CN103884000A

CN103884000A - Heat-dissipating device for LED lamp

Info

Publication number: CN103884000A
Application number: CN201410153671.1A
Authority: CN
Inventors: 金丽秋
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-04-16
Filing date: 2014-04-16
Publication date: 2014-06-25

Abstract

The invention discloses a heat-dissipating device for an LED lamp. The heat-dissipating device comprises a substrate used as a heat-dissipating carrier, an LED light-emitting tube installed on the substrate, and an external heat-dissipating device. Lower copper foil covers the back of the substrate. Upper copper foil covers the upper surface of the substrate and is provided with an installation hole of the LED light-emitting tube. As the copper foil covers the upper surface and the lower surface of the substrate, heat generated in the working process of the LED light-emitting tube can be well dissipated through the copper foil, the heat-dissipating effect of welding points can be improved due to the plated-through hole, and the service life of the LED lamp can be prolonged.

Description

LED heat sink for lamp

Technical field

The invention provides a kind of heat abstractor, especially a kind of heat abstractor for LED illuminating industry.

Background technology

Along with expanding economy, all trades and professions are increasing for the demand of electric power resource, substantially be in supply falls short of demand and current situation is electric power, therefore saving electric energy becomes a kind of inevitable, LED lamp has entered into people's the visual field gradually as a kind of energy-conservation model in this case, LED lamp main feature is that power is little, brightness is large, save electric energy, and long service life, therefore the ratio that LED lamp occupies in illumination market is also increasing, but restrict at present a heat dispersion that principal element is exactly product of LED lamp development, the heat radiation of now common LED lamp product mainly all relies on external heat sink to complete, the quality of external heat sink has directly determined the life-span of LED lamp.To LED, illumination has new requirement at present a lot of industries, as be applied in the LED lamp on electronic jacquard, just need the number of lamp pearl more, the length long enough of aluminium base, due to increasing of lamp pearl quantity, heat generation also quite large, simple dependence relies on common external heat sink to be difficult to solve heat dissipation problem, and want the particularly preferred external heat sink of result of use to need to drop into more cost, these have all caused certain problem to production enterprise.

Summary of the invention

The deficiency that the object of the invention is to overcome above-mentioned technology provides the LED heat sink for lamp of a kind of good heat dissipation effect, long service life, has solved the LED lamp of the prior art problem that heat dispersion is poor in the time that lamp pearl quantity is too much, service life is shorter.

For achieving the above object, technical scheme of the present invention is:

LED heat sink for lamp, comprise the substrate as heat radiation carrier, be arranged on LED luminous tube and external heat sink on substrate, the back side of described substrate is coated with lower Copper Foil, the upper surface of substrate is coated with Copper Foil, on described upper Copper Foil, offer the installing hole that LED luminous tube is installed, on described substrate, offer plated through-hole, plated through-hole be positioned at LED luminous tube under.

The core part of technical solution of the present invention has been to improve the heat dispersion of LED lamp, under the condition of identical external heat sink, the present invention can first distribute a part by upper Copper Foil by the heat of the luminous generation of LED lamp pearl, the heat not dissipating can conduct on substrate by plated through-hole, then is distributed by the secondary that substrate carries out heat.

As the preferred version of the technical program, the thickness of described lower Copper Foil is 2-4mm, and the thickness of described upper Copper Foil is 2-3mm.

According to convention, for improving heat dispersion, the thicker heat dispersion of thickness that should be upper Copper Foil and lower Copper Foil is better, but actual effect is really not so, in the situation that guaranteeing that external heat sink and lamp pearl power are constant, learn through many experiments demonstration and theoretical calculate: in the time that the thickness of upper Copper Foil is less than 2mm, along with the increase heat radiation of upper copper thickness is better, in the time that the thickness of upper Copper Foil exceedes 4mm, along with the increase of upper copper thickness, it is not obvious that heat dispersion improves; Instantly when the thickness of Copper Foil is less than 2mm, along with the increase heat radiation of lower copper thickness is better, when the thickness of Copper Foil exceedes 4mm instantly, along with the increase of lower copper thickness, it is not obvious that heat dispersion improves, and therefore this preferred version selects the thickness of Copper Foil at 2-4mm, and the thickness of lower Copper Foil is at 2-3mm.

As the preferred version of the technical program, described substrate is aluminium base, is covered with copper in the upper and lower surface of aluminium base.

This preferred version is on the basis of original heat dispersion, increase the efficiency of secondary heat radiation, the heat of failing to distribute by upper Copper Foil conducts on aluminium base by plated through-hole, this preferred version aluminium substrate is as heat dissipation base, traditional glass-fiber-plate of comparing is greatly increased on heat dispersion, and be respectively covered with layer of copper in the upper and lower surface of aluminium base, because the heat dispersion of copper is considerably beyond aluminium, the heat of failing to distribute by upper Copper Foil distributes by the aluminium base of double-sided copper-clad, in the situation that external heat sink is identical, greatly improve the radiating efficiency of whole device.

Beneficial effect of the present invention is: compared with prior art, by the coated Copper Foil respectively of the upper and lower surface at substrate, the heat that LED luminous tube distributes in the time of work can well distribute by Copper Foil, plated through-hole the radiating effect that can improve pad place is set, thereby extended the service life of LED lamp.

Accompanying drawing explanation

Fig. 1 is structural representation of the present invention.

In figure: substrate 1, LED luminous tube 2, external heat sink 3, lower Copper Foil 41, upper Copper Foil 42, plated through-hole 5.

The specific embodiment

Below in conjunction with accompanying drawing, and in conjunction with the embodiments, the present invention is described further.

Embodiment:

As shown in Figure 1, LED heat sink for lamp, comprise the substrate 1 as heat radiation carrier, be arranged on LED luminous tube 2 and external heat sink 3 on substrate 1, the back side of described substrate 1 is coated with lower Copper Foil 41, and the upper surface of substrate 1 is coated with Copper Foil 42, offers the installing hole that LED luminous tube 2 is installed on described upper Copper Foil 42, on described substrate 1, offer plated through-hole 5, plated through-hole 5 be positioned at LED luminous tube 2 under.

As preferred version, the thickness of described lower Copper Foil 41 is 2-4mm, and the thickness of described upper Copper Foil 42 is 2-3mm.

According to convention, for improving heat dispersion, the thicker heat dispersion of thickness that should be upper Copper Foil 42 and lower Copper Foil 41 is better, but actual effect is really not so, in the situation that guaranteeing that external heat sink and lamp pearl power are constant, learn through many experiments demonstration and theoretical calculate: in the time that the thickness of upper Copper Foil 42 is less than 2mm, along with the increase heat radiation of upper Copper Foil 42 thickness is better, in the time that the thickness of upper Copper Foil 42 exceedes 4mm, along with the increase of upper Copper Foil 42 thickness, it is not obvious that heat dispersion improves; Instantly when the thickness of Copper Foil 41 is less than 2mm, along with the increase heat radiation of lower Copper Foil 41 thickness is better, instantly when the thickness of Copper Foil 41 exceedes 4mm, along with the increase of lower Copper Foil 41 thickness, it is not obvious that heat dispersion improves, therefore this preferred version selects the thickness of Copper Foil 42 at 2-4mm, and the thickness of lower Copper Foil 41 is at 2-3mm.

As preferred version, described substrate 1 is aluminium base, is respectively covered with layer of copper in the upper and lower surface of substrate 1.

Preferred version is on the basis of original heat dispersion, increase the efficiency of secondary heat radiation, the heat of failing to distribute by upper Copper Foil 42 conducts on aluminium base 1 by plated through-hole 5, this preferred version aluminium substrate is as heat dissipation base, traditional glass-fiber-plate of comparing is greatly increased on heat dispersion, and be respectively covered with layer of copper in the upper and lower surface of aluminium base 1, because the heat dispersion of copper is considerably beyond aluminium, the heat of failing to distribute by upper Copper Foil 42 distributes by the aluminium base 1 of double-sided copper-clad, in the situation that external heat sink is identical, greatly improve the radiating efficiency of whole device.

The heat radiation pathway of apparatus of the present invention is brought into use and is produced heat from LED luminous tube 2, first LED luminous tube 2 dispels the heat from upper Copper Foil 42, the heat that LED luminous tube 2 can be produced is dispersed most, other a part of heat of its device, conduct on the lower Copper Foil 41 and substrate 1 in double face copper by plated through-hole 5, conducted to external heat sink 3 by lower Copper Foil 41 again, carry out distributing again.Because the heat transfer property of Copper Foil is obviously better than traditional glass-fiber-plate or simple aluminium base, and the device of this double-radiation function, can greatly improve the efficiency of dissipation of heat, reduce the temperature of LED luminous tube, extend the service life of LED.

Plated through-hole 5 the radiating effect that can improve LED luminous tube 2 pad places is set, thereby extended the service life of LED lamp.

Claims

1.LED heat sink for lamp, comprise the substrate (1) as heat radiation carrier, be arranged on LED luminous tube (2) and external heat sink (3) on substrate (1), it is characterized in that: the back side of described substrate (1) is coated with lower Copper Foil (41), the upper surface of substrate (1) is coated with Copper Foil (42), on described upper Copper Foil (42), offer the installing hole for LED luminous tube (2) are installed, on described substrate (1), offer plated through-hole (5), plated through-hole (5) be positioned at LED luminous tube (2) under.

2. LED heat sink for lamp as claimed in claim 1, is characterized in that: the thickness of described lower Copper Foil (41) is 2-4mm, and the thickness of described upper Copper Foil (42) is 2-3mm.

3. LED heat sink for lamp as claimed in claim 1, is characterized in that: described substrate (1) is aluminium base, is also covered with layer of copper in the upper and lower surface of aluminium base.