CN100594323C - High Power Semiconductor Lighting Lamp - Google Patents

Abstract

The invention discloses a high-power semiconductor light, comprising a bracket, an LED drive plate, a radiator block and a group of LED modules, wherein, the radiator block is pieced together by a plurality of column radiators and connecting strips, and a LED bolt which is formed into a whole with the LED modules penetrates a copper backing and is fixed on the bottom of a column hole in the centerof the column radiator; the LED drive plate is fixed on the top part of a bracket and inside a thermal baffle which is fixed with the bracket; the bracket is provided with fairleads and radiating holes, and is fixed with a hole of a heat transferring plate; and the LED drive plate is electrically connected with the LED modules. The column radiator consists of a column heat conductor, the heat transferring plates and fins, is made into a whole by adopting aluminum materials with good thermal conduction, can improve heat-sinking capability to ambient space, and fulfill the development of a street lamp, a pendent lamp, a ceiling embedded lamp, and other high-power or semiconductor light fittings.

Description

High Power Semiconductor Lighting Lamp

technical field

The invention relates to a semiconductor lighting lamp, in particular to a high-power semiconductor lighting lamp.

Background technique

Semiconductor electric light source is a kind of electric light source without filament. It is a light-emitting device that directly converts electrical energy into light energy. It is called a light-emitting diode, also known as a semiconductor lamp, and is referred to as LED in English. Semiconductor lighting is considered to be a new energy-saving light source for lighting in the 21st century. LED not only saves energy, but also has the characteristics of long life, small size, safety, environmental protection, maintenance-free, and easy control. LEDs can already replace traditional light sources in many places, especially the emergence of high-power LEDs, which has accelerated the speed at which LEDs replace traditional lighting sources, and has also made the large-area application of LEDs in indoor lighting a reality.

High-power LEDs are a direction for the future development of the LED industry, but high-power LEDs have higher requirements for heat dissipation technology. The greater the power of the LED module, the higher the heat flux density of the chip, and the ambient temperature will soon occur when the ambient temperature reaches a certain limit. Light decay directly leads to the decline of LED life. When the effect of the radiator is not good, the temperature of the LED chip rises sharply and damages the LED chip. Promote the application of high-power LEDs.

At present, the heat dissipation of high-power LED modules mostly adopts flat extruded profile electronic heat sinks or heat sinks processed by aluminum ingot CNC machine tools. The geometric shape of the electronic radiator with this structure is fixed, the volume is large, and there is no good heat dissipation channel. The heat dissipation of the LED lighting fixture is poor and the light decays quickly, which directly leads to the decline of the life of the LED. The development cost of radiators processed by CNC machine tools of aluminum ingots is very high.

Contents of the invention

In order to solve the problem that the geometric shape of the electronic radiator is fixed, the volume is large, and the heat dissipation effect of the LED is poor, which is not suitable for the special heat dissipation of the LED module, the invention provides a high-power semiconductor lighting lamp.

The technical solution adopted by the present invention to solve the technical problem is: including a bracket, an LED driver board, a heat sink group and a group of LED modules, the heat sink group is composed of several column type heat sinks and connecting strips, and is integrated with the LED module The LED bolts pass through the copper gasket and are fixed on the bottom of the column hole in the center of the column type radiator; the LED driver board is fixed on the top of the bracket and the inside of the heat shield, the heat shield is fixed with the bracket, and there are holes on the bracket. Lead holes and heat dissipation holes, the bracket is fixed to the hole of the heat transfer sheet, and the LED driver board is electrically connected to the LED module.

The column-type heat sink is composed of a column-type heat conductor, a heat transfer sheet and a fin; a column hole and an LED fixing hole are opened in the column-type heat conductor, and a copper plug is filled in the bottom of the column hole; Ribs and heat transfer fins are arranged around the column type heat conductor, heat transfer fin holes are arranged on the end section of the heat transfer fins, and ribs are arranged on both sides of the heat transfer fins.

The beneficial effect of the present invention is that, compared with the structure of arranging the heat dissipation ribs in the upward direction of the hot air flow, its remarkable advantage is that the heat in the LED module has a super heat absorption capacity. The copper gasket or copper plug quickly absorbs heat, and then conducts the heat to the heat transfer fins and fins through the aluminum column type heat conductor that absorbs heat and dissipates more balanced heat, and exchanges the heat with the surrounding air to achieve Increasing the heat transfer coefficient can reduce the temperature difference between the radiator and the surrounding air, which will minimize the temperature in the LED module, reduce the light decay of the LED module, and achieve the purpose of improving the life of the LED module; at the same time, due to the adoption of The post-type heat sink is assembled to realize high-power semiconductor lighting. The second advantage is that the post-type heat sink can be extruded and cut, and has a compact structure, which improves the heat dissipation capacity to the surrounding space, and can meet the needs of developing street lamps, hanging lamps, etc. lamps, ceiling recessed lamps and other high-power or other semiconductor lighting fixtures.

Description of drawings

Fig. 1 is a structural schematic diagram of an embodiment of the present invention.

Fig. 2 is a bottom view of Fig. 1 .

Fig. 3 is a schematic structural view of the column radiator in the embodiment shown in Fig. 2 .

Fig. 4 is a B-B sectional view of Fig. 3 .

In the figure 1. Bracket, 101. Lead hole, 102. Cooling hole, 2. LED driver board, 3. Heat shield, 4. Column type heat conductor, 401. Column hole, 402. LED fixing hole, 5. LED bolt , 6. Copper gasket, 7. LED module, 8. Radiator group, 9. Heat transfer sheet hole, 10. Connecting strip, 11. Column type radiator, 12. Copper plug, 13. Heat transfer sheet, 14. Fin, 15. fin, 16. fin, 17. LED heat sink.

Detailed ways

As shown in Figures 1 to 4, the present invention includes a bracket 1, an LED driver board 2, a radiator group 8 and a group of LED modules 7, and the radiator group 8 is composed of several column radiators 11 and connecting strips 10. The LED bolt 5 integrally formed with the LED module 7 passes through the copper gasket 6, and is threadedly fixed on the bottom surface of the column hole 401 in the center of the column type heat sink 11; the LED driver board 2 is fixed on the top of the bracket 1 and the heat shield 3, the heat shield 3 is fixed to the bracket 1, and the bracket 1 is provided with a power line leading to the LED driver board 2, a lead hole 101 where the bracket 1 is fixed, and a cooling hole 102 for dissipating heat from the radiator group 8. The bracket 1 and the heat transfer sheet hole 9 are fixed with screws, and the LED driver board 2 is electrically connected with the LED module 7 .

In order to prevent dust from falling on the radiator group 8 , an aluminum lampshade can be arranged on the step of the bracket 1 . When the bracket 1 needs to be connected with the screw socket, the insulating shell and the threaded lamp cap can be sequentially connected on the top of the bracket 1 .

The column type heat sink 11 is composed of a column type heat conductor 4, heat transfer fins 13, fins 14, fins 15 and fins 16; a column hole 401 and an LED are fixed in the column type heat conductor 4 In the hole 402, in order to quickly reduce the temperature of the LED module 7, a copper plug 12 is filled in the bottom of the column hole 401; in order to quickly dissipate the heat in the column type heat conductor 4, a heat dissipation rib 16 is arranged around it And heat transfer fins 13, heat transfer fin holes 9 are provided on the end of the heat transfer fins 13, and fins 14 and ribs 15 for heat dissipation are also provided on both sides of the heat transfer fins 13; column type heat dissipation Device 11 is made of aluminum material with good thermal conductivity.

The heat dissipation substrate of the LED module 7 generally has flat LED heat sinks 17 with LED bolts 5 and without bolts. The LED module 7 with the LED heat sink 17 can be fixed to the LED fixing hole 402 with screws. The copper spacer 6 can be changed into a metal PCB board, and several copper spacers 6 can also be assembled into a flat plate. One side of the flat plate can be made into a metal PCB board, and the patch-type LED module 7 can be welded. One side is connected with the column type radiator 11, or is die-cast integrally with the column type radiator 11.

When using a less powerful LED module 7 or a high-power LED, the column hole 401 in the column type heat sink 11 may not be opened, and only a hole that can fix the LED is provided if necessary; the output power of the LED module 7 and The size of the heat dissipation substrate or its fixing method is different, while the shape and size of the inner and outer diameters of the column type heat conductor 4 and the number and size of the heat transfer fins 13, fins 14, fins 15 and fins 16 are different; The device 11 can not only be combined into high-power semiconductor lighting fixtures such as round, square, rectangular, strip and polygonal shapes, but also a single column type radiator 11 can be made into various high-power LED lighting fixtures.

Claims (3)

1. A high-power semiconductor lighting lamp, including a bracket, an LED driver board, a radiator group, and a group of LED modules, characterized in that: the radiator group is composed of several column-type radiators and connecting bars, and is composed of LED modules The integrated LED bolt is fixed on the bottom surface of the column hole in the center of the column radiator through the copper gasket; There is a heat shield between the bracket and the radiator group, and the heat shield is fixed to the bracket. The LED driver board is arranged between the top of the bracket and the heat shield. There are lead holes and heat dissipation holes on the bracket. The column type heat dissipation The radiator is provided with heat transfer sheet holes, the column type radiator and the bracket are fixed through the heat transfer sheet holes, and the LED driver board is electrically connected with the LED module. 2. The high-power semiconductor lighting lamp according to claim 1, characterized in that: the column-type heat sink is composed of a column-type heat conductor, heat transfer fins and fins; There are column holes and LED fixing holes in the column type heat conductor, and copper plugs are filled in the bottom of the column holes; A heat transfer sheet is arranged around the column type heat conductor, a heat transfer sheet hole is arranged on the end section of the heat transfer sheet, and ribs are respectively arranged around the column type heat conductor and both sides of the heat transfer sheet. 3. The high-power semiconductor lighting lamp according to claim 1, wherein the column-type heat sink is made of aluminum material with good thermal conductivity.

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