CN217903138U

CN217903138U - LED light source structure for reducing junction temperature of LED chip based on COB packaging

Info

Publication number: CN217903138U
Application number: CN202123391055.4U
Authority: CN
Inventors: 周宗兴
Original assignee: Shenzhen Zhishangshixian Technology Co ltd
Current assignee: Shenzhen Zhishangshixian Technology Co ltd
Priority date: 2021-12-29
Filing date: 2021-12-29
Publication date: 2022-11-25
Anticipated expiration: 2031-12-29

Abstract

The utility model discloses a reduce LED light source structure of LED chip junction temperature based on COB encapsulation relates to LED light source technical field, which comprises a base, the top of base is provided with four bracing pieces, four the top of bracing piece is provided with the fixed plate, the top of fixed plate sets up radiator unit, radiator unit's top is provided with the base plate, the top of base plate is provided with a plurality of heat transfer subassembly. The utility model provides a LED light source radiating effect is limited in the use of reality, still can lead to the chip to damage because the high temperature, influence the problem of the normal use of LED light source, can obtain timely transmission with the heat that LED lamp pearl produced, the convenience gives off the heat, setting through radiator unit, the air fast flow of heat dissipation incasement chamber has been realized, the convenient inner chamber of taking the heat that produces the fin out of the heat dissipation case, realize thermal giving off, the temperature is reduced, and then the heat dissipation to LED lamp pearl has been realized.

Description

LED light source structure for reducing junction temperature of LED chip based on COB packaging

Technical Field

The application relates to the technical field of LED light sources, in particular to an LED light source structure for reducing junction temperature of an LED chip based on COB packaging.

Background

COB packaging is fully called chip-on-board packaging, and is a technology for solving the problem of heat dissipation of an LED. Bare chips are attached to an interconnect substrate with a conductive or non-conductive adhesive and then wire bonded to make electrical connections.

Junction temperature is the actual operating temperature of the semiconductors in the electronic device. In operation, it is typically warmer than the package housing. The temperature difference is equal to the power of the heat therebetween multiplied by the thermal resistance.

However, the heat dissipation effect of the LED light source in the prior art is limited in the actual use process, and the normal use of the LED light source is still affected due to the damage of the chip caused by the overhigh temperature.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED light source structure of reduction LED chip junction temperature based on COB encapsulation to solve the problem that proposes among the above-mentioned background art.

The embodiment of the application adopts the following technical scheme:

the utility model provides a reduce LED light source structure of LED chip junction temperature based on COB encapsulation, includes the base, the top of base is provided with four bracing pieces, four the top of bracing piece is provided with the fixed plate, the top of fixed plate sets up radiator unit, radiator unit's top is provided with the base plate, the top of base plate is provided with a plurality of heat transfer assembly, each heat transfer assembly's top has been provided with LED lamp pearl.

Preferably, the radiator unit is including heat dissipation case, heat dissipation fan, fin and through-hole, the heat dissipation case sets up between fixed plate and base plate, the fixed embedded inner chamber at the heat dissipation case of heat dissipation fan, a plurality of the fin sets gradually the bottom at the base plate from a left side to the right side, a plurality of the through-hole link up the outer wall of seting up at the base plate.

Preferably, the heat transfer component comprises an insulating layer, a first adhesive layer, a heat conducting layer and a second adhesive layer, the insulating layer is arranged at the bottom end of the LED lamp bead, the first adhesive layer is arranged at the bottom end of the insulating layer, the heat conducting layer is adhered to the bottom end of the first adhesive layer, and the second adhesive layer is adhered to the bottom end of the heat conducting layer and adhered to the top end of the substrate.

Preferably, the top of base plate is provided with arc lamp shade, the first venthole of a plurality of has been seted up to the outer wall of lamp shade, a plurality of second venthole has been seted up along the axial in the bottom of heat dissipation case.

Preferably, the first bonding layer and the second bonding layer are graphene layers, the heat conduction layer is a copper sheet layer, and the insulation layer is a heat conduction insulation layer.

Preferably, the substrate is an aluminum plate.

Preferably, four fixing holes are formed in the bottom end of the base in a penetrating mode.

The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects:

one, the heat that LED lamp pearl produced can loop through insulating layer, first bond line, heat-conducting layer, second bond line and base plate transmission to fin in the operation, realizes thermal transmission, makes the heat that LED lamp pearl produced obtain timely transmission, conveniently gives off the heat.

And secondly, through the setting of the heat conduction insulating layer, the insulating layer can be enabled to transfer heat, the first bonding layer made through the graphene layer can realize carrying out thermal transfer on the contact of connecting the heat conduction layer and the insulating layer, through the setting of the copper sheet layer, the heat transfer can be realized, the copper sheet layer has good heat transferability, the time of the heat transfer is accelerated, the substrate can be connected with the heat conduction layer through the second bonding layer, the heat can be transferred to the substrate, and the purpose of timely transferring the heat generated by the LED lamp beads is realized.

Third, start the heat dissipation fan, make the heat dissipation fan blow the air to the outer wall of fin, and discharge through the second venthole, the air fast flow of heat dissipation incasement chamber has been realized, the convenient inner chamber of taking the heat that produces the fin out of heat dissipation case, realize thermal giving off, the cooling, and then realized the heat dissipation to LED lamp pearl, when the heat dissipation fan starts, can make the air blow in the inner chamber of lamp shade and contact with the arc inner wall of lamp shade through the through-hole, discharge the lamp shade through first venthole, the air flow of lamp shade inner chamber has been realized, can directly dispel the heat to LED lamp pearl, further reduction LED lamp pearl's operating temperature.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a diagram: the three-dimensional structure of the utility model is shown schematically;

FIG. 2 is a diagram of: the utility model discloses a front view cross-sectional view of a heat radiation component;

FIG. 3 is a diagram of: the utility model discloses LED chip's structural schematic.

In the figure: 1. the LED lamp comprises a base, 2, a supporting rod, 3, a fixing plate, 4, a heat dissipation box, 5, a substrate, 6, a lampshade, 7, LED lamp beads, 8, an insulating layer, 9, a first bonding layer, 10, a heat conduction layer, 11, a second bonding layer, 12, a heat dissipation fan, 13, a cooling fin, 14, a through hole, 15, a first air outlet, 16, a second air outlet, 17 and a fixing hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a reduce LED light source structure of LED chip junction temperature based on COB encapsulation, which comprises a base 1, the top of base 1 is provided with four bracing pieces 2, the top of four bracing pieces 2 is provided with fixed plate 3, the top of fixed plate 3 sets up radiator unit, radiator unit's top is provided with base plate 5, the top of base plate 5 is provided with a plurality of heat transfer assembly, each heat transfer assembly's top has been provided with LED lamp pearl 7, setting through heat transfer assembly, the heat that LED lamp pearl 7 produced when moving loops through insulating layer 8, first bond line 9, heat-conducting layer 10, second bond line 11 and base plate 5 transmit to fin 13, realize thermal transmission, the heat that makes LED lamp pearl 7 produce obtains timely transmission, conveniently give off the heat, setting through radiator unit, the air of having realized heat dissipation box 4 inner chamber flows fast, conveniently take the heat that fin 13 produced out of heat dissipation box 4 inner chamber, realize thermal giving off, reduce the temperature, and then realized the heat dissipation to LED lamp pearl 7.

As preferred scheme, furthermore, the radiator unit is including heat dissipation case 4, heat dissipation fan 12, fin 13 and through-hole 14, heat dissipation case 4 sets up between fixed plate 3 and base plate 5, the fixed embedded inner chamber at heat dissipation case 4 of heat dissipation fan 12, a plurality of fin 13 sets gradually the bottom at base plate 5 from a left side to the right side, a plurality of through-hole 14 link up and sets up the outer wall at base plate 5, start heat dissipation fan 12, make heat dissipation fan 12 blow the outer wall of fin 13 with the air, and discharge through second venthole 16, the air fast flow of 4 inner chambers of heat dissipation case has been realized, conveniently take the inner chamber of heat dissipation case 4 out of the heat that fin 13 produced, realize thermal giving off, reduce the temperature, and then realized the heat dissipation to LED lamp pearl 7.

As preferred scheme, furthermore, heat transfer assembly is including insulating layer 8, first bond line 9, heat-conducting layer 10 and second bond line 11, insulating layer 8 sets up the bottom at LED lamp pearl 7, first bond line 9 sets up the bottom at insulating layer 8, heat-conducting layer 10 pastes the bottom at first bond line 9, second bond line 11 pastes the bottom at heat-conducting layer 10 and bonds at the top of base plate 5, the heat that LED lamp pearl 7 produced can loop through insulating layer 8 in the operation, first bond line 9, heat-conducting layer 10, second bond line 11 and base plate 5 transmit to fin 13, realize thermal transmission, the heat that makes LED lamp pearl 7 produce obtains timely transmission, conveniently give off the heat.

As preferred scheme, furthermore, the top of base plate 5 is provided with arc-shaped lamp shade 6, the first venthole 15 of a plurality of has been seted up to the outer wall of lamp shade 6, a plurality of second venthole 16 has been seted up along the axial to the bottom of heat dissipation case 4, setting through lamp shade 6, can make the air of blowing in the 6 inner chambers of lamp shade and the contact of the arc inner wall of lamp shade 6, through first venthole 15 exhaust lamp shade 6, the air flow of 6 inner chambers of lamp shade has been realized, can directly dispel the heat to LED lamp pearl 7, further reduction LED lamp pearl 7's operating temperature, setting through second venthole 16, can make the air escape of heat dissipation case 4, realize the air flow of 4 inner chambers of heat dissipation case, realize the heat dissipation to fin 13.

As preferred scheme, it is further, first bond line 9 and second bond line 11 are graphite alkene layer, heat-conducting layer 10 is the copper sheet layer, insulating layer 8 is heat conduction insulating layer 8, first bond line 9 of making through graphite alkene layer can realize carrying out thermal transmission on the contact of connecting heat-conducting layer 10 and insulating layer 8, setting through the copper sheet layer, can realize the transmission to the heat, the copper sheet layer has good heat transfer nature, accelerate the time of heat transfer, can make base plate 5 be connected with heat-conducting layer 10 through second bond line 11, still can be with heat transfer to base plate 5, the realization carries out the purpose of timely transmission to the heat that LED lamp pearl 7 produced.

As preferred scheme, further, base plate 5 is aluminum plate, and aluminum plate has good heat transfer performance, conveniently transmits the heat that LED lamp pearl 7 produced.

Preferably, four fixing holes 17 are formed in the bottom end of the base 1 in a penetrating manner, and the device can be fixed and installed by using fasteners conveniently through the fixing holes 17.

The working principle is as follows: when the device is used, heat generated by the LED lamp beads 7 in operation can be transmitted to the radiating fins 13 sequentially through the insulating layer 8, the first adhesive layer 9, the heat conducting layer 10, the second adhesive layer 11 and the substrate 5, so that heat transmission is realized, the heat generated by the LED lamp beads 7 is transmitted timely, and the heat is conveniently radiated;

start heat dissipation fan 12, make heat dissipation fan 12 blow the air to the outer wall of fin 13, and discharge through second venthole 16, the air fast flow of 4 inner chambers of heat dissipation case has been realized, the convenient inner chamber of heat dissipation case 4 of bringing heat dissipation case 4 out of with fin 13 production, realize thermal giving off, the cooling, and then realized the heat dissipation to LED lamp pearl 7, when heat dissipation fan 12 starts, can make the air blow in the inner chamber of lamp shade 6 and contact with the arc inner wall of lamp shade 6 through-hole 14, through first venthole 15 discharge lamp shade 6, the air flow of 6 inner chambers of lamp shade has been realized, can directly dispel the heat to LED lamp pearl 7, further reduction LED lamp pearl 7's operating temperature.

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. An LED light source structure based on COB encapsulation that reduces LED chip junction temperature characterized in that: including base (1), the top of base (1) is provided with four bracing pieces (2), four the top of bracing piece (2) is provided with fixed plate (3), the top of fixed plate (3) sets up radiator unit, radiator unit's top is provided with base plate (5), the top of base plate (5) is provided with a plurality of heat transfer assembly, each heat transfer assembly's top has been provided with LED lamp pearl (7).

2. The COB-based LED light source structure capable of reducing the junction temperature of the LED chip as claimed in claim 1, wherein: the heat dissipation assembly comprises a heat dissipation box (4), a heat dissipation fan (12), a heat dissipation sheet (13) and a through hole (14), the heat dissipation box (4) is arranged between a fixing plate (3) and a base plate (5), the heat dissipation fan (12) is fixedly embedded in an inner cavity of the heat dissipation box (4) and is a plurality of the heat dissipation sheet (13) is sequentially arranged at the bottom end of the base plate (5) from left to right and is a plurality of the through hole (14) is communicated with the outer wall of the base plate (5).

3. The COB-based LED light source structure capable of reducing the junction temperature of the LED chip as claimed in claim 1, wherein: the heat transfer component comprises an insulating layer (8), a first bonding layer (9), a heat conducting layer (10) and a second bonding layer (11), the insulating layer (8) is arranged at the bottom end of the LED lamp bead (7), the first bonding layer (9) is arranged at the bottom end of the insulating layer (8), the heat conducting layer (10) is adhered to the bottom end of the first bonding layer (9), and the second bonding layer (11) is adhered to the bottom end of the heat conducting layer (10) and adhered to the top end of the substrate (5).

4. The COB-based LED light source structure capable of reducing the junction temperature of the LED chip as claimed in claim 2, wherein: the top of base plate (5) is provided with arc lamp shade (6), a plurality of first venthole (15) have been seted up to the outer wall of lamp shade (6), a plurality of second venthole (16) have been seted up along the axial in the bottom of heat dissipation case (4).

5. The COB-based LED light source structure capable of reducing the junction temperature of the LED chip, according to claim 3, wherein: the first bonding layer (9) and the second bonding layer (11) are graphene layers, the heat conduction layer (10) is a copper sheet layer, and the insulation layer (8) is a heat conduction insulation adhesive layer.

6. The COB-based LED light source structure capable of reducing the junction temperature of the LED chip as claimed in claim 1, wherein: the base plate (5) is an aluminum plate.

7. The COB-based LED light source structure capable of reducing the junction temperature of the LED chip as claimed in claim 1, wherein: the bottom end of the base (1) is provided with four fixing holes (17) in a penetrating way.