CN102252200A - Semiconductor refrigeration high-power LED lamp - Google Patents

Semiconductor refrigeration high-power LED lamp Download PDF

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Publication number
CN102252200A
CN102252200A CN2011101872530A CN201110187253A CN102252200A CN 102252200 A CN102252200 A CN 102252200A CN 2011101872530 A CN2011101872530 A CN 2011101872530A CN 201110187253 A CN201110187253 A CN 201110187253A CN 102252200 A CN102252200 A CN 102252200A
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CN
China
Prior art keywords
led lamp
radiator
chilling plate
metal sheet
power led
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Pending
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CN2011101872530A
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Chinese (zh)
Inventor
房林
卢会水
陈传华
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卢会水
房林
陈传华
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Application filed by 卢会水, 房林, 陈传华 filed Critical 卢会水
Priority to CN2011101872530A priority Critical patent/CN102252200A/en
Publication of CN102252200A publication Critical patent/CN102252200A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a semiconductor refrigeration high-power LED lamp, aiming at solving the junction temperature problem of a high-power LED lamp. The technical scheme adopted by the invention is as follows: a cold end of a semiconductor refrigeration sheet is connected with a module baseplate of a high-power LED module via a cold end metal sheet; a temperature sensor is mounted on or near the module baseplate, the temperature sensor is in electric connection with an upper-lower limit temperature control circuit, a temperature control switch in electric connection with the semiconductor refrigeration sheet is in electric connection with the upper-lower limit temperature control circuit, and a power supply is connected with the temperature control switch, the upper-lower limit temperature control circuit and the high-power LED module through a power supply switch respectively; the module baseplate, the cold end metal sheet and a radiator are connected together by a plurality of heat insulation bolts; and heat insulation materials are filled on the periphery of the semiconductor refrigeration sheet and between the radiator and the cold end metal sheet. According to the semiconductor refrigeration high-power LED lamp, the semiconductor refrigeration sheet is used for cooling actively and forcibly; the working temperature of the high-power LED module is reduced to below 40 degrees centigrade; and the luminous efficiency of the high-power LED is enhanced to the greatest limit.

Description

The semiconductor refrigerating high-powered LED lamp
Technical field
The present invention relates to a kind of LED lamp, particularly relate to a kind of semiconductor refrigerating high-powered LED lamp, belong to lighting field.
Background technology
LED (Light Emitting Diode) is as a kind of outstanding semiconductor light sources,, advantages such as power consumption low, long service life, environmental protection little with its volume, and being expected to became desirable of new generation solid-state energy-saving illumination light source in following 10 years.Yet LED throws light in the process of high-power development, has been subjected to the influence of heat dissipation problem, becomes the main bottleneck that present obstruction great power LED technology is applied.Because the characteristics of luminescence of LED has determined its operating temperature and luminous efficiency to be inversely proportional to, the rising of LED junction temperature can make the luminous efficiency of great power LED reduce, and quickens the light decay of LED, the life-span of obviously reducing LED.For the above great power LED module illumination of 50W, the fault more than 70% all is to cause owing to the LED temperature is too high.Experimental results show that: if single great power LED module temperature is reduced to below 40 ℃, the corresponding increase of luminous efficiency, also can increase by 1 times service life.
At present, the domestic and international heat dissipation technology that great power LED is used adopts following 4 kinds of modes: the fin natural heat dissipation, install fan forced heat radiation, the heat radiation of loop heat pipe technology additional substantially.First kind is the fin natural heat dissipation, owing to rely on the structure of self to realize heat radiation fully, transient response is poor, and the heat radiation conduction is slow, makes that the fin area is bigger, and volume and cost increase; Second kind is to install the fan forced heat radiation additional, and the life-span of fan is limited, general about 3 years, and the fan noise that has been in operation, because the requirement of waterproof, this radiating mode can't be used in specific occasions such as outdoor lamp; The third is loop heat pipe technology heat radiation, need charge into heat transfer medium in the pipeline of sealing, and the volume and weight of radiator portion is very big and need be exposed on the lamp outer casing face, influences the light fixture outward appearance, and cost is higher, applies difficulty; The 4th kind is to reduce the great power LED temperature by semiconductor chilling plate.Semiconductor chilling plate, claim thermoelectric refrigerator again, basic principle is a peltier effect: the flow through contact place of two different conductors of electric current can produce heat release and heat absorption phenomenon, the size of heat release and heat absorption is by the size decision of operating current, in normal working conditions, the temperature difference of cold and hot end will remain between 40~65 degree.According to the semiconductor refrigerating theory, apply a DC voltage at the semiconductor chilling plate two ends, can make the heating of semiconductor chilling plate one end, other end refrigeration.We claim the end that generates heat to be " hot junction ", and an end of refrigeration be " cold junction ", the cooperation temperature control circuit, cryogenic temperature is accurately controlled, no working medium and moving component, simple in structure, volume is little, noiselessness.
Disclose a kind of led light source with semiconductor heat dissipation device in the Chinese patent application 200910109212.2, it comprises: led light source and semiconductor chilling plate, the cold junction of described semiconductor chilling plate closely is connected with the led light source back side.The hot junction of semiconductor chilling plate closely is connected with a radiator.During work, the semiconductor chilling plate cold junction absorbs the heat that light source produces and also is transmitted to the hot junction, and the radiator by being attached thereto then is discharged into heat in the surrounding environment and goes, and thus, keeps LED to work under the temperature environment about 60 degree.But, the problem that this structure exists is: on the one hand because the cold junction of this scheme semiconductor chilling plate is connected the led light source back side and radiator with the hot junction respectively by organic silica gel, for high-powered LED lamp, often occur in conjunction with not firm phenomenon, and in a single day the organic silica gel cracking appears, will directly cause product rejection; On the other hand, in the practical set process, between the led light source back side of high-powered LED lamp and the radiator because metal shell connects or the existence of metal connecting piece, can occur without " the heat conduction short circuit " of crossing the semiconductor chilling plate effect, and the temperature rise of the radiator that is caused by " heat conduction short circuit " is not the generation semiconductor chilling plate effect under, the forced cooling usefulness that is to say semiconductor chilling plate is not given full play to, and becomes very difficult so further keep LED to work under lower temperature environment.
Summary of the invention
In order further to reduce the operating temperature of high-powered LED lamp, the purpose of this invention is to provide a kind of semiconductor refrigerating high-powered LED lamp, this lamp is applied to high-power LED lighting system with semiconductor refrigerating technology, adopt initiatively forced cooling of semiconductor chilling plate, the operating temperature of great power LED module can be reduced to below 40 ℃, improve the great power LED luminous efficiency to greatest extent.
The present invention solves the scheme that its technical problem takes: this semiconductor refrigerating high-powered LED lamp, comprise led light source and semiconductor chilling plate, the cold junction of described semiconductor chilling plate is connected with the led light source back side, the hot junction of semiconductor chilling plate is connected with a radiator, it is characterized in that, described led light source is the great power LED module, and the cold junction of described semiconductor chilling plate is connected with the module group substrates of great power LED module by the cold side metal sheet; On the module group substrates or near temperature sensor of arrangement, this temperature sensor is electrically connected a bound temperature-control circuit, the temperature detect switch (TDS) that is electrically connected with semiconductor chilling plate is electrically connected the bound temperature-control circuit, and power supply connects temperature detect switch (TDS), bound temperature-control circuit and great power LED module respectively by power switch; A plurality of adiabatic screws link together described module group substrates, cold side metal sheet and radiator, the peripheral of semiconductor chilling plate and between radiator and cold side metal sheet filling with insulation material.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described cold side metal sheet is the reflective surface of LED lamp.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described cold side metal sheet is a parabolic shape.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described adiabatic screw is the screw that nonmetal heat-insulating material is made.
Described semiconductor refrigerating high-powered LED lamp, its further scheme be, between cold side metal sheet and the module group substrates, between semiconductor chilling plate and the cold side metal sheet, be coated with heat-conducting silicone grease between semiconductor chilling plate and the radiator.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described radiator is the metal shade of LED lamp.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described radiator is the independently radiator structure that passes lampshade.
Good effect of the present invention is:
Because a plurality of adiabatic screws link together described module group substrates, cold side metal sheet and radiator, the peripheral of semiconductor chilling plate and between radiator and cold side metal sheet filling with insulation material.Can prevent that not only taking place in conjunction with not firm phenomenon from appearring in high-powered LED lamp, and, the setting of adiabatic screw and heat-barrier material, also avoided without " the heat conduction short circuit " of crossing the semiconductor chilling plate effect, the active forced cooling usefulness of semiconductor chilling plate is not fully exerted, LED solved the heat dissipation problem of great power LED module, obtained good actual effect, so can work under lower temperature environment.This technical scheme can be reduced to the operating temperature of great power LED module below 40 ℃ as required, even 0 ℃.This programme semiconductor chilling plate is an electric current transducing type device, by the electric current of control input, can realize high-precision temperature control.The semiconductor chilling plate thermal inertia is very little, and under the good situation of hot-side heat dissipation, cooling time is lacked, can be reached maximum temperature difference soon, reduces the temperature of great power LED module rapidly, has improved the luminous efficiency of high-powered LED lamp to greatest extent; The setting of simultaneous temperature sensor, bound temperature-control circuit makes the great power LED module be operated in predefined optimum temperature interval, has obviously reduced light decay, has prolonged the service life of high-powered LED lamp greatly.
Than the fin natural heat dissipation that at present both at home and abroad great power LED is used, install fan forced heat radiation, three kinds of radiating modes of loop heat pipe technology heat radiation additional, the technical program simple in structure, volume is little, cost is low.Can obtain significant especially actual benefit for fields such as the high-power LED street lamp illumination of the current demand that is widely used, automobile front illumination, indoor and outdoor high-power illuminations.
Description of drawings:
Fig. 1 is a semiconductor refrigerating high-power LED lamp structure schematic diagram;
Fig. 2 is a semiconductor refrigerating high-powered LED lamp electrical schematic diagram.
Wherein, 1-cold junction; The 2-hot junction; The 3-radiator; 4, adiabatic screw, 5-great power LED module; The 6-module group substrates; 7-cold side metal sheet; The 8-heat-barrier material; The adiabatic screw of 9-; The 10-semiconductor chilling plate; 11 temperature sensors; 12 bound temperature-control circuits; The E-dc source; The JK-temperature detect switch (TDS); The K-power switch.
The specific embodiment
As Fig. 1, Fig. 2.The semiconductor refrigerating high-powered LED lamp comprises parts such as great power LED module 5, cold side metal sheet 7, semiconductor chilling plate 10 and radiator 3.
The cold junction of semiconductor chilling plate 10 is connected with the module group substrates 6 of great power LED module 5 by cold side metal sheet 7; On the module group substrates 6 or near temperature sensor 11 of arrangement, this temperature sensor is electrically connected a bound temperature-control circuit 12, the temperature detect switch (TDS) JK that is electrically connected with semiconductor chilling plate is electrically connected bound temperature-control circuit 12, and power supply E connects temperature detect switch (TDS) JK, bound temperature-control circuit 12 and great power LED module 5 respectively by power switch K.A plurality of adiabatic screws 4 link together described module group substrates 6, cold side metal sheet 7 and radiator 3, the peripheral of semiconductor chilling plate and between radiator and cold side metal sheet filling with insulation material 8.
Semiconductor chilling plate 10, the heat that produces when the great power LED module 5 of cold junction 1 absorption is worked is transferred to radiator 3 by hot junction 2, diffuses to great power LED lamp system outside.
Near great power LED module group substrates 6, settle a temperature sensor, after connecting the power switch K of dc source E, great power LED module 5 is luminous, produce heat simultaneously, when temperature reaches the temperature of setting, the bound temperature-control circuit is connected temperature detect switch (TDS) JK, the temperature of great power LED module 5 begins to descend, when dropping to the temperature of setting, the bound temperature-control circuit disconnects temperature detect switch (TDS) JK, makes great power LED module 5 be operated in predefined optimum temperature interval, reached the temperature of real-time reduction and control great power LED module 5, improve the great power LED luminous efficiency to greatest extent, reduce light decay, the purpose that increases the service life.
Because great power LED module group substrates 6 can be not in full accord with area, the shape of semiconductor chilling plate 10, just needs by the 7 adaptive connections of cold side metal sheet, cold side metal sheet 7 closely contacts with great power LED module group substrates 6; The cold junction 1 of semiconductor chilling plate 10 is pressed on the cold side metal sheet 7, and cold side metal sheet 7 can be the reflective surface of lamp, and shape can be made tubular or parabolic shape; Hot junction 2 closely contacts with radiator 3, and radiator 3 is made of metal, and it can be the metal shade of LED lamp, also can be the independently radiator structure that passes lampshade, for example the fin that is provided with separately.Adiabatic screw 4, adiabatic screw 9 pass the module group substrates 6 of great power LED, and be fastening in the screw-in radiator 3, and adiabatic screw 4 and adiabatic screw 9 can of 2-8 only can be made by materials such as nylon, pottery, lucite, rigid plastics; Form the space between radiator 3 and the cold side metal sheet 7, for the heat conduction, the convection current that prevent hot junction 2, be radiated cold junction 1, and then influence system's refrigerating efficiency, be packed into heat-barrier material 8 in this space, as: plastics, resin, polyurathamc etc.Between cold side metal sheet 7 and the great power LED module group substrates 6, between cold junction 1 and the cold side metal sheet 7, between hot junction 2 and the radiator 3, the coating heat-conducting silicone grease reduces hot slippages, improves heat transfer efficiency.

Claims (7)

1. semiconductor refrigerating high-powered LED lamp, comprise led light source and semiconductor chilling plate, the cold junction of described semiconductor chilling plate is connected with the led light source back side, the hot junction of semiconductor chilling plate is connected with a radiator, it is characterized in that, described led light source is the great power LED module, and the cold junction of described semiconductor chilling plate is connected with the module group substrates of great power LED module by the cold side metal sheet; On the module group substrates or near temperature sensor of arrangement, this temperature sensor is electrically connected a bound temperature-control circuit, the temperature detect switch (TDS) that is electrically connected with semiconductor chilling plate is electrically connected the bound temperature-control circuit, and power supply connects temperature detect switch (TDS), bound temperature-control circuit and great power LED module respectively by power switch; A plurality of adiabatic screws link together described module group substrates, cold side metal sheet and radiator, the peripheral of semiconductor chilling plate and between radiator and cold side metal sheet filling with insulation material.
2. semiconductor refrigerating high-powered LED lamp according to claim 1 is characterized in that, described cold side metal sheet is the reflective surface of LED lamp.
3. semiconductor refrigerating high-powered LED lamp according to claim 1 is characterized in that, described cold side metal sheet is a parabolic shape.
4. according to claim 2 or 3 described semiconductor refrigerating high-powered LED lamps, it is characterized in that described adiabatic screw is the screw that nonmetal heat-insulating material is made.
5. semiconductor refrigerating high-powered LED lamp according to claim 4 is characterized in that, between cold side metal sheet and the module group substrates, between semiconductor chilling plate and the cold side metal sheet, be coated with heat-conducting silicone grease between semiconductor chilling plate and the radiator.
6. semiconductor refrigerating high-powered LED lamp according to claim 1 is characterized in that, described radiator is the metal shade of LED lamp.
7. semiconductor refrigerating high-powered LED lamp according to claim 1 is characterized in that, described radiator is the independently radiator structure that passes lampshade.
CN2011101872530A 2011-07-06 2011-07-06 Semiconductor refrigeration high-power LED lamp Pending CN102252200A (en)

Priority Applications (1)

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CN2011101872530A CN102252200A (en) 2011-07-06 2011-07-06 Semiconductor refrigeration high-power LED lamp

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Application Number Priority Date Filing Date Title
CN2011101872530A CN102252200A (en) 2011-07-06 2011-07-06 Semiconductor refrigeration high-power LED lamp

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CN102252200A true CN102252200A (en) 2011-11-23

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102537735A (en) * 2011-12-31 2012-07-04 江苏三显照明科技有限公司 LED lamp
CN103807615A (en) * 2012-11-07 2014-05-21 海洋王(东莞)照明科技有限公司 Lamp
CN104654074A (en) * 2014-12-18 2015-05-27 东莞市高鑫机电科技服务有限公司 Intelligent programmable LED (Light Emitting Diode) illuminating lamp and control method
CN105987314A (en) * 2015-05-16 2016-10-05 深圳市金达照明有限公司 Lamp capable of automatically adjusting light source temperature
CN106287610A (en) * 2015-05-24 2017-01-04 上思县东岽电子科技有限责任公司 A kind of electronic heat dissipation device of the great power LED of COB type
CN106764974A (en) * 2016-12-23 2017-05-31 宁波方太厨具有限公司 A kind of baking box

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2927321Y (en) * 2006-06-14 2007-07-25 朱建钦 Large-power semiconductor luminescent device
CN101082411A (en) * 2006-12-08 2007-12-05 东莞市科锐德数码光电科技有限公司 lamp
CN101275735A (en) * 2008-05-12 2008-10-01 张春涛 High-power LED lamp structure and manufacturing method thereof
CN201273934Y (en) * 2008-08-15 2009-07-15 上海小糸车灯有限公司 Portable LED heat resistance test apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2927321Y (en) * 2006-06-14 2007-07-25 朱建钦 Large-power semiconductor luminescent device
CN101082411A (en) * 2006-12-08 2007-12-05 东莞市科锐德数码光电科技有限公司 lamp
CN101275735A (en) * 2008-05-12 2008-10-01 张春涛 High-power LED lamp structure and manufacturing method thereof
CN201273934Y (en) * 2008-08-15 2009-07-15 上海小糸车灯有限公司 Portable LED heat resistance test apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102537735A (en) * 2011-12-31 2012-07-04 江苏三显照明科技有限公司 LED lamp
CN103807615A (en) * 2012-11-07 2014-05-21 海洋王(东莞)照明科技有限公司 Lamp
CN104654074A (en) * 2014-12-18 2015-05-27 东莞市高鑫机电科技服务有限公司 Intelligent programmable LED (Light Emitting Diode) illuminating lamp and control method
CN105987314A (en) * 2015-05-16 2016-10-05 深圳市金达照明有限公司 Lamp capable of automatically adjusting light source temperature
CN105987314B (en) * 2015-05-16 2017-10-17 深圳市金达照明有限公司 A kind of light-source temperature automatically adjusts light fixture
CN106287610A (en) * 2015-05-24 2017-01-04 上思县东岽电子科技有限责任公司 A kind of electronic heat dissipation device of the great power LED of COB type
CN106764974A (en) * 2016-12-23 2017-05-31 宁波方太厨具有限公司 A kind of baking box

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Application publication date: 20111123