CN103883989A - LED lamp with heat dissipation device - Google Patents
LED lamp with heat dissipation device Download PDFInfo
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- CN103883989A CN103883989A CN201410141122.2A CN201410141122A CN103883989A CN 103883989 A CN103883989 A CN 103883989A CN 201410141122 A CN201410141122 A CN 201410141122A CN 103883989 A CN103883989 A CN 103883989A
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Abstract
The invention provides an LED lamp which comprises an LED bulb shell, a substrate and an LED light emitting chip group. One side of the substrate (2) is attached to the inner surface of the LED bulb shell (1), the LED light emitting chip group (3) is attached to the other side of the substrate (2), the LED light emitting chip group (3) comprises one or more LED light emitting chips which are connected in series through bonding wires (22), anodes of the LED light emitting chips are electrically connected to the substrate (2), and cathodes of the LED light emitting chips are connected with a flexible circuit board (4) to form a power supply circuit with a power source. The LED light emitting chips are attached to the LED bulb shell, so that the LED light emitting chips and the bulb shell make full contact, heat of the LED light emitting chips can be dissipated outside more easily, and heat dissipation efficiency is greatly improved.
Description
Technical field
The present invention relates to LED lighting field, especially a kind of LED lamp, particularly, relates to the LED lamp with excellent heat dispersion performance.
Background technology
Along with the widespread adoption of LED, as the advantage of emerging illumination new light sources, embodied day by day significantly, but simultaneously, the unidirection luminous property of price, LED and LED need large-area heat abstractor.
The part that the puzzlement of following several items also becomes LED illumination development day by day hinders.
A, price: LED illumination is made up of LED light source, power drives, LED heat abstractor and four major parts of bulb structure, and along with constantly dropping of LED light source price, it is severe that the Cost Problems of other three parts becomes.
B, large-scale heat abstractor
Because LED can produce a large amount of heats when luminous; in design, be that protection properties of product are stable; must assist heat radiation with large-area metal, this part metal has increased light fixture cost has limited the directionality of the unidirectional bright dipping of LED, goes back the globality of the light fixture bright dipping of partial occlusion.
For example, number of patent application is that 201310242060.X, denomination of invention are " the U-shaped pipe heat dissipation, energy conservation of LED chip lamp ", and number of patent application is 201310190476.1, patent name has all proposed technical solution separately for " a kind of line style LED light source ".The present invention wishes the technical scheme that provides on this basis different.
Summary of the invention
The technological deficiency existing for LED lamp heat radiation aspect in prior art, the object of this invention is to provide a kind of LED lamp with heat abstractor, it is characterized in that, at least comprises LED lampshade 1, substrate 2 and LED luminescence chip group 3;
Wherein, a side of described substrate 2 is attached at the inner surface of described LED bulb housing 1, and described LED luminescence chip group 3 is attached at the opposite side of described substrate 2;
Described LED luminescence chip group 3 comprises one or more LED luminescence chips; And in the time that described LED luminescence chip group 3 comprises multiple LED luminescence chip, between described multiple LED luminescence chip, be connected in series by bonding line 22, the anode of described multiple LED luminescence chips is electrically connected on described substrate 2, the negative electrode of described multiple LED luminescence chips be connected with a FPC with make and power supply form current supply circuit.
Preferably, described FPC 4 is arranged on described substrate 2.
Preferably, described FPC 4 comprises L binding post, N binding post, FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chips, and described FPC anode is electrically connected with described substrate 2.
Preferably, described FPC 4 comprises FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chips, described FPC anode is electrically connected with described substrate 2, in the time that described LED lamp uses, described FPC anode and FPC negative electrode are connected with power anode and negative electrode respectively.
Preferably, the upper surface of the LED luminescence chip at least described LED luminescence chip group 3 scribbles fluorescent material 23.
Preferably, described substrate 2 is provided with at least one via hole 21 as loophole for the region or the peripheral region that attach described LED luminescence chip group 3.
Preferably, described at least one via hole 21 is evenly distributed.
Preferably, the surface area of described substrate 2 is greater than the surface area of described LED luminescence chip group 3.
Preferably, described substrate 2 is any composition in following material: sheet metal; Alloying metal sheet; Or sheet glass.
Preferably, described substrate 2 is transparence or translucent.
Further, the quantity of described substrate 2 is one or more, and accordingly, the quantity of described LED luminescence chip group 3 is no less than the quantity of described substrate 2.
The present invention is by being close to LED bulb housing by LED luminescence chip, LED luminescence chip can fully be contacted in bulb housing, and then make the LED luminescence chip can be closer to the external world, making LED luminescence chip to be more easily dispersed into the external world goes, improve widely radiating efficiency, improved service life and the service efficiency of LED lamp.And this radiating mode is easier, easy operating and realization, have good market value.
Brief description of the drawings
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that other features, objects and advantages of the present invention will become:
Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED lamp;
Fig. 2 illustrates according to the first embodiment of the present invention, the structural representation of LED lamp;
Fig. 3 illustrates according to the first embodiment of the present invention, the structural representation of the substrate of LED lamp and bulb housing, LED luminescence chip group annexation;
Fig. 4 illustrates according to the first embodiment of the present invention, the connection diagram of the substrate of LED lamp and LED luminescence chip group, FPC;
Fig. 5 illustrates according to the first embodiment of the present invention, and in LED lamp, power drives template is incorporated into the connection diagram in flexible circuitry plate structure; And
Fig. 6 illustrates according to the first embodiment of the present invention, and in LED lamp, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.
Detailed description of the invention
Those skilled in the art understand, the present invention mainly provides a kind of LED lamp with excellent heat dispersion performance, and realizing heat sinking function is mainly to rely on the LED luminescence chip of LED lamp to press close to LED bulb housing, make LED luminescence chip can with external environment condition more short distance liftoff approach, make the luminescence chip of LED can more directly contact external environment, realize more simply and easily the heat radiation of LED luminescence chip.Further, the shape that it will be appreciated by those skilled in the art that the bulb housing of described LED lamp can be circular, can be rectangle, can be also other any shapes, and this does not affect flesh and blood of the present invention, do not repeat them here,
Particularly, Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED lamp.Further, it will be appreciated by those skilled in the art that and the invention provides a kind of LED lamp, it at least comprises LED bulb housing 1, substrate 2 and LED luminescence chip group 3.Preferably, it will be appreciated by those skilled in the art that described LED lampshade 1 has formed inner space 8, and in prior art scheme, described LED luminescence chip is placed in described inner space 8.Preferably, those skilled in the art understand, described LED luminescence chip group 3 is tightly attached at the inwall of described LED bulb housing 1 by substrate 2, by described luminescence chip group 3 is tightly attached with the inwall of described LED bulb housing 1 and can be made the heat that described luminescence chip group 3 produces be dispersed in the residing external environment condition of LED lamp by the shortest approach by substrate 2, preferably, the heat of described LED luminescence chip group 3 conducts to LED bulb housing 1 by substrate 2, thereby heat is absorbed by described LED bulb housing 1 equably, the heat that described LED luminescence chip group 3 produces only need to just can directly be dispersed into the external world by very thin one deck LED bulb housing, and the heat that can not make described LED luminescence chip group 3 produce accumulates in described LED lamp in large quantities, cause the heat radiation difficulty of LED lamp, the heat that described LED luminescence chip group 3 is produced can be gone out by Quick diffusing, the temperature that has ensured LED lamp remains in rational scope, and then guarantee LED lamp is normal, safety and efficient operation.
Particularly, it will be appreciated by those skilled in the art that a side of described substrate 2 is close to the inner surface of described LED bulb housing 1, the opposite side of described substrate 2 is close to described LED luminescence chip group 3.Further, those skilled in the art understand, the inwall that described LED luminescence chip is directly attached, is fixed on to described LED bulb housing 1 has great difficulty in the realization of technology, therefore need by the described substrate 2 of middle placement with described luminescence chip 3 at described LED bulb housing 1, described substrate 2 can be fixed with described bulb housing 1 well, described substrate 2 can be fixed with described luminescence chip 3, therefore, can realize well described luminescence chip 3 and be fixed on the inwall of described LED bulb housing 1 by described substrate 2.Further, those skilled in the art understand, fixed form between fixed form between described LED bulb housing 1 and described substrate 2 and described substrate 2 and described LED luminescence chip group 3 is not unique, can realize the relatively fixing of three, this does not affect flesh and blood of the present invention, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence.Preferably, those skilled in the art understand, described substrate 2 is designed to translucent or transparence and can ensures to greatest extent that the wide part that described LED luminescence chip group 3 is launched can both exhale, if described substrate 2 is nontransparent shape or light transmission extreme difference, can cause the illuminating effect extreme difference of LED lamp, can be that the light that LED lamp projects produces many shades and blackspot, greatly affect illuminating effect and the function of LED lamp.Further, those skilled in the art understand, realize described substrate 2 transparence or translucent can by use transparent material make described substrate 2, also can be by punching at described substrate 2, so also can increase the penetration capacity of light, can make the illuminating effect of LED lamp better.The processing of any transparent or translucentization that can realize described substrate 2, all can meet the requirement of the present invention to described substrate 2, and this does not affect flesh and blood of the present invention, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that in this detailed description of the invention, the surface of described substrate 2 is obviously little than described LED luminescence chip group 3.The effect that described substrate 2 plays is mainly for connecting described LED bulb housing 1 and described LED luminescence chip group 3, so the size of described substrate 2 is not had to strict restriction, can realizing above-mentioned linkage function.But consider that if described substrate is too large, and will affect the illumination effect of described LED luminescence chip group 3 through described LED bulb housing 1, the illuminating effect of described LED lamp is made a big impact.Therefore, described substrate 2 should be realizing under the prerequisite that connects described LED bulb housing 1 and described LED luminescence chip group 3 functions, as much as possible little.Can not affect largely like this lighting function of described LED luminescence chip group 3, ensure the illuminating effect of described LED lamp, its object is consistent with described substrate 2 is designed to the transparent or translucent effect that will reach, and does not repeat them here.
Further, those skilled in the art understand, in another specific embodiment, example is specific embodiment as shown in Figure 3, the surface area of described substrate 2 is preferably more than the area of described LED luminescence chip group 3, thereby described LED luminescence chip group 3 is adhered on described substrate 2 by entirety, and further described substrate 2 is fixedly attached to the inner surface of described LED bulb housing 1.Further, it will be appreciated by those skilled in the art that attaching set forth in the present invention does not represent that described substrate 2 is attached to the inner surface of described LED bulb housing 1, and only represent that both are fixed relatively.
Further, it will be appreciated by those skilled in the art that the thickness of described substrate 2 should be less.In the thickness of described substrate 2 remains on a less thickness range, can realize better light transmission, the light that is unlikely to described LED luminescence chip group 3 is launched causes very large decay after described substrate 2, has ensured the illuminating effect of light transmission and described LED lamp.Further, if it will be appreciated by those skilled in the art that, described substrate 2 is too thick, can serious mistake stop the light that described LED luminescence chip group 3 is launched, and causes the significantly decay of described light, also can affect the heat dispersion of described LED lamp.
Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixed, its position can be determined according to the position of described LED luminescence chip group 3 is corresponding.Meanwhile, the quantity of described substrate 2 is not unique yet, and it can be also multiple can being one.Further, those skilled in the art understand determining of quantity and the determining of position of described substrate 2, mainly in order better described LED bulb housing 1 to be fitted with described LED luminescence chip group 3, can be in concrete realization, quantity and the position of dynamically adjusting described substrate 2, do not repeat them here.
In sum, described LED lamp is mainly made up of described LED bulb housing 1, described substrate 2 and described LED luminescence chip group 3.Realize being connected of described LED bulb housing 1 and described LED luminescence chip group 3 by described substrate 2, make described LED luminescence chip group 3 directly fit in described LED bulb housing 1, greatly shorten the heat conducting distance of described LED luminescence chip group 3, the heat that described LED luminescence chip group 3 is produced directly just can promptly be passed in external environment condition and go by the LED bulb housing of thin layer, greatly improve the radiating efficiency of described LED lamp, form the good thermal conductivity of LED lamp, and then the service life and the service efficiency that extend LED lamp, solve simply and easily the heat dissipation problem of LED lamp.
Further, it will be appreciated by those skilled in the art that in this detailed description of the invention, the upper surface of the LED luminescence chip in described LED luminescence chip group 3 scribbles fluorescent material.Particularly, described LED luminescence chip group 3 comprises one or more LED luminescence chips, and preferably, in the time that it comprises multiple LED luminescence chip, the electric power providing from electric power driving module all can be provided each LED luminescence chip, does not repeat them here.Further, preferably, the upper surface of wherein one or more LED luminescence chips scribbles fluorescent material, thereby the light that the LED luminescence chip of coated fluorescent material is sent is more even, and color is more easily received by consumer.
Further, those skilled in the art understand, Fig. 1 only shows the schematic diagram of LED luminescence chip group 3 described in a described substrate 2 and a group, this does not show that the present invention only only limits to one group of LED luminescence chip group 3, for example the schematic diagram that shows LED luminescence chip group 3 described in the described substrate 2 of many groups and a group embodiment illustrated in fig. 2, does not repeat them here.Further, it will be appreciated by those skilled in the art that the extremely middle preferred embodiment that drives described LED luminescence chip group 3 by circuit connecting mode of having set forth embodiment illustrated in fig. 6 at Fig. 4, specifically please refer to Fig. 4 to embodiment illustrated in fig. 6.
Fig. 2 illustrates according to the first embodiment of the present invention, the layout architecture schematic diagram of LED lamp.The layout architecture that it will be appreciated by those skilled in the art that described LED lamp is only not figure described in figure, and described LED luminescence chip group 3 can be various shapes with the combination of described substrate 2.Figure shown in described Fig. 2 is the moulding of petal type bulb lamp, wherein said LED luminescence chip group 3 is petal type structure, shape extends from the afterbody of described LED bulb housing 1, and spread out with strip along the inner surface of described LED bulb housing 1, then again gather at the top of described LED bulb housing 1, its shape is as petal.And described LED luminescence chip group 3 is connected on the inner surface of described LED bulb housing 1 by described substrate 2, utilize LED bulb housing 1 to carry out direct cross-ventilation heat radiation, LED lamp bar directly contacts with LED bulb housing 1, the heat that LED produces conducts endlessly to LED bulb housing 1, LED bulb housing 1 is through horizontal and vertical conduction air, under the convection action of cool exterior air, constantly carrying out heat exchange, LED bulb housing 1 has played good thermolysis.By this kind of design, the heat that LED luminescence chip group 3 is produced is more easily dispersed in air.It will be appreciated by those skilled in the art that the pattern diagram for other LED lamp, its general configuration, as Fig. 2 institute formula, is only that the structure of LED luminescence chip group 3 is different, therefore do not repeat them here.
With reference to embodiment illustrated in fig. 2, those skilled in the art understand, preferably, the part that described luminescence chip group 3 is placed in described LED lampshade 1 tail end is connected with electric power driving module, described electric power driving module is connected with power supply by the screw socket of described LED bulb housing 1 afterbody, and the in the situation that of Power supply, described luminescence chip group 3 is powered, driven, thereby described in gained, luminescence chip group 3 is luminous, and then make LED lamp provided by the present invention luminous.
Fig. 3 illustrates according to the first embodiment of the present invention, the structural representation of LED lamp substrate.Fig. 3 shown in it will be appreciated by those skilled in the art that is not unique LED lamp substrate structural representation, and the object of this figure only shows the general configuration of substrate 2 described in LED lamp.As shown in Figure 3, described substrate 2 is attached on the inner surface of described LED bulb housing 1, and described LED luminescence chip group 3 (this is not shown) is attached on described substrate 2 accordingly.Wherein, in this Fig. 3, a part for the substrate 2 illustrating, inwhole, be only the part of the LED bulb housing 1 of arcuation.
Further, in the present embodiment, described substrate 2 at least comprises via hole 21, particularly, the via hole 21 distributing with laser ablation ad hoc rules on described substrate 2, via hole 21 diameters, between 0.1～0.5mm, the light of LED luminescence chip group 3 can be passed through.It is not changeless it will be appreciated by those skilled in the art that the quantity of described via hole 21 and distributing.For example preferably, described via hole 21 be uniformly distributed be one rectangular, in a further advantageous embodiment, described via hole 21 is uniformly distributed and is a round shape, and in another preferred embodiment, the part of described via hole 21 is uniformly distributed, another part non-uniform Distribution, and this does not affect concrete technical scheme of the present invention.It will be appreciated by those skilled in the art that described via hole 21, at least as loophole purposes, does not repeat them here.
More specifically, described substrate 2 adopts aluminium base by punch forming, substrate 2 presents linear pattern mode cabling, which can facilitate bending, make LED luminescence chip group 3 be more prone to brake forming on substrate 2, the width of LED luminescence chip group 3 can be selected between 0.5～5mm, substrate 2 thickness are selected between 0.3～2.0mm, one group of LED luminescence chip group 3 power is preferably between 1～3W, LED luminescence chip group 3 combination is divided into the various combinations such as 3,4,6,8, to be combined into the LED lamp of different capacity, do not repeat them here.
Below in conjunction with accompanying drawing 4, Fig. 5 and Fig. 6, elaborate and how to drive the luminous preferred embodiment of described LED luminescence chip group 3 by circuit connecting mode.
Fig. 4 illustrates according to the first embodiment of the present invention, the connection diagram of LED lamp substrate and LED luminescence chip group, FPC.It will be appreciated by those skilled in the art that described Fig. 4 is not the unique connected mode figure of the present embodiment, the object of this figure is intended to the connection diagram of explanation enforcement preferred embodiment.Particularly, as shown in Figure 4, described LED luminescence chip group 3 is connected to a side of described substrate 2, the opposite side of described substrate 2 is connected with the inner surface of described bulb housing 1, it will be appreciated by those skilled in the art that the mode that described LED luminescence chip is connected with described substrate 2 is not changeless, can be for example that directly stamp is on the surface of described substrate 2, mode is varied, but does not affect flesh and blood of the present invention, therefore do not repeat them here.Meanwhile, be distributed with via hole 21 (not showing in Fig. 4) on described substrate 2, about the distribution of via hole 21, existing narration in above-mentioned Fig. 3, therefore do not repeat them here.
More specifically, between described each LED luminescence chip, be connected in series by described bonding line 22, by this kind of connected mode, between described each LED luminescence chip, can form a series circuit, power supply simultaneously and power-off simultaneously.
Further, FPC 4 described in is installed in the one end that connects power supply at described substrate 2, it will be appreciated by those skilled in the art that preferably, and the afterbody of described substrate 2 is provided with described FPC 4.Further, it will be appreciated by those skilled in the art that the method that described FPC 4 is arranged on substrate 2 is not changeless, it can use the method for pressing also can use the method for adhesion, method is multiple, but does not affect flesh and blood of the present invention, therefore do not repeat them here.
Further, in the present embodiment, as shown in FIG., preferably, the anode of last luminescence chip in described LED luminescence chip group 3 is electrically connected with described substrate 2, the negative electrode of a luminescence chip of close FPC 4 in LED luminescence chip group 3 is connected with the cathodic electricity in FPC 4 simultaneously.Further, those skilled in the art understand, in the use procedure of LED lamp provided by the invention, described substrate 2 is electrically connected the afterbody by described bulb housing 1 preferably with external power source, such external power source is normally electrically connected and obtains with the afterbody of described bulb housing 1 by lamp socket, thereby makes external power source can drive described LED lamp.Further, it will be appreciated by those skilled in the art that the both positive and negative polarity of external power source will be connected with described substrate 2, FPC 4 respectively, thus the power circuit of complete, and example is as shown in Figure 6.
Further, those skilled in the art understand, in the use procedure of LED lamp provided by the invention, alternating current is be directly electrically connected with described LED luminescence chip group with wire or first passed through to be electrically connected with described LED luminescence chip group after the rectification of external driving power, constant current by described lamp holder position again by the lamp holder of described LED lamp, and Fig. 4 and embodiment illustrated in fig. 5 in, described FPC is serving as the effect of conducting circuit and LED drive circuit carrier.
Under the direct drive pattern of AC, the alternating current direct of described lamp holder joints connects L binding post and the N binding post on the FPC 4 being wired to shown in Fig. 4 or Fig. 5, by described LED luminescence chip group being powered after EMC filter circuit, bridge rectifier, constant-current drive circuit, concrete structure as shown in FIG. 4 and 5.Wherein, described EMC filter circuit, bridge rectifier, constant-current drive circuit etc. are not shown in Fig. 4 and Fig. 5, and preferably, it is to be all directly attached to the circuit by scolding tin and FPC on FPC by COB binding technology to form path.
Further, it will be appreciated by those skilled in the art that by above-mentioned connected mode, the both positive and negative polarity of LED luminescence chip group 3 forms, thereby can the in the situation that of externally fed, can form an electric loop, by the break-make of control loop, and then control the whether luminous of described LED luminescence chip group 3.
It will be appreciated by those skilled in the art that in order to make LED lamp send the white light of better effect, coat fluorescent material 23 at the upper surface of described LED luminescence chip group 3, as shown in FIG..
Closer, how the electric loop shown in Fig. 4 is connected with power drives, below in conjunction with accompanying drawing 5 and accompanying drawing 6, the embodiment that specifically sets forth two kinds of connections.
Fig. 5 illustrates according to the first embodiment of the present invention, and in LED lamp, power drives template is incorporated into the connection diagram in flexible circuitry plate structure.It will be appreciated by those skilled in the art that described Fig. 5 is not unique structure connection layout, the object of this figure is intended to illustrate the structure connection of electric power driving module 5 and FPC 4.Particularly, as shown in Figure 5, in described FPC 4, at least comprise binding post L, binding post N, FPC anode and FPC negative electrode.Further, in the embodiment shown in fig. 5, described FPC anode and FPC negative electrode present in the mode of electric power driving module 5, and preferably those skilled in the art understand described electric power driving module 5 at least integrated AC-DC conversion module and constant-current driven module (not shown), thereby the both positive and negative polarity of described LED luminescence chip group 3 is formed.Those skilled in the art understand, described electric power driving module 5 is placed in the inside of FPC 4, becomes one of structure of FPC 4, and those skilled in the art understand, described electric power driving module 5 is integrated in method in FPC 4 to be had a variety ofly, does not repeat them here.
Further, with reference to figure 4, it will be appreciated by those skilled in the art that the negative electrode of described FPC 4 is connected with the cathodic electricity of described LED luminescence chip, the anode of described FPC 4 is electrically connected with described substrate 2.By such connected mode, make described substrate 2 with positive charge, thereby the anode of described LED luminescence chip is connected with any point of described substrate 2, and do not need to be connected to the anode of described FPC 4, save the material of described FPC 4, be also convenient to process.And in preferred variant, for structure shown in Fig. 4 to Fig. 6, also the anode of described FPC 4 can be electrically connected with the anode of described LED luminescence chip, the negative electrode of described FPC 4 is electrically connected with described substrate 2, correspondingly the negative electrode of described LED luminescence chip is electrically connected with described substrate 2, thereby also can form the current supply circuit for described LED luminescence chip.
Further, it will be appreciated by those skilled in the art that for a LED luminescence chip group, preferably each the LED luminescence chip in this LED luminescence chip group directly connects by bonding line 22, thereby forms cascaded structure.On such architecture basics, the negative electrode of first LED luminescence chip can be used as the negative electrode of described LED luminescence chip group, and the anode of last LED luminescence chip can be used as the anode of described LED luminescence chip group.Again further, change in example at one, those skilled in the art understand, each LED luminescence chip in described LED luminescence chip group also can be separately by its anodic bonding to described substrate 2, correspondingly the negative electrode of each LED luminescence chip is connected on the negative electrode of described FPC 4, and this does not affect technical scheme of the present invention.
Further, with reference to above-mentioned Fig. 4 and Fig. 5, those skilled in the art understand, in above-described embodiment and variation example, it provides the electrical interface of anode and negative electrode for described LED luminescence chip, thereby in the time that the anode of power supply and negative electrode are connected to respectively above-mentioned anode and negative electrode, can form a current supply circuit to described LED luminescence chip, not repeat them here.
More specifically, with above-mentioned embodiment illustrated in fig. 4 similar, in the LED lamp course of work provided by the invention, when described substrate 2 is electrically connected with external power source by the afterbody of bulb housing 1, described external power source drives described luminescence chip group 3 by described electric power driving module 5 grades, thereby it is luminous to control described luminescence chip group 3.By this kind of connection, described electric power driving module 5, under the effect of FPC 4, forms electric loop with described substrate 2 and described LED luminescence chip group 3, reaches the effect of controlling described luminescence chip break-make.
Fig. 6 illustrates according to the first embodiment of the present invention, and in LED lamp, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.In conjunction with above-mentioned embodiment illustrated in fig. 4, those skilled in the art understand described FPC 4 and at least comprise FPC anode, i.e. LED+ shown in Fig. 6, and FPC negative electrode, i.e. LED-shown in Fig. 6.Described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chips, and described FPC anode is electrically connected with described substrate 2.By such connected mode, described in connecting when external power source 7 substrate 2 with positive charge, form anodal, thereby the both positive and negative polarity of described luminescence chip group 3 is formed.It will be appreciated by those skilled in the art that described Fig. 6 is not unique structure connection layout, the object of this figure is intended to illustrate the structure connection of external power source (external drive part) 7 and FPC 4.By this kind of design, can control the circuit on-off of whole luminescence chip group 3 by described FPC 4, realize the whether luminous control to luminescence chip group 3.
Further, shown in figure 6, under DC mode activated, the alternating current direct of above-mentioned lamp holder joints connects and is wired on external driving power, carry out after EMC filter circuit, bridge rectifier, constant-current drive circuit in power supply inside, by the positive and negative electrode on the FPC above wire connecting lamp bar, finally form path again.It will be appreciated by those skilled in the art that FPC has only played the effect of communication line here, do not possess the ability that AC directly drives.
Further, with reference to above-mentioned Fig. 1 to Fig. 6, those skilled in the art understand, above-mentioned Fig. 1 to Fig. 6 is not the unique structure connection layout of the present invention, and the object of above-mentioned figure is intended to illustrate the structure of LED lamp provided by the invention and wherein structure, the connection of LED luminescence chip group and FPC.As shown in Figure 5, described substrate 2 preferably adopts metallic conductor, so cannot realize complicated circuit and telegraph circuit, so preferably thereunder region laminating great-wall shaped FPC, and according to arranging of substrate, multiple LED luminescence chip groups can be set, and between each LED luminescence chip group, preferably adopting parallel way, quantity in parallel is to be determined by the number of described LED luminescence chip group.Preferably, the quantity of described LED luminescence chip group can be selected between 3-10 bar, and according to power difference, combination also can be different, and this does not affect technical scheme of the present invention.
Further, the bottom of described substrate 2 is anodes, and the negative electrode of described substrate 2 is connected to FPC by bonding line, as shown in Figure 4.And Fig. 4 can be understood to a detail section in Fig. 5, Fig. 6, electric power driving module 5 and wiring part are made up of below rectangular region in Fig. 5.Electric power driving module 5 shown in Fig. 5 mainly comprises following parts, for example EMC filter circuit, bridge rectifier, constant-current drive circuit and other holding circuits composition.By above-mentioned technical scheme, make LED lamp provided by the invention can pass through DC powered, also can drive by alternating current, installation and debugging are safeguarded and all become very simple.Further, the alternating current direct of above-mentioned lamp holder joints connects L ac terminal, the N ac terminal on the FPC 4 being wired to above lamp bar, after EMC filter circuit, bridge rectifier, constant-current drive circuit, wherein EMC filter circuit, bridge rectifier, constant-current drive circuit are to be all directly attached to the circuit by scolding tin and FPC on FPC by COB (chip On board) binding technology to form path.
Further, those skilled in the art understand, because described substrate 2 preferably adopts metal, therefore described substrate 2 can only serve as an electrode, and LED is a LED device, and wanting luminously must have 2 electrodes, one adds positive voltage, one adds negative voltage, and circuit part relies on FPC to complete, as shown in Figure 4.FPC is without delivering to tail end line place, can greatly save like this cost of wiring board, FPC only needs to be connected with the electrode cathode of first chip, after the LED quantity of connecting certain, anode conducts electricity conducting by substrate true qualities, directly fit together by via hole or welding with the anode on FPC, realize the conducting of circuit.
Above specific embodiments of the invention are described.It will be appreciated that, the present invention is not limited to above-mentioned specific implementations, and those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (11)
1. a LED lamp with heat abstractor, is characterized in that, at least comprises LED bulb housing (1), substrate (2) and LED luminescence chip group (3);
Wherein, a side of described substrate (2) is attached at the inner surface of described LED bulb housing (1), and described LED luminescence chip group (3) is attached at the opposite side of described substrate (2);
Described LED luminescence chip group (3) comprises one or more LED luminescence chips; And in the time that described LED luminescence chip group (3) comprises multiple LED luminescence chip, between described multiple LED luminescence chip, be connected in series by bonding line (22), it is upper that the anode of described multiple LED luminescence chips is electrically connected to described substrate (2), and the negative electrode of described multiple LED luminescence chips is connected to make to form current supply circuit with power supply with a FPC (4).
2. LED lamp according to claim 1, is characterized in that, described FPC (4) is preferably arranged on described substrate (2).
3. LED lamp according to claim 1 and 2, it is characterized in that, described FPC (4) comprises L binding post, N binding post, FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chips, and described FPC anode is electrically connected with described substrate (2).
4. LED lamp according to claim 1 and 2, it is characterized in that, described FPC (4) comprises FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chips, described FPC anode is electrically connected with described substrate (2), in the time that described LED lamp uses, described FPC anode and FPC negative electrode are connected with power anode and negative electrode respectively.
5. according to the LED lamp described in any one in claim 1 to 4, it is characterized in that, the upper surface of the LED luminescence chip at least described LED luminescence chip group (3) scribbles fluorescent material (23).
6. according to the LED lamp described in any one in claim 1 to 5, it is characterized in that, described substrate (2) is provided with at least one via hole (21) as loophole for the region or the peripheral region that attach described LED luminescence chip group (3).
7. LED lamp according to claim 6, is characterized in that, described at least one via hole (21) is evenly distributed.
8. according to the LED lamp described in any one in claim 1 to 7, it is characterized in that, the surface area of described substrate (2) is greater than the surface area of described LED luminescence chip group (3).
9. according to the LED lamp described in any one in claim 1 to 8, it is characterized in that, described substrate (2) is any composition in following material:
-sheet metal;
-alloying metal sheet; Or
-sheet glass.
10. according to the LED lamp described in any one in claim 1 to 9, it is characterized in that, preferably, described substrate (2) is transparence or translucent.
11. according to the LED lamp described in claim 1 to 10 any one, it is characterized in that, the quantity of described substrate (2) is one or more, and accordingly, the quantity of described LED luminescence chip group (3) is no less than the quantity of described substrate (2).
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| CN201410141122.2A CN103883989B (en) | 2014-04-09 | 2014-04-09 | A kind of LED with heat abstractor |
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