CN100594323C - High power semiconductor lighting lamp - Google Patents
High power semiconductor lighting lamp Download PDFInfo
- Publication number
- CN100594323C CN100594323C CN200710039473A CN200710039473A CN100594323C CN 100594323 C CN100594323 C CN 100594323C CN 200710039473 A CN200710039473 A CN 200710039473A CN 200710039473 A CN200710039473 A CN 200710039473A CN 100594323 C CN100594323 C CN 100594323C
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- China
- Prior art keywords
- led
- upright post
- post type
- radiator
- heat transfer
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- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000009413 insulation Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a high-power semiconductor light, comprising a bracket, an LED drive plate, a radiator block and a group of LED modules, wherein, the radiator block is pieced together by a plurality of column radiators and connecting strips, and a LED bolt which is formed into a whole with the LED modules penetrates a copper backing and is fixed on the bottom of a column hole in the centerof the column radiator; the LED drive plate is fixed on the top part of a bracket and inside a thermal baffle which is fixed with the bracket; the bracket is provided with fairleads and radiating holes, and is fixed with a hole of a heat transferring plate; and the LED drive plate is electrically connected with the LED modules. The column radiator consists of a column heat conductor, the heat transferring plates and fins, is made into a whole by adopting aluminum materials with good thermal conduction, can improve heat-sinking capability to ambient space, and fulfill the development of a street lamp, a pendent lamp, a ceiling embedded lamp, and other high-power or semiconductor light fittings.
Description
Technical field
The present invention relates to a kind of semi-conductor lighting lamp, particularly a kind of high power semiconductor lighting lamp.
Background technology
The semi-conductor electricity light source is a kind of electric light source that does not have filament, is a kind of luminescent device that directly electric energy is converted into luminous energy, is called light emitting diode, is also referred to as semiconductor lamp, the English LED that is called for short.Semiconductor lighting is considered to the new energy-conserving light source of illumination of 21 century.LED is not only energy-conservation, also have the life-span long, volume is little, safety, environmental protection, characteristics such as non-maintaining, easy to control.LED can replace conventional light source to use in a lot of places, and the speed of LED replacement traditional lighting light source has been quickened in the particularly appearance of great power LED, also makes LED become real in the large-area applications of room lighting.
Great power LED is a direction of LED industry future development, but great power LED is had relatively high expectations to heat dissipation technology, the power of led module is big more, the heat flow density of its chip is just high more, environment temperature reaches certain limit will very fast generation light decay, directly cause the decline in LED life-span, the temperature of led chip sharply rises and damages led chip when the effect of radiator is bad, has only the heat dissipation technology that solves great power LED, delay the light decay of LED to greatest extent, the application of the large-area popularization great power LED of ability.
At present, the heat radiation of high-power LED module is adopted plate shaped extrusion section bar electronic radiation device mostly or is adopted aluminium ingot Digit Control Machine Tool processing heat radiator.The geometry of the electronic radiation device of this structure is fixing, and volume is big, does not have good heat dissipation channel, and the heat radiation of LED lighting is relatively poor and comparatively fast produce light decay, directly causes the decline in LED life-span.Adopt the radiator of aluminium ingot Digit Control Machine Tool processing, its development cost are very high.
Summary of the invention
Fixing for the geometry that solves the electronic radiation device, volume is big, and the LED radiating effect is relatively poor and be not suitable for the special project heat radiation of led module, the invention provides a kind of high power semiconductor lighting lamp.
The technical solution adopted for the present invention to solve the technical problems is: comprise support, LED drive plate, radiator group and one group of led module, this radiator group is pieced together by several upright post type radiators and connection strap, and the LED bolt that constitutes one with led module passes on the leghole bottom surface that copper backing is fixed on upright post type radiator center; The LED drive plate is fixed on the top of support and the inside of thermal insulation board, and thermal insulation board and support fix, and has fairlead and louvre on support, and support and heat transfer film perforation fix, and the LED drive plate is electrically connected with led module.
Described upright post type radiator is to constitute one by upright post type heat carrier, heat transfer sheet and fin; In the upright post type heat carrier, have leghole and LED fixing hole, and at the bottom of the leghole, filled and led up the copper stopper; Be provided with fin and heat transfer sheet around the upright post type heat carrier, the latter end of heat transfer sheet is provided with the heat transfer film perforation, and the both sides of its heat transfer sheet are provided with fin.
The invention has the beneficial effects as follows, the structure that this direction that makes progress along thermal current is arranged radiated rib is compared with traditional plate shaped electronic radiation device, its remarkable advantage is, heat in the led module is absorbed heat fast by copper backing with superpower heat absorption capacity or copper stopper, again by heat absorption, the heat radiation upright post type heat carrier of balanced aluminium matter is conducted heat on heat transfer sheet and the fin, these heats and surrounding air are carried out heat exchange, just can increase the coefficient of heat transfer, can reduce the temperature difference between radiator and the surrounding air, with the temperature that reduces to greatest extent in the led module, reduce the light decay of led module, reach the purpose that improves the led module life-span; Simultaneously because of having adopted the upright post type radiator mode of piecing together to realize high power semiconductor lighting lamp, secondly advantage is, the upright post type radiator can be with being squeezed into section bar, can cut use, compact conformation, improved the heat-sinking capability in space towards periphery, can satisfy the exploitation street lamp, hang multiple high power or other semiconductor lamps such as lamp, ceiling embedded lamp.
Description of drawings
Fig. 1 is the structural representation of a kind of embodiment of the present invention.
Fig. 2 is the upward view of Fig. 1.
Fig. 3 is the structural representation of the upright post type radiator in embodiment illustrated in fig. 2.
Fig. 4 is the B-B cutaway view of Fig. 3.
1. supports among the figure, 101. fairleads, 102. louvres, 2.LED drive plate, 3. thermal insulation board, 4. upright post type heat carrier, 401. legholes, 402.LED fixing hole, 5.LED bolt, 6. copper backing, 7.LED module, 8. radiator group, 9. heat transfer film perforation, 10. connection strap, 11. upright post type radiators, 12. the copper stopper, 13. heat transfer sheets, 14. fins, 15. fin, 16. fins, 17.LED fin.
The specific embodiment
By Fig. 1～shown in Figure 4, the present invention includes support 1, LED drive plate 2, radiator group 8 and one group of led module 7, this radiator group 8 is pieced together by several upright post type radiators 11 and connection strap 10, the LED bolt 5 that constitutes one with led module 7 passes copper backing 6, is fixed on threadably on leghole 401 bottom surfaces at upright post type radiator 11 centers; LED drive plate 2 is fixed on the top of support 1 and the inside of thermal insulation board 3, thermal insulation board 3 fixes with support 1, on support 1, have the louvre 102 of fairlead 101 that the power line of introducing LED drive plate 2 and this support 1 be fixed and radiator group 8 distribute heats, support 1 fixes with heat transfer film perforation 9 usefulness screw modes, and LED drive plate 2 is electrically connected with led module 7.
In order to prevent that dust from dropping on the radiator group 8, can be provided with aluminium matter lampshade on the step of support 1.When this support 1 need be connected with screw socket, on support 1 top, can connect insulation crust and screwed socket successively.
Described upright post type radiator 11 is to constitute one by upright post type heat carrier 4, heat transfer sheet 13, fin 14, fin 15 and fin 16; In upright post type heat carrier 4, have leghole 401 and LED fixing hole 402,, in the end of leghole 401, filled and led up copper stopper 12 in order to reduce the temperature of led module 7 rapidly; In order to distribute the heat in upright post type heat carrier 4 rapidly, be provided with heat transmission fin 16 and heat transfer sheet 13 around it, the latter end of heat transfer sheet 13 is provided with heat transfer film perforation 9, and also is provided with heat transmission fin 14 and fin 15 on the both sides of its heat transfer sheet 13; Upright post type radiator 11 adopts the good aluminum of thermal conductivity to make.
The heat-radiating substrate of led module 7 generally have carry LED bolt 5 and the plate LED fin 17 of strap bolt not.The led module 7 that has LED fin 17 can fix with LED fixing hole 402 usefulness screw modes.Can change system into the metal pcb board to copper backing 6, also can be combined into several copper backings 6 flat board of one, this plate side can make the metal pcb board, and can soldering surface mounted formula led module 7, opposite side is connected with upright post type radiator 11, or is cast into one with upright post type radiator 11.
When using lower-powered led module 7 or great power LED, the leghole 401 in upright post type radiator 11 can be not open-minded, only leave in case of necessity can fixed L ED the hole get final product; The size or its fixed form different of the power output of led module 7 and heat-radiating substrate, the inner and outer diameter shape of upright post type heat carrier 4 is then different with size with the number of size and heat transfer sheet 13, fin 14, fin 15 and fin 16; Upright post type radiator 11 can not only be pieced together and makes high power semiconductor lightings such as round, square, rectangle, stripe shape and multiangular, also can single upright post type radiator 11 makes single various high-power LED lighting fixtures.
Claims (3)
1, a kind of high power semiconductor lighting lamp, comprise support, LED drive plate, radiator group and one group of led module, it is characterized in that: this radiator group is pieced together by several upright post type radiators and connection strap, and the LED bolt that constitutes one with led module passes on the leghole bottom surface that copper backing is fixed on upright post type radiator center;
Be provided with thermal insulation board between support and the radiator group, thermal insulation board and support fix, the LED drive plate is arranged between the top and thermal insulation board of support, on support, have fairlead and louvre, the upright post type radiator is provided with the heat transfer film perforation, upright post type radiator and support fix by the heat transfer film perforation, and the LED drive plate is electrically connected with led module.
2, high power semiconductor lighting lamp according to claim 1 is characterized in that: the upright post type radiator is to constitute one by upright post type heat carrier, heat transfer sheet and fin;
In the upright post type heat carrier, have leghole and LED fixing hole, and at the bottom of the leghole, filled and led up the copper stopper;
Be provided with heat transfer sheet around the upright post type heat carrier, the latter end of heat transfer sheet is provided with the heat transfer film perforation, and around the upright post type heat carrier and the both sides of heat transfer sheet be respectively arranged with fin.
3, high power semiconductor lighting lamp according to claim 1 is characterized in that, described upright post type radiator adopts the good aluminum of thermal conductivity to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710039473A CN100594323C (en) | 2007-04-13 | 2007-04-13 | High power semiconductor lighting lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710039473A CN100594323C (en) | 2007-04-13 | 2007-04-13 | High power semiconductor lighting lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101285558A CN101285558A (en) | 2008-10-15 |
| CN100594323C true CN100594323C (en) | 2010-03-17 |
Family
ID=40057897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710039473A Expired - Fee Related CN100594323C (en) | 2007-04-13 | 2007-04-13 | High power semiconductor lighting lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100594323C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI460374B (en) * | 2011-08-08 | 2014-11-11 | Sunyeer Technology Co Ltd | Heat dissipation device of lamp and heat sink structure thereof |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101900263A (en) * | 2009-06-01 | 2010-12-01 | 彭云滔 | Combined high-power LED lamp |
| WO2010139179A1 (en) * | 2009-06-01 | 2010-12-09 | Peng Yuntao | Combined high-power led lamp |
| CN101922637B (en) * | 2009-08-23 | 2012-10-10 | 彭云滔 | LED modularized light source and high-power LED lamp combined by same |
| TWI395905B (en) * | 2010-10-11 | 2013-05-11 | Hon Hai Prec Ind Co Ltd | Led illumination device and conduction structure thereof |
| CN102200233A (en) * | 2011-06-20 | 2011-09-28 | 广州莱迪光电股份有限公司 | Light-emitting diode (LED) bulb lamp structure |
-
2007
- 2007-04-13 CN CN200710039473A patent/CN100594323C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI460374B (en) * | 2011-08-08 | 2014-11-11 | Sunyeer Technology Co Ltd | Heat dissipation device of lamp and heat sink structure thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101285558A (en) | 2008-10-15 |
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Address after: 277100 Shandong Province, Zaozhuang high tech Zone Fuyuan Road four No. 259 Shandong tech Industrial Co. Ltd. Patentee after: Jin Songshan Address before: 116600 Department of ENT, Development Zone Hospital, 146 West Road, Dalian Development Zone, the Yellow Sea, Liaoning Patentee before: Jin Songshan |
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Address after: 100095, 2, 1, unit 201-1, 10 building, No. 1, Gao Li Zhang Road, Haidian District, Beijing. Patentee after: Zhongke Haoding Science and Technology Co.,Ltd. Address before: 100096 Beijing Haidian District Building Material City West Road 85 Shenzhou Science Park Area A 3 Floors Patentee before: BEIJING TIMES HAODING TECHNOLOGY Co.,Ltd. |
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