TWI797871B - Two-phase immersion-type heat-dissipation substrate structure - Google Patents

Abstract

A two-phase immersion-type heat-dissipation substrate structure is provided. The two-phase immersion-type heat-dissipation substrate structure includes an immersion-type heat-dissipation substrate and a fin group. The immersion-type heat-dissipation substrate has a front surface and a back surface opposite to the front surface. The back surface of the immersion-type heat-dissipation substrate is configured to contact a heat-generating element, and the front surface of the immersion-type heat-dissipation substrate is formed with the fin group. The fin group includes a plurality of fins perpendicular to the front surface of the immersion-type heat-dissipation substrate, and the front and the back surfaces of the immersion-type heat-dissipation substrate are not arranged in parallel, so that a direction of extension of each fin is neither perpendicular nor parallel to a direction in which the bubbles escape.

Description

Two-phase immersion heat dissipation substrate structure

The invention relates to a heat dissipation substrate structure, in particular to a two-phase submerged heat dissipation substrate structure.

The immersion cooling technology is to immerse the heating element (such as server, disk array, etc.) directly in the non-conductive cooling liquid, so as to take away the heat energy generated by the heating element through the heat absorption and vaporization of the cooling liquid. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem to be solved in the industry.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a two-phase submerged heat dissipation substrate structure for the deficiencies of the prior art.

An embodiment of the present invention provides a two-phase immersion heat dissipation substrate structure for contacting with heating elements, comprising: an immersion heat dissipation substrate and a fin group; the immersion heat dissipation substrate has a front surface and a surface opposite to the front surface The back side of the immersion heat dissipation base is used to contact the heating element, the front side of the immersion heat dissipation base is formed with the fin group, and the fin group includes a plurality of fins perpendicular to the The front side of the submerged heat dissipation base, and the front side of the submerged heat dissipation base is not parallel to the back side of the submerged heat dissipation base, so that the extending direction of each fin is neither perpendicular nor parallel.

In a preferred embodiment, the immersion heat dissipation base is made of one of aluminum, copper, aluminum alloy, and copper alloy.

In a preferred embodiment, each of the fins is integrally formed vertically on the front surface of the submerged heat dissipation base by metal injection molding.

In a preferred embodiment, each of the fins is a porous metal cooling fin submerged in a two-phase cooling fluid with a porosity greater than 7%.

In a preferred embodiment, the angle formed by the front surface of the immersion heat dissipation substrate and the back surface of the immersion heat dissipation substrate is set to be between 10 degrees and 20 degrees.

The embodiment of the present invention also provides a two-phase immersion heat dissipation substrate structure, which is used to contact the heating element, including: an immersion heat dissipation base, a first fin group and a second fin group; the immersion heat dissipation The substrate has a front surface and a back surface opposite to the front surface, the back surface of the immersion heat dissipation substrate is used to contact the heating element, the front surface of the immersion heat dissipation substrate is formed with the first fin group and the The second set of fins, the first set of fins and the second set of fins are sequentially arranged on the front side of the submerged heat dissipation base along the air bubble escape direction, and the first set of fins includes a plurality of A first fin is perpendicular to the front of the immersion heat dissipation base, and the second fin group includes a plurality of second fins perpendicular to the front of the immersion heat dissipation base, each of the first fins The height of the fins is greater than the fin height of each of the second fins, and the front of the immersion heat dissipation substrate is not parallel to the back of the immersion heat dissipation substrate, so that each of the first fins and the Each of the second fins is neither perpendicular nor parallel to the air bubble dissipation direction.

In a preferred embodiment, the cross-sectional thickness of the submerged heat dissipation base decreases gradually along the air bubble dissipation direction, and the position of the first fin group corresponds to the smaller cross-sectional thickness of the submerged heat dissipation base. In the thicker area, the position of the second fin group corresponds to the thinner area of the immersion heat dissipation base, and the position of the thicker area of the immersion heat dissipation base is used Corresponding to the high temperature area of the heat source of the heating element, the position of the thinner cross-sectional thickness area of the submerged heat dissipation substrate is used to correspond to the high temperature area of the heating element that is not the heat source.

In a preferred embodiment, each of the first fins and each of the second fins are integrally formed vertically on the front surface of the immersion heat dissipation base by metal injection molding.

In a preferred embodiment, each of the first fins and each of the second fins is respectively a holed metal cooling fin submerged in a two-phase cooling liquid with a porosity greater than 7%.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

Please refer to FIG. 1 , which is one embodiment of the present invention. The embodiment of the present invention provides a two-phase immersion heat dissipation structure 700 for contacting a heating element 800 . As shown in FIG. 1 , a two-phase immersion heat dissipation structure 700 provided according to an embodiment of the present invention basically includes an immersion heat dissipation base 10 and a fin set 20 .

In this embodiment, the immersion heat dissipation substrate 10 can be made of high thermal conductivity material, such as aluminum, copper, aluminum alloy or copper alloy. Furthermore, the submerged heat dissipation substrate 10 of this embodiment may be a porous metal heat dissipation substrate submerged in a two-phase cooling liquid 900 (such as an electronic fluorinated liquid) with a porosity greater than 5%, which is used to increase the amount of bubbles generated, To enhance the immersion cooling effect. It should be noted that, FIG. 1 shows the hole structure exaggerated or enlarged, so as to better understand the present invention.

In this embodiment, the submerged heat dissipation substrate 10 has a front surface 11 and a back surface 12 opposite to the front surface 11 . The back surface 12 of the immersion heat dissipation substrate 10 is used for contacting the heating element 800 . Fins 20 are formed on the front surface 11 of the submerged heat dissipation substrate 10 .

Furthermore, the fin set 20 of this embodiment includes a plurality of fins 201 perpendicular to the front surface 11 of the immersion heat dissipation substrate 10 . The fins 201 may be sheet fins, but may also be columnar fins. Moreover, the fins 201 are integrally formed vertically on the front surface 11 of the submerged heat dissipation substrate 10 by metal injection molding and immersed in the two-phase cooling liquid 900 . Moreover, each fin 201 of this embodiment is a perforated metal heat dissipation fin, that is to say, the fin group 20 of this embodiment is composed of a plurality of perforated metal heat dissipation fins. Furthermore, the porosity of the fins 201 in this embodiment is higher than that of the submerged heat dissipation substrate 10 . Furthermore, the fin 201 of this embodiment is a porous metal heat dissipation fin submerged in the two-phase cooling liquid 900 with a porosity greater than 7%, so as to further increase the generation of air bubbles. Moreover, the front side 11 and the back side 12 of the submerged heat dissipation substrate 10 of this embodiment are not parallel, so that the extending direction of each fin 201 is neither perpendicular nor parallel to the air bubble dissipation direction D, thereby reducing air bubbles when a large number of air bubbles are generated. The resistance to upward dissipation increases the replenishment efficiency of the surrounding fluid, thereby improving the overall immersion heat dissipation effect. Moreover, through practical tests, when the angle θ formed by the front surface 11 and the back surface 12 of the submerged heat dissipation substrate 10 is set to be between 10° and 20°, the overall immersion heat dissipation effect is the best.

[Second embodiment]

Please refer to FIG. 2 , which is the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the submerged heat dissipation substrate 10 has a front surface 11 and a back surface 12 opposite to the front surface 11 . The back surface 12 of the immersion heat dissipation substrate 10 is used for contacting the heating element 800 . A first fin set 20 a and a second fin set 20 b are formed on the front surface 11 of the immersion heat dissipation base 10 .

Further speaking, the first fin group 20a and the second fin group 20b in this embodiment are sequentially arranged on the front surface 11 of the submerged heat dissipation substrate 10 along the air bubble escape direction D, it can also be said that the first fin group 20a and the second fin group The second fin group 20b is sequentially arranged on the front surface 11 of the submerged heat dissipation substrate 10 along the direction opposite to the direction of gravity, and the fin height of the plurality of first fins 201a of the first fin group 20a is greater than that of the first fin group 20a. The fin heights of the plurality of second fins 201b of the second fin group 20b, and the front side 11 and the back side 12 of the immersion heat dissipation substrate 10 are not parallel, so that a large number of fins generated in the first fin group 20a and its surrounding area When the air bubbles escape along the air bubble escape direction D (upward), the escape resistance caused by the influence of the second fin set 20b can be greatly reduced.

Furthermore, as shown in FIG. 2 , the cross-sectional thickness of the submerged heat dissipation substrate 10 of the present embodiment gradually decreases along the air bubble dissipation direction D (upward), so that the position of the first fin group 20a corresponds to that of the submerged heat dissipation substrate. 10, the position of the second fin group 20b corresponds to the thinner area of the immersion heat dissipation base 10, and the position of the thicker area of the immersion heat dissipation base 10 corresponds to the heating element 800 predetermined heat source high-temperature region 801, the position of the thinner region of the submerged heat dissipation substrate 10 corresponds to the non-heat source high-temperature region of the heating element 800 (it can also be said that the heat source low-temperature region with relatively low heating temperature), so that the fins The position of the first fin group 20a with a higher height corresponds to the predetermined heat source high temperature area 801 of the heating element 800, and the position of the second fin group 20b with a lower fin height corresponds to the non-heat source high temperature area of the heating element 800 , so that the high heat generated by the heat source high-temperature region 801 of the heating element 800 can be taken away, so as to further enhance the immersion heat dissipation effect.

Based on the above, the two-phase immersion heat dissipation substrate structure provided by the present invention can at least pass through "the immersion heat dissipation substrate has a front surface and a back surface opposite to the front surface", "the immersion heat dissipation substrate has The back side of the immersion heat dissipation base is used to contact the heating element, and the front side of the immersion heat dissipation base is formed with the fin group", "the fin group includes a plurality of fins perpendicular to the front side of the immersion type heat dissipation base , and the front of the immersion heat dissipation base is not parallel to the back of the immersion heat dissipation base, so that the extension direction of each of the fins is neither perpendicular nor parallel to the air bubble dissipation direction", thus It can reduce the resistance of the bubbles to dissipate upward when a large number of bubbles are generated, and increase the replenishment efficiency of the surrounding fluid, thereby improving the overall immersion heat dissipation effect.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

700: two-phase immersion heat dissipation substrate structure 10: immersion heat dissipation substrate 11: front 12: back 20: fin group 201: fin 20a: first fin group 201a: first fin 20b: second fin Group 201b: second fin 800: heating element 801: high temperature zone of heat source 900: two-phase cooling liquid θ : included angle D: direction of bubble escape

FIG. 1 is a schematic side view of a two-phase submerged heat dissipation substrate structure according to a first embodiment of the present invention.

FIG. 2 is a schematic side view of a two-phase submerged heat dissipation substrate structure according to a second embodiment of the present invention.

700: two-phase immersion heat dissipation substrate structure

10: Submerged cooling base

11: front

12: back

20: fin group

201: fins

800: heating element

900: two-phase coolant

θ: included angle

D: Bubble escape direction

Claims (9)

A two-phase immersion heat dissipation substrate structure for contacting heating elements, comprising: an immersion heat dissipation substrate and a fin group; the immersion heat dissipation substrate has a front surface and a back surface opposite to the front surface, the The back side of the immersion heat dissipation base is used to contact the heating element, the front side of the immersion heat dissipation base is formed with the fin group, and the fin group includes a plurality of fins perpendicular to the immersion heat dissipation The front side of the base, and the front side of the immersion heat dissipation base is not parallel to the back side of the immersion heat dissipation base, so that the extension direction of each fin is neither perpendicular nor parallel to the bubble dissipation direction; wherein, the The angle formed by the front surface of the immersion heat dissipation substrate and the back surface of the immersion heat dissipation substrate is set to be between 10 degrees and 20 degrees. The two-phase immersion heat dissipation substrate structure according to claim 1, wherein the immersion heat dissipation substrate is made of one of aluminum, copper, aluminum alloy, and copper alloy. The two-phase immersion heat dissipation substrate structure as claimed in claim 1, wherein each fin is integrally formed vertically on the front surface of the immersion heat dissipation substrate by metal injection molding. The two-phase submerged heat dissipation substrate structure according to claim 3, wherein each of the fins is a porous metal heat dissipation fin submerged in the two-phase cooling liquid with a porosity greater than 7%. A two-phase immersion heat dissipation substrate structure for contacting heating elements, comprising: an immersion heat dissipation base, a first fin group and a second fin group; the immersion heat dissipation base has a front surface and the said front side opposite to the back side, the dip The back side of the submerged heat dissipation base is used to contact the heating element, the front side of the submerged heat dissipation base is formed with the first fin group and the second fin group, the first fin group and the The second fin group is sequentially arranged on the front side of the immersion heat dissipation base along the air bubble dissipation direction, the first fin group includes a plurality of first fins perpendicular to the front side of the immersion heat dissipation base, The second fin group includes a plurality of second fins perpendicular to the front surface of the immersion heat dissipation base, and the fin height of each of the first fins is greater than that of each of the second fins height, and the front side of the immersion heat dissipation substrate is not parallel to the back surface of the immersion heat dissipation substrate, so that each of the first fins and each of the second fins is not in the same direction as the bubble dissipation direction Neither vertical nor parallel. The two-phase immersion heat dissipation substrate structure according to claim 5, wherein, the cross-sectional thickness of the immersion heat dissipation substrate gradually decreases along the air bubble dissipation direction, and the position of the first fin group corresponds to In the region where the sectional thickness of the immersion heat dissipation base is relatively thick, the position of the second fin group corresponds to the region where the sectional thickness of the immersion heat dissipation substrate is relatively thin, and the area of the immersion heat dissipation substrate The position of the area with a thicker cross-sectional thickness is used to correspond to the high-temperature region of the heat source of the heating element, and the position of the area with a thinner cross-sectional thickness of the submerged heat dissipation substrate is used to correspond to the non-heating area of the heating element. The high temperature zone of the heat source. The two-phase immersion heat dissipation substrate structure according to claim 5, wherein the immersion heat dissipation substrate is made of one of aluminum, copper, aluminum alloy, and copper alloy. The two-phase immersion heat dissipation substrate structure according to claim 5, wherein, each of the first fins and each of the second fins is vertically integrally formed on the immersion heat sink by metal injection molding. The front side of the thermal base. The two-phase immersion heat dissipation substrate structure according to claim 5, wherein each of the first fins and each of the second fins is respectively immersed in a two-phase cooling liquid and has a porosity greater than 7 % perforated metal fins.

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