200838409 0950234 22214twf.doc/〇〇6 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱器，且特別是有關於一種 利用多個叢聚式配置之導熱金屬絲以增加散熱面積的散熱 器。 【先前技術】 目前所使用的電子元件均會產生熱量，尤其當積體電 Φ 路製造技術越發達，單位面積内所包含的電路元件也越 夕，同B守電子元件的操作速度亦大幅增加。然此換來的便 是電子元件會產生高熱量。 為I解決電子元件所產生的熱問題，進而使電子元件 的使用壽命能夠延長，便開發出數種散熱裝置，用以將電 子元件所產生的熱量傳導到外界，以減少電子元件本身的 溫加散熱裝置之單位面積内之散熱密度，為達到 尚散熱效率的常見方法。 、生、撒政，片製程包括擠型、平板衝壓、鋁壓鑄、鍛 埶κ，口=等等方法。然而，無論是何種製程所製造出 率Γ、ι ^你有其加工上的極限。為達到有較高的散熱效 :® = ^須更換製程成本較高的方式來生產散熱 片，因而棱向了製造成本。 -夂為傳統以鋁擠型成形方式所製作之散熱器。 1:及：個埒：’傳統的散熱器100主要包括-散熱底板 至散敎1柘ιΓ韓片120,其中散熱籍片120係垂直地連接 ”、、_ 〇上。如圖1所示，在設計擠型散熱鰭片時 200838409 0950234 22214twf.doc/006 僅能設計單一幾何截面，且散熱鰭片高度(L)與鰭片間之尸 隙間（D)的比值(L/D)，會受到模具強度之材奉^極^所= 制。因此，L/D比值最大只能在1〇〜15之間。圖2綠示^ 傳統之一散熱鰭片的立體示意圖。請參考圖2，每二 熱,鰭片的有效散熱面積S為： S-2LHf+Ltf+2Hftf 一般而言，鰭片高度L越高或鰭片間隔]□越窄時之散 =效果會越好。但實務上受到模具本身開模極限的限制， 鰭片間隔D往往無法做得太密，故散熱密度(單位體積内 =包含的散熱面積)也受到限制，而無法提供較佳之散^ 【發明内容】 ^發明提供—種散熱器，此憾器包括乡個散熱部， 器是^1含多個以絲式配置之導熱金屬絲。此散熱 之散熱面積，進而提升其散熱效率。 政― 片組本-f 器，此散熱器具有多個散熱鰭 散埶链片！?;：，片、、且包卜主散熱_片以及至少一辅助 稭由辅助散熱則之設置以增加 面積’進吨升錄熱鮮。 I、、 為解決上述問題，本發明提出—種散執哭， 之^^數個韻部。散熱部是彼關隔㈣置於底座 屬絲。且各散熱部包括多數個以叢聚式配置之導熱金 200838409 0950234 22214twf.doc/006 在本發明之-實施例中，底座之材料包括銅、銅人 金、銘或是铭合金。 ° 在本發明之-實施例中，這些散熱部實質上為相互平 行。 在本發明之-實施例中’這些導熱金屬絲之材料 銅、銅合金、銘或是銘合金。 在本發明之一實施例中，各散熱部中所包含之導熱全 屬絲係呈陣列式排列。 為解決上述問題’本發明另提出—種散熱器，其包括 一底座及多個散熱鰭片組。散熱籍片組是彼此間隔地設置 於底座之一表面，其中，各散熱鰭片組包括一主散熱鰭片 以及至少一辅助散熱鰭片，且輔助散熱鰭片是設置於主散 熱鱗片之-~側。 在本發明之一實施例中，底座之材料包括銅、銅合 金、鋁或是鋁合金。 在本發明之一實施例中，這些散熱鰭片組實質上為相 互平行。 在本發明之一實施例中，辅助散熱鰭片之數目為兩 片’且分別設置於主散熱籍片之左右兩側。 在本發明之一實施例中，主散熱鰭片及辅助散熱鰭片 之材料包括銅、銅合金、铭或是铭合金。 在本發明之一實施例中，辅助散熱籍片包括多個以叢 聚式配置之導熱金屬絲。而這些導熱金屬絲之材料包括 鋼、鋼合金、鋁或是鋁合金。此外，各散熱鰭片中所包含 6 200838409 0950234 22214twf.doc/0D6 之這些導熱金屬絲係呈陣列式排列。 本發明之散熱器是利用多數個呈叢聚式配置之導熱 金屬^以取代傳制散熱鰭片，由於這些導熱金屬絲之表 面積逖大於傳統之散熱鰭片的表面積，因此，可大幅增加 散熱器之散熱面積，進而提升其散熱效率。此外，本發明 所揭露之另-種散熱ϋ是於傳統之散熱鰭片的兩侧分^設 ^-辅助散熱鰭片，藉㈣助散熱鰭片之設置以增加散熱 裔之散熱面積，進而提升其散熱效率。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖3繪不為根據本發明之一實施例的一種散熱器的立 體示意圖。請參考目3，本發明之散熱器2〇〇主要包括一 底座210以及多數個散熱部22〇。散熱部22〇是彼此間隔 地設置於底座210之上表面21〇a，且各散熱部22〇包括多 數個以叢聚式配置之導熱金屬絲222。本發明之特點主要 疋藉由這些王叢聚式配置之導熱金屬絲222取代傳統片狀 的散熱鰭片，此叢聚式配置指的是多條導熱金屬絲222以 陣列或不規則方式排列在一起。由於這些導熱金屬絲222 之表面積遠大於傳統之散熱鰭片的表面積，因此，可大幅 g加其政熱面積，進而提升其散熱效率。 圖4繪示為本發明之一散熱部的立體示意圖。請參考 圖4,假没在本發明之散熱部具有與傳統的散熱鰭片相同 的長度、覓度及咼度的狀況下，在tf厚度範圍内設置有五 7 200838409 0950234 22214twf.doc/006 條導熱金屬絲，如此，每一條導熱金屬絲之半徑r為 且在L的長度内所具有之導熱金屬絲的數量11為5xL/計 因此’每組散熱部之有效散熱面積&為： \ = ><义 +πτ2) = ^x(27irxHf+7ir2) = 5nLHf+^xLtf 因此，二者面積之差異為： M = L(5;r—2)Z///+ $ —ιμ —% 假設t产lmm、η尸l〇mm、1^5〇麵，則對應散熱面積 之^異為Δ8=6823ιηιη2，且8斧7.4倍。因此，本發明之 叢聚式導熱金屬絲的設計確實可大幅增加散絲之散熱面 積’進而提升其散熱效率。 、 ^ 明之—實施例中，上述底座21G及導熱金屬絲 所材料可為銅、銅合金、lg、齡金或是其他導熱性 ^良屬。此外’這些散熱部22G就像傳統的散熱韓 片一板Μ貝上為相互平行，且各散熱部22〇中所包含之 熱金屬絲222是呈陣列式排列。 、 圖^繪tf為根據本發明之另—實施例的—種散熱器的 H不，。請參相5，此散熱器300主要包括-底座 夕個散熱鰭片|且32〇。這些散熱鰭片、组no是彼此間 隔地設置於底座 U u 表面1〇a，其中，各散熱韓片組 匕括-片主散_片322以及至少—片輔助散熱韓片 8 200838409 22214twf.doc/〇〇6 324 且辅助放熱鰭片324是設置於主散熱鰭片322之一 側。此散熱為300主要是藉由辅助散熱鰭片324之設置而 增加其散熱面積，進而提升其散熱效率。 同樣地，在本發明之一實施例中，上述底座310及散 熱鰭片組320之材料可為銅、銅合金、鋁、鋁合金或是其 他導熱性質良好之金屬。在此實施例中，散熱鰭片組32〇 包含兩片辅助散熱鰭片324分別設置於主散熱鰭片322之 左右兩側。此外，辅助散熱鰭片324亦可由圖2中所示之 叢聚式導熱金屬絲敝成，以進―步地增加其散熱面積， 且這些導熱金屬絲同樣是呈陣列式排列。 #、、 綜上所述，本發明之散熱器是於底座上設置多個散埶 部，各散熱部包含多數個呈叢聚式配置之導熱金屬絲，藉 由追些導熱金屬絲取代傳統的散熱鰭片，以增加 散熱面積，進而提升其散熱效率。 此外，本發明所揭露之另一種散熱器是於 韓片的兩側分別設置-輔助散熱鰭片，其同樣是藉由=助、 ==之設置以增加散熱器之散熱面積，進而提升其散 雖然本發明已以較佳實施例揭露如上，然其 限疋本發@ ’任何所屬技術領域丨具有通常知識 脫離本發明之精神和範助，當可作些許之 丛不 因此本發明之保護範圍當視後附之申請專利 為準。 |介疋者 【圖式簡單說明】 9 200838409 U93U234 22214twf.d〇c/〇〇6 圖1繪示 圖2繪示 圖3纟會不 體示意圖。 為傳統以鋁擠型成形方 分別為傳統之-散熱4戶=之=器 器的立 為根據本發明之-實施例== 圖4½示為本發明之一散熱部的立體示意圖。 圖5繪示為根據本發明之另一實施例的一種散熱器的 侧視不意圖。200838409 0950234 22214twf.doc/〇〇6 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat conducting wire using a plurality of clustering configurations for increasing heat dissipation The area of the radiator. [Prior Art] At present, the electronic components used generate heat, especially when the integrated circuit manufacturing technology is more developed, the circuit components included in the unit area are also on the eve, and the operating speed of the electronic components with B is also greatly increased. . In exchange for this, electronic components generate high heat. In order to solve the thermal problem caused by the electronic components, and thus extend the service life of the electronic components, several heat dissipation devices have been developed to conduct the heat generated by the electronic components to the outside to reduce the temperature of the electronic components themselves. The heat dissipation density per unit area of the heat sink is a common method for achieving heat dissipation efficiency. , raw, sub-government, film process including extrusion, flat stamping, aluminum die-casting, forging 埶 κ, mouth = and so on. However, no matter what kind of process is produced, ι ^ you have the limit of processing. In order to achieve high heat dissipation: ® = ^ requires a high cost of replacement process to produce heat sinks, thus erroneously manufacturing costs. -夂 is a conventional heat sink made by aluminum extrusion molding. 1: and: 埒: 'The traditional heat sink 100 mainly includes - the heat sink base plate to the bulk 1 柘 Γ Γ Korean film 120, wherein the heat sinking film 120 is vertically connected", _ 〇 on. As shown in Figure 1, When designing extruded fins, 200838409 0950234 22214twf.doc/006 can only design a single geometric section, and the ratio (L/D) of the fin height (L) to the gap between the fins (D) will be affected. The material strength of the mold is controlled by ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ The second heat, the effective heat dissipation area S of the fin is: S-2LHf+Ltf+2Hftf Generally speaking, the higher the fin height L or the narrower the fin spacing] □ the better the effect will be. But in practice The limit of the mold opening limit, the fin spacing D can not be made too dense, so the heat dissipation density (including the heat dissipation area per unit volume) is also limited, and can not provide a better dispersion ^ [Summary] A kind of radiator, the refrigerating device includes a heat dissipating portion of the town, and the device is a heat conducting wire with a plurality of wires arranged in the wire. The heat dissipation area, in turn, enhances its heat dissipation efficiency. The government-chipset-f device has a plurality of heat-dissipating fins and a chain of squirting fins!?::,, and the main heat-dissipating _ film and at least one The auxiliary straw is set by the auxiliary heat dissipation to increase the area 'into the tons of hot and fresh. I. In order to solve the above problems, the present invention proposes a kind of rhyme that is scattered and cried, and the heat dissipation part is separated. (4) The base wire is placed on the base, and each heat dissipation portion includes a plurality of heat conduction golds arranged in a cluster type. 200838409 0950234 22214twf.doc/006 In the embodiment of the present invention, the material of the base includes copper, copper, gold, or It is an alloy. In the embodiment of the present invention, the heat dissipating portions are substantially parallel to each other. In the present invention - the material of the heat conducting wires is copper, copper alloy, inscription or alloy. In one embodiment of the present invention, the heat-distributing filaments included in each of the heat dissipating portions are arranged in an array. To solve the above problems, the present invention further provides a heat sink including a base and a plurality of fins. The heat dissipation group is separated from each other The heat dissipation fins comprise a main heat dissipation fin and at least one auxiliary heat dissipation fin, and the auxiliary heat dissipation fins are disposed on the side of the main heat dissipation scale. In one embodiment, the material of the base comprises copper, copper alloy, aluminum or aluminum alloy. In one embodiment of the invention, the heat dissipation fin sets are substantially parallel to each other. In one embodiment of the invention, the auxiliary heat sink fins The number of the pieces is two pieces and is respectively disposed on the left and right sides of the main heat dissipation sheet. In one embodiment of the invention, the materials of the main heat dissipation fins and the auxiliary heat dissipation fins include copper, copper alloy, Ming or Ming. alloy. In one embodiment of the invention, the auxiliary heat sink includes a plurality of thermally conductive wires in a cluster configuration. The materials of these heat conductive wires include steel, steel alloy, aluminum or aluminum alloy. In addition, the heat conducting wires included in each heat sink fin 6 200838409 0950234 22214twf.doc/0D6 are arranged in an array. The heat sink of the present invention utilizes a plurality of heat conducting metals arranged in a cluster configuration to replace the heat radiating fins. Since the surface area of the heat conducting wires is larger than that of the conventional heat sink fins, the heat sink can be greatly increased. The heat dissipation area increases the heat dissipation efficiency. In addition, the other type of heat dissipation disclosed in the present invention is provided on the two sides of the conventional heat dissipation fins, and the auxiliary heat dissipation fins are provided by (4) the heat dissipation fins to increase the heat dissipation area of the heat dissipation body, thereby improving Its heat dissipation efficiency. The above described features and advantages of the present invention will become more apparent from the following description. [Embodiment] FIG. 3 is a schematic perspective view of a heat sink according to an embodiment of the present invention. Referring to Item 3, the heat sink 2 of the present invention mainly includes a base 210 and a plurality of heat radiating portions 22A. The heat dissipating portions 22 are disposed on the upper surface 21〇a of the base 210 at intervals, and each of the heat dissipating portions 22 includes a plurality of thermally conductive wires 222 arranged in a cluster. The features of the present invention are mainly achieved by replacing the conventional fin-shaped heat dissipating fins with the heat conducting wires 222 of the king clustering configuration, which means that the plurality of heat conducting wires 222 are arranged in an array or an irregular manner. Since the surface area of these heat conducting wires 222 is much larger than that of the conventional heat sink fins, the heat radiating area can be greatly increased, thereby improving the heat dissipation efficiency. 4 is a perspective view of a heat dissipating portion of the present invention. Referring to FIG. 4, in the case where the heat dissipating portion of the present invention has the same length, twist and twist as the conventional heat dissipating fin, five 7 7 200838409 0950234 22214twf.doc/006 are set in the thickness range of tf. The heat conducting wire, such that the radius r of each of the heat conducting wires is and the number of the heat conducting wires 11 in the length of L is 5 x L / meter. Therefore, the effective heat radiating area of each group of heat radiating portions is: \ = ><义+πτ2) = ^x(27irxHf+7ir2) = 5nLHf+^xLtf Therefore, the difference between the two areas is: M = L(5;r-2)Z///+ $—ιμ—% Hypothesis t produces lmm, η corpse l〇mm, 1^5 〇 face, the corresponding heat dissipation area is Δ8=6823ιηιη2, and 8 axe 7.4 times. Therefore, the design of the cluster-type heat-conducting wire of the present invention can greatly increase the heat dissipation area of the filaments, thereby improving the heat-dissipating efficiency. In the embodiment, the material of the base 21G and the heat conductive wire may be copper, copper alloy, lg, age gold or other thermal conductivity. Further, these heat radiating portions 22G are parallel to each other like the conventional heat sink Korean plate, and the heat wires 222 included in the respective heat radiating portions 22 are arranged in an array. Figure 2 is a diagram of a heat sink according to another embodiment of the present invention. Please refer to phase 5. This heat sink 300 mainly includes a base and a heat sink fin | and 32 inches. The heat dissipating fins and the group no are disposed on the surface U 〇a of the base U u at intervals from each other, wherein each of the heat dissipating Korean chip sets includes a main dissipating film 322 and at least a chip auxiliary heat dissipating film 8 200838409 22214twf.doc / 〇〇 6 324 and the auxiliary heat-dissipating fins 324 are disposed on one side of the main heat-dissipating fins 322. The heat dissipation of 300 is mainly caused by the arrangement of the auxiliary heat dissipation fins 324 to increase the heat dissipation area, thereby improving the heat dissipation efficiency. Similarly, in one embodiment of the present invention, the material of the base 310 and the finned fin set 320 may be copper, copper alloy, aluminum, aluminum alloy or other metal having good thermal conductivity. In this embodiment, the heat dissipation fin set 32A includes two auxiliary heat dissipation fins 324 respectively disposed on the left and right sides of the main heat dissipation fins 322. In addition, the auxiliary heat sink fins 324 can also be formed by the clustered heat conductive wires shown in Fig. 2 to further increase the heat dissipation area thereof, and the heat conductive wires are also arranged in an array. In summary, the heat sink of the present invention is provided with a plurality of diverging portions on the base, and each of the heat dissipating portions includes a plurality of heat conducting wires arranged in a cluster configuration, which replaces the conventional one by chasing some heat conducting wires. Heat sink fins to increase heat dissipation area and improve heat dissipation efficiency. In addition, another heat sink disclosed in the present invention is provided with auxiliary cooling fins on both sides of the Korean chip, which is also provided by the setting of = help and == to increase the heat dissipation area of the heat sink, thereby enhancing the dispersion. Although the present invention has been disclosed in the above preferred embodiments, it is to be understood that the scope of the present invention is not limited to the scope of the present invention. The patent application attached is subject to the patent application. | Introducer [Simple description of the diagram] 9 200838409 U93U234 22214twf.d〇c/〇〇6 Figure 1 shows Figure 2 shows the diagram of Figure 3. For the conventional aluminum extrusion molding, the conventional one is a heat dissipation unit. The embodiment according to the present invention is a perspective view of a heat dissipating portion of the present invention. Figure 5 is a side elevational view of a heat sink in accordance with another embodiment of the present invention.
【主要元件符號說明】 100 :散熱器 110 :散熱底板 120 ··散熱鰭片 200 :散熱器 210 :底座 210a ·上表面 220 :散熱部 222 :導熱金屬絲 3〇〇 =散熱器 310 :底座 310a :表面 320 =散熱鱔片組 322 :主散熱鰭片 324 :輔助散熱鰭片[Main component symbol description] 100: heat sink 110: heat dissipation substrate 120 · heat dissipation fin 200 : heat sink 210 : base 210 a · upper surface 220 : heat dissipation portion 222 : heat conductive wire 3 〇〇 = heat sink 310 : base 310a : Surface 320 = Heat Dissipation Chip Set 322 : Main Heat Sink Fin 324 : Auxiliary Heat Sink