CN201555083U - Multi-chip high-power LED lamp and a radiator structure - Google Patents

Multi-chip high-power LED lamp and a radiator structure Download PDF

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Publication number
CN201555083U
CN201555083U CN2009202707308U CN200920270730U CN201555083U CN 201555083 U CN201555083 U CN 201555083U CN 2009202707308 U CN2009202707308 U CN 2009202707308U CN 200920270730 U CN200920270730 U CN 200920270730U CN 201555083 U CN201555083 U CN 201555083U
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CN
China
Prior art keywords
power led
substrate
integrated
chip high
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009202707308U
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Chinese (zh)
Inventor
刘薇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Kingsun Optoelectronic Co Ltd
Original Assignee
Dongguan Kingsun Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Kingsun Optoelectronic Co Ltd filed Critical Dongguan Kingsun Optoelectronic Co Ltd
Priority to CN2009202707308U priority Critical patent/CN201555083U/en
Application granted granted Critical
Publication of CN201555083U publication Critical patent/CN201555083U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a multi-chip high-power LED lamp and a radiator structure. A concave surface integrated with a plurality of LED chips is formed on the base surface of the lamp; the chips after being integrated are coated with fluorescent rubber; a plurality of heat conduction pipes are extended out from two sides of the base-plate; and a plurality of radiating fins are mounted on each heat conduction pipe. Therefore, the utility model leaves out multiple thermal resistances formed by heat sink, the connection between heat sink and the aluminum base-plate, the aluminum base-plate, the connection between the aluminum base-plate and the radiating bodies and the like, so as to efficiently improve radiating capacity and achieve better radiating effect; and the utility model has excellent heat conducting effect, and efficiently solves the problems of integration and heat dissipation of the multi-chip high-power LED lamp, so as to efficiently solve the problems of the multi-chip high-power LED lamp.

Description

Multi-chip high power LED light fixture and radiator structure
Technical field
The utility model relates to a kind of radiator structure of multicore sheet packaged high-power LED light fixture, is used for the road traffic lighting field.
Background technology
The prior art relevant with the application, its fitting structure normally with a plurality of led chips by heat sink welding of aluminum substrate, and aluminium base is connected one with the lamp radiator housing reaches the heat radiation purpose, two electrodes of led chip are realized interconnecting by a plurality of pellet electrodes that are provided with on the welding substrate.This light fixture is owing to be subjected to the restriction of radiating condition, volume is generally bigger, the integrated super-high-power LED of multicore sheet that adopts is because its caloric value is many at present, heat sink, substrate and this traditional packaged type thermal resistance of housing radiator are big, make the needs that traditional radiator behind the light fixture can not satisfy heat radiation at all, cause the integrated super-high-power LED unstable properties of multicore sheet, and then can not extensive use.
The utility model content
The purpose of this utility model is to provide a kind of multi-chip high power LED light fixture and radiator structure, effectively solves the heat dissipation problem of the integrated high-power LED lamp of multicore sheet.
For this purpose, the utility model provides a kind of multi-chip high power LED light fixture, it comprises a substrate, substrate is offered the concave surface of integrated a plurality of led chips on basal plane, at the integrated a plurality of led chips of concave bottom, scribble fluorescent glue on a plurality of chips after integrated, be stamped optical lens on the substrate, extend many heat pipes respectively in the substrate both sides, a plurality of fin are installed on the heat pipe.
The utility model provides a kind of radiator structure of multi-chip high power LED light fixture simultaneously, it comprises a substrate, substrate is offered the concave surface of integrated a plurality of led chips on basal plane, extend many heat pipes respectively in the substrate both sides, and a plurality of fin are installed on the heat pipe.
The multi-chip high power LED light fixture that the utility model provides, a plurality of chips are integrated into the substrate concave surface, the radiator structure that this is novel, in the substrate both sides a plurality of heat pipes are set, a plurality of fin are set on heat pipe, have saved being connected between heat sink, heat sink and the aluminium base, aluminium base and aluminium base and multiple thermal resistances such as being connected of radiator, thereby, effectively improve heat-sinking capability, reach better radiating effect; Heat-conducting effect is very good, effectively solves the integrated and heat dissipation problem of multi-chip high power LED light fixture.
Below in conjunction with accompanying drawing technical solutions of the utility model are described in further detail.
Description of drawings
Fig. 1 is the structural representation of the utility model multi-chip high power LED light fixture;
Fig. 2 is the utility model multi-chip high power LED lamp cooling structure schematic diagram;
Fig. 3 is the integrated schematic diagram of multicore sheet of the utility model multi-chip high power LED light fixture.
The specific embodiment
In order to understand the utility model, make those skilled in the art can realize the utility model, see also Fig. 1 to Fig. 3.
Referring to Fig. 2, the radiator structure 1 of the multi-chip high power LED light fixture that this is novel, it comprises a substrate 2, substrate 2 is offered the concave surface of integrated a plurality of led chips on basal plane, extend many heat pipes 3 respectively in substrate 2 both sides, a plurality of fin 4 are installed on the heat pipe 3.
Referring to Fig. 1, Fig. 3, multi-chip high power LED light fixture 5 of the present utility model, it comprises a substrate 2, substrate 2 is offered the concave surface of integrated a plurality of led chips on basal plane, at the integrated a plurality of led chips 6 of concave bottom, scribble fluorescent glue on a plurality of chips 6 after integrated, be stamped optical lens 7 on the substrate 2, extend many heat pipes 3 respectively in substrate 2 both sides, a plurality of fin 4 are installed on the heat pipe 3.Its substrate and heat pipe adopt the red copper material, and heat-conducting effect is better.Save multiple thermal resistance, adopted heat-pipe radiating apparatus, further improved radiating effect.

Claims (2)

1. multi-chip high power LED light fixture, it comprises a substrate, it is characterized in that: described substrate is offered the concave surface of integrated a plurality of led chips on basal plane, at the integrated a plurality of led chips of concave bottom, scribble fluorescent glue on a plurality of chips after integrated, be stamped optical lens on the substrate, extend many heat pipes respectively, a plurality of fin are installed on the heat pipe in the substrate both sides.
2. the radiator structure of a multi-chip high power LED light fixture, it comprises a substrate, it is characterized in that: described substrate is offered the concave surface of integrated a plurality of led chips on basal plane, extends many heat pipes respectively in the substrate both sides, and a plurality of fin are installed on the heat pipe.
CN2009202707308U 2009-11-25 2009-11-25 Multi-chip high-power LED lamp and a radiator structure Expired - Fee Related CN201555083U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009202707308U CN201555083U (en) 2009-11-25 2009-11-25 Multi-chip high-power LED lamp and a radiator structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009202707308U CN201555083U (en) 2009-11-25 2009-11-25 Multi-chip high-power LED lamp and a radiator structure

Publications (1)

Publication Number Publication Date
CN201555083U true CN201555083U (en) 2010-08-18

Family

ID=42614766

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009202707308U Expired - Fee Related CN201555083U (en) 2009-11-25 2009-11-25 Multi-chip high-power LED lamp and a radiator structure

Country Status (1)

Country Link
CN (1) CN201555083U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102606905A (en) * 2011-10-21 2012-07-25 杭州临安新联电器工业有限公司 Heat-pipe type LED (light emitting diode) lamp
CN103672775A (en) * 2013-12-05 2014-03-26 长兴恒动光电有限公司 LED lamp radiator
CN106439519A (en) * 2016-10-26 2017-02-22 广东合新材料研究院有限公司 Radiator and cooling method based on heat pipe-cellular aluminum structure
US10168041B2 (en) 2014-03-14 2019-01-01 Dyson Technology Limited Light fixture

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102606905A (en) * 2011-10-21 2012-07-25 杭州临安新联电器工业有限公司 Heat-pipe type LED (light emitting diode) lamp
CN103672775A (en) * 2013-12-05 2014-03-26 长兴恒动光电有限公司 LED lamp radiator
CN103672775B (en) * 2013-12-05 2016-03-23 长兴恒动光电有限公司 A kind of LED lamp heat sink
US10168041B2 (en) 2014-03-14 2019-01-01 Dyson Technology Limited Light fixture
CN106439519A (en) * 2016-10-26 2017-02-22 广东合新材料研究院有限公司 Radiator and cooling method based on heat pipe-cellular aluminum structure

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100818

Termination date: 20151125