CN203642131U - LED heat sink with high-heat dissipation performance and LED lamp provided with LED heat sink - Google Patents
LED heat sink with high-heat dissipation performance and LED lamp provided with LED heat sink Download PDFInfo
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- CN203642131U CN203642131U CN201420019579.1U CN201420019579U CN203642131U CN 203642131 U CN203642131 U CN 203642131U CN 201420019579 U CN201420019579 U CN 201420019579U CN 203642131 U CN203642131 U CN 203642131U
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- radiator
- light source
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Abstract
The utility model discloses an LED heat sink with high-heat dissipation performance. The LED heat sink comprises an aluminum substrate body, a power channel is formed in the middle of the aluminum substrate body, a light source installing base used for sealing the power channel and installing an LED light source is arranged at the end of the aluminum substrate body, and a plastic film layer is arranged on the peripheral surface of the aluminum substrate body. The utility model further discloses an LED lamp provided with the LED heat sink. By the arrangement of the plastic film layer on the peripheral surface of the aluminum substrate body, radiation and heat dissipation performance are improved, and heat dissipation effect is improved; by the arrangement of the insulating layer, safety and reliability of the LED lamp provided with the heat sink are improved.
Description
Technical field
The utility model relates to field of illumination lamp technology, particularly relates to a kind of LED radiator of high heat dispersion and uses the LED lamp of this radiator.
Background technology
The heat radiation of LED lamp is more and more by people are paid attention to, and its reason is that the light decay of LED lamp is directly relevant with its temperature with the life-span, and the bad LED light temperature that will cause that dispels the heat is too high.The heat radiation of LED lamp mainly relies on radiator to complete, so the quality of the heat dispersion of LED lamp radiator directly has influence on the service life of LED lamp.Conventionally the heat radiation process of LED lamp is: the heat that LED chip produces arrives convection current and the heat loss through radiation of radiator outer surface → radiator outer surface by the encapsulating structure → LED substrate → heat-conducting glue → surface conductive of close LED substrate.Therefore, the quality of radiator heat-dissipation performance is main relevant with heat loss through radiation effect with the convection current of its heat conductivility and outer surface.
For this reason, radiator often selects quality light, the good metallic aluminium of heat conductivility is made, in order further to improve the radiating effect of radiator, improve convection current and heat loss through radiation effect by the area of dissipation that increases outer surface, in the situation that not increasing radiator volume, generally by increasing radiating ribs density and highly realizing.
But, the thermal conductivity factor of conventional die casting aluminium only has 96.2W/ (mK), internal heat conducting power is limited, heat loss through convection and the heat loss through radiation ability of die casting aluminium outer surface are also very limited simultaneously, just can only be by increasing the volume of radiator if need further to improve heat dispersion, be unfavorable for the miniaturization of LED lamp, for in the situation that not increasing radiator volume, increase the radiating effect of radiator, the patent documentation of publication No. CN102853405A discloses a kind of LED radiator and LED light fixture, this LED radiator comprises aluminium base body, described aluminium base body has the pars intermedia of hollow bulb, its surface distributed has multiple radiating ribs, in described aluminium base body, be also embedded with copper part.This LED light fixture comprises lamp housing, is located at the LED light source in described lamp housing, the radiator that the aluminium base of LED light source is installed and is fixedly connected with described aluminium base, and described radiator is LED radiator described above.LED radiator in the document adopts and in traditional aluminium base radiator, is embedded the copper part that thermal conductivity is higher, and radiator radiating effect in the situation that not increasing fin area and volume is promoted greatly, thus the life-span of having improved the LED in light fixture.
In said structure, in aluminium base radiator, embed copper part, although increased to a certain extent heat conductivility, not only make the structure of radiator more complicated, be difficult for processing, and the weight of copper part is large and price is more expensive, has improved the production cost of LED lamp and the weight of lamp body.
Utility model content
The utility model provides a kind of LED radiator of high heat dispersion, to solve the radiator heat-dissipation poor effect of prior art, the problem that complex structure and processing cost are larger.
A LED radiator for high heat dispersion, comprises aluminium base body, and the centre of described aluminium base body offers power channel, and end is provided with sealing power channel and is used for installing the light source mount pad of LED light source, and the outer surface of described aluminium base body is provided with plastic film layer.
The setting of described plastic film layer, has improved heat loss through radiation ability of the present utility model, improves radiating effect, has formed insulating barrier simultaneously, has improved the safety and reliability that LED lamp of the present utility model is housed.Described plastic film layer is realized by electrostatic plastics-spraying technology, and the main material of plastic-blasting is pure polyester powder, and after plastic-blasting, pure polyester powder coating solidify to form described plastic film layer through 180 DEG C of high-temperature baking levellings.
In order to improve radiating effect of the present utility model, preferred, the installed surface of described light source mount pad is provided with the first copper plate.LED lamp of the present utility model is installed, and because the heat conductivility of copper is better than aluminium, described the first copper plate conducts to fast by the heat of LED light source the outer surface that then aluminium base body arrive aluminium base body and dispels the heat.
Further preferred, between the outer surface of described aluminium base body and plastic film layer, be provided with the first copper plate and be communicated with the second copper plate.The first copper plate being interconnected by setting and the second copper plate, the outer surface that the heat that LED light source can be produced conducts to aluminium base body fast dispels the heat, and effectively improves the radiating effect of radiator; And due to the first copper plate and the second copper plate very thin, can increase hardly aluminium radiator weight and volume.
In order to make comprehensive heat-sinking capability the best of the present utility model, preferred, the thickness of described plastic film layer is 0.07mm～0.09mm.The reason of thickness of restriction plastic film layer is, if the thickness of plastic film layer is too small, improve the DeGrain of heat loss through radiation, but thickness is excessive, can affect again heat conductivility of the present utility model.
At the cost of considering radiating effect and amount of copper consuming, preferred, the thickness of described the first copper plate and the second copper plate is 0.013mm～0.015mm.Described thickness is excessively thin, can reduce heat conductivility, but along with the increase of thickness, can increase again amount of copper consuming, raises the cost.
A kind of LED lamp, comprise the LED radiator of above-mentioned high heat dispersion and be arranged on the LED light source on this LED radiator, described LED light source comprises LED chip and for the heat-conducting substrate of LED chip is installed, described heat-conducting substrate reclines and is arranged on the installed surface of light source mount pad.Described heat-conducting substrate reclines and is arranged on the installed surface of light source mount pad, makes LED light source heat be directly delivered to fast aluminium base body, thereby improves thermal conduction effect, further improves radiating effect.
The LED radiator of high heat dispersion of the present utility model and use the LED lamp of this radiator, is provided with plastic film layer by the outer surface at aluminium base body.Improve heat loss through radiation ability of the present utility model, improved radiating effect, formed insulating barrier simultaneously, improved the safety and reliability of LED lamp of the present utility model.
Brief description of the drawings
Fig. 1 is cutaway view of the present utility model.
Fig. 2 is perspective view of the present utility model.
Detailed description of the invention
As illustrated in figs. 1 and 2, the LED radiator of the high heat dispersion of the present embodiment comprises aluminium base body 1, the centre of aluminium base body 1 offers power channel 2, end is provided with sealing power channel 2 and is used for installing the light source mount pad 3 of LED light source, the installed surface 31 of light source mount pad 3 is provided with the first copper plate 5, the outer surface 11 of aluminium base body 1 is provided with the second copper plate 4 being communicated with the first copper plate 5, outside the second copper plate 4, is provided with plastic film layer 6.
In order to make comprehensive heat-sinking capability the best of the present utility model, in the present embodiment, the thickness of plastic film layer 6 is 0.08mm.
In order to reduce amount of copper consuming, between the first copper plate and the second copper plate, some copper facing passages can be set, but process more complicated, in the present embodiment, for convenient processing, the whole surface of aluminium base body 1 is provided with copper plate.
The heat loss through radiation ability that plastic film layer 6 has improved the present embodiment is set, improves radiating effect, formed insulating barrier simultaneously, improved the safety and reliability that LED lamp of the present utility model is housed.In the present embodiment, plastic film layer is realized by electrostatic plastics-spraying technology, and the main material of plastic-blasting is pure polyester powder, and after plastic-blasting, pure polyester powder coating solidify to form described plastic film layer through 180 DEG C of high-temperature baking levellings.
Between the outer surface 11 of aluminium base body 1 and plastic film layer 6, arrange and be communicated with the second copper plate 4 with the first copper plate 5.Because the heat conductivility of copper is better than aluminium, thereby the outer surface 11 that the heat of LED light source is transmitted to aluminium base body 1 fast from the installed surface 31 of light source mount pad 3 dispels the heat, substantially do not increasing in LED heatsink weight and volume situation, improve radiating effect, make LED lamp fast cooling, increase service life.
The LED lamp of the present embodiment, comprise the LED radiator of above-mentioned high heat dispersion and be arranged on the LED light source on this LED radiator, LED light source comprises LED chip and for the heat-conducting substrate of LED chip is installed, heat-conducting substrate reclines and is arranged on the installed surface of light source mount pad.
In sum, the LED radiator of the high heat dispersion of the present embodiment and LED lamp, improved the heat loss through radiation ability of the present embodiment by plastic film layer 6 is set, improve radiating effect, form insulating barrier simultaneously, improved the safety and reliability of the LED lamp of the present embodiment.
Claims (6)
1. the LED radiator of a high heat dispersion, comprise aluminium base body, the centre of described aluminium base body offers power channel, and end is provided with sealing power channel and is used for installing the light source mount pad of LED light source, it is characterized in that, the outer surface of described aluminium base body is provided with plastic film layer.
2. the LED radiator of high heat dispersion as claimed in claim 1, is characterized in that, the installed surface of described light source mount pad is provided with the first copper plate.
3. the LED radiator of high heat dispersion as claimed in claim 2, is characterized in that, is provided with the first copper plate and is communicated with the second copper plate between the outer surface of described aluminium base body and plastic film layer.
4. the LED radiator of high heat dispersion as claimed in claim 1, is characterized in that, the thickness of described plastic film layer is 0.07mm～0.09mm.
5. the LED radiator of high heat dispersion as claimed in claim 3, is characterized in that, the thickness of described the first copper plate and the second copper plate is 0.013mm～0.015mm.
6. a LED lamp, comprise the LED radiator of the high heat dispersion as described in claim as arbitrary in claim 1～5 and be arranged on the LED light source on this LED radiator, it is characterized in that, described LED light source comprises LED chip and for the heat-conducting substrate of LED chip is installed, described heat-conducting substrate reclines and is arranged on the installed surface of light source mount pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420019579.1U CN203642131U (en) | 2014-01-13 | 2014-01-13 | LED heat sink with high-heat dissipation performance and LED lamp provided with LED heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420019579.1U CN203642131U (en) | 2014-01-13 | 2014-01-13 | LED heat sink with high-heat dissipation performance and LED lamp provided with LED heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203642131U true CN203642131U (en) | 2014-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420019579.1U Expired - Fee Related CN203642131U (en) | 2014-01-13 | 2014-01-13 | LED heat sink with high-heat dissipation performance and LED lamp provided with LED heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203642131U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104214631A (en) * | 2014-08-27 | 2014-12-17 | 苏州骏发精密机械有限公司 | LED (light-emitting diode) automobile headlamp radiator |
| CN106714504A (en) * | 2015-07-31 | 2017-05-24 | 中兴通讯股份有限公司 | Remote radio unit, mounting element, and radio-frequency communication system |
-
2014
- 2014-01-13 CN CN201420019579.1U patent/CN203642131U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104214631A (en) * | 2014-08-27 | 2014-12-17 | 苏州骏发精密机械有限公司 | LED (light-emitting diode) automobile headlamp radiator |
| CN106714504A (en) * | 2015-07-31 | 2017-05-24 | 中兴通讯股份有限公司 | Remote radio unit, mounting element, and radio-frequency communication system |
| CN106714504B (en) * | 2015-07-31 | 2019-11-05 | 中兴通讯股份有限公司 | Remote Radio Unit, installation part and RF communication system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140611 Termination date: 20170113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |