CN209447843U - A kind of graphene LED chip heat-radiating substrate - Google Patents
A kind of graphene LED chip heat-radiating substrate Download PDFInfo
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- CN209447843U CN209447843U CN201920593547.5U CN201920593547U CN209447843U CN 209447843 U CN209447843 U CN 209447843U CN 201920593547 U CN201920593547 U CN 201920593547U CN 209447843 U CN209447843 U CN 209447843U
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Abstract
The utility model discloses a kind of graphene LED chip heat-radiating substrates, including LED chip, heat dissipation metal base, graphene radiating base layer, high-temperature-resistant epoxy resin and connecting bracket；The upper surface of the graphene radiating base layer is connect with LED chip, and the lower surface of the graphene radiating base layer is connect with heat dissipation metal substrate surface, and the high-temperature-resistant epoxy resin is used to support heat dissipation metal base substrate；The connecting bracket is for connecting adjacent LED chip heat-radiating substrate.The utility model is using graphene radiating base layer as heat sink body structure, it is graphene coated between heat dissipation metal base interface, it is radiated using the high thermal conductivity of grapheme material, while improving thermal conductivity of material, the heat dissipation effect of LED chip is improved by improving the swept area of heat source part and heat sink body, in addition the heat of point is spread rapidly through graphene into plane, reduces the temperature of LED chip, LED component luminous efficiency can be improved, reduce the service life.
Description
Technical field
The utility model relates to arrive LED encapsulation field, more particularly, to a kind of graphene LED chip heat-radiating substrate.
Background technique
LED(Light Emitting Diode) as a kind of outstanding semiconductor devices, power consumption small in size with its
The advantages that low, long service life, environmental protection, has become ideal solid-state Energy -- Saving Illuminating Source of new generation.As LED is to bloom
Effect, high power development, heat dissipation problem is outstanding day by day, and one side power becomes greatly, and LED encapsulation structure also becomes increasingly complex；
The volume of another aspect LED is smaller and smaller, is the accumulation of LED component heat brought by such change.When LED component temperature
When degree reaches critical point, light output characteristic and the service life of device of LED can have been seriously affected, therefore has solved LED component heat dissipation and asks
Topic becomes particularly important.
Existing LED component substrate generally uses metal substrate.Metal substrate is mainly using aluminium or copper as base's material, therefore
The processing of necessary more insulating layers in technique, but the thermal expansion coefficient (about 20~23 × 10-6/K) of metal is much larger than LED core
Piece (about 5~8 × 10-6/K), this excessive swelling be easy to cause substrate to generate thermal expansion, cause LED chip damage or drop
Low luminous efficiency, therefore, metal substrate is not suitable for hot environment and high power or high current LED is used.
To sum up, it is necessary to a kind of LED heat radiation substrate be provided, solve the insulating heat-conduction material of traditional heat-dissipating substrate use simultaneously
It realizes good LED heat dissipation effect, improves LED component luminous efficiency, extends LED component service life.
Utility model content
It is scattered to provide a kind of novel graphene LED chip for the deficiency of the utility model in order to overcome the above technical problems
Hot substrate can be fully solved above-mentioned technical problem.
The technical solution adopted in the utility model are as follows: a kind of graphene LED chip heat-radiating substrate, including LED chip, metal
Radiating base layer, graphene radiating base layer, high-temperature-resistant epoxy resin and connecting bracket；The upper surface of the graphene radiating base layer
It is connect with LED chip, the lower surface of the graphene radiating base layer is connect with heat dissipation metal substrate surface, the high temperature resistant
Epoxy resin is used to support heat dissipation metal base substrate；The connecting bracket is for connecting adjacent LED chip heat-radiating substrate.
Further, the heat dissipation metal base and connecting bracket are Copper alloy material.
Further, the exposed surface of the heat dissipation metal base is coated with one layer of graphene heat radiation coating.
The beneficial aspects that the utility model generates are: the utility model is using graphene radiating base layer as heat sink body knot
Structure, it is graphene coated between heat dissipation metal base interface, it is radiated using the high thermal conductivity of grapheme material, is improving material
While expecting heating conduction, the heat dissipation effect of LED chip is improved by improving the swept area of heat source part and heat sink body,
In addition the heat of point is spread rapidly through graphene into plane, reduces the temperature of LED chip, the luminous effect of LED component can be improved
Rate reduces the service life.
Detailed description of the invention
Fig. 1 is the schematic diagram of the utility model；
Fig. 2 is the array schematic diagram of the utility model；
In figure: 1- heat dissipation metal base, 2- graphene radiating base layer, 3- high-temperature-resistant epoxy resin, 4- connecting line, 5-LED
Chip, 6- connecting bracket.
Specific embodiment
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, so that those skilled in the art
The utility model can be better understood and can be practiced, but illustrated embodiment is not as the restriction to the utility model.
A kind of graphene LED chip heat-radiating substrate shown in the utility model, including LED chip 5, graphene radiating base layer
1 and heat dissipation metal base 2, the upper surface of graphene radiating base layer 1 connect with LED chip 5, the following table of graphene radiating base layer 1
The connection of 2 upper surface of face heat dissipation metal base, high-temperature-resistant epoxy resin is a kind of high temperature resistant engineering PPS resin, for connecting metal
Radiating base layer 2 and graphene radiating base layer 1 are simultaneously located at its both ends；Connecting bracket 6 is used for base that each graphene LED chip radiates
Plate is connected with each other, mechanization when in order to encapsulate.Connecting line 4 is the gold thread of purity 99.99%, be connecting substrate radiating base layer 2 with
LED chip 5.
In the present embodiment, for the graphene of graphene radiating base layer 1 with a thickness of 1MM, effect is exactly 5 institute of LED chip
The heat of heat dissipation is timely transmitted to above heat dissipation metal base 2.Heat dissipation metal base 1 is Copper alloy material；By graphene
Advantageous 300~the 400W/mk of thermal conductivity coefficient of radiating base layer 2 and 100~300W/ of thermal coefficient of heat dissipation metal base 1
Mk, the heat-conducting effect of superelevation can provide high power or high current LED comes using making LED chip 5 will not be because of bad be led of radiating
The facts of light decay, the luminous efficiency reduction of cause etc. generates.
The utility model proposes a kind of graphene LED chip heat-radiating substrate, simple and compact for structure, light-weight, insulation
Performance is good, production cost is low, has good heat dissipation performance, and solve the heat dissipation performance of LED chip, the light for improving LED is defeated
The service life of characteristic and LED component out.
The above descriptions are merely preferred embodiments of the present invention, not does to the structure of the utility model any
Formal limitation, any simple modification made by the above technical examples according to the technical essence of the present invention are equivalent
Variation and modification, in the range of still falling within the technical solution of the utility model.
Claims (3)
1. a kind of graphene LED chip heat-radiating substrate, including LED chip, heat dissipation metal base, graphene radiating base layer, resistance to height
Temperature epoxy resin and connecting bracket；The upper surface of the graphene radiating base layer is connect with LED chip, and the graphene dissipates
The lower surface of hot radical layer is connect with heat dissipation metal substrate surface, and the high-temperature-resistant epoxy resin is used to support heat dissipation metal base
Substrate；The connecting bracket is for connecting adjacent LED chip heat-radiating substrate.
2. a kind of graphene LED chip heat-radiating substrate according to claim 1, it is characterised in that: the heat dissipation metal
Base and connecting bracket are Copper alloy material.
3. a kind of graphene LED chip heat-radiating substrate according to claim 1, it is characterised in that: the heat dissipation metal
The exposed surface of base is coated with one layer of graphene heat radiation coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920593547.5U CN209447843U (en) | 2019-04-28 | 2019-04-28 | A kind of graphene LED chip heat-radiating substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920593547.5U CN209447843U (en) | 2019-04-28 | 2019-04-28 | A kind of graphene LED chip heat-radiating substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209447843U true CN209447843U (en) | 2019-09-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920593547.5U Active CN209447843U (en) | 2019-04-28 | 2019-04-28 | A kind of graphene LED chip heat-radiating substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN209447843U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110690181A (en) * | 2019-10-15 | 2020-01-14 | 福建省信达光电科技有限公司 | Thermoelectric-separation LED substrate and manufacturing method thereof |
-
2019
- 2019-04-28 CN CN201920593547.5U patent/CN209447843U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110690181A (en) * | 2019-10-15 | 2020-01-14 | 福建省信达光电科技有限公司 | Thermoelectric-separation LED substrate and manufacturing method thereof |
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