CN106287610A - A kind of electronic heat dissipation device of the great power LED of COB type - Google Patents
A kind of electronic heat dissipation device of the great power LED of COB type Download PDFInfo
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- CN106287610A CN106287610A CN201510267176.8A CN201510267176A CN106287610A CN 106287610 A CN106287610 A CN 106287610A CN 201510267176 A CN201510267176 A CN 201510267176A CN 106287610 A CN106287610 A CN 106287610A
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- China
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- semiconductor chilling
- chilling plate
- great power
- cob type
- power led
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Abstract
A kind of electronic heat dissipation device of the great power LED of COB type, aluminum material is used to do shell, shell shape is the square box bodily form, form a sealing inner chamber unrelated with ambient temperature inside box, seal, in inner chamber, face of feeling cold, luminous circuit board and the semiconductor chilling plate of semiconductor chilling plate, the lead-in wire of luminous plaque working power are installed.When sending working power to luminous plaque and semiconductor chilling plate, the just work of the great power LED of COB type, in annular seal space, distribute the biggest heat；Meanwhile, semiconductor chilling plate is devoted oneself to work after obtaining electricity, and by face of feeling cold, cold energy is neutralized the heat that luminous plaque distributes.As long as selecting the power of suitable semiconductor chilling plate, just can the temperature of the great power LED of COB type be controlled below 50, making LED obtain life in application and reaching 50,000 hours.
Description
Technical field
The present invention relates to the electronic heat dissipation device of the great power LED of a kind of COB type.
Background technology
The most popular great power LED uses high density integrated circuit having, and high power combines, and single chip LED sheet has tens watts of power, COB lamp to be claimed.This LED is because power is big, and the lamp sheet that works together to produce the biggest heat, and the bad meeting of cooling measure, to the thermo-field thoery of lamp, makes lamp damage time serious.
Summary of the invention
The electronic heat dissipation device of the great power LED of the present invention a kind of COB type, the electronic heat dissipation device of the great power LED of a kind of COB type is disclosed, this device is that core forms an annular seal space 2 unrelated with ambient temperature by semiconductor chilling plate, has the great power LED 4 of semiconductor chilling plate 7, COB type in annular seal space.
The electronic heat dissipation device of the great power LED of a kind of COB type, device apparatus structure is made up of the great power LED 4 of the COB type on aluminum shell 3, clear glass eyeglass 1, semiconductor chilling plate 7, the pad 8 of semiconductor chilling plate, luminous plaque 5 and luminous plaque and the working power lead-in wire 6 and 9 of semiconductor supply cooling piece 7, luminous plaque 5.
Accompanying drawing explanation
Accompanying drawing is the structural representation of the electronic heat dissipation device of the great power LED of a kind of COB type.
Detailed description of the invention
As shown in drawings, the shell 3 of electronic heat dissipation device is aluminum matter cast form, and shell is a short cup-shaped, bottom mounting related components, and top is clear glass lid.Described lid adhesive is fixed；The perforate of described bottom is fixed on lamp housing 10 by Luo Ding.Lamp housing has 4 power supply lead wires 6 and 9, is the working power lead-in wire of luminous plaque and semiconductor chilling plate respectively.The connection of shell 3 and lamp housing 10 can be fixed with adhesive or Luo Ding.
As shown in drawings, there is the great power LED 4 of semiconductor chilling plate 7 and COB type in annular seal space.Described semiconductor chilling plate 7, its heating face is connected with aluminum matter lamp housing, for good heat radiating, is uniformly coated with heat conductive silica gel in the heating face of lamp housing and quasiconductor.The surrounding of the semiconductor chilling plate pad 8 specialized in for semiconductor chilling plate,；The great power LED of described COB type, luminous plaque uses aluminum base circuit board, and aluminum matter radiating surface is connected with the face of feeling cold of semiconductor chilling plate, uses adhesive or Luo Ding to fix；The component side of aluminum base circuit board is towards glass-mirror, and the monolithic power of COB lamp can be with 10W, 20W, 30W etc..
Claims (5)
1. an electronic heat dissipation device for the great power LED of COB type, its apparatus structure is done shell by aluminum material, and profile is square box, forms an annular seal space unrelated with ambient temperature, be provided with semiconductor chilling plate and luminous circuit board in annular seal space inside box.
The electronic heat dissipation device of the great power LED of a kind of COB type the most according to claim 1, it is characterized in that: the inner bottom part of box is provided with semiconductor chilling plate and luminous circuit board, additionally the aperture of a power supply lead wire is respectively opened on both sides, and aperture uses adhesive good seal after installing power line.
The electronic heat dissipation device of the great power LED of a kind of COB type the most according to claim 2, it is characterised in that: the top of box is covered by one block of clear glass, and uses adhesive good seal.
The electronic heat dissipation device of the great power LED of a kind of COB type the most according to claim 1, it is characterized in that: the components and parts erection sequence in annular seal space, count from glass profit minute surface toward bottom and be: the bottom of the heating face-annular seal space of the face of the feeling cold-semiconductor chilling plate of COB emitting components-aluminum base circuit board-semiconductor chilling plate.
The electronic heat dissipation device of the great power LED of a kind of COB type the most according to claim 1, it is characterised in that: bottom surface adhesive or the Luo Ding of the little square box of aluminum matter are fixed on the outside plate of LED, in order to more preferably dispel the heat, coat heat conductive silica gel at bottom even.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510267176.8A CN106287610A (en) | 2015-05-24 | 2015-05-24 | A kind of electronic heat dissipation device of the great power LED of COB type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510267176.8A CN106287610A (en) | 2015-05-24 | 2015-05-24 | A kind of electronic heat dissipation device of the great power LED of COB type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106287610A true CN106287610A (en) | 2017-01-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510267176.8A Pending CN106287610A (en) | 2015-05-24 | 2015-05-24 | A kind of electronic heat dissipation device of the great power LED of COB type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106287610A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2927321Y (en) * | 2006-06-14 | 2007-07-25 | 朱建钦 | Large-power semiconductor luminescent device |
| CN201331035Y (en) * | 2009-01-09 | 2009-10-21 | 中南大学 | High-power luminous LED illumination device based on semiconductor refrigeration heat radiation |
| CN102102868A (en) * | 2010-11-18 | 2011-06-22 | 常州星宇车灯股份有限公司 | Large-power light emitting diode (LED) active radiating device for car lamp |
| CN102252200A (en) * | 2011-07-06 | 2011-11-23 | 卢会水 | Semiconductor refrigeration high-power LED lamp |
| CN203983277U (en) * | 2014-07-22 | 2014-12-03 | 江苏洪昌科技股份有限公司 | A kind of direct encapsulating structure of great power LED COB of automobile lighting |
| CN204067353U (en) * | 2014-08-11 | 2014-12-31 | 深圳市伟兴鑫电子科技有限公司 | The integrated COB light source encapsulating structure of a kind of great power LED |
| CN104282824A (en) * | 2014-09-26 | 2015-01-14 | 深圳市志金电子有限公司 | Method for manufacturing high-power high-reflectance COB substrate and light source |
-
2015
- 2015-05-24 CN CN201510267176.8A patent/CN106287610A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2927321Y (en) * | 2006-06-14 | 2007-07-25 | 朱建钦 | Large-power semiconductor luminescent device |
| CN201331035Y (en) * | 2009-01-09 | 2009-10-21 | 中南大学 | High-power luminous LED illumination device based on semiconductor refrigeration heat radiation |
| CN102102868A (en) * | 2010-11-18 | 2011-06-22 | 常州星宇车灯股份有限公司 | Large-power light emitting diode (LED) active radiating device for car lamp |
| CN102252200A (en) * | 2011-07-06 | 2011-11-23 | 卢会水 | Semiconductor refrigeration high-power LED lamp |
| CN203983277U (en) * | 2014-07-22 | 2014-12-03 | 江苏洪昌科技股份有限公司 | A kind of direct encapsulating structure of great power LED COB of automobile lighting |
| CN204067353U (en) * | 2014-08-11 | 2014-12-31 | 深圳市伟兴鑫电子科技有限公司 | The integrated COB light source encapsulating structure of a kind of great power LED |
| CN104282824A (en) * | 2014-09-26 | 2015-01-14 | 深圳市志金电子有限公司 | Method for manufacturing high-power high-reflectance COB substrate and light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170104 |