CN202469989U - Combined three-dimensional LED (light-emitting diode) radiator - Google Patents
Combined three-dimensional LED (light-emitting diode) radiator Download PDFInfo
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- CN202469989U CN202469989U CN2012200774070U CN201220077407U CN202469989U CN 202469989 U CN202469989 U CN 202469989U CN 2012200774070 U CN2012200774070 U CN 2012200774070U CN 201220077407 U CN201220077407 U CN 201220077407U CN 202469989 U CN202469989 U CN 202469989U
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Abstract
The utility model relates to a combined three-dimensional LED (light-emitting diode) radiator. The structure of a radiator used by a traditional high-power LED lamp is of the way of mounting a chip below the radiator, and the effective heat radiation basically depends on the surface area of the radiator. The combined three-dimensional LED radiator disclosed by the utility model is provided with two layers of thin plate-like radiating fins, and a laminar heat conducting fin is clamped between the two layers of the thin plate-like radiating fins; fin-shaped bulges are arranged on the upper surface of a thin plate of the upper-layer radiating fin; folded sheets are arranged at the two ends of the thin plate of the lower-layer radiating fin, and bulged curved surfaces are arranged on the folded sheets; integrated LED chips are embedded in the thin plates of the wing-shaped radiating fins; the sections of the fin-shaped bulges are rectangular or triangular; and strip-shaped open slots are arranged on the folded sheets and the curved surfaces. The combined three-dimensional LED radiator disclosed by the utility model adopts the three-dimensional wing plate type radiating fin structure, thereby increasing the heat radiation area of the LED chips; and by arranging the heat conducting fin, the heat radiation efficiency is improved, and the service life of the LED lamp is effectively prolonged.
Description
Technical field
The utility model belongs to the LED technical field of lamps, is specifically related to a kind of combined 3 D stereo LED radiator.
Background technology
Light-emitting diodes degree pipe LED is as new generation of green environment protection solid lighting source, has a series of advantages such as few, photochromic pure, all solid state, the light weight of power consumption, volume are little, environmental protection.Have portion of energy when LED is luminous and be converted into heat, the led chip temperature is raise.And temperature to the influence of the service behaviour of led chip greatly, and high temperature can cause the photon of chip outgoing to reduce, and the colour temperature quality descends, and it is aging to accelerate chip, shortens serious consequences such as device lifetime.Therefore for guaranteeing the LED operate as normal, must its heat that comes out be distributed timely.At present the great power LED chip application is more and more, and great power LED can only be converted into luminous energy with about 10% ~ 15% input power according to data, and all the other 85% ~ 90% are converted into heat energy.The high-power LED light source is divided into two types again, and a kind of is array distributed great power LED light source, and it is several LED to be carried out array distribution arrange.Another kind is an integrated form great power LED light source, will count that LEDs is integrated to be packaged together.This LED light fixture of two types is different because of LED chip layout mode, distribution curve flux, take up room and dispel the heat above different.Comparatively speaking, it is light that the light fitting quality that integrated form great power LED light source is processed is wanted, and materials will lack aspect encapsulating material, and the requirement that also can reach street lighting is compared with array distributed great power LED light source in the luminous intensity distribution aspect, is later street lamp development trend.But because comparing array, heat radiation wants difficult, so the lost of life, become an obstruction set accepted way of doing sth high-power LED light source development key difficult problem.
It is the mode that chip is installed in the finned radiator below that traditional high-power LED lamp is the top with heat spreader structures, and its efficiently radiates heat depends on radiator surface area basically.The heat of led chip mainly relies on the base plate of radiator conduction, and is that LED installs the temperature of the temperature of upper area far above the radiator edge forever, because its heat must progressively be conducted to the radiator edge by led chip installation surface zone.And the main flow radiator all adopts 6063 aluminium, and its thermal conductivity generally is no more than 200K/W.Simultaneously, in traditional handicraft, all be coated with thermal conductive silicon lipid material in the middle of radiator and the led chip, its thermal conductivity is basically between several K/W and tens K/W.Like this, just be difficult to make the heat of led chip to be able to more effectively conduct more through radiator.
Summary of the invention
The purpose of the utility model provides a kind of heat dissipation capacity of effective raising led chip, the combined 3 D stereo LED radiator that prolongs its service life.
The technical scheme that the utility model adopted is:
A kind of combined 3 D stereo LED radiator is provided with integrated LED chip, it is characterized in that:
Described radiator is provided with two-layer laminal fin, is folded with laminar conducting strip between two radiating sheets;
The thin plate upper surface of upper strata fin is provided with the fin shape projection of array, and thin plate and fin shape projection are formed fin shape fin;
The thin plate two ends of lower floor's fin are provided with turns up sheet, turns up sheet and is provided with the curved surface of heaving, and thin plate, turns up sheet and the curved surface turned up on the sheet is formed wing fin;
Integrated LED chip is embedded in the thin plate of wing fin.
The cross section of the fin shape projection on the described fin shape fin is rectangle or triangle.
Turning up on the described wing fin is provided with the bar shaped fluting on sheet and the curved surface.
Described conducting strip edges at two ends is sealed heat-conducting glue and is sealed.
The utlity model has following advantage:
1, has higher radiating efficiency.Can the heat that led chip or large power semiconductor device produced be distributed fast, effectively reduce the semiconductor devices junction temperature, prolong the semiconductor devices life-span.
2, save material, reduce cost.Compare traditional heat-dissipating device structure, it is lighter that efficient 3 D stereo heat spreader structures can be done, and saves a large amount of non-ferrous metals, and effectively reduce the radiator cost, has good economic benefits and social benefit.
3, the long-life.Traditional heat-dissipating device and chip contact-making surface adopt materials such as silicone grease mostly, have certain service life.And efficient 3 D stereo radiator adopts high conducting strip to guarantee that radiator contacts with the effective of chip, its stable performance, and corrosion-resistant resistance to oxidation, the theoretical life-span is an endless.
4, environmental protection.Radiator all material 100% is recyclable, does not contain Toxic matter, and is free from environmental pollution.
Description of drawings
Fig. 1 is the utility model structure chart.
Among the figure, 1-fin shape fin, 2-seals heat-conducting glue, the wing fin of 3-, 4-conducting strip, 5-integrated LED chip.
The specific embodiment
Below in conjunction with the specific embodiment the utility model is carried out detailed explanation.
The described a kind of combined 3 D stereo LED radiator of the utility model is provided with two-layer laminal fin, is folded with laminar conducting strip 4 between two radiating sheets; The thin plate upper surface of upper strata fin is provided with the fin shape projection of array, and thin plate and fin shape projection are formed fin shape fin 1; The thin plate two ends of lower floor's fin are provided with turns up sheet, turns up sheet and is provided with the curved surface of heaving, and thin plate, turns up sheet and the curved surface turned up on the sheet is formed wing fin 3; Integrated LED chip 5 is embedded in the thin plate of wing fin 3.The cross section of the fin shape projection on the fin shape fin 1 is rectangle or triangle.Turning up on the wing fin 3 is provided with the bar shaped fluting on sheet and the curved surface.Conducting strip 4 edges at two ends are sealed heat-conducting glue 2 and are sealed.Wing fin 3 has bigger area of dissipation, turns up the bar shaped that all is provided with on sheet and the curved surface and slots to its booster action that dispels the heat; Fin shape fin 1 also has bigger area of dissipation.The composite set of two kinds of heat radiating fin structures both heat radiation advantages, more effectively improved radiating efficiency.The entire infrastructure of wing fin 3 and fin shape fin 1 all adopts 1060 pure aluminum materials, and 6063 traditional aluminium of its thermal conductivity ratio exceed more than 10%, can be more fast the heat of led chip be conducted.
Claims (4)
1. a combined 3 D stereo LED radiator is provided with integrated LED chip (5), it is characterized in that:
Described radiator is provided with two-layer laminal fin, is folded with laminar conducting strip (4) between two radiating sheets;
The thin plate upper surface of upper strata fin is provided with the fin shape projection of array, and thin plate and fin shape projection are formed fin shape fin (1);
The thin plate two ends of lower floor's fin are provided with turns up sheet, turns up sheet and is provided with the curved surface of heaving, and thin plate, turns up sheet and the curved surface turned up on the sheet is formed wing fin (3);
Integrated LED chip (5) is embedded in the thin plate of wing fin (3).
2. a kind of combined 3 D stereo LED radiator according to claim 1 is characterized in that:
The cross section of the fin shape projection on the described fin shape fin (1) is rectangle or triangle.
3. a kind of combined 3 D stereo LED radiator according to claim 1 and 2 is characterized in that:
Turning up on the described wing fin (3) is provided with the bar shaped fluting on sheet and the curved surface.
4. a kind of combined 3 D stereo LED radiator according to claim 3 is characterized in that:
Described conducting strip (4) edges at two ends is sealed heat-conducting glue (2) and is sealed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012200774070U CN202469989U (en) | 2012-03-05 | 2012-03-05 | Combined three-dimensional LED (light-emitting diode) radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012200774070U CN202469989U (en) | 2012-03-05 | 2012-03-05 | Combined three-dimensional LED (light-emitting diode) radiator |
Publications (1)
Publication Number | Publication Date |
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CN202469989U true CN202469989U (en) | 2012-10-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2012200774070U Expired - Fee Related CN202469989U (en) | 2012-03-05 | 2012-03-05 | Combined three-dimensional LED (light-emitting diode) radiator |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102588926A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Combination type three-dimensional light-emitting diode (LED) radiator |
CN111336484A (en) * | 2020-03-12 | 2020-06-26 | 苏州永腾电子制品有限公司 | High-efficient three-dimensional microstructure radiator |
-
2012
- 2012-03-05 CN CN2012200774070U patent/CN202469989U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102588926A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Combination type three-dimensional light-emitting diode (LED) radiator |
CN111336484A (en) * | 2020-03-12 | 2020-06-26 | 苏州永腾电子制品有限公司 | High-efficient three-dimensional microstructure radiator |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20140305 |