CN101994919A - Light emitting diode (LED) lamp with heat dissipation circuit board - Google Patents
Light emitting diode (LED) lamp with heat dissipation circuit board Download PDFInfo
- Publication number
- CN101994919A CN101994919A CN2009101015535A CN200910101553A CN101994919A CN 101994919 A CN101994919 A CN 101994919A CN 2009101015535 A CN2009101015535 A CN 2009101015535A CN 200910101553 A CN200910101553 A CN 200910101553A CN 101994919 A CN101994919 A CN 101994919A
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- Prior art keywords
- copper foil
- circuit board
- foil layer
- led
- heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Abstract
The invention discloses a light emitting diode (LED) lamp with a heat dissipation circuit board, which comprises a circuit board and an LED light emitting unit which is electrically connected on the circuit board, wherein the circuit board is a double-layer copper foil board; an insulating layer is integrally formed between the upper and lower copper foil layers; the circuit board is provided with a through hole; a heat conduction material is arranged in the through hole to form a heat conduction column; the upper and lower copper foil layers are communicated with each other by the heat conduction column; and heat, which is formed by the LED light emitting unit arranged on the upper copper foil layer, is evenly transferred to the upper and lower copper foil layers through the heat conduction column, thereby effectively radiating heat through the upper and lower copper foil layers. Therefore, the lamp has simple design structure, and the heat dissipation circuit board adopted in the invention can be freely provided with LED light emitting units with different powers according to the power of the lamp in actual demands, so that heat inside the LED lamp can be effectively radiated, thereby prolonging the service life of the lamp and effectively preventing light attenuation of the lamp.
Description
Technical field
The present invention relates to a kind of LED lamp, particularly relate to a kind of LED lamp with cooling circuit board.
Background technology
Traditional LED luminescence unit mostly is small-power, luminous efficiency, rich color based on led chip, and, use more and more stronger in the demand in general lighting and decorative lighting field to the great power LED luminescence unit to environmental pollution damage for the mercury metal of traditional fluorescent tube.
The heat radiation of great power LED luminescence unit hampers it always and uses widely, mainly is owing to can't well dispel the heat, and makes the life-span of LED luminescence unit reduce, and makes that its light decay is more serious.Chinese patent application numbers 200310118374.5 discloses a kind of high heat conduction PCB type surface adhesioluminescence diode, it mainly adopts heat-conducting metal body and led chip is packaged together, make the heat of led chip to spread out of, connect fin then at heat-conducting metal body rear portion by this heat-conducting metal body.Other has a kind of radiating mode, be to offer a circular port on circuit board, the LED luminescence unit is arranged at the circular port top, and a circular copper seat is embedded this circular port, and should upwards closely connect the aluminium base of LED luminescence unit bottom by circle copper seat, and then connect fin bottom the circular copper seat.Yet, the LED luminescence unit mainly dispels the heat by in its bottom the fin mode being set, this kind mode makes bigger for the volume of high-power LED luminescence unit, and adopt the overall structure of the LED lamp that this kind mode designs bigger, because the fin of the less timely employing larger volume of contact area of LED luminescence unit and fin still can not effectively reduce the junction temperature of led chip, and then influences the service life of this LED luminescence unit.
Summary of the invention
The objective of the invention is the defective at above-mentioned prior art existence, a kind of LED lamp with cooling circuit board is provided, this LED lamp inside is provided with cooling circuit board, makes that the junction temperature that is arranged at the led chip in the light fixture can be effectively reduced.
For achieving the above object, the present invention has the LED lamp of cooling circuit board, comprises circuit board and is electrically connected on LED luminescence unit on this circuit board.This circuit board is double-deck copper foil plate, the insulating barrier that between upper and lower copper foil layer, has one to form at interval, offer through hole on the circuit board, thereby heat-conducting is set in the through hole forms heating column, this heating column is communicated with upper and lower copper foil layer, the heat that is arranged at the LED luminescence unit formation on the copper foil layer is passed to upper and lower copper foil layer through this heating column uniformly with heat, by upper and lower copper foil layer heat is effectively radiate.
Further, etching has the conducting wire that is electrically connected as the LED luminescence unit on the last copper foil layer, and forms pad in the etching of the end of conducting wire.The some heating columns that are provided with on the circuit board become array arrangement, and the density of heating column that is positioned at LED luminescence unit below is bigger, and less away from the density of the heating column of LED luminescence unit, the density general goal all becomes evenly to arrange with the heating column at the little place of density.
This LED lamp further includes upper and lower radiating piece, upper and lower radiating piece is close to upper and lower copper foil layer setting respectively, accepting hole is offered at last radiating piece middle part, and this accepting hole sidewall polishing forms reflector, and the LED luminescence unit that is welded on the copper foil layer is contained in the reflector bottom.Upper and lower radiating piece is the fin that forms the space on metalwork.
As mentioned above, the present invention has the LED lamp of cooling circuit board, when the LED luminescence unit energising on being arranged at this circuit board with heat dispersion is lighted, the heat of its generation is passed to copper foil layer, is passed to down copper foil layer by heating column, last copper foil layer is gone out heat radiation by the radiating piece of going up close-connected with it, and following copper foil layer is gone out heat radiation by radiating piece down close-connected with it.Therefore the project organization of this light fixture is simple, select the LED luminescence unit of layout different capacity arbitrarily adopting on the cooling circuit board of the present invention the size of lamp power according to actual needs, make that the internal heat of LED lamp is effectively given off, and then prolong service life of light fixture, and effectively prevent the light decay of light fixture.
Description of drawings
In Figure of description:
Fig. 1 is the schematic diagram that the present invention has the LED lamp of cooling circuit board;
Fig. 2 is the partial schematic sectional view of the cooling circuit board of the LED lamp of the present invention with cooling circuit board;
Fig. 3 is the cooling circuit board of the LED lamp of the present invention with cooling circuit board and the assembling cross-sectional schematic of LED luminescence unit;
Fig. 4 is the cross-sectional schematic that the present invention is equiped with upper and lower radiating piece.
The description of reference numerals of each element is as follows among the figure:
Last copper foil layer 21 conducting wires 22
Following copper foil layer 27 insulating barriers 28
Last radiating piece 31 reflectors 32
Following radiating piece 36
The specific embodiment
For describing technology contents of the present invention, architectural feature, the purpose that is realized and effect in detail, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
See also Fig. 1 and Fig. 2, the LED lamp 100 with cooling circuit board comprises circuit board 20 and is electrically connected on LED luminescence unit 10 on this circuit board.This circuit board 20 is double-deck copper foil plate, the insulating barrier 28 that between upper and lower copper foil layer 21,27, has one to form at interval, offer through hole on the circuit board 20, establish heat-conducting formation heating column 26 thereby irritate in the through hole, the diameter dimension of this heating column 26 is being between 0.3mm and the 1mm, but makes corresponding adjustment according to the kiss the earth of LED luminescence unit 10.Etching has the conducting wire 22 that is electrically connected as LED luminescence unit 10 on the last copper foil layer 21, and 22 end etching forms pad 23 in the conducting wire.The density of heating column 26 that is positioned at LED luminescence unit 10 belows is bigger, and is less away from the density of the heating column 26 of LED luminescence unit 10, and the density general goal all becomes evenly to arrange with the heating column 26 at the little place of density.Conducting wire 22 and pad 23 insulation ground are arranged on the insulating barrier 28, and conducting wire 22 and pad 28 and last copper foil layer 21 other parts are provided with at interval.
As shown in Figure 3, these LED luminescence unit 10 1 bottom portions are formed with electric connection point, and this electric connection point is electrically connected with conducting wire 22 on being arranged at copper foil layer 21, and other zone seats of LED luminescence unit 10 bottoms are located on the big last copper foil layer 21 of heating column 26 density.When these LED luminescence unit 10 energisings are lighted, the heat of its generation conducts to copper foil layer 21 by the aluminium base of LED luminescence unit 10 bottoms, last copper foil layer 21 conducts to down copper foil layer 27 by himself and by heating column 26 with heat, heat effectively can be radiate by upper and lower copper foil layer 21,27 bigger areas, and then the junction temperature of reduction LED luminescence unit 10, to increase its service life and effectively to reduce light decay.
As shown in Figure 4, when great power LED luminescence unit 10 passed to big electric current, the heat of its generation can't be by upper and lower copper foil layer 21,27 heat radiations, and this moment, correspondence on upper and lower copper foil layer 21,27 added upper and lower radiating piece 31,36.Upper and lower radiating piece the 31, the 36th, the fin of formation space on metalwork.Wherein, following radiating piece 36 is close to down, and copper foil layer 27 is provided with, accepting hole is offered at last radiating piece 31 middle parts, this accepting hole sidewall polishing forms reflector 32, the LED luminescence unit 10 that is welded on the copper foil layer 21 is contained in reflector 32 bottoms, and last radiating piece 31 all is provided with at interval with conducting wire 22 and pad 23, makes and goes up radiating piece 31 and conducting wire 22 and 23 one-tenth state of insulations of pad.
When LED luminescence unit 10 energisings on being arranged at this circuit board with heat dispersion 20 are lighted, the heat of its generation is passed to copper foil layer 21, is passed to down copper foil layer 27 by heating column 26, last copper foil layer 21 is gone out heat radiation by the radiating piece 31 gone up close-connected with it, and following copper foil layer 27 is gone out heat radiation by radiating piece down close-connected with it 36.The reflector offered on last radiating piece 31 32 can be realized angle adjustment that LED luminescence unit 10 is emitted beam in order to the optically focused mode simultaneously.
In sum, protection scope of the present invention is not limited to the foregoing description, still all should belong to opinion interest field of the present invention as for the change of component count described in this specification or the replacement of equivalent elements etc.
Claims (6)
1. LED lamp with cooling circuit board, comprise circuit board and be electrically connected on LED luminescence unit on this circuit board, it is characterized in that: this circuit board is double-deck copper foil plate, the insulating barrier that between upper and lower copper foil layer, has one to form at interval, offer through hole on the circuit board, thereby heat-conducting is set in the through hole forms heating column, this heating column is communicated with upper and lower copper foil layer, the heat that is arranged at the LED luminescence unit formation on the copper foil layer is passed to upper and lower copper foil layer through this heating column uniformly with heat, by upper and lower copper foil layer heat is effectively radiate.
2. the LED lamp with cooling circuit board according to claim 1 is characterized in that: upward etching has the conducting wire that is electrically connected as the LED luminescence unit on the copper foil layer, and forms pad in the etching of the end of conducting wire.
3. the LED lamp with cooling circuit board according to claim 1 is characterized in that: this LED lamp further comprises radiating piece, should go up radiating piece and be close to the copper foil layer setting, accepting hole is offered at last radiating piece middle part, this accepting hole sidewall polishing forms reflector, and the LED luminescence unit that is electrically connected on the copper foil layer is contained in the reflector bottom.
4. the LED lamp with cooling circuit board according to claim 1 is characterized in that: the LED lamp further comprises radiating piece down, and this time radiating piece is close to copper foil layer setting down.
5. the LED lamp with cooling circuit board according to claim 1, it is characterized in that: this LED lamp further comprises upper and lower radiating piece, this upper and lower radiating piece is close to upper and lower copper foil layer setting, accepting hole is offered at last radiating piece middle part, this accepting hole sidewall polishing forms reflector, and the LED luminescence unit that is electrically connected on the copper foil layer is contained in the reflector bottom.
6. according to claim 3,4 or 5 described LED lamps with cooling circuit board, it is characterized in that: radiating piece is the fin that forms the space on metalwork.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101015535A CN101994919A (en) | 2009-08-10 | 2009-08-10 | Light emitting diode (LED) lamp with heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101015535A CN101994919A (en) | 2009-08-10 | 2009-08-10 | Light emitting diode (LED) lamp with heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101994919A true CN101994919A (en) | 2011-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101015535A Pending CN101994919A (en) | 2009-08-10 | 2009-08-10 | Light emitting diode (LED) lamp with heat dissipation circuit board |
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| Country | Link |
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| CN (1) | CN101994919A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588926A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Combination type three-dimensional light-emitting diode (LED) radiator |
| CN102588925A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Wing plate type three-dimensional light-emitting diode (LED) radiator |
| CN102588924A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator |
| CN102686019A (en) * | 2012-05-22 | 2012-09-19 | 深圳市华星光电技术有限公司 | Circuit board as well as LED (Light-Emitting Diode) lamp strip and production method thereof |
| CN102927542A (en) * | 2012-11-20 | 2013-02-13 | 上海信洁照明科技有限公司 | Heat radiation structure of LED lamp and LED lamp |
| CN103822114A (en) * | 2013-09-30 | 2014-05-28 | 孙明 | LED bulb lamp and method for manufacturing same |
| CN103884000A (en) * | 2014-04-16 | 2014-06-25 | 金丽秋 | Heat-dissipating device for LED lamp |
| CN104869744A (en) * | 2014-02-24 | 2015-08-26 | 联想(北京)有限公司 | Circuit board and preparation method thereof |
| CN110285344A (en) * | 2019-06-19 | 2019-09-27 | 厦门普为光电科技有限公司 | The lamps and lanterns of high heat dissipation efficiency |
| CN111315108A (en) * | 2018-12-12 | 2020-06-19 | 珠海方正科技高密电子有限公司 | Circuit board and electrical equipment |
-
2009
- 2009-08-10 CN CN2009101015535A patent/CN101994919A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588926A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Combination type three-dimensional light-emitting diode (LED) radiator |
| CN102588925A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Wing plate type three-dimensional light-emitting diode (LED) radiator |
| CN102588924A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator |
| CN102686019A (en) * | 2012-05-22 | 2012-09-19 | 深圳市华星光电技术有限公司 | Circuit board as well as LED (Light-Emitting Diode) lamp strip and production method thereof |
| WO2013174033A1 (en) * | 2012-05-22 | 2013-11-28 | 深圳市华星光电技术有限公司 | Circuit board, led lamp strip and manufacturing method thereof |
| CN102927542A (en) * | 2012-11-20 | 2013-02-13 | 上海信洁照明科技有限公司 | Heat radiation structure of LED lamp and LED lamp |
| CN103822114A (en) * | 2013-09-30 | 2014-05-28 | 孙明 | LED bulb lamp and method for manufacturing same |
| CN103822114B (en) * | 2013-09-30 | 2016-05-18 | 亚浦耳照明股份有限公司 | A kind of LED bulb lamp and preparation method thereof |
| CN104869744A (en) * | 2014-02-24 | 2015-08-26 | 联想(北京)有限公司 | Circuit board and preparation method thereof |
| CN103884000A (en) * | 2014-04-16 | 2014-06-25 | 金丽秋 | Heat-dissipating device for LED lamp |
| CN111315108A (en) * | 2018-12-12 | 2020-06-19 | 珠海方正科技高密电子有限公司 | Circuit board and electrical equipment |
| CN110285344A (en) * | 2019-06-19 | 2019-09-27 | 厦门普为光电科技有限公司 | The lamps and lanterns of high heat dissipation efficiency |
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Application publication date: 20110330 |