CN201100917Y - High-efficiency LED packaging structure - Google Patents

Abstract

The utility model relates to a high efficiency LED constructs dress structure, mainly including: the packaged LED substrate comprises a nonmetal substrate, wherein the outer end face of the nonmetal substrate is provided with a predetermined number of LED crystals and a pre-designed circuit, and the LED crystals are connected with the circuit by a lead to form the packaged LED substrate; the heat radiation module is arranged below the LED substrate and comprises a packaging frame fixedly arranged with the nonmetal substrate, the tail end of the packaging frame is provided with a nonmetal heat radiation layer with a porous structure, a hollow containing space is arranged between the nonmetal substrate and the nonmetal heat radiation layer, air in the hollow containing space can be convected by virtue of pores of the nonmetal heat radiation layer, so that heat generated by the LED crystal can be rapidly conducted and evenly distributed on the metal film layer to form a heat soaking effect, and then the heat of the metal film layer is rapidly conducted to the nonmetal heat radiation layer at the other end by virtue of the heat convection in the hollow containing space to dissipate heat, so that the LED packaging structure is simplified and the heat radiation effect is rapid.

Description

High efficiency LED structure

technical field

The utility model relates to the technical field of high-efficiency LED construction, in particular to a high-efficiency LED construction structure.

Background technique

LED is the abbreviation of Light-Emitting Diode (Light-Emitting Diode), which is a solid-state light-emitting element made of semiconductor materials. The principle of luminescence is to convert electrical energy into light, that is, to apply current to compound semiconductors. Through the combination of electrons and holes, the excess energy will be released in the form of light to achieve the effect of luminescence. It belongs to cold luminescence and has a lifespan of up to ten years. More than 10,000 hours. The biggest features of LEDs are: no need for idling time, fast response, small size, low power consumption, shock resistance, low pollution, suitable for mass production, high reliability, and easy to be made into a very small or Array elements. But because LED is a solid-state lighting, that is, when the chip is energized, the quantum excited state returns to emit energy (light), but in the process of emitting light, the light energy in the chip cannot be completely transmitted to the outside world, and the energy that cannot be emitted is in the inside of the chip and It will be absorbed in the package, forming heat. The general conversion efficiency of LED is only about 10% to 30%, so less than 0.2W of 1W of electricity can be turned into visible light, and the rest is heat. If the heat is not dissipated, the accumulated heat will damage the efficiency and life of the chip. . Therefore, in order to apply high-efficiency LEDs to lighting equipment, the problem of heat dissipation must first be solved. Most of the existing LED heat dissipation adopts metal heat sinks, or combined with heat pipes, cooling chips, vapor chambers, heat dissipation fans, etc., which generally have disadvantages such as poor heat dissipation effect, insufficient heat dissipation speed, complex heat dissipation module structure, and high cost. . As for the construction method of the LED chip, take the Taiwan New Patent No. M311116 "Structure Improvement of the Printed Circuit Board of the Light-Emitting Diode Carrier" as an example (refer to the patent announcement data on May 01, 2007), which includes: the substrate; An insulating layer, the first insulating layer is stacked on one side of the substrate; a copper layer, the copper layer is stacked on one side of the first insulating layer, and the copper layer has a second insulating layer; and a surface layer, The surface layer is stacked on one side of the copper layer and adjacent to the side of the second insulating layer; wherein, the substrate can be an aluminum plate or an aluminum sheet. In this previous proposal, LED chips are constructed on an aluminum metal substrate. Since the substrate to be constructed is made of metal, an insulating layer must be laminated on one side of the substrate. Thick heat dissipation performance is poor, too thin and lose insulation performance. This is the biggest deficiency in the prior art, and this deficiency has become a difficult problem to be overcome urgently in the industry.

Utility model content

In view of this, the main purpose of the present invention is to provide a high-efficiency LED assembly structure, which can simplify the LED assembly structure and quickly dissipate heat.

In order to achieve the above object, the utility model adopts the following schemes to realize:

A high-efficiency LED construction structure, which is mainly composed of a construction LED substrate and a heat dissipation module. The construction LED substrate includes a non-metal substrate, and a predetermined number of LED crystals and pre-set LED crystals are arranged on the outer end surface of the non-metal substrate. For the designed circuit, the inner end surface of the non-metallic substrate can be provided with a metal thin film layer, and the LED crystal and the circuit are connected by wires to form a structured LED substrate. The heat dissipation module is located under the structured LED substrate. The packaging frame fixed on the metal substrate, the end of the packaging frame is provided with a non-metal heat dissipation layer with a porous structure, and there is a hollow space between the non-metal substrate and the non-metal heat dissipation layer, so that the air in the hollow space can pass through the non-metal heat dissipation layer. The pores of the metal heat dissipation layer have convection.

In the above solution, the heat dissipation module can also adopt the following method: the heat dissipation module arranged under the LED substrate is composed of a porous non-metallic heat dissipation layer, and the non-metal heat dissipation layer is opposite to the surface of the LED substrate. Has a hollow space.

From the above scheme, it can be seen that the heat generated by the LED crystal set on the non-metallic substrate can be quickly conducted and evenly distributed in the metal film layer to form a heat uniform effect, and then the heat convection in the hollow space will dissipate the metal The heat of the film layer is quickly conducted to the non-metal heat dissipation layer at the other end for heat dissipation, which has the effect of simplifying the LED structure and rapid heat dissipation.

Description of drawings

Fig. 1 is the combined sectional view of the utility model embodiment;

Fig. 2 is the combined sectional view of the utility model having a metal film layer embodiment;

Fig. 3 is a combined sectional view of another embodiment of the utility model.

Explanation of reference signs:

1 Construct LED substrate 10 Non-metallic substrate

11 LED crystal 12 circuit

13 wires 2 heat dissipation module

20 package frame 21 non-metal heat dissipation layer

22 hollow space 3 metal film layer

4 heat dissipation module 40 non-metallic heat dissipation layer

41 hollow space

Detailed ways

In order to achieve the aforementioned purpose of the utility model, the following examples are listed and described as follows with accompanying drawings, so that those skilled in the art can gain a better understanding of the structure, features and achieved effects of the utility model.

First of all, please refer to Fig. 1. As can be seen from Fig. 1, the utility model is mainly composed of a structure LED substrate 1 and a heat dissipation module 2. The structure LED substrate 1 includes a non-metal substrate 10 (the non-metal substrate is made of Conductive and non-metallic materials with heat dissipation effect, such as: glass substrate, alumina substrate, zirconia substrate, silicon carbide substrate, etc.), the outer end surface of the non-metal substrate 10 is provided with a predetermined number of LED crystals 11 and pre-designed The circuit 12, the LED crystal 11 and the circuit 12 are connected with the wire 13 to form the LED substrate 1. The heat dissipation module 2 is arranged under the LED substrate 1 and includes a packaging frame fixed to the non-metallic substrate 10. 20. The end of the packaging frame 20 is provided with a non-metallic heat dissipation layer 21 with a porous structure (the non-metallic heat dissipation layer 21 with a porous structure, refer to the Chinese Taiwan No. I256322 and M256967 patents applied by the designer of this case), the non-metallic There is a hollow space 22 between the substrate 10 and the non-metal heat dissipation layer 21, so that the air in the hollow space 22 can convect through the pores of the non-metal heat dissipation layer 21, so that the LED crystal 11 arranged on the non-metal substrate 10 produces The heat can be conducted quickly, and the heat can be quickly conducted to the non-metallic heat dissipation layer 21 at the other end through the heat convection in the hollow space 22 to dissipate heat, which has the effect of simplifying the LED structure and quickly dissipating heat.

Please refer to Fig. 2, the inner end surface of the aforementioned non-metallic substrate 10 of the utility model can be provided with a metal thin film layer 3, and the metal thin film layer 3 has a thermal diffusion effect, so that the heat generated by the LED crystal 11 arranged on the non-metallic substrate 10 It can be quickly conducted by the metal thin film layer 3 and evenly distributed in the metal thin film layer 3 to form a heat uniform effect, and then the heat of the metal thin film layer 3 can be quickly conducted to the other end by the heat convection in the hollow space 22 The non-metal heat dissipation layer 21 dissipates heat.

Please refer to Fig. 3, the aforementioned heat dissipation module 4 of the utility model arranged under the LED substrate 1 is a non-metallic heat dissipation layer 40 with a porous structure (the nonmetal heat dissipation layer 40 with a porous structure refers to the design of the present case designer) China Taiwan No. I256322 and No. M256967 patents), the non-metallic heat dissipation layer 40 has a hollow space 41 with respect to the non-metallic substrate 10 surface of the LED substrate 1. Similarly, the air in the hollow space 41 can Through convection through the pores of the non-metallic heat dissipation layer 40, the heat generated by the LED crystal 11 disposed on the non-metallic substrate 10 can be quickly conducted, and the heat can be quickly conducted to the other end through the heat convection in the hollow space 41 The non-metallic heat dissipation layer 40 dissipates heat, which has the effect of simplifying the LED structure and quickly dissipating heat. In this embodiment, the inner end surface of the non-metal substrate 10 can be provided with a metal thin film layer 3, and the metal thin film layer 3 has a thermal diffusion effect, so that the heat generated by the LED crystal 11 arranged on the non-metal substrate 10 can be quickly absorbed by the metal thin film layer. 3 Conduction, and evenly distributed in the metal thin film layer 3, forming a uniform heat effect, and then quickly conduct the heat of the metal thin film layer 3 to the non-metallic heat dissipation layer 40 at the other end by the heat convection in the hollow space 41 to dissipate heat .

However, the above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model. All equivalent structural changes made by those skilled in the art using the utility model description and claims should be Included in the patent scope of the present utility model.

Claims (4)

1, a kind of high efficiency LED assembling structure is characterized in that, mainly includes:

Structure dress LED substrate includes non-metal base plate, and the circuit that this non-metal base plate outer face is provided with the LED crystal of predetermined quantity and designs in advance, LED crystal and circuit constitute structure dress LED substrate with wire bond;

The heat radiation module, be located at the below of structure dress LED substrate, it includes the package shelf that sets firmly with non-metal base plate, this package shelf end is provided with the nonmetal heat dissipating layer with multi-pore structure, has between the hollow appearance hole convection current that interior air can borrow this nonmetal heat dissipating layer to have between hollow was held between this non-metal base plate and nonmetal heat dissipating layer.

2, high efficiency LED assembling structure as claimed in claim 1 is characterized in that, described non-metal base plate inner face is provided with metal film layer.

3, high efficiency LED assembling structure as claimed in claim 1 is characterized in that, the described heat radiation module of being located at structure dress LED substrate below constitutes by having mushy nonmetal heat dissipating layer, and the relative non-metal base plate mask of this nonmetal heat dissipating layer has between the hollow appearance.

4, high efficiency LED assembling structure as claimed in claim 3 is characterized in that, described non-metal base plate inner face is provided with metal film layer.

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