous surface layers to dissipate heat. The spade-shaped fins are distributed in the high-wattage area (high-temperature area A1), and the porous surface layer is distributed in the low-wattage area (low-temperature area A2), thereby providing a high-efficiency heat sink. In addition, the present invention can also be used with a uniform temperature plate to evenly conduct heat to the porous surface layer to assist low-temperature nucleation.
[第二實施例] [Second Embodiment]
請參閱圖4及圖5所示，其為本發明的第二實施例，本實施例與第一實施例大致相同，其差異說明如下。 Please refer to FIG. 4 and FIG. 5 , which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.
本實施例的兩相浸沒式複合型散熱裝置100a可以應用於多個熱源9的電子裝置(圖略)，以兩個熱源9為例，其正上方設有兩組的散熱鰭片20，兩組的散熱鰭片20是分開的，每一組的散熱鰭片20涵蓋的面積大於熱源9的投影面積。散熱基底10的第一表面11在熱源9的周圍設有表面多孔層40a，兩個熱源9的中間設有表面多孔層40a。第二表面12在兩組的散熱鰭片20的周圍設有表面多孔層30a，兩組的散熱鰭片20的中間也設有表面多孔層30a。表面多孔層30a未延伸到散熱基底10的邊緣。 The two-phase immersed composite heat dissipation device 100a of this embodiment can be applied to electronic devices (not shown) with multiple heat sources 9. Taking two heat sources 9 as an example, two sets of heat dissipation fins 20 are provided directly above them. The sets of heat dissipation fins 20 are separated, and the area covered by each set of heat dissipation fins 20 is larger than the projected area of the heat source 9 . The first surface 11 of the heat dissipation substrate 10 is provided with a surface porous layer 40a around the heat source 9, and a surface porous layer 40a is provided between the two heat sources 9. The second surface 12 is provided with a surface porous layer 30a around the two groups of heat dissipation fins 20, and is also provided with a surface porous layer 30a in the middle of the two groups of heat dissipation fins 20. The surface porous layer 30a does not extend to the edge of the heat dissipation substrate 10.
[實施例的有益效果] [Beneficial effects of the embodiment]
本發明的其中一有益效果在於，本發明所提供的兩相浸沒式複合型散熱裝置，其能透過「複數個鰭片，與該熱源相對，且設置於該散熱基底的該第二表面的該高溫區域內」與「表面多孔層，位於該散熱基底的低溫區域的範圍內」結合而成複合型散熱裝置，其中採用「表面多孔層」的多孔結構配合冷卻液，能夠增加產生氣泡的成核點，同時「散熱鰭片」能提升垂直方向的熱傳導性能，從而得以有效的強化整體浸沒式散熱效果。 One of the beneficial effects of the present invention is that the two-phase immersed composite heat dissipation device provided by the present invention can be opposed to the heat source through a plurality of fins, and is disposed on the second surface of the heat dissipation base. "In the high-temperature region" and "the surface porous layer, located within the low-temperature region of the heat dissipation substrate" are combined to form a composite heat dissipation device. The porous structure of the "surface porous layer" is used in conjunction with the coolant to increase the nucleation of bubbles. At the same time, the "heat dissipation fins" can improve the heat conduction performance in the vertical direction, thereby effectively enhancing the overall immersion heat dissipation effect.
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的申請專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的申請專利範圍內。 The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.
100:散熱裝置 100: Cooling device
10:散熱基底 10:Heat dissipation base
11:第一表面 11: First surface
12:第二表面 12: Second surface
20:鰭片 20:fins
30、40:表面多孔層 30, 40: Surface porous layer
9:熱源 9:Heat source
A1:高溫區域 A1: High temperature area
A2:低溫區域 A2: Low temperature area
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111142489A TWI823668B (en) | 2022-11-08 | 2022-11-08 | Two-phase immersion cooling compound heat-dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111142489A TWI823668B (en) | 2022-11-08 | 2022-11-08 | Two-phase immersion cooling compound heat-dissipating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI823668B true TWI823668B (en) | 2023-11-21 |
| TW202419802A TW202419802A (en) | 2024-05-16 |
Family
ID=89722756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111142489A TWI823668B (en) | 2022-11-08 | 2022-11-08 | Two-phase immersion cooling compound heat-dissipating device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI823668B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1679383A (en) * | 2002-06-28 | 2005-10-05 | 先进能源科技公司 | Heat sink made from longer and shorter graphite sheets |
| TWM630294U (en) * | 2022-03-25 | 2022-08-01 | 邁萪科技股份有限公司 | Heat sink with improved surface structure for liquid immersion cooling heat source |
-
2022
- 2022-11-08 TW TW111142489A patent/TWI823668B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1679383A (en) * | 2002-06-28 | 2005-10-05 | 先进能源科技公司 | Heat sink made from longer and shorter graphite sheets |
| TWM630294U (en) * | 2022-03-25 | 2022-08-01 | 邁萪科技股份有限公司 | Heat sink with improved surface structure for liquid immersion cooling heat source |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202419802A (en) | 2024-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20060208354A1 (en) | Thermal interface structure and process for making the same | |
| TWM627557U (en) | Immersion-cooled porous heat-dissipation substrate structure | |
| US20240244797A1 (en) | Two-phase immersion-type composite heat dissipation device | |
| TWM631419U (en) | Liquid immersion radiator | |
| JP2005077052A (en) | Flat heat pipe | |
| TWI823668B (en) | Two-phase immersion cooling compound heat-dissipating device | |
| US20240142181A1 (en) | Two-phase immersion-type heat dissipation structure having skived fin with high porosity | |
| US12048119B2 (en) | Immersion-type liquid cooling heat dissipation sink | |
| TWM629671U (en) | Immersion-cooled heat-dissipation structure | |
| TWM624077U (en) | Heat-dissipation device with patterned surface layer for vehicle | |
| TW202411587A (en) | Two-phase immersion-cooling heat-dissipation composite structure having high-porosity solids and high-thermal-conductivity fins | |
| TWI816524B (en) | Two-phase immersion-cooling heat-dissipation structure having skived fin with high porosity | |
| TWI833342B (en) | Two-phase immersion-cooling heat-dissipation structure having porous structure | |
| TWI833500B (en) | Two-phase immersion-cooling type heat-dissipation structure having skived fins with high surface roughness | |
| US20240155808A1 (en) | Two-phase immersion-cooling heat-dissipation composite structure having high-porosity solid structure and high-thermal-conductivity fins | |
| TWI857868B (en) | Immersion boiler | |
| TWI779869B (en) | Immersion-cooled porous heat-dissipation structure | |
| TWI792347B (en) | Two-phase immersion-cooled fin structure | |
| TWI809641B (en) | Immersion-cooling type heat-dissipation plate | |
| CN221807548U (en) | Immersed radiator | |
| TWI817698B (en) | Two-phase immersion-cooling heat-dissipation structure having acute angle notch | |
| TWI813026B (en) | Two-phase immersion-cooled heat-dissipation substrate | |
| TWI822512B (en) | Two-phase immersion-cooling heat-dissipation structure with shortened evacuation route for vapor bubbles | |
| TWI807635B (en) | Immersion-cooling type heat-dissipation structure | |
| TWI819807B (en) | Two-phase immersion-cooling heat-dissipation structure having fins for facilitating bubble generation |