TWI816444B - Immersion-cooling heat-dissipation structure with high density fins - Google Patents

Abstract

An immersion-cooling heat-dissipation structure with high density fins is provided. The heat-dissipation structure includes a heat-dissipation substrate and a plurality of sheet-shaped fins. The thickness of the heat-dissipation substrate ranges from 2 to 6 mm. The bottom surface of the heat-dissipating substrate is configured to contact the heat-generating element being immersed in the two-phase coolant. The sheet-shaped fins are integrally formed on the surface of the heat-dissipation substrate and arranged in high density. The length of each sheet-shaped fin ranges from 60 to 120 mm. The width of each sheet-shaped fin ranges from 0.1 to 0.5 mm. The height of each sheet-shaped fin ranges from 3 to 10 mm, and the spacing between any two adjacent ones of the sheet-shaped fins ranges from 0.1 to 0.5 mm. The first predetermined ratio of the spacing to the width is determined to be between 0.5:1 and 2:1. The second predetermined ratio of the height to the width is determined to be between 6:1 and 50:1. The third predetermined ratio of the height to the spacing is determined to be between 6:1 and 50:1. The sheet-shaped fins are arranged to form an array, and the width of the array ranges from 50 to 80 mm.

Description

Submersible cooling structure with high-density cooling fins

The present invention relates to a heat dissipation structure, specifically to an immersed heat dissipation structure with high-density heat dissipation fins.

Immersion cooling technology directly immerses heating components (such as servers, disk arrays, etc.) in non-conductive cooling liquid, so that the cooling liquid absorbs heat and vaporizes to take away the heat energy generated by the operation of the heating components. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.

In view of this, the inventor has been engaged in the development and design of related products for many years. He felt that the above deficiencies could be improved, so he devoted himself to research and applied academic theories, and finally proposed an invention that is reasonably designed and effectively improves the above deficiencies.

The technical problem to be solved by the present invention is to provide an immersed heat dissipation structure with high-density heat dissipation fins in view of the shortcomings of the existing technology.

Embodiments of the present invention provide an immersed heat dissipation structure with high-density heat dissipation fins, including a heat dissipation base and a plurality of sheet-like heat dissipation fins. The thickness of the heat dissipation base is 2 to 6 mm. The bottom surface of the heat dissipation base can For contacting the heating element immersed in the two-phase cooling liquid, a plurality of the sheet-like heat dissipation fins are integrally formed on the surface of the heat dissipation base and arranged in a high density, and the length of each sheet-like heat dissipation fin is 60 to 120 mm, the width is 0.1 to 0.5 mm, the height is 3 to 10 mm, and the spacing between any two side-by-side sheet-like heat dissipation fins is 0.1 to 0.5 mm, and the spacing is consistent with the The first predetermined ratio formed by the width is between 0.5:1 and 2:1, the second predetermined ratio formed by the height and the width is between 6:1 and 50:1, the height and The third predetermined ratio formed by the spacing is between 6:1 and 50:1, and the plurality of sheet-shaped heat dissipation fins are arranged to form an arrangement width, and the arrangement width is between 50 and 80 mm.

In a preferred embodiment, a plurality of the sheet-shaped heat dissipation fins and the heat dissipation base are immersed in a tank containing the two-phase cooling liquid, and the two-phase cooling liquid is a low boiling point fluorinated Electronic engineering fluid, and the boiling point of the two-phase coolant is 35 degrees Celsius to 60 degrees Celsius.

In a preferred embodiment, the heat dissipation base is made of one of copper, copper alloy, and aluminum alloy.

In a preferred embodiment, the immersed heat dissipation structure with high-density heat dissipation fins further includes a surface thin layer formed on the surface of the heat dissipation base and the surface of the plurality of sheet-like heat dissipation fins. At least one of them.

In a preferred embodiment, the surface thin layer is one of a surface plating layer and a surface coating, and is made of one of nickel, titanium, and stainless steel.

In a preferred embodiment, the heat dissipation base is formed with a plurality of vertical through holes vertically penetrating the heat dissipation base.

In a preferred embodiment, the plurality of sheet-like heat dissipation fins are integrally formed on the surface of the heat dissipation base and then undergo secondary processing to remove at least part of the plurality of sheet-like heat dissipation fins, thereby At least part of the plurality of sheet-like heat dissipation fins is made to have unequal heights, or the plurality of the plurality of sheet-like heat dissipation fins on at least one area of the surface of the heat dissipation base is completely removed.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

The following is a description of the relevant implementation modes disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Please refer to FIGS. 1 to 3 , which are one embodiment of the present invention. The embodiment of the present invention provides an immersed heat dissipation structure with high-density heat dissipation fins, which can be used to contact heat-generating devices immersed in a two-phase cooling liquid. Element 900. As shown in the figure, the immersed heat dissipation structure with high-density heat dissipation fins provided according to the embodiment of the present invention basically includes a heat dissipation base 10 and a plurality of sheet-like heat dissipation fins 20, and the plurality of sheet-like heat dissipation fins The sheet 20 and the heat dissipation substrate 10 may be immersed in a tank 700 filled with two-phase cooling liquid 800. Furthermore, the two-phase cooling liquid 800 in this embodiment is a low-boiling point fluorinated electronic engineering liquid, and the boiling point of the two-phase cooling liquid 800 is between 35 degrees Celsius and 60 degrees Celsius.

In this embodiment, the heat dissipation substrate 10 may be made of copper, copper alloy, or aluminum alloy. A plurality of sheet-shaped heat dissipation fins 20 are integrally formed on the surface of the heat dissipation base 10 . That is to say, the surface of the heat dissipation base 10 in this embodiment is integrally formed with a plurality of sheet-like heat dissipation fins 20 arranged at an extremely high density, so that they are made of the same material as the heat dissipation base 10 .

In addition, the bottom surface of the heat dissipation substrate 10 can be used to contact the heating element 900 immersed in the two-phase cooling liquid 800, so that the heating element 900 immersed in the two-phase cooling liquid 800 can absorb heat and vaporize through the two-phase cooling liquid 800. The heat energy generated by the heating element 900 can be transferred through the heat dissipation base 10 to contact and absorb the heat energy generated by the heating element 900, and the heat energy can be quickly transferred to the multiple sheet-like heat dissipation fins that are integrally formed on the surface of the heat dissipation base 10 and arranged in an extremely high density. 20, and utilizes the heat absorption and vaporization of the two-phase coolant 800 to take away the heat energy absorbed by the multiple sheet-shaped heat dissipation fins 20, thereby enhancing the overall immersion heat dissipation effect.

In order to truly improve the overall immersed heat dissipation effect, after testing, the thickness T of the heat dissipation base 10 should be between 2 and 6 mm, the length L of the sheet heat dissipation fins should be between 60 and 120 mm, and the width W should be between 0.1 and 120 mm. 0.5 mm, the height H should be between 3 and 10 mm, and the distance D between any two side-by-side fins should be between 0.1 and 0.5 mm.

Following the above, in order to further improve the overall immersion heat dissipation effect, through continuous testing, the above-mentioned first predetermined ratio (D:W) formed by the distance D and the width W is between 0.5 :1 to 2:1, a second predetermined ratio (H:W) formed by the above-mentioned height H and width W is between 6:1 to 50:1, the above-mentioned height H and width W The distance D forms a third predetermined ratio (H:D) between 6:1 and 50:1, and the sheet-like heat dissipation fins 20 are arranged along the width direction perpendicular to the length direction thereof. , the plurality of sheet-like heat dissipation fins 20 are arranged to form an arrangement width W1, and the arrangement width W1 is between 50 and 80 mm.

[Second Embodiment]

Please refer to FIG. 4 , which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the immersed heat dissipation structure with high-density heat dissipation fins may further include a surface thin layer 30 . The surface thin layer 30 may be formed on the surface of the heat dissipation substrate 10 , the surface of the sheet-like heat dissipation fins 20 , or both. The surface thin layer 30 may be a surface plating or surface coating, and may be made of metals such as nickel, titanium, stainless steel, etc. This can increase the amount of bubbles generated to further enhance the immersion heat dissipation effect.

[Third Embodiment]

Please refer to FIG. 5 , which is a third embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, the heat dissipation base 10 can be formed with a plurality of vertical through holes 101 vertically penetrating the heat dissipation base 10 , which can not only be used for screws to be fastened, but also can be used for air bubbles to pass through. Furthermore, the vertical through holes 101 may be located at the corners of the heat dissipation substrate 10 , and the number of the vertical through holes 101 may be four or more.

[Fourth Embodiment]

Please refer to FIG. 6 , which is a fourth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the plurality of flaky heat dissipation fins 20 are integrally formed on the surface of the heat dissipation base 10 and then undergo secondary processing, such as mechanical processing or chemical processing, so that at least part of the plurality of flaky heat dissipation fins 20 is formed. Remove, so that at least part of the plurality of flake heat dissipation fins 20 is of unequal height, or so that the plurality of flake heat dissipation fins 20 on at least one area of the surface of the heat dissipation substrate 10 are completely removed.

Based on the above, the invention provides an immersed heat dissipation structure with high-density heat dissipation fins, which can at least pass through "the thickness of the heat dissipation base is 2 to 6 mm" and "the bottom surface of the heat dissipation base can be used for contact Heating elements immersed in two-phase cooling liquid", "A plurality of the sheet-like heat dissipation fins are integrally formed on the surface of the heat dissipation base and arranged in a high density", "Each of the sheet-like heat dissipation fins The length is 60 to 120 mm, the width is 0.1 to 0.5 mm, the height is 3 to 10 mm, and the spacing between any two side-by-side sheet heat dissipation fins is 0.1 to 0.5 mm." "The spacing is between "The first predetermined ratio formed by the width is between 0.5:1 and 2:1", "The second predetermined ratio formed by the height and the width is between 6:1 and 50:1" , "The third predetermined ratio formed by the height and the spacing is between 6:1 and 50:1." "A plurality of the sheet-like heat dissipation fins are arranged to form an arrangement width, and the arrangement width is The technical solution between 50 and 80 mm can effectively enhance the overall immersion heat dissipation effect.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10:Heat dissipation base

101: Vertical through hole

20: Flake cooling fins

30:Surface thin layer

T:Thickness

L: length

H: height

W: Width

D: spacing

W1: Arrangement width

900: Heating element

800: Two-phase coolant

700: Tank body

Figure 1 shows a schematic side view of the structure of the first embodiment of the present invention.

FIG. 2 shows an enlarged schematic structural view of part II in FIG. 1 .

Figure 3 shows a schematic structural top view of the first embodiment of the present invention.

Figure 4 shows a schematic diagram of a second embodiment of the present invention.

Figure 5 shows a schematic three-dimensional view of the third embodiment of the present invention.

Figure 6 shows a schematic perspective view of the fourth embodiment of the present invention.

10:Heat dissipation base

20: Flake cooling fins

T:Thickness

900: Heating element

800: Two-phase coolant

700: Tank body

Claims (6)

An immersed heat dissipation structure with high-density heat dissipation fins, including a heat dissipation base and a plurality of sheet-like heat dissipation fins. The thickness of the heat dissipation base is 2 to 6 mm. The bottom surface of the heat dissipation base can be used for contact and immersion. For a heating element in a two-phase coolant, a plurality of the sheet-like heat dissipation fins are integrally formed on the surface of the heat dissipation base and arranged at a high density. The length of each of the sheet-like heat dissipation fins is 60 to 120 mm. , the width is 0.1 to 0.5 mm, the height is 3 to 10 mm, and the spacing between any two side-by-side sheet-like heat dissipation fins is 0.1 to 0.5 mm, and the spacing and the width form the first The predetermined ratio is between 0.5:1 and 2:1, and the second predetermined ratio formed by the height and the width is between 6:1 and 50:1, and the height and the spacing are formed by The third predetermined ratio is between 6:1 and 50:1, and a plurality of the sheet-shaped heat dissipation fins are arranged to form an arrangement width, and the arrangement width is between 50 and 80 mm; wherein, the heat dissipation fins are The base is made of one of copper, copper alloy, and aluminum alloy. The immersed heat dissipation structure with high-density heat dissipation fins as claimed in claim 1, wherein a plurality of the sheet-like heat dissipation fins and the heat dissipation base are immersed in a tank containing the two-phase cooling liquid. , the two-phase cooling liquid is a low-boiling fluorinated electronic engineering liquid, and the boiling point of the two-phase cooling liquid is 35 degrees Celsius to 60 degrees Celsius. The immersed heat dissipation structure with high-density heat dissipation fins as described in claim 1 further includes a surface thin layer formed on the surface of the heat dissipation base and the surface of a plurality of sheet-like heat dissipation fins. At least one of. The immersed heat dissipation structure with high-density heat dissipation fins as described in claim 3, wherein the surface thin layer is one of a surface plating layer and a surface coating, and is made of Made of one of nickel, titanium, and stainless steel. The immersed heat dissipation structure with high-density heat dissipation fins as claimed in claim 1, wherein the heat dissipation base is formed with a plurality of vertical through holes vertically penetrating the heat dissipation base. The immersed heat dissipation structure with high-density heat dissipation fins as described in claim 1, wherein a plurality of the sheet-like heat dissipation fins are integrally formed on the surface of the heat dissipation base and then undergo secondary processing to form a plurality of them. At least a part of the sheet-like heat dissipation fins is removed, so that at least a part of the plurality of sheet-like heat dissipation fins are of different heights, or the plurality of the plurality of said sheet-like heat dissipation fins on at least one area of the surface of the heat dissipation base are removed. The fins are completely removed.

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