CN201057381Y - High power semiconductor lighting lamp - Google Patents
High power semiconductor lighting lamp Download PDFInfo
- Publication number
- CN201057381Y CN201057381Y CNU200720068940XU CN200720068940U CN201057381Y CN 201057381 Y CN201057381 Y CN 201057381Y CN U200720068940X U CNU200720068940X U CN U200720068940XU CN 200720068940 U CN200720068940 U CN 200720068940U CN 201057381 Y CN201057381 Y CN 201057381Y
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- China
- Prior art keywords
- led
- radiator
- upright post
- post type
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a high power semiconductor illumination which comprises a frame, a LED drive board, a radiator set and a group of LED modules. The radiator set comprises a plurality of pole-shaped radiators and connecting strips; a LED bolt which is integrated with the LED module after going through a copper gasket is fixed to the bottom face of a pole hole at the center of the pole-shaped radiator; the LED drive board is fixed to the top of the frame and the interior of a heat shield which is fixed with the frame; a lead through hole and a radiation hole are cut on the frame which is fixed with a hole of a radiator sheet; the LED drive board is electrically connected with the LED module. The pole-shaped radiator consists of a pole-shaped heat conductor, the radiator sheet and fins and is made of aluminum materials with good heat conduction into an integration, which improves the radiation capability to the surrounding environment and meets requirements of various high power or other semiconductor illuminations such as road lamps, hanging lamps and embedding lamps in ceiling.
Description
Technical field
The utility model relates to a kind of semi-conductor lighting lamp, particularly a kind of high power semiconductor lighting lamp.
Background technology
The semi-conductor electricity light source is a kind of electric light source that does not have filament, is a kind of luminescent device that directly electric energy is converted into luminous energy, is called light emitting diode, is also referred to as semiconductor lamp, the English LED that is called for short.Semiconductor lighting is considered to the new energy-conserving light source of illumination of 21 century.LED is not only energy-conservation, also have the life-span long, volume is little, safety, environmental protection, characteristics such as non-maintaining, easy to control.LED can replace conventional light source to use in a lot of places, and the speed of LED replacement traditional lighting light source has been quickened in the particularly appearance of great power LED, also makes LED become real in the large-area applications of room lighting.
Great power LED is a direction of LED industry future development, but great power LED is had relatively high expectations to heat dissipation technology, the power of led module is big more, the heat flow density of its chip is just high more, environment temperature reaches certain limit will very fast generation light decay, directly cause the decline in LED life-span, the temperature of led chip sharply rises and damages led chip when the effect of radiator is bad, has only the heat dissipation technology that solves great power LED, delay the light decay of LED to greatest extent, the application of the large-area popularization great power LED of ability.
At present, the heat radiation of high-power LED module is adopted plate shaped extrusion section bar electronic radiation device mostly or is adopted aluminium ingot Digit Control Machine Tool processing heat radiator.The geometry of the electronic radiation device of this structure is fixing, and volume is big, does not have good heat dissipation channel, and heat-sinking capability is relatively poor and comparatively fast produce light decay, directly causes the decline in LED life-span.Adopt the radiator of aluminium ingot Digit Control Machine Tool processing, its development cost are very high.
Summary of the invention
Fixing for the geometry that solves the electronic radiation device, volume is big, and the LED radiating effect is relatively poor and be not suitable for the special project heat radiation of led module, and the utility model provides a kind of high power semiconductor lighting lamp.
The technical scheme that its technical problem that solves the utility model adopts is: comprise support, LED drive plate, radiator group and one group of led module, this radiator group is pieced together by several upright post type radiators and connection strap, and the LED bolt that constitutes one with led module passes on the leghole bottom surface that copper backing is fixed on upright post type radiator center; The LED drive plate is fixed on the top of support and the inside of thermal insulation board, and thermal insulation board and support fix, and has fairlead and louvre on support, and support and heat transfer film perforation fix, and the LED drive plate is electrically connected with led module.
Described upright post type radiator is to constitute one by upright post type heat carrier, heat transfer sheet and fin; In the upright post type heat carrier, have leghole and LED fixing hole, and at the bottom of the leghole, filled and led up the copper stopper; Be provided with fin and heat transfer sheet around the upright post type heat carrier, the latter end of heat transfer sheet is provided with the heat transfer film perforation, and the both sides of its heat transfer sheet are provided with fin.
The invention has the beneficial effects as follows, the structure that this direction that makes progress along thermal current is arranged radiated rib is compared with traditional plate shaped electronic radiation device, its remarkable advantage is, heat in the led module is absorbed heat fast by copper backing with superpower heat absorption capacity or copper stopper, again by heat absorption, the heat radiation upright post type heat carrier of balanced aluminium matter is conducted heat on heat transfer sheet and the fin, these heats and surrounding air are carried out heat exchange, just can increase the coefficient of heat transfer, can reduce the temperature difference between radiator and the surrounding air, with the temperature that reduces to greatest extent in the led module, reduce the light decay of led module, reach the purpose that improves the led module life-span; Simultaneously because of having adopted the upright post type radiator mode of piecing together to realize high power semiconductor lighting lamp, secondly advantage is, the upright post type radiator can be with being squeezed into section bar, can cut use, compact conformation, improved the heat-sinking capability in space towards periphery, can satisfy the exploitation street lamp, hang multiple high power or other semiconductor lamps such as lamp, ceiling embedded lamp.
Description of drawings
Fig. 1 is the structural representation of a kind of embodiment of the present utility model.
Fig. 2 is the upward view of Fig. 1.
Fig. 3 is the structural representation of the upright post type radiator in embodiment illustrated in fig. 2.
Fig. 4 is the B-B cutaway view of Fig. 3.
1. supports among the figure, 101. fairleads, 102. louvres, 2.LED drive plate, 3. thermal insulation board, 4. upright post type heat carrier, 401. legholes, 402.LED fixing hole, 5.LED bolt, 6. copper backing, 7.LED module, 8. radiator group, 9. heat transfer film perforation, 10. connection strap, 11. upright post type radiators, 12. the copper stopper, 13. heat transfer sheets, 14. fins, 15. fin, 16. fins, 17.LED fin.
The specific embodiment
By Fig. 1~shown in Figure 4, the utility model comprises support 1, LED drive plate 2, radiator group 8 and one group of led module 7, this radiator group 8 is pieced together by several upright post type radiators 11 and connection strap 10, the LED bolt 5 that constitutes one with led module 7 passes copper backing 6, is fixed on threadably on leghole 401 bottom surfaces at upright post type radiator 11 centers; LED drive plate 2 is fixed on the top of support 1 and the inside of thermal insulation board 3, thermal insulation board 3 fixes with support 1, on support 1, have the louvre 102 of fairlead 101 that the power line of introducing LED drive plate 2 and this support 1 be fixed and radiator group 8 distribute heats, support 1 fixes with heat transfer film perforation 9 usefulness screw modes, and LED drive plate 2 is electrically connected with led module 7.
In order to prevent that dust from dropping on the radiator group 8, can be provided with aluminium matter lampshade on the step of support 1.When this support 1 need be connected with screw socket, on support 1 top, can connect insulation crust and screwed socket successively.
Described upright post type radiator 11 is to constitute one by upright post type heat carrier 4, heat transfer sheet 13, fin 14, fin 15 and fin 16; In upright post type heat carrier 4, have leghole 401 and LED fixing hole 402,, in the end of leghole 401, filled and led up copper stopper 12 in order to reduce the temperature of led module 7 rapidly; In order to distribute the heat in upright post type heat carrier 4 rapidly, be provided with heat transmission fin 16 and heat transfer sheet 13 around it, the latter end of heat transfer sheet 13 is provided with heat transfer film perforation 9, and also is provided with heat transmission fin 14 and fin 15 on the both sides of its heat transfer sheet 13.
Described upright post type radiator 11 adopts the good aluminum of thermal conductivity to make.
The heat-radiating substrate of led module 7 generally have carry LED bolt 5 and the plate LED fin 17 of strap bolt not.The led module 7 that has LED fin 17 can fix with LED fixing hole 402 usefulness screw modes.Can change system into the metal pcb board to copper backing 13, also can be combined into several copper backings 6 flat board of one, this plate side can make the metal pcb board, and can soldering surface mounted formula led module 7, opposite side is connected with upright post type radiator 11, or is cast into one with upright post type radiator 11.
When using lower-powered led module 7 or great power LED, the leghole 401 in upright post type radiator 11 can be not open-minded, only leave in case of necessity can fixed L ED the hole get final product; The size or its fixed form different of the power output of led module 7 and heat-radiating substrate, the inner and outer diameter shape of upright post type heat carrier 4 is then different with size with the number of size and heat transfer sheet 13, fin 14, fin 15 and fin 16; Upright post type radiator 11 can not only be pieced together and makes high power semiconductor lightings such as round, square, rectangle, stripe shape and multiangular, also can single upright post type radiator 11 makes single various high-power LED lighting fixtures.
Claims (3)
1. high power semiconductor lighting lamp, comprise support, LED drive plate, radiator group and one group of led module, it is characterized in that: this radiator group is pieced together by several upright post type radiators and connection strap, and the LED bolt that constitutes one with led module passes on the leghole bottom surface that copper backing is fixed on upright post type radiator center;
The LED drive plate is fixed on the top of support and the inside of thermal insulation board, and thermal insulation board and support fix, and has fairlead and louvre on support, and support and heat transfer film perforation fix, and the LED drive plate is electrically connected with led module.
2. high power semiconductor lighting lamp according to claim 1 is characterized in that: the upright post type radiator is to constitute one by upright post type heat carrier, heat transfer sheet and fin;
In the upright post type heat carrier, have leghole and LED fixing hole, and at the bottom of the leghole, filled and led up the copper stopper;
Be provided with fin and heat transfer sheet around the upright post type heat carrier, the latter end of heat transfer sheet is provided with the heat transfer film perforation, and the both sides of its heat transfer sheet are provided with fin.
3. high power semiconductor lighting lamp according to claim 1 is characterized in that, described upright post type radiator adopts the good aluminum of thermal conductivity to make.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200720068940XU CN201057381Y (en) | 2007-04-13 | 2007-04-13 | High power semiconductor lighting lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200720068940XU CN201057381Y (en) | 2007-04-13 | 2007-04-13 | High power semiconductor lighting lamp |
Publications (1)
Publication Number | Publication Date |
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CN201057381Y true CN201057381Y (en) | 2008-05-07 |
Family
ID=39426224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNU200720068940XU Expired - Fee Related CN201057381Y (en) | 2007-04-13 | 2007-04-13 | High power semiconductor lighting lamp |
Country Status (1)
Country | Link |
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CN (1) | CN201057381Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102242890A (en) * | 2011-05-30 | 2011-11-16 | 陶珊瑚 | Spliced LED (Light Emitting Diode) street lamp |
-
2007
- 2007-04-13 CN CNU200720068940XU patent/CN201057381Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102242890A (en) * | 2011-05-30 | 2011-11-16 | 陶珊瑚 | Spliced LED (Light Emitting Diode) street lamp |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
DD01 | Delivery of document by public notice |
Addressee: Jin Songshan Document name: Notification to Pay the Fees |
|
DD01 | Delivery of document by public notice |
Addressee: Jin Songshan Document name: Notification of Termination of Patent Right |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080507 Termination date: 20100413 |