CN102588924A

CN102588924A - Double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator

Info

Publication number: CN102588924A
Application number: CN2012100543244A
Authority: CN
Inventors: 胡民浩; 高辉
Original assignee: SHAANXI TANGHUA ENERGY CO Ltd
Current assignee: SHAANXI TANGHUA ENERGY CO Ltd
Priority date: 2012-03-05
Filing date: 2012-03-05
Publication date: 2012-07-18

Abstract

The invention relates to a double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator. In the traditional heat radiator structure for high-power LED lamps, chips are mounted below the heat radiator. The effective radiation basically depends on the superficial area of the heat radiator. The heat radiator is provided with two layers of laminated radiating fins; both the upper surface of the upper-layer radiating fin and the lower surface of the lower-layer radiating fin are provided with fin-type protuberances of arrays; a laminated heat conducting fin is clamped between the upper-layer radiating fin and the lower-layer radiating fin; an integrated LED chip is inlayed in a thin plate of the lower-layer radiating fin; the cross section of the fin-type protuberance is rectangular or triangular; the fin-type protuberance of the upper-layer radiating fin is higher than the fin-type protuberance of the lower-layer radiating fin; and the edges at both ends of the heat conducting fin are sealed by a sealing heat conducting adhesive. According to the invention, the three-dimensional double-layer fin-type radiating fin is adopted, so as to increase the radiating area of the LED chip; and a heat conducting fin is set so that the radiating efficiency is improved, so as to effectively prolong the service life of the LED lamp.

Description

Double-deck fin type 3 D stereo LED radiator

Technical field

The invention belongs to the LED technical field of lamps, be specifically related to a kind of double-deck fin type 3 D stereo LED radiator.

Background technology

Light-emitting diodes degree pipe LED is as new generation of green environment protection solid lighting source, has a series of advantages such as few, photochromic pure, all solid state, the light weight of power consumption, volume are little, environmental protection.Have portion of energy when LED is luminous and be converted into heat, the led chip temperature is raise.And temperature to the influence of the service behaviour of led chip greatly, and high temperature can cause the photon of chip outgoing to reduce, and the colour temperature quality descends, and it is aging to accelerate chip, shortens serious consequences such as device lifetime.Therefore for guaranteeing the LED operate as normal, must its heat that comes out be distributed timely.At present the great power LED chip application is more and more, and great power LED can only be converted into luminous energy with about 10% ~ 15% input power according to data, and all the other 85% ~ 90% are converted into heat energy.The high-power LED light source is divided into two types again, and a kind of is array distributed great power LED light source, and it is several LED to be carried out array distribution arrange.Another kind is an integrated form great power LED light source, will count that LEDs is integrated to be packaged together.This LED light fixture of two types is different because of LED chip layout mode, distribution curve flux, take up room and dispel the heat above different.Comparatively speaking, it is light that the light fitting quality that integrated form great power LED light source is processed is wanted, and materials will lack aspect encapsulating material, and the requirement that also can reach street lighting is compared with array distributed great power LED light source in the luminous intensity distribution aspect, is later street lamp development trend.But because comparing array, heat radiation wants difficult, so the lost of life, become an obstruction set accepted way of doing sth high-power LED light source development key difficult problem.

It is the mode that chip is installed in the finned radiator below that traditional high-power LED lamp is the top with heat spreader structures, and its efficiently radiates heat depends on radiator surface area basically.The heat of led chip mainly relies on the base plate of radiator conduction, and is that LED installs the temperature of the temperature of upper area far above the radiator edge forever, because its heat must progressively be conducted to the radiator edge by led chip installation surface zone.And the main flow radiator all adopts 6063 aluminium, and its thermal conductivity generally is no more than 200K/W.Simultaneously, in traditional handicraft, all be coated with thermal conductive silicon lipid material in the middle of radiator and the led chip, its thermal conductivity is basically between several K/W and tens K/W.Like this, just be difficult to make the heat of led chip to be able to more effectively conduct more through radiator.

Summary of the invention

The purpose of this invention is to provide a kind of heat dissipation capacity of effective raising led chip, the double-deck fin type 3 D stereo LED radiator that prolongs its service life.

The technical scheme that the present invention adopted is:

A kind of double-deck fin type 3 D stereo LED radiator is provided with integrated LED chip, it is characterized in that:

Described radiator is provided with two-layer laminal fin, and the lower surface of the upper surface of upper strata fin and lower floor's fin is provided with the fin shape projection of array;

Be folded with laminar conducting strip between described upper strata fin and the lower floor's fin;

Described integrated LED chip is embedded in the thin plate of lower floor's fin.

The cross section of described fin shape projection is rectangle or triangle.

The height of the fin shape projection of described upper strata fin is greater than the fin shape projection of lower floor's fin.

The edges at two ends of described conducting strip is sealed heat-conducting glue and is sealed.

The present invention has the following advantages:

1, has higher radiating efficiency.Can the heat that led chip or large power semiconductor device produced be distributed fast, effectively reduce the semiconductor devices junction temperature, prolong the semiconductor devices life-span.

2, save material, reduce cost.Compare traditional heat-dissipating device structure, it is lighter that efficient 3 D stereo heat spreader structures can be done, and saves a large amount of non-ferrous metals, and effectively reduce the radiator cost, has good economic benefits and social benefit.

3, the long-life.Traditional heat-dissipating device and chip contact-making surface adopt materials such as silicone grease mostly, have certain service life.And efficient 3 D stereo radiator adopts high conducting strip to guarantee that radiator contacts with the effective of chip, its stable performance, and corrosion-resistant resistance to oxidation, the theoretical life-span is an endless.

4, environmental protection.Radiator all material 100% is recyclable, does not contain Toxic matter, and is free from environmental pollution.

Description of drawings

Fig. 1 is a structure chart of the present invention.

Among the figure, 1-upper strata fin, 2-seals heat-conducting glue, 3-lower floor fin, 4-conducting strip, 5-integrated LED chip.

The specific embodiment

Below in conjunction with the specific embodiment the present invention is carried out detailed explanation.

A kind of double-deck fin type 3 D stereo LED radiator of the present invention is provided with two-layer laminal fin, and the lower surface of the upper surface of upper strata fin 1 and lower floor's fin 3 is provided with the fin shape projection of array; Be folded with laminar conducting strip 4 between upper strata fin 1 and the lower floor's fin 3; Integrated LED chip 5 is embedded in the thin plate of lower floor's fin 3.The cross section of fin shape projection is rectangle or triangle.The height of the fin shape projection of upper strata fin 1 is greater than the fin shape projection of lower floor's fin 3.The edges at two ends of conducting strip 4 is sealed heat-conducting glue 2 and is sealed.The fin of double-deck fin-type has bigger area of dissipation, and all fin 1 structures all adopt 1060 pure aluminum materials, and 6063 traditional aluminium of its thermal conductivity ratio exceed more than 10%, can be more fast the heat of led chip be conducted.

Claims

1. a double-deck fin type 3 D stereo LED radiator is provided with integrated LED chip (5), it is characterized in that:

Described radiator is provided with two-layer laminal fin, and the lower surface of the upper surface of upper strata fin (1) and lower floor's fin (3) is provided with the fin shape projection of array;

Be folded with laminar conducting strip (4) between described upper strata fin (1) and the lower floor's fin (3);

Described integrated LED chip (5) is embedded in the thin plate of lower floor's fin (3).

2. double-deck fin type 3 D stereo LED radiator according to claim 1 is characterized in that:

The cross section of described fin shape projection is rectangle or triangle.

3. double-deck fin type 3 D stereo LED radiator according to claim 1 and 2 is characterized in that:

The height of the fin shape projection of described upper strata fin (1) is greater than the fin shape projection of lower floor's fin (3).

4. double-deck fin type 3 D stereo LED radiator according to claim 3 is characterized in that:

The edges at two ends of described conducting strip (4) is sealed heat-conducting glue (2) and is sealed.