CN201093435Y - Ultra-high power LED lamp - Google Patents
Ultra-high power LED lamp Download PDFInfo
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- CN201093435Y CN201093435Y CNU2007201498541U CN200720149854U CN201093435Y CN 201093435 Y CN201093435 Y CN 201093435Y CN U2007201498541 U CNU2007201498541 U CN U2007201498541U CN 200720149854 U CN200720149854 U CN 200720149854U CN 201093435 Y CN201093435 Y CN 201093435Y
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- led lamp
- power led
- heat pipe
- lamp according
- heat
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Abstract
The utility model relates to a super-power LED lamp and a manufacturing method, the super-power LED lamp is composed by that a cup body (A) of the super-power LED lamp is connected with a group that is provided with a heat pipe (1) and a base plate (4) which are combined; the connection between the cup body (A) of the super-power LED lamp and the base plate (4) is finished by adopting a module type encapsulation manufacturing method; the cup body of the super-power LED lamp and the metal base plate are integrated into a whole structure, so as to lead that the heat conduction resistance between the cup body and the metal base plate is approximate to zero; the problem of the large heat resistance caused by the connection of a common fastening way between the high heat-conduction organic silicon gel body and the metal base plate is solved effectively; the utility model has obvious cooling effect and is suitable for the manufacture of the large-power LED lamp above 0.5 W, in particular to the manufacture of the super-power LED lamp above 10W; the needs of different floodlights can be satisfied directly and the super-power LED lamp has the characteristics of concise and compact structure, convenient installation, beautiful appearance, durability and obvious energy-saving effect and so on.
Description
Technical field
The utility model belongs to a kind of LED lamp, particularly a kind of high-powered LED lamp.
Background technology
As everyone knows, the LED lamp is the same with conventional light source, duration of work can produce heat, the LED lamp is to add under the energy, the radiation recombination in electronics and hole and the electricity that takes place cause effect the 30-35% of energy are converted into luminous energy, but not the lattice vibration that radiation recombination takes place is converted into heat energy with the energy of all the other 65-70%.LED is very sensitive illuminating part to temperature, under the lower situation of operating temperature, just can obtain high reliable optical index, could satisfy the instructions for use of illumination usually.In order to make the LED lamp can adapt to the needs of general illumination, the solid-state illumination light source presses for the problem that solves the unit light flux, the increase of LED lamp unit light flux and every unit caloric value is significantly increased, and rolling up of heat makes LED wick sheet decay of luminescence and loses use value, and particularly how to solve heat radiation be a present big technical barrier to high-power LED lamp.For solving this difficult problem, in the patent No. is 200420012318.3 high-capacity LED radiator structure, the organization plan of liquid radiator has been proposed, 200420112643.7 great power LED cooling is strengthened assembly structure, the organization plan of radiating bottom plate has been proposed, the 200610124134.x LED lamp of our company has proposed connection semiconductor methods for cooling and organization plan.
Summary of the invention
The purpose of this utility model is: be in order to solve the heat dissipation technology difficult problem of present illumination level great power LED, to propose a kind of superhigh power LED lamp.
Superhigh power LED lamp of the present utility model is meant to be no less than that led chip forms that its general power is not less than the LED lamp of 0.5W, it is characterized in that: be connected to substrate (4) by LED Lamp cup body (A), substrate (4) is provided with heat pipe (1) combination and constitutes.Also can be considered by LED Lamp cup body (A) and be connected to heat-radiating substrate (4) combination that includes heat pipe (1) and constitute.Described heat pipe caliber can be at the metal tube or the non-metallic pipe of 3--100mm scope, and the contour structures of heat pipe (1) is circle or ellipse or flat type or profile shapes.It is characterized in that: superconduct heat media is housed in the pipe.Heat pipe can be provided with a heat pipe or one group of heat pipe as required or organize heat pipe structure more.Heat pipe (1) has at least an end to be made as connector, so that be connected with external heat radiation object.Heat pipe can adopt welding manner or be fixed on the substrate (4) with the high-heat-conductivity glue bonding mode, also can adopt embedded mode or integrated die casting mode to make the substrate element product of band heat pipe, and its use is better.Its heat radiation is more smooth and easy, the radiating and cooling better effects if.
Superhigh power LED lamp of the present utility model, its described LED Lamp cup body (A) is in high thermal conductivity insulating materials Lamp cup framework (2), fills high-termal conductivity, high index of refraction and low-expansion organic silica gel and constitutes; Its inside is provided with the fluorescent material interlayer, the fluorescent material interlayer is topped have comprise at least a great power LED or led chip and LED just/gold thread that is connected between negative electricity interlayer, led chip and chip, chip and the stent electrode and LED externally just/negative electrode pin (3).Establish led chip (10) in its LED Lamp cup body (A) to connect as one the module integrated structure with substrate (4).The wherein setting of LED or led chip can uniform or non-uniform many or numerous great power LEDs.Its Lamp cup body (A) can be made the parts product form and use.
Superhigh power LED lamp of the present utility model is the same with conventional light source, duration of work can produce heat, the LED lamp is to add under the energy, the radiation recombination in electronics and hole and the electricity that takes place cause effect the 30-35% of energy are converted into luminous energy, but not the lattice vibration that radiation recombination takes place is converted into heat energy with the energy of all the other 65-70%.LED is very sensitive illuminating part to temperature, under the lower situation of operating temperature, just can obtain high reliable optical index, could satisfy the instructions for use of illumination usually.The heat pipe that is provided with in the reinforcement superhigh power LED lamp of the present invention, can move quickly and effectively after the high-power LED energising, the very high heat of chip moment generation, having solved junction temperature of chip gathers rapidly, cause chip temperature sharply to rise, make LED lamp brightness rapid attenuation, even the problem of burning LED.Superhigh power LED lamp of the present invention, the heat pipe on its metal substrate can move the heat that super-high-power LED sends rapidly, makes the led chip junction temperature be controlled at (below 120 ℃) under the reliable temperature.The heat that the application of heat pipe produces in the time of can effectively moving LED work on the one hand solves the light decay problem that great power LED does not freely cause because of heat radiation.Heat pipe one end connects great power LED, and the other end is connected in lamp housing or other radiator, and promptly heat pipe (1) has at least an end to be made as connector, so that be connected with external heat radiation object.An outside end connector, variety of way that can prior art is connected in lamp housing or other radiator, and the heat that LED produces is transferred to lamp housing or radiator rapidly by heat pipe, can realize that heat radiation is faster, and is better; Can change the structure of traditional high-power LED lamp on the other hand, it is smaller and more exquisite to make it structure, is more convenient for using.
Because the combination of its super-high-power LED Lamp cup and metal substrate is the employing module to be encapsulated integrally formed manufacture method and finishes, and its LED Lamp cup body (A) in establish led chip (10) to connect as one modular structure with substrate (4).By making that the hot conduction resistance between the two is less; Solved the high heat conduction organosilicon colloid effectively and be connected the big problem of thermal resistance that exists with general fastening means with metal substrate.
The invention has the beneficial effects as follows:
1, the panel radiator of band heat pipe, radiating effect is remarkable, applicable to the manufacturing of the LED lamp of the above super high power of the manufacturing of the high-power LED lamp more than the 0.5W, particularly 10W;
2, the combination of great power LED Lamp cup and metal substrate is to adopt module to encapsulate integrally formed manufacture method, and super-high-power LED Lamp cup and the metal substrate structure that both had been formed in one makes that the hot conduction resistance between the two is very little; Solved the high heat conduction organosilicon colloid effectively and be connected the big problem of thermal resistance that exists with general fastening means with metal substrate.
3, break through the low a great problem of LED lamp brightness, realized with LED being light source, can directly make the requirement of satisfying variant illuminating lamp;
Characteristics such as 4, it has compactness simple for structure, and is easy for installation, attractive and durable, and energy-saving effect is remarkable.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing, but be not limited thereto.
Fig. 1, single heat pipe one-way heat conduction structural representation
Fig. 2, single heat pipe one-way heat conduction structural profile schematic diagram
Fig. 3, more than two groups heat pipe two-way type conductive structure schematic diagram
Fig. 4, more than two groups heat pipe two-way type conductive structure generalized section
Fig. 5, organize multidirectional heat pipe for thermal conductivity structural representation more
Fig. 6, organize multidirectional heat pipe for thermal conductivity structural profile schematic diagram more
Among the figure: heat pipe (1), Lamp cup framework (2), LED Lamp cup body (A), great power LED just/negative electrode pin (3), led support substrate (4), fluorescent material interlayer (6), high-power LED chip (7), organic silica gel (8), tin cream or high thermal conductive silicon glue (9), gold thread (10).
The specific embodiment
The manufacture method of superhigh power LED lamp of the present utility model is to adopt the module group type encapsulation making method to finish, and high-powered LED lamp cup and metal substrate both be formed as one structure.Wherein:
(1) heat pipe: the significant components among the present invention, the heat that produces in the time of can moving great power LED work rapidly.Heat pipe one end connects great power LED, and the other end is connected in lamp housing or other radiator, and the heat that LED produces is transferred to lamp housing or radiator rapidly by heat pipe, realizes the heat radiation purpose.According to load (LED heating power) situation and heat pipe self thermophoresis ability, heat pipe can have single group, two groups (figure one, and figure five) or many groups are formed (every group of heat pipe is made up of single or many heat pipes), and (∮ 3 for its caliber size, ∮ 5, ∮ 6, and ∮ 8 ... ∮ 100 etc.), contour structures (circle, ellipse, flat type or other shapes) and length (the heat pipe length of led support substrate (4) or metal substrate (5)) all can decide according to concrete application.
(2) LED Lamp cup framework: the insulating materials by high thermal conductivity is formed, inside comprise LED just/the negative electricity interlayer.Fill high-termal conductivity, high index of refraction and low-expansion organic silica gel in the cup;
(3) great power LED just/the negative electrode pin;
(4) led support substrate: by aluminium, copper or other heat conductivility good metal alloy composition, its bottom is connected in heat pipe (1);
(5) fluorescent material interlayer, thickness is at 0.01mm-10mm;
(6) high-power LED chip;
(7) organic silica gel: have high-termal conductivity, high index of refraction and low-expansion coefficient;
(8) tin cream or high thermal conductive silicon glue (thermal conductivity is at 0.01w/mk-200w/mk) are used for being connected between heat pipe and led support substrate or the metal substrate, and the heat that LED is produced imports heat pipe rapidly into;
(9) gold thread: realize led chip and chip, being connected between chip and the stent electrode.
Claims (15)
1. superhigh power LED lamp, described superhigh power LED lamp is meant and is no less than that led chip forms, its general power is not less than the LED lamp of 0.5W, it is characterized in that: be connected to substrate (4) by LED Lamp cup body (A), substrate (4) is connected in heat pipe (1) and constitutes.
2. superhigh power LED lamp according to claim 1 is characterized in that: in the pipe of its heat pipe (1) superconduct heat media is housed.
3. superhigh power LED lamp according to claim 1 is characterized in that: its heat pipe design is a heat pipe structure.
4. superhigh power LED lamp according to claim 1 is characterized in that: its heat pipe design is one group of heat pipe structure.
5. superhigh power LED lamp according to claim 1 is characterized in that: its heat pipe design is for being no less than one group of heat pipe structure.
6. superhigh power LED lamp according to claim 1 is characterized in that: heat pipe (1) has an end to be made as to be convenient to the joint that is connected with external heat radiation object at least.
7. superhigh power LED lamp according to claim 1 is characterized in that: heat pipe (1) and metallic plate (5) be combined into Welding Structure.
8. superhigh power LED lamp according to claim 1 is characterized in that: the structure that is combined into glue bond of heat pipe (1) and metallic plate (5).
9. superhigh power LED lamp according to claim 1 is characterized in that: the parts product that is combined into embedding or the integrated structure of die casting of heat pipe (1) and metallic plate (5).
10. superhigh power LED lamp according to claim 1 is characterized in that: the caliber of its heat pipe (1) is the metal tube or the non-metallic pipe of 3--100mm scope.
11. superhigh power LED lamp according to claim 1 is characterized in that: the contour structures of heat pipe (1) is circle or ellipse or flat type or profile shapes.
12. superhigh power LED lamp according to claim 1, it is characterized in that: fill heat-conducting organic silica gel in the heat-conducting insulation material Lamp cup framework (2) of its LED Lamp cup body (A), be provided with the fluorescent material interlayer in its organic silica gel, the fluorescent material interlayer is topped have comprise at least a great power LED or led chip (10), LED just/negative electricity interlayer, led chip and chip, the gold thread that is connected between chip and the stent electrode.
13. superhigh power LED lamp according to claim 1 is characterized in that: establish led chip (10) in its LED Lamp cup body (A) to connect as one the module integrated structure with substrate (4).
14. superhigh power LED lamp according to claim 1 is characterized in that: the fluorescent material interlayer in its LED Lamp cup body (A) is topped to be had and is no less than a great power LED or led chip, and it is that uniform or non-uniform form is arranged.
15. superhigh power LED lamp according to claim 1 is characterized in that: the phosphor powder layer thickness in its LED Lamp cup body (A) is in the 0.01mm-10mm scope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201498541U CN201093435Y (en) | 2007-04-29 | 2007-04-29 | Ultra-high power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201498541U CN201093435Y (en) | 2007-04-29 | 2007-04-29 | Ultra-high power LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201093435Y true CN201093435Y (en) | 2008-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNU2007201498541U Expired - Fee Related CN201093435Y (en) | 2007-04-29 | 2007-04-29 | Ultra-high power LED lamp |
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| CN (1) | CN201093435Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI447326B (en) * | 2010-01-19 | 2014-08-01 | Beom-Young Myung | Led illumination device and illuminating apparatus employing the same |
| CN107559677A (en) * | 2017-09-21 | 2018-01-09 | 佛山市深研信息技术有限公司 | A kind of LED headlights based on market building external application good heat dissipation effect |
-
2007
- 2007-04-29 CN CNU2007201498541U patent/CN201093435Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI447326B (en) * | 2010-01-19 | 2014-08-01 | Beom-Young Myung | Led illumination device and illuminating apparatus employing the same |
| CN107559677A (en) * | 2017-09-21 | 2018-01-09 | 佛山市深研信息技术有限公司 | A kind of LED headlights based on market building external application good heat dissipation effect |
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Legal Events
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: DONGGUAN CLED OPTOELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER NAME: DONGGUAN CLED OPTOELETRONIC TECHNOLOGY CO., LTD. |
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| CP03 | Change of name, title or address |
Address after: 523808, 2 floor, building 1, Songshan science and Technology Industrial Park, Dongguan, Guangdong Patentee after: Dongguan Cled Optoelectronic Technology Co., Ltd. Address before: 523270 Guangdong city of Dongguan province Xian village Gaobu town second Chau Industrial Zone A building Patentee before: Dongguan Cled Optoeletronic Technology Co., Ltd. |
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| DD01 | Delivery of document by public notice |
Addressee: Dongguan Cled Optoelectronic Technology Co., Ltd. Document name: Notification to Pay the Fees |
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| DD01 | Delivery of document by public notice |
Addressee: Dongguan Cled Optoelectronic Technology Co., Ltd. Document name: Notification of Termination of Patent Right |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080730 Termination date: 20150429 |
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| EXPY | Termination of patent right or utility model |