TWI822512B - Two-phase immersion-cooling heat-dissipation structure with shortened evacuation route for vapor bubbles - Google Patents

Abstract

A two-phase immersion-cooling heat-dissipation structure with shortened evacuation route for vapor bubbles is provided. The structure includes an immersion-cooling substrate and a plurality of immersion-cooling fins. The immersion-cooling substrate has opposite first and second surfaces. The second surface is used for contacting the heat source immersed in the two-phase coolant, and the first surface is connected with the immersion-cooling fins. The immersion-cooling fins include at least one skived fin which is integrally formed on the first surface of the immersion-cooling substrate by skiving. The immersion-cooling fins further include at least one functional fin. The functional fin is a single continuous fin whose length extending in an evacuation direction. The functional fin has a central portion corresponding in position to the heat source, and upper and lower end portions respectively away from the heat source, and the height of the central portion is greater than that of the upper and lower end portions.

Description

Two-phase immersion cooling heat dissipation structure with shortened bubble discharge path

The present invention relates to a heat dissipation structure, specifically to a two-phase immersed cooling heat dissipation structure with a shortened bubble discharge path.

Two-phase immersion-cooling technology directly immerses heat sources (such as server motherboards, disk arrays, etc.) in non-conductive two-phase coolant to penetrate The two-phase coolant absorbs heat and boils away the heat energy generated by the operation of the heat source. However, how to dissipate heat more effectively through two-phase immersion cooling technology has always been a problem that the industry needs to solve.

In view of this, the inventor has been engaged in the development and design of related products for many years. He felt that the above deficiencies could be improved, so he devoted himself to research and applied academic theories, and finally proposed an invention that is reasonably designed and effectively improves the above deficiencies.

The technical problem to be solved by the present invention is to provide a two-phase immersed cooling and heat dissipation structure with a shortened bubble discharge path in view of the shortcomings of the existing technology.

An embodiment of the present invention discloses a two-phase immersed cooling and heat dissipation structure with a shortened bubble discharge path. It has an immersed base and a plurality of immersed fins. The immersed base has opposite first surfaces and A second surface. The second surface of the immersed base is used to make contact with a heat source immersed in the two-phase cooling liquid. A plurality of the immersed fins are connected to the first surface of the immersed base, and a plurality of The immersed fins include at least one scraped fin integrally formed on the first surface of the immersed base in a scraping molding manner, and a plurality of the immersed fins further include at least one functional Fins, the functional fins are single continuous fins extending along the bubble discharge direction, the functional fins have a central portion corresponding to the position of the heat source, and upper end portions that are respectively far away from the position of the heat source. and the lower end portion, and the height of the central portion of the functional fin is greater than at least one of the height of the upper end portion and the height of the lower end portion of the functional fin.

In a preferred embodiment, the thickness of any one of the submersed fins is between 0.1 and 0.35 mm, the height of any one of the submersed fins is between 5 and 10 mm, and any two of the submersible fins are between 0.1 and 0.35 mm. The distance between fins is between 0.1~0.35mm.

In a preferred embodiment, the distance between at least two of the immersed fins is different from the distance between the other two of the immersed fins.

In a preferred embodiment, the immersed fins are made of copper or copper alloy.

In a preferred embodiment, the surface roughness Ra of the immersed fin is >1.5 μm.

In a preferred embodiment, the upper end of the functional fin forms an upper slope that gradually decreases in height from bottom to top, and the lower end of the functional fin forms a lower slope that gradually decreases in height from top to bottom.

In a preferred embodiment, the two-phase immersed cooling heat dissipation structure with shortened bubble discharge path further includes: a reinforced outer frame, which is combined to the immersed base and surrounds a plurality of the immersed fins. at least part of.

In a preferred embodiment, at least one of the immersed base and the reinforced outer frame is formed with a plurality of through holes, and a plurality of spring screws pass through the plurality of through holes.

In a preferred embodiment, the two-phase immersed cooling heat dissipation structure with shortened bubble discharge path further includes: a high thermal conductivity structure, which is combined to the second surface of the immersed substrate to make the immersed substrate The method is to form indirect contact with the heat source through the highly thermally conductive structure. A vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

The following is a description of the relevant implementation modes disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. In addition, the same or similar parts in the drawings are labeled with the same reference numerals. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Please refer to FIGS. 1 to 3 , which are the first embodiment of the present invention. The embodiment of the present invention provides a two-phase immersed cooling heat dissipation structure with a shortened bubble discharge path for contact immersion in two-phase cooling liquid. heat source. As shown in the figure, a two-phase immersed cooling heat dissipation structure with a shortened bubble discharge path provided according to an embodiment of the present invention includes an immersed base 10 and a plurality of immersed fins 20 .

In this embodiment, the immersed substrate 10 can be made of a material with high thermal conductivity, such as aluminum, copper or alloys thereof. The immersed substrate 10 may be a non-porous heat dissipation material or a porous heat dissipation material. Preferably, the immersed substrate 10 can be a porous metal heat dissipation plate immersed in a two-phase cooling liquid 900 (such as a non-conductive electronic fluoride liquid) with a porosity greater than 8%, which can facilitate the generation of bubbles and increase the two-phase cooling liquid. Phase immersion cooling effect.

In this embodiment, the immersed substrate 10 has a first surface 101 and a second surface 102 opposite to each other. The second surface 102 of the immersed substrate 10 is used to form contact with the heat source 800 immersed in the two-phase cooling liquid 900. This contact may be direct contact or indirect contact through an intermediary layer.

The first surface 101 of the immersed base 10 is connected to a plurality of immersed fins 20 , and the plurality of immersed fins 20 include at least one integrally formed on the first surface 101 of the immersed base 10 by scraping. Skived-fin 20a. Preferably, each immersed fin 20 can be a scraper fin 20a, which can obtain a larger surface area to absorb heat and form nucleate boiling (nucleate boiling) through extremely high-density arrangement of scraper fins. Increase the effect of two-phase immersion cooling.

Moreover, the plurality of immersed fins 20 also include at least one functional fin 20b (functional fin), and the functional fin 20b is a single continuous fin whose length extends along the bubble discharge direction D, where the bubble discharge direction D It is the direction from bottom to top, which can also be said to be the direction opposite to the direction of gravity. After the bubbles are detached from the functional fins 20b, they will escape along the bubble discharge direction D. Preferably, each immersed fin 20 can be a functional fin 20b. Preferably, each immersed fin 20 may be a scraper fin 20a and a functional fin 20b.

Furthermore, the functional fin 20b has a central portion 201 corresponding to the position of the heat source 800, and an upper end portion 202 and a lower end portion 203 respectively upward and downward away from the position of the heat source 800. Furthermore, the height of the central portion 201 of the functional fin 20b is greater than the height of the upper end portion 202 or the lower end portion 203 of the functional fin 20b. In this embodiment, the height of the central part 201 refers to the horizontal straight line distance from the first surface 101 to the highest point of the central part 201, and the height of the upper end part 202 refers to the horizontal straight line distance from the first surface 101 to the highest point of the upper end part 202. , the height of the lower end 203 refers to the horizontal straight line distance from the first surface 101 to the highest point of the lower end 203 .

Since the heat source 800 is immersed in the two-phase coolant 900 for boiling heat transfer, excess bubbles generated near the heat source 800 will be squeezed upward and downward. If the upward and downward bubble discharge paths are long, the bubble discharge efficiency will be deteriorated. Therefore, In this embodiment, the height of the central portion 201 of the functional fin 20b is greater than the height of the upper end 202 and/or the lower end 203 of the functional fin 20b, so that the bubble discharge path in the upper end 202 area and the lower end 203 area is improved. (As shown in Figure 3) The variable shortening results in better bubble discharge efficiency, which can effectively increase the effect of two-phase immersion cooling.

The surface roughness Ra of the immersed fin 20 in this embodiment is >1.5 μm. The thickness T of the immersed fin 20 is between 0.1 mm and 0.35 mm. The thickness T here refers to the center thickness of a single fin. The distance G between any two immersed fins 20 is between 0.1mm~0.35mm. The distance G here refers to the shortest distance between the side of the immersed fin 20 and the side of the adjacent immersed fin 20, and the immersed fin The distance G between the side surfaces of the fins 20 and the side surfaces of adjacent immersed fins 20 forms a bubble discharge channel for air bubbles to be discharged, and the distance G between at least two immersed fins 20 and the other two immersed fins 20 The distance between them is different. The height H of any immersed fin 20 is between 5 mm and 10 mm. The height H here refers to the horizontal straight line distance from the first surface 101 to the highest point of the immersed fin 20 .

[Second Embodiment]

Please refer to FIG. 4 and FIG. 5 , which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, the upper end 202 of the functional fin 20b in the immersed fin 20 forms an upper slope 2021 that gradually decreases in height from bottom to top, and the lower end 203 of the functional fin 20b forms an upper slope 2021 that gradually decreases in height from top to bottom. The gradually lower lower slope 2031, that is, the upper end 202 and the lower end 203 respectively form an upper slope 2021 and a lower slope 2031 with gradually lower heights in the up and down direction away from the heat source 800. Therefore, in this embodiment, in addition to the The height of the central part 201 is greater than the average height of the upper end 202 and the lower end 203 of the functional fins 20b, and an upper slope 2021 and a lower slope 2031 are formed through the functional fins 20b, so that the upper end 202 area and the lower end The bubble discharge path in the area 203 (as shown in FIG. 5 ) can be shortened, resulting in better bubble discharge efficiency, thereby more effectively increasing the effect of two-phase immersion cooling.

[Third Embodiment]

Please refer to Figure 6, which is a third embodiment of the present invention. This embodiment is substantially the same as the first and second embodiments, and the differences are explained as follows.

In this embodiment, the immersed base 10 is also combined with a reinforced outer frame 30 that surrounds at least part of the plurality of immersed fins 20 to enhance the overall structural strength and avoid problems and damage caused by warping. The reinforced outer frame 30 may be made of aluminum alloy or stainless steel. Furthermore, the reinforced outer frame 30 may be bonded to the immersed base 10 by means of press fit, welding, friction stir welding (FSW), gluing, or diffusion bonding.

[Fourth Embodiment]

Please refer to FIG. 7 , which is a fourth embodiment of the present invention. This embodiment is substantially the same as the first, second and third embodiments, and the differences are explained as follows.

In this embodiment, a plurality of through holes 15 can be formed on both sides of the immersed base 10 or both sides of the reinforced outer frame 30, and a plurality of spring screws 25 can pass through the plurality of through holes 15 to better fix it. Motherboard with heat source 800.

[Fifth Embodiment]

Please refer to FIG. 8 , which is a fifth embodiment of the present invention. This embodiment is substantially the same as the first and second embodiments, and the differences are explained as follows.

In this embodiment, a high thermal conductivity structure 40 is further included. Furthermore, the high thermal conductivity structure 40 is coupled to the second surface 102 of the immersed substrate 10 so that the immersed substrate 10 forms indirect contact with the heat source 800 immersed in the two-phase cooling liquid through the high thermal conductivity structure 40 . In detail, the high thermal conductivity structure 40 may be bonded to the second surface 102 of the immersed substrate 10 through welding, friction stir welding, gluing, or diffusion bonding. In other embodiments, the immersed substrate 10 may be integrally formed with the high thermal conductivity structure 40 .

Furthermore, a vacuum sealed cavity 401 is formed inside the high thermal conductivity structure 40, and the top wall and bottom wall of the vacuum sealed cavity 401 can also be formed with sintered bodies, and the vacuum sealed cavity 401 contains an appropriate amount of liquid, and the liquid Can be water or acetone. Moreover, the other side of the high thermal conductivity structure 40 can be used to contact the heat source 800 immersed in the two-phase cooling liquid, so that the heat source 800 immersed in the two-phase cooling liquid can not only absorb heat and boil away the heat source 800 to generate The thermal energy can also contact and absorb the thermal energy generated by the heat source 800 through the high thermal conductivity structure 40, causing the liquid in the vacuum sealed chamber 401 to vaporize and evaporate into steam, which is distributed to the immersed substrate 10 and quickly transfers the heat energy to the immersed substrate 10. The substrate 10 is integrally formed with scraped fins arranged at an extremely high density, and the two-phase coolant is used to absorb heat and boil to take away the heat energy absorbed by the scraped fins, while the steam in the vacuum sealed cavity 401 surrenders the heat energy and After condensation on the top wall of the cavity, it flows back to the bottom wall of the cavity. Such a high-speed loop can quickly dissipate the heat energy generated by the heat source 800, thus enhancing the effect of two-phase immersion cooling.

Based on the above, the present invention provides a two-phase immersed cooling and heat dissipation structure with a shortened bubble discharge path, which can at least be achieved by "the immersed base has an opposite first surface and a second surface, and the second surface of the immersed base The surface is used to make contact with the heat source immersed in the two-phase coolant. The first surface of the immersed base is connected with a plurality of immersed fins. The plurality of immersed fins include at least one integrally formed by scraping. "Scaved fins on the first surface of the immersed base", "The plurality of immersed fins include at least one functional fin", "The functional fin is a single continuous fin whose length extends along the bubble discharge direction. ”, “The functional fin has a central part corresponding to the position of the heat source, and an upper end part and a lower end part far away from the heat source position respectively. The height of the central part of the functional fin is greater than the height and lower end of the upper end part of the functional fin. The overall technical solution of "at least one of the height of the part" can effectively enhance the effect of the overall two-phase immersion cooling.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10:Immersed base

101: First surface

102: Second surface

15:Perforation

20: Submersible fins

20a: Shoved fins

20b: Functional fins

201:Central Department

202:Upper end

2021: Upper slope

203:Lower end

2031: Lower slope

25:Spring screw

30: Strengthen the frame

40: High thermal conductivity structure

401: Vacuum sealed chamber

H: height

T:Thickness

G: spacing

D: Bubble discharge direction

800:Heat source

900: Two-phase coolant

Figure 1 is a schematic side view of the first embodiment of the present invention.

Figure 2 is a schematic front view of the first embodiment of the present invention.

Figure 3 is a schematic diagram of a bubble discharge path according to the first embodiment of the present invention.

Figure 4 is a schematic side view of the second embodiment of the present invention.

Figure 5 is a schematic diagram of a bubble discharge path according to the second embodiment of the present invention.

Figure 6 is a schematic side view of the third embodiment of the present invention.

Figure 7 is a schematic side view of the fourth embodiment of the present invention.

Figure 8 is a schematic side view of the fifth embodiment of the present invention.

10:Immersed base

101: First surface

102: Second surface

20: Submersible fins

201:Central Department

202:Upper end

203:Lower end

H: height

D: Bubble discharge direction

800:Heat source

900: Two-phase coolant

Claims (8)

A two-phase immersed cooling and heat dissipation structure with a shortened bubble discharge path, which has an immersed base and a plurality of immersed fins. The immersed base has a first surface and a second surface that are opposite to each other. The second surface of the immersed base is used to form contact with the heat source immersed in the two-phase cooling liquid. The first surface of the immersed base is connected with a plurality of the immersed fins, and the plurality of immersed fins It includes at least one scraped fin integrally formed on the first surface of the immersed base in a scraping molding manner, and a plurality of the immersed fins also includes at least one functional fin, and the function The functional fin is a single continuous fin whose length extends along the bubble discharge direction. The functional fin has a central part corresponding to the position of the heat source, and an upper end part and a lower end part respectively far away from the position of the heat source. The height of the central part of the functional fin is greater than at least one of the height of the upper end part and the height of the lower end part of the functional fin; wherein, the upper end part of the functional fin forms a shape that gradually decreases in height from bottom to top. An upper slope, the lower end of the functional fin forms a lower slope whose height gradually decreases from top to bottom. The two-phase immersed cooling heat dissipation structure with shortened bubble discharge path as described in claim 1, wherein the thickness of any one of the immersed fins is between 0.1~0.35mm, and the thickness of any one of the immersed fins is The height is between 5~10mm, and the distance between any two immersed fins is between 0.1~0.35mm. The two-phase immersed cooling and heat dissipation structure with shortened bubble discharge path as described in claim 2, wherein the distance between at least two of the immersed fins is different from the distance between the other two of the immersed fins. The two-phase immersed cooling heat dissipation structure with shortened bubble discharge path as described in claim 1, wherein the immersed fins are made of one of copper or copper alloy. The two-phase immersed cooling heat dissipation structure with shortened bubble discharge path as described in claim 1, wherein the surface roughness of the immersed fin is Ra>1.5 μm. The two-phase immersed cooling heat dissipation structure with shortened bubble discharge path as claimed in claim 1, further comprising: a reinforced outer frame, which is coupled to the immersed base and surrounds at least one of the plurality of immersed fins. part. The two-phase immersed cooling and heat dissipation structure with shortened bubble discharge path as described in claim 6, wherein at least one of the immersed base and the reinforced outer frame is formed with a plurality of through holes and a plurality of spring screws Correspondingly pass through a plurality of the perforations. The two-phase immersed cooling heat dissipation structure with shortened bubble discharge path as described in claim 1 further includes: a high thermal conductivity structure, which is combined to the second surface of the immersed substrate so that the immersed substrate is permeable The highly thermally conductive structure is in indirect contact with the heat source, a vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid.

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