TW202315508A - Two-phase immersion-cooled heat-dissipation substrate - Google Patents

Abstract

A two-phase immersion-cooled heat-dissipation substrate configured to contact a heat-generating element is provided. The two-phase immersion-cooled heat-dissipation substrate includes an immersion-cooled heat-dissipation substrate, at least one first fin group, and at least one second fin group. The at least one first fin group and the at least one second fin group are formed on the top surface of the immersion-cooled heat-dissipation substrate. The position of the at least one first fin group corresponds to the at least one predetermined high-temperature region of the heat-generating element, and the position of the at least one second fin group corresponds to the at least one predetermined low-temperature region of the heat-generating element. The at least one first fin group includes a plurality of first fins, and the at least one second fin group includes a plurality of second fins. The first fins have a higher density of arrangement than the second fins, and the first fins have a higher height than the second fins.

Description

Two-phase immersion cooling substrate

The invention relates to a heat dissipation substrate, in particular to a two-phase submerged heat dissipation substrate.

The immersion cooling technology is to immerse the heating element (such as server, disk array, etc.) directly in the non-conductive cooling liquid, so as to take away the heat energy generated by the heating element through the heat absorption and vaporization of the cooling liquid. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem to be solved in the industry.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a two-phase submerged heat dissipation base material for the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, the present invention provides a two-phase submerged heat dissipation substrate for contacting with heating elements, comprising: a submerged heat dissipation substrate; at least one first fin group; at least one second fin group; Wherein, the submerged heat dissipation base has an upper surface and a lower surface, the lower surface is used for contacting the heating element, and the upper surface is formed with the at least one first fin group and the at least one first fin group. Two fin groups, the position of the at least one first fin group corresponds to the position directly above the high temperature region of at least one heat source of the heating element, and the position of the at least one second fin group corresponds to the position of the heating element Not directly above the high temperature region of the at least one heat source, the at least one first fin group includes a plurality of first fins, the at least one second fin group includes a plurality of second fins, and the at least one second fin group includes a plurality of second fins. The arrangement density of the plurality of first fins is greater than the arrangement density of the plurality of second fins, and the fin height of the plurality of first fins is greater than the fin height of the plurality of second fins.

In a preferred embodiment, the immersion heat dissipation base is made of one of aluminum, copper, aluminum alloy, and copper alloy.

In a preferred embodiment, the submerged heat dissipation substrate is a porous metal heat sink submerged in a two-phase cooling liquid with a porosity greater than 5%.

In a preferred embodiment, the porosity of each of the first fin groups and the porosity of each of the second fin groups are higher than the porosity of the immersion heat dissipation substrate.

In a preferred embodiment, the number of fins in each first fin group is greater than the number of fins in each second fin group.

In a preferred embodiment, each of the first fin groups and each of the second fin groups are integrally formed on the upper surface of the immersion heat dissipation base.

In a preferred embodiment, each of the first fin groups and each of the second fin groups are arranged in a continuous arrangement.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

Please refer to FIG. 1 , which is one embodiment of the present invention. The embodiment of the present invention provides a two-phase immersion heat dissipation substrate 700 for contacting a heating element 800 . As shown in FIG. 1, the two-phase immersion heat dissipation substrate 700 provided according to the embodiment of the present invention basically includes an immersion heat dissipation substrate 10, at least one first fin group 20, and at least one second fin Group 30.

In this embodiment, the immersion heat dissipation substrate 10 can be made of high thermal conductivity materials, such as aluminum, copper or alloys thereof. Furthermore, the immersion heat dissipation substrate 10 of this embodiment may be a porous metal heat sink submerged in the two-phase cooling liquid 900 with a porosity greater than 5%, which is used to increase the generation of air bubbles to enhance the immersion heat dissipation effect. Moreover, the porosity of the submerged heat dissipation substrate 10 of the present embodiment is set to be above 5% and below 50%.

In this embodiment, the immersion heat dissipation substrate 10 has an upper surface 11 and a lower surface 12 opposite to each other. The lower surface 12 of the submerged heat dissipation substrate 10 is used for contacting the heating element 800 . Moreover, a first fin set 20 and two second fin sets 30 are formed on the upper surface 11 of the immersion heat dissipation substrate 10 .

Furthermore, the position of the first fin group 20 in this embodiment is directly above the predetermined heat source high temperature zone 801 corresponding to the heating element 800, and the positions of the two second fin groups 30 are corresponding to the non- Directly above the high temperature zone of the heat source. In this embodiment, the heat source high temperature zone 801 is at the center of the heating element 800, and the non-heat source high temperature zone (it can also be said that the two heat source low temperature zones 802 with relatively low heating temperature) are on both sides of the center of the heating element 800, so that In this embodiment, the position of the first fin group 20 corresponds to the center of the heating element 800 , and the positions of the two second fin groups 30 correspond to two sides of the center of the heating element 800 . Moreover, the first fin group 20 and the two second fin groups 30 are arranged in a continuous arrangement, that is, the two second fin groups 30 are arranged outwardly following the first fin group 20 .

Furthermore, in this embodiment, the first fin set 20 includes a plurality of first fins 201 , and each second fin set 30 includes a plurality of second fins 301 . Moreover, the arrangement density of the plurality of first fins 201 in the first fin group 20 is greater than the arrangement density of the plurality of second fins 301 in the second fin group 30 , and the plurality of first fins 201 in the first fin group 20 The fin height of the fin 201 is greater than the fin height of the plurality of second fins 301 of the second fin set 30 .

Therefore, in this embodiment, the position of the first fin group 20 formed on the surface of the immersion heat dissipation substrate 10 is directly above the predetermined heat source high temperature region 801 corresponding to the heating element 800, and the plurality of first fin groups 20 The arrangement of the first fins 201 is relatively dense, and the fin heights of the plurality of first fins 201 of the first fin group 20 are relatively high, so as to increase more immersion heat dissipation areas on the limited surface area, thereby better The high heat generated by the high temperature zone 801 of the heat source is taken away to further enhance the immersion cooling effect.

[Second embodiment]

Please refer to FIG. 2 , which is the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the immersion heat dissipation substrate 10 has an upper surface 11 and a lower surface 12 opposite to each other. The lower surface 12 of the submerged heat dissipation substrate 10 is used for contacting the heating element 800 . Moreover, two first fin sets 20 and three second fin sets 30 are formed on the upper surface 11 of the immersion heat dissipation substrate 10 .

Further speaking, the positions of the two first fin groups 20 in this embodiment are directly above the predetermined two heat source high-temperature regions 801 of the heating element 800, and the positions of the three second fin groups 30 are corresponding to the heating element 800. Directly above the non-heat source high temperature region of the element 800. In this embodiment, the two heat source high-temperature regions 801 are located on both sides of the center of the heating element 800, and the non-heat source high-temperature regions (it can also be said that the three heat source low-temperature regions 802 with relatively low heating temperatures) are in the center of the heating element 800. The positions of the two first fin groups 20 in this embodiment correspond to the two sides of the center of the heating element 800, while the positions of the three second fin groups 30 correspond to the heating element 800 at the center and outermost. Moreover, the two first fin groups 20 and the three second fin groups 30 are arranged in a continuous arrangement.

Furthermore, in this embodiment, each first fin group 20 includes a plurality of first fins 201 , and each second fin group 30 includes a plurality of second fins 301 . Moreover, the arrangement density of the plurality of first fins 201 in the first fin group 20 is greater than the arrangement density of the plurality of second fins 301 in the second fin group 30 , and the plurality of first fins 201 in the first fin group 20 The fin height of the fin 201 is greater than the fin height of the plurality of second fins 301 of the second fin set 30 .

The number of fins of each first fin group 20 and the number of fins of each second fin group 30 in this embodiment are not specifically limited, but the number of fins of each first fin group 20 is preferably greater than each The number of fins in the second fin group 30.

In this embodiment, the porosity of each first fin set 20 and the porosity of each second fin set 30 are higher than that of the immersion heat dissipation substrate 10 . And, the porosity of each first fin group 20 of this embodiment and the porosity of each second fin group 30 are set at more than 50% and less than 95%, and each first fin group of this embodiment The porosity of the fin set 20 may also be higher than that of each second fin set 30 .

It should be noted that this embodiment shows the hole structure exaggerated or enlarged, so as to better understand the present invention.

Each first fin group 20 and each second fin group 30 in this embodiment can be integrally formed or welded on the surface of the immersion heat dissipation substrate 10, but each first fin group 20 and each second fin group The fin group 30 is preferably integrally formed on the surface of the submerged heat dissipation substrate 10 .

Therefore, in this embodiment, the position of the two first fin groups 20 formed on the surface of the immersion heat dissipation substrate 10 is directly above the predetermined two heat source high temperature regions 801 corresponding to the heating element 800, and the two first fin groups The plurality of first fins 201 in the sheet group 20 are arranged densely, and the fin heights of the plurality of first fins 201 in the two first fin groups 20 are relatively high, which can be achieved on the premise that the overall quality of the product varies less. Next, create a more ideal utilization rate of the surface area of the immersion heat dissipation substrate 10, so as to further enhance the effect of the immersion heat dissipation.

Based on the above, the two-phase immersion heat dissipation base material provided by the present invention can pass "the immersion type heat dissipation base has an upper surface and a lower surface, the lower surface is used to contact the heating element, the The upper surface is formed with the at least one first fin group and the at least one second fin group", "the position of the at least one first fin group corresponds to the at least one heat source high temperature area of the heating element directly above, the position of the at least one second fin group corresponds to the position directly above the high temperature region of the heating element that is not the at least one heat source”, “the at least one first fin group includes a plurality of first Fins, the at least one second fin group includes a plurality of second fins", "the arrangement density of the plurality of first fins is greater than the arrangement density of the plurality of second fins, and the The overall technical solution that the fin height of the plurality of first fins is greater than the fin height of the plurality of second fins can effectively improve the effect of immersion heat dissipation.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

700: two-phase immersion heat dissipation substrate 10: Submerged cooling base 11: Upper surface 12: Lower surface 20: The first fin group 201: First fin 30: Second fin group 301: second fin 800: heating element 801: heat source high temperature zone 802: Low temperature zone of heat source 900: two-phase coolant

FIG. 1 is a schematic side view of a two-phase submerged heat dissipation substrate according to a first embodiment of the present invention.

FIG. 2 is a schematic side view of a two-phase submerged heat dissipation substrate according to a second embodiment of the present invention.

700: two-phase immersion heat dissipation substrate

10: Submerged cooling base

11: Upper surface

12: Lower surface

20: The first fin group

201: First fin

30: Second fin group

301: second fin

800: heating element

801: heat source high temperature zone

802: Low temperature zone of heat source

900: two-phase coolant

Claims (7)

A two-phase immersion heat dissipation substrate for contacting a heat generating element comprising: an immersion heat dissipation base; at least one first fin set; at least one second fin set; Wherein, the submerged heat dissipation base has an upper surface and a lower surface, the lower surface is used for contacting the heating element, and the upper surface is formed with the at least one first fin group and the at least one first fin group. Two fin groups, the position of the at least one first fin group corresponds to the position directly above the high temperature region of at least one heat source of the heating element, and the position of the at least one second fin group corresponds to the position of the heating element Not directly above the high temperature region of the at least one heat source, the at least one first fin group includes a plurality of first fins, the at least one second fin group includes a plurality of second fins, and the at least one second fin group includes a plurality of second fins. The arrangement density of the plurality of first fins is greater than the arrangement density of the plurality of second fins, and the fin height of the plurality of first fins is greater than the fin height of the plurality of second fins. The two-phase immersion heat dissipation substrate according to claim 1, wherein the immersion heat dissipation substrate is made of one of aluminum, copper, aluminum alloy, and copper alloy. The two-phase immersion heat dissipation substrate as claimed in claim 2, wherein the immersion heat dissipation substrate is a porous metal heat sink submerged in two-phase cooling liquid with a porosity greater than 5%. The two-phase immersion heat dissipation substrate according to claim 3, wherein the porosity of each of the first fin groups and the porosity of each of the second fin groups are higher than that of the immersion heat dissipation The porosity of the substrate. The two-phase immersion heat dissipation substrate according to claim 1, wherein the number of fins in each of the first fin groups is greater than the number of fins in each of the second fin groups. The two-phase immersion heat dissipation substrate according to claim 1, wherein each of the first fin groups and each of the second fin groups are integrally formed on the upper surface of the immersion heat dissipation substrate. On the surface. The two-phase immersion heat dissipation substrate according to claim 1, wherein each of the first fin groups and each of the second fin groups are arranged in a continuous arrangement.

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