CN101571244A - Composite flat head lamp of high-power LED chips and common LED chips - Google Patents
Composite flat head lamp of high-power LED chips and common LED chips Download PDFInfo
- Publication number
- CN101571244A CN101571244A CNA2009101079575A CN200910107957A CN101571244A CN 101571244 A CN101571244 A CN 101571244A CN A2009101079575 A CNA2009101079575 A CN A2009101079575A CN 200910107957 A CN200910107957 A CN 200910107957A CN 101571244 A CN101571244 A CN 101571244A
- Authority
- CN
- China
- Prior art keywords
- led chip
- power led
- head lamp
- led chips
- protective cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 20
- 230000001681 protective effect Effects 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 11
- 229920006351 engineering plastic Polymers 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 13
- 238000005286 illumination Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Abstract
The invention relates to a composite flat head lamp of high-power LED chips and common LED chips, mainly solving the heat output problems of the high-power LED head lamps and simultaneously solving the problem that the high-power LED as the main flat head lamp and a protective cover as an auxiliary head lamp are designed by combining both; the base electrode of the main head lamp adopts a double sided copper clad plate used for printed circuit boards; parts of copper clad plates on the positions where the high-power chips are installed and on the peripheries of the positions are corroded and most copper clad plates are respectively used as positive and negative thermal sinks of the high-power LED chips and metal plated holes are used for connecting thermal sinks at double sided positive and negative electrodes; the high-power LED chips serve as main head lamps; the end face on the periphery of a protective cover with upper part sealed by frames clings to the common LED chips; the protective cover is manufactured by transparent engineering plastics; lighting material laminae are silk-printed on the internal surface of the protective cover; the light source and a control circuit can respectively control the main head lamp and the auxiliary head lamp. The invention belongs to the technical field of the composite flat head lamp of the high-power LED chips and common LED chips.
Description
Technical field
Belong to high-power LED chip and common LED chip portfolio flat head lamp field.
Background technology
Present known high-power LED illumination all adopts the illumination of conventional lamp formula, does not also find the flat illuminating lamp of high-power LED chip, is subjected to certain limitation for universal LED illumination.
Summary of the invention
The purpose of this invention is to provide a kind of high-power LED chip and the flat illuminating lamp of common LED chip portfolio, solve above-mentioned deficiency.
Technical scheme is: substrate adopts the two-sided copper clad plate of use in printed circuit board, the copper clad plate front surface only erodes welding high-power LED chip place, other copper clad plates have solved the heat dissipation problem of high-power LED chip as high-power LED chip positive and negative electrode plate-shaped fin.High-power LED chip is as the key lighting light source.
Basic principle is: 100 for high-power LED chip, and the copper clad plate below the high-power chip is corroded, and high-power LED chip is welded on the positive fin 200 that is made of copper clad plate, and 200 constitute the led chip positive pole radiating fins; The high-power LED chip negative pole is welded on the fin 300 that is made of copper clad plate, and 300 constitute led chip negative pole fin, and 200 and 300 is electrically insulated from one another; 400 insulated substrates that erode for copper clad plate play the electric insulation effect.High-power LED chip is as the key lighting light source.The copper clad plate 200 of substrate reverse side and 300 is connected the fin that doubles with positive 200 with 300 pairs of application metal aperture 500.
The welding high power LED substrate reaches together with sealing above the high-power LED chip with substrate resistant to elevated temperatures engineering plastics plate of transparent flame-retarding or transparency glass plate protective cover 700 onesize and that same shape thickness is 3～5mm; resistant to elevated temperatures engineering plastics plate of transparent flame-retarding or transparency glass plate inner surface remove corresponding high-power chip place silk-screen lighting material layer, the translucent lighting material thin layer of corresponding high-power LED chip place silk-screen.With transparent engineering plastics plate or the tight common LED chip 600 that adheres to by the flexible circuit board welding of transparency glass plate periphery end face.
When the high-power LED chip electrified light emitting forms the key lighting light source; When common LED chip electrified light emitting, transparent engineering plastics plate or transparency glass plate inner surface are owing to there being the lighting material thin layer to form the floor light effect.The lighting material thin layer of inner surface can be realized the personalization 800 of Any Digit, literal, pattern.
The lighting material thin layer can play the effect of regulating the look end.
When high-power LED chip and common LED chip, simultaneously during electrified light emitting, also available luminescent spectrum is regulated the common LED chip illumination colour temperature of improving whole flat head lamp.
The good effect of high-power LED chip of the present invention and common LED chip portfolio flat head lamp: energy-saving and environmental protection, improve colour temperature, improve light pollution, panelized also can realize personalized illumination, because panelized is more convenient for installing.
Description of drawings
Fig. 1 is high-power LED chip and common LED chip portfolio flat head lamp key lighting lamp schematic diagram:
Among the figure:
100 is high-power LED chip;
200 is the high-power LED chip positive pole radiating fin;
300 is high-power LED chip negative pole fin;
400 for the substrate of copper clad plate after eroding partly;
500 is that the number of metal hole is the two-sided positive and negative electrode fin of connection on the positive and negative electrode fin.
Fig. 2 is high-power LED chip and common LED chip portfolio flat head lamp protective cover and assist illuminator schematic diagram:
Among the figure:
600 is the tight bonding common LED chip of protective cover periphery end face;
700 are the protection cover plate;
800 is the individual luminous pattern of assist illuminator;
900 frames for sealing key lighting lamp and assist illuminator;
100 transmit protective cover partly for high-power LED chip.
The specific embodiment
1, chooses the double-deck copper clad plate of hard used for printed circuit as substrate;
2, corroded copper clad plate by the two-sided correspondence of circuit diagram, have only welding high-power LED chip place and guarantee that positive and negative fabulous electric insulation of chip and periphery perform electric insulation and erode copper clad plate, other most copper clad plates keep, respectively as high-power LED chip positive pole radiating fin and negative pole fin;
3, high-power LED chip positive and negative electrode fin is done number of metal plating hole, and effect is electricity, the positive and negative negative pole fin of thermally coupled substrate two-sided chip, increases area of dissipation, improves the radiating effect of high-power LED chip;
4, choose high-power LED chip, both positive and negative polarity is welded on respectively on the high-power LED chip fin.
More than substantially perform the key lighting lamp.
5, the thickness of selection and the same size of aforesaid substrate is the good transparent engineering plastics plate of the fire-retardant heat resistanceheat resistant performance of 3～5mm or the clear glass protective cover as the key lighting lamp, protective cover inner surface silk-screen lighting material thin layer;
6, the latent edge of protective cover periphery end face is close to attached common LED chip with the flexible PCB welding, and electrified light emitting is as the secondary light source illuminating lamp;
7, the lighting material layer of protective cover surface silk-screen can become personalized literal, numeral, pattern by silk-screen; Through complicated optical principle, these literal, numeral, pattern are luminous when common LED chip electrified light emitting;
8, key lighting lamp substrate and protective cover are in periphery frame sealing and fixing, and the common LED chip be can not see in the outside;
9, it is bright or assist illuminator is bright or both are bright entirely that power supply can be controlled the key lighting lamp respectively;
10, the lighting material thin layer of protective cover surface silk-screen can improve colour temperature and reduce light pollution;
11, same principle can make the Assembled lamp of several high-power LED chips, increases illuminance, and the examination client needs and decides.
Use
Be applied to indoor and outdoor lighting, compartment intraoral illumination and the municipal lighting engineerings such as vehicle, steamer, railway.
Claims (4)
1, a kind of high-power LED chip and common LED chip portfolio flat head lamp, it is characterized in that: adopt the double-deck copper clad plate of use in printed circuit board as substrate, corroded copper clad plate by the two-sided correspondence of circuit diagram, have only welding high-power LED chip place and guarantee that chip both positive and negative polarity electric insulation and periphery perform electric insulation and erode copper clad plate, other most copper clad plates keep respectively as high-power LED chip positive pole radiating fin and negative pole fin; The high-power LED chip positive and negative electrode is welded on respectively on the high-power LED chip positive and negative electrode fin, and the positive and negative electrode fin is made the number of metal hole and connected the positive and negative two-sided corresponding positive and negative electrode fin of substrate, and the LED electrified light emitting constitutes the key lighting lamp.
2, according to the high-power LED chip and the common LED chip portfolio flat head lamp of claim 1; it is characterized in that: the sealing of key lighting lamp upper surface is applied the cover protective cover with the transparent engineering plastics or the clear glass of flame-resistant high-temperature-resistant; protective cover inner surface silk-screen lighting material thin layer; the latent common LED chip that is bumped into the flexible PCB welding of protective cover periphery end face is as assist illuminator.
3, according to claim 1 and require 2 high-power LED chip and common LED chip portfolio flat head lamp, it is characterized in that: protective cover inner surface silk-screen becomes personalized literal, numeral, pattern.
4, according to claim 1 and require 2 high-power LED chip and common LED chip portfolio flat head lamp, it is characterized in that: the lighting material thin layer of protective cover inner surface can improve the illumination colour temperature and alleviate light pollution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101079575A CN101571244B (en) | 2009-06-15 | 2009-06-15 | Composite flat lamp of high-power LED chips and common LED chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101079575A CN101571244B (en) | 2009-06-15 | 2009-06-15 | Composite flat lamp of high-power LED chips and common LED chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101571244A true CN101571244A (en) | 2009-11-04 |
| CN101571244B CN101571244B (en) | 2011-04-06 |
Family
ID=41230673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101079575A Expired - Fee Related CN101571244B (en) | 2009-06-15 | 2009-06-15 | Composite flat lamp of high-power LED chips and common LED chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101571244B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588926A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Combination type three-dimensional light-emitting diode (LED) radiator |
| CN102588924A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator |
| CN102809081A (en) * | 2012-08-15 | 2012-12-05 | 苏州金科信汇光电科技有限公司 | Penetration meteor tube |
-
2009
- 2009-06-15 CN CN2009101079575A patent/CN101571244B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588926A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Combination type three-dimensional light-emitting diode (LED) radiator |
| CN102588924A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator |
| CN102809081A (en) * | 2012-08-15 | 2012-12-05 | 苏州金科信汇光电科技有限公司 | Penetration meteor tube |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101571244B (en) | 2011-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhang Lihong Assignor: Jin Zili Contract record no.: 2011440020504 Denomination of invention: Composite flat head lamp of high-power LED chips and common LED chips Granted publication date: 20110406 License type: Exclusive License Open date: 20091104 Record date: 20111221 |
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| ASS | Succession or assignment of patent right |
Owner name: NANNING STONE QIMING OPTOELECTRONICS TECHNOLOGY CO Free format text: FORMER OWNER: JIN ZILI Effective date: 20120807 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518067 SHENZHEN, GUANGDONG PROVINCE TO: 530022 NANNING, GUANGXI ZHUANG AUTONOMOUS REGION |
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| TR01 | Transfer of patent right |
Effective date of registration: 20120807 Address after: 530022, the Guangxi Zhuang Autonomous Region, Nanning hi tech Zone, Zhenxing Road, 89, gold industry and Technology Park, a workshop on the third floor Patentee after: Nanning Stone Qiming Optoelectronics Technology Co., Ltd. Address before: 518067, No. 6, No. 401, 62 flower road, Shekou, Guangdong, Shenzhen, Nanshan District Patentee before: Jin Zili |
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| DD01 | Delivery of document by public notice |
Addressee: Nanning Stone Qiming Optoelectronics Technology Co., Ltd. Document name: Notification to Pay the Fees |
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| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Nanning Stone Qiming Optoelectronics Technology Co., Ltd. Document name: Notification of Passing Examination on Formalities |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110406 Termination date: 20170615 |