CN204805986U - Multipoint mode distribution LED lamp - Google Patents

Abstract

The utility model provides a multipoint mode distribution LED lamp, its characterized in that includes LED bulb shell (1), LED luminescence chip group (3) at least, LED luminescence chip group (3) is arranged in LED bulb shell 1) in, wherein, the surface of LED bulb shell (1) is equipped with a plurality of heat dissipation points (7). The utility model discloses a surface of bulb shell (1) sets up heat dissipation point (7), improves the cooling surface of bulb shell (1) is in making the LED lamp produced heat can giving off the air rapidly when luminous to make the heat dissipation of LED lamp more abundant. This kind of radiating mode is more simple and convenient, easily operates and realizes, has fine market value.

Description

A kind of multipoint mode distribution LED lamp

Technical field

The utility model relates to field of LED illumination, especially a kind of LED, particularly, relates to a kind of multipoint mode distribution LED lamp.

Background technology

Along with the widespread adoption of LED, as the advantage of emerging illumination new light sources, embodied day by day significantly, but LED needs large-area heat abstractor simultaneously.The bulb lamp that daily people get used to has a common characteristic: vitreum spheroid shape shell, bulb spherical.Those skilled in the art know that heat radiation needs enough area of dissipations and air to do convection current, and distance from thermal source to radiating surface is short as far as possible, and thermal resistance between thermal source to radiating surface is low is only a desirable radiator structure.But current most of LED bulb all reduces glass shell, increase the metal heat sink being with a lot of heat radiating fin to dispel the heat.The surface area of metal heat sink is not greater than bare glass shell.By experiment for many years, utility model people finds that the radiating surface increasing glass shell will be better design, but it's a pity, there is not such scheme in the prior art, therefore the purpose of this utility model is exactly the radiating effect in order to be improved LED by the mode of increase LED cell-shell radiating surface.

Utility model content

For the technological deficiency that LED heat radiation aspect in prior art exists, the purpose of this utility model is to provide a kind of multipoint mode distribution LED lamp.

According to an aspect of the present utility model, provide a kind of multipoint mode distribution LED lamp, it is characterized in that, at least comprise LED cell-shell 1, LED luminescence chip group 3, described LED luminescence chip group 3 is placed in described LED cell-shell 1; Wherein, the outer surface of described LED cell-shell 1 is provided with multiple heat radiation point 7.

Preferably, a micropore 72 is provided with in the described heat radiation point 7 of part.

Preferably, the tail end of described LED cell-shell 1 is connected with lamp socket 4, and preferably, or the described lamp socket 4 of the tail end of described LED cell-shell 1 is at least provided with a gas outlet.

Preferably, described heat radiation point 7 is protruding wave point 71.

Preferably, described wave point 71 is for being attached at described LED cell-shell 1 outer surface.

Preferably, the material that uses of described wave point 71 is for heat conductivility is higher than the material of described LED cell-shell 1.

Preferably, described wave point 71 with described LED cell-shell 1 for simultaneous manufacturing forms.And in a further advantageous embodiment, described wave point 71 is the surfaces pasting described LED cell-shell 1 after described LED cell-shell 1 is processed into.

Preferably, described heat radiation point 7 is for being depressed in the Lunar concavity shape thing 73 of described LED cell-shell 1 outer surface.

Preferably, the width at the middle part 25 of described substrate 2 is greater than the front end 26 of described substrate 2 and the width of rear end 27.

Preferably, described LED luminescence chip group 3 comprises one or more LED luminescence chip; And when described LED luminescence chip group 3 comprises multiple LED luminescence chip, be connected in series by bonding line 22 between described multiple LED luminescence chip, the anode of described multiple LED luminescence chip is electrically connected on described substrate 2, and the negative electrode of described multiple LED luminescence chip is connected with a FPC to make to form current supply circuit with power supply.

Preferably, described FPC 4 is arranged on described substrate 2.

Preferably, described FPC 4 comprises L binding post, N binding post, FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chip, and described FPC anode is electrically connected with described substrate 2.

Preferably, described FPC 4 comprises FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chip, described FPC anode is electrically connected with described substrate 2, when described LED uses, described FPC anode and FPC negative electrode are connected with power anode and negative electrode respectively.

Preferably, the upper surface of the LED luminescence chip at least described LED luminescence chip group 3 scribbles fluorescent material 23.

Preferably, described substrate 2 is provided with at least one via hole 21 for the region or peripheral region attaching described LED luminescence chip group 3.

Preferably, at least one via hole 21 described is evenly distributed.

Preferably, the surface area of described substrate 2 is greater than the surface area of described LED luminescence chip group 3.

Preferably, described substrate 2 is any one composition in following material: sheet metal; Alloying metal sheet; Or sheet glass.

Preferably, described substrate 2 is transparence or translucent.

The utility model is by arranging heat radiation point 7 at the outer surface of described bulb housing 1, and improve the radiating surface of described bulb housing 1, the heat that LED is produced when luminescence is dispersed in air rapidly, thus makes the heat radiation of LED more abundant.Further, those skilled in the art understand, by structure of the present utility model, LED luminescence chip is close to LED cell-shell, LED luminescence chip fully can be contacted in bulb housing, and then enable LED luminescence chip closer to the external world, make LED luminescence chip can more easily be dispersed into the external world and go, greatly increase radiating efficiency, improve service life and the service efficiency of LED.This radiating mode is easier, is easy to operation and realizes, having good market value.

Accompanying drawing explanation

By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present utility model will become more obvious:

Fig. 1 illustrates according to a detailed description of the invention of the present utility model, the structural representation of LED;

Fig. 2 illustrates according to the first embodiment of the present utility model, is provided with the structural representation of the LED of a micropore 72 in the described heat radiation point 7 of part

Fig. 3 illustrates according to the first embodiment of the present utility model, and described heat radiation point 7 is the structural representation of the LED of protruding wave point 71.

Fig. 4 illustrates according to the first embodiment of the present utility model, and described heat radiation point 7 is for being depressed in the structural representation of the LED of the Lunar concavity shape thing 73 of described LED cell-shell 1 outer surface.

Fig. 5 illustrates according to the first embodiment of the present utility model, the structural representation of LED;

Fig. 6 illustrates according to the first embodiment of the present utility model, the connection diagram of the substrate of LED and LED luminescence chip group, FPC;

Fig. 7 illustrates according to the first embodiment of the present utility model, and in LED, power drives template is incorporated into the connection diagram in flexible circuitry plate structure; And

Fig. 8 illustrates according to the first embodiment of the present utility model, and in LED, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.

Detailed description of the invention

Those skilled in the art understand, the utility model mainly provides a kind of multipoint mode distribution LED lamp, the advantage of the LED of multipoint mode distribution is adopted to be to make LED have better heat dispersion, its function improving radiating efficiency mainly arranges heat radiation point 7 and realizes on described LED cell-shell 1, heat radiation point 7 is set and additionally can increases area of dissipation, the heat in bulb housing 1 is distributed more rapidly with abundant.

Particularly, Fig. 1 illustrates the structural representation of the LED according to a detailed description of the invention of the present utility model.The utility model provides a kind of multipoint mode distribution LED lamp, it at least comprises LED cell-shell 1, LED luminescence chip group 3 (not shown in figure 1), described LED luminescence chip group 3 is placed in described LED cell-shell 1, and wherein, the outer surface of described LED cell-shell 1 is provided with multiple heat radiation point 7.Further, it will be appreciated by those skilled in the art that LED luminescence chip group 3 has abundant description with the set-up mode of bulb housing 1 in other parts of the utility model, such as, arrange in attaching mode, do not repeat them here.

Further, it will be appreciated by those skilled in the art that the shape of described heat radiation point 7 can be that diversified, general shape has circle, square, attractive in appearance in order to profile, also can be designed to the multiple patterns such as star, flower pattern.Heat radiation point 7 can be one-body molded with bulb housing 1, also can shaping separately after be attached to again on bulb housing 1.Such as, in a preferred embodiment, when designing the mould of described LED cell-shell 1, to the design doing projection or depression in requisition for the position arranging heat radiation point 7, just there is concave point or salient point as heat radiation point 7 after corresponding bulb housing 1 is shaping.It will be appreciated by those skilled in the art that by such specific embodiment, the surface area of described LED cell-shell 1 can be made to increase, thus increase its area of dissipation.In concrete use procedure, the LED luminescence chip group 3 in described LED cell-shell 1 dispel the heat after heat conduct to the inner surface of described LED cell-shell 1, and be further advanced by the outwardly portion heat radiation of described LED cell-shell 1.Because the area of dissipation of described LED cell-shell 1 adds, so have the better radiating effect with conventional bulb.

And in another preferred embodiment, such as, process separately heat radiation point, be then bonded in the outer surface of bulb housing 1.Further, it will be appreciated by those skilled in the art that preferably, first make LED cell-shell 1, this is traditional handicraft, is then bonded in the outer surface of bulb housing 1 by transparent glue.Such as, the mode of automation is adopted to bond, bulb housing 1 passes through on streamline, streamline arranges the annular hollow mould corresponding with bulb housing 1 profile, and mould is provided with draw-in groove for fixed-type good heat radiation point 7, be stuck in the draw-in groove of mould by bottom the heat radiation point 7 of forming after dipped transparent glue, when bulb housing 1 is by mould, pass through automatic control process, make draw-in groove near the outer surface of bulb housing 1 until the bottom of heat radiation point 7 touches bulb housing 1, the draw-in groove being now fixed with heat radiation point 7 unclamps, heat radiation point 7 is bonded in bulb housing 1 outer surface.Similarly, it will be appreciated by those skilled in the art that the object arranging heat radiation point 7 is to increase the area of dissipation of bulb housing 1, which kind of design is adopted not affect flesh and blood of the present utility model, so described heat radiation point is one-shot forming, or shaping separately, do not repeat them here.

Further, specifically implement in side at one, as shown in Figure 2, micropore 72 is provided with in described heat radiation point 7, its object is to make the hot-air in bulb housing 1 be discharged by micropore, cold air also can enter into bulb housing 1 inside from micropore 72 simultaneously, by such embodiment, the hot-air of bulb housing 1 inside can be dispersed into more fast in air, improve radiating efficiency.Described micropore 72 can be made by the mode of mould is one-body molded with heat radiation point 7, namely at heat radiation point 7 in requisition for Position Design needle-like outstanding arranging micropore 72, the size of its size and micropore is suitable, after shaping like this, heat radiation point 7 just forms micropore 72 naturally.Further, those skilled in the art understand, in a further advantageous embodiment, also can by technique carve micropores on heat radiation point 7 such as engravings, artistic carving generally also adopts the mode of automation to carry out, namely described bulb housing 1 passes through on streamline, the place passed through at bulb housing 1 is provided with engraved die, the shape of mould is suitable with the shape of bulb housing 1, engraving needle is fixed in the position of need to arrange micropore 72, when bulb housing 1 by time, by automatic controlling, make engraving needle near heat radiation point 7 so that on heat radiation point 7 carve micropore 72.

Further, with reference to embodiment illustrated in fig. 2, those skilled in the art understand, the quantity of described micropore 72 is not fixed, part heat radiation point 7 can arrange described micropore 72, also micropore 72 can be set on whole heat radiation point 7, and described micropore 72 position on heat radiation point 7 also can be random or ordered arrangement.Such as, in a preferred embodiment, preferably, described LED cell-shell 1 top and afterbody arrange micropore 72 on the heat radiation point 7 of LED luminescence chip group 3, and the plane that these micropores 72 are formed is in vertical direction as far as possible close to a plane, described LED cell-shell 1 left part and right part arrange micropore 72 on the heat radiation point 7 of LED luminescence chip group 3 simultaneously, and these micropores are as far as possible unilateral close to one in the horizontal direction, the plane of vertical direction and the plane of horizontal direction do not cross one another simultaneously, avoid convection current interference each other, such arrangement can realize better convection effects, the cold air of the hot-air of bulb housing 1 inside and bulb housing 1 outside is fully exchanged, reach better radiating effect.Further, it will be appreciated by those skilled in the art that the arrangement mode of micropore 72 has multiple, this does not affect flesh and blood of the present utility model, does not repeat them here.

Further, in another change case, the micropore 72 that the heat radiation point 7 of described bulb housing 1 afterbody is arranged can be more more, because cold air pressure is greater than hot-air, cold air is more sink to bottom, after described bulb housing 1 afterbody arranges more micropores 72, more cold air can be had to enter into bulb housing 1 from the afterbody of bulb housing 1 inner, the hot-air of compressing bulb housing 1 inside is discharged to bulb housing 1 outside faster, makes heat radiation more abundant.

Further, in another preferred change case, the tail end of described LED cell-shell 1 is connected with lamp socket 4, and preferably, the tail end of described LED cell-shell 1 or described lamp socket 4 are at least provided with a gas outlet.Those skilled in the art understand, along with the rising of temperature, atmospheric density diminishes, hot-air is below above floating over, cold air sinks to, natural cold air pressure is greater than the pressure of hot-air, after or the described lamp socket 4 of the tail end of LED cell-shell 1 at least sets out gas port, more cold air enters into bulb housing 1 from bottom inner, thus the hot-air can oppressing bulb housing 1 top is got rid of more rapidly, thus raising radiating effect, its quantity can be determined according to the size of bulb housing 1 or lamp socket 4 and shape, can be one or more, it can be the arrangement of rule, also can be irregular arrangement, this does not affect flesh and blood of the present utility model, do not repeat them here.

Further, it will be appreciated by those skilled in the art that described gas outlet can with bulb housing 1 or lamp socket 4 one-body molded, such as by mould one-body molded, mould arranges projection in requisition for the position setting out gas port, so after shaping can self-assembling formation gas outlet.Also can in bulb housing 1 or the shaping rear independent processing of lamp socket 4, such as realized by the technique of boring, bore process generally also adopts the mode of automation to carry out, namely described bulb housing 1 or lamp socket 4 pass through on streamline, the place passed through at described bulb housing 1 or lamp socket 4 is provided with drill bit, the quantity of drill bit and position can with the quantity of gas outlet and position to corresponding, when described bulb housing 1 or lamp socket 4 pass through, by automatic controlling, make drill bit near described bulb housing 1 or lamp socket 4 and then get out gas outlet at described bulb housing 1 or lamp socket 4.Further, it will be appreciated by those skilled in the art that and take which kind of moulding process not affect flesh and blood of the present utility model, do not repeat them here.

Further, those skilled in the art understand, the arrangement mode of above-mentioned gas outlet can arrange according to particular order, such as can set out gas port in the position of left side afterbody and right side afterbody symmetry, the cold air that afterbody can be made to enter like this is more prone to the center arriving LED cell-shell 1 inside, the hot-air of compressing center flows to the inner surface of LED cell-shell 1 more fast, and then it is outside to be discharged to LED cell-shell 1 from micropore 72.

Further, Fig. 3 shows an embodiment of the utility model detailed description of the invention, described heat radiation point 7 is designed to protruding wave point 71, and the advantage of this design is to increase area of dissipation to greatest extent as required by wider range that the size of wave point can be selected.The material of wave point 71 can be identical with bulb housing 1, also can be different, and the molding mode of described wave point 71 and set-up mode, in the existing description of this detailed description of the invention previous section, do not repeat them here.

Preferably, the embodiment shown in Fig. 3, the wave point 71 of described projection is attached to described LED cell-shell 1 outer surface.Those skilled in the art understand, described wave point 71 usually will shaping separately after, be pasted onto bulb housing 1 outer surface by glue, glue and wave point 71 will select transparent material and index of refraction is wanted suitably, be generally the material such as glass, resin, light can be passed through to greatest extent.Further, also can be filled with heat-conducting liquid in wave point 71 and improve radiating effect.

Preferably, the embodiment shown in Fig. 3, the wave point of described projection and described LED cell-shell 1 form for simultaneous manufacturing.Select this scheme advantage be one-body molded can Simplified flowsheet, and do not need to use other extra materials such as glue, the impact on index of refraction, thermal conductivity that these materials bring can not be considered.Shortcoming is that the material that wave point 71 can be selected is limited to, and can only select the material identical with bulb housing 1.

Further, the wave point 71 of described projection can use heat conductivility higher than the material of described LED cell-shell 1, and such as, the ALN adopting ultra-high conducting heating rate is main material, allows heat pass to the air of wave point 71 periphery rapidly.It will be appreciated by those skilled in the art that and select which kind of high heat-conducting not affect flesh and blood of the present utility model, do not repeat them here.

As one change, Fig. 4 illustrates another embodiment of this detailed description of the invention, and described heat radiation point 7 is for being depressed in the Lunar concavity shape thing 73 of described LED cell-shell 1 outer surface.Described Lunar concavity shape thing 73 is one-body molded in bulb housing 1, and its quantity can be determined according to bulb housing 1 size and shape, can be one or more, it can be the arrangement of rule, can be irregular arrangement, this affect flesh and blood of the present utility model, does not repeat them here yet.

Further, those skilled in the art understand, described Lunar concavity shape thing 73 is made by the mode of mould is one-body molded, i.e. Position Design Lunar concavity shape outstanding of LED cell-shell 1 correspondence, and on shaping so rear LED cell-shell 1, nine just form Lunar concavity shape thing 73 naturally.Similarly can arrange described micropore 72 in described Lunar concavity shape thing 73, such as embodiment illustrated in fig. 2 the same, the molding mode of micropore and arrangement mode have a detailed description in the utility model detailed description of the invention previous section, do not repeat them here.

Further, in another embodiment, heat radiation point 7 part set on described LED cell-shell 1 is wave point 71, and a part is described Lunar concavity shape thing 73.Such as, can adopt that the mode of mould is one-body molded to be made, such as can process separately again protruding wave point 71, then bulb housing 1 outer surface being provided with Lunar concavity shape thing 73 is pasted onto, concrete moulding process has a detailed description in detailed description of the invention of the present utility model, does not repeat them here.Preferably, described wave point 71 and Lunar concavity shape thing 73 adopt symmetrical mode to arrange, the advantage of this design is, described Lunar concavity shape thing 73 forms a cold air chamber in LED cell-shell 1 outside, when described wave point 71 and Lunar concavity shape thing 73 are provided with micropore 73, because cold air pressure is larger, the hot-air that micropore 72 on described Lunar concavity shape thing 73 flows out is less, the cold air flowed into is more, the hot-air that micropore 72 on corresponding wave point 71 flows out is more, the cold thing flowed into is less, in described bulb housing 1, the flowing of air can be more regular like this, the hot-air of bulb housing 1 inside and the more quick and abundant of outside exchange of cold air.

With reference to above-described embodiment, it will be appreciated by those skilled in the art that the shape of the bulb housing of described LED can be circular, can be rectangle, can be other any shapes, this affect flesh and blood of the present utility model, does not repeat them here yet,

Particularly, Fig. 5 illustrates according to a detailed description of the invention of the present utility model, the structural representation of LED.Further, it will be appreciated by those skilled in the art that the utility model provides a kind of LED, it at least comprises LED cell-shell 1, substrate 2 and LED luminescence chip group 3.Preferably, those skilled in the art understand, described LED luminescence chip group 3 is tightly attached at the inwall of described LED cell-shell 1 by substrate 2, be dispersed in the external environment condition residing for LED by described luminescence chip group 3 is tightly attached the heat that described luminescence chip group 3 can be made to produce with the inwall of described LED cell-shell 1 by substrate 2 by the shortest approach, namely preferably, the heat of described LED luminescence chip group 3 conducts to LED cell-shell 1 by substrate 2, thus even heat ground absorb by described LED cell-shell 1, the heat that described LED luminescence chip group 3 produces only needs just directly to be dispersed into the external world by very thin one deck LED cell-shell, and the heat that described LED luminescence chip group 3 can not be made to produce accumulates in described LED in large quantities, cause the heat radiation difficulty of LED, the heat that described LED luminescence chip group 3 is produced can be gone out by Quick diffusing, ensure that the temperature of LED remains in rational scope, and then ensure the normal of LED, safety and efficiently work.

Particularly, it will be appreciated by those skilled in the art that the inner surface of described LED cell-shell 1 is close in the side of described substrate 2, the opposite side of described substrate 2 is close to described LED luminescence chip group 3.Further, those skilled in the art understand, the inwall directly attaching described LED luminescence chip, be fixed on described LED cell-shell 1 has great difficulty in the realization of technology, therefore need by placing described substrate 2 in the middle of described LED cell-shell 1 with described luminescence chip 3, described substrate 2 can be fixed with described bulb housing 1 well, described substrate 2 can be fixed with described luminescence chip 3, therefore, can realize by described substrate 2 inwall that described luminescence chip 3 is fixed on described LED cell-shell 1 well.Further, those skilled in the art understand, fixed form between described LED cell-shell 1 and described substrate 2 and the fixed form between described substrate 2 and described LED luminescence chip group 3 not unique, the relatively fixing of three can be realized, this does not affect flesh and blood of the present utility model, does not repeat them here.

In one particularly embodiment, the quantity of described substrate 2 and the quantity of described LED luminescence chip group 3 adapt, the side of described substrate 2 is attached at the inner surface of described LED cell-shell 1, and a described LED luminescence chip group 3 is attached at the opposite side of a corresponding described substrate 2.Such as described substrate 2 one has five, then described LED luminescence chip group 3 one has five groups, then often organize the opposite side that described LED luminescence chip group 3 correspondence is attached at every bar substrate 2.

Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence.Preferably, those skilled in the art understand, described substrate 2 is designed to translucent or transparence and can ensures that the wide part that described LED luminescence chip group 3 is launched can both exhale to greatest extent, if described substrate 2 is nontransparent shape or light transmission extreme difference, then can cause the illuminating effect extreme difference of LED, can be that the light that LED projects produces many shades and blackspot, greatly have impact on illuminating effect and the function of LED.Further, those skilled in the art understand, realize described substrate 2 transparence or translucent can by use transparent material make described substrate 2, also can by punching at described substrate 2, so also can increase the penetration capacity of light, the illuminating effect of LED can be made better.Any process that can realize transparent or translucentization of described substrate 2, all can meet the requirement of the utility model to described substrate 2, this does not affect flesh and blood of the present utility model, does not repeat them here.

Preferably, it will be appreciated by those skilled in the art that in this embodiment, the surface of described substrate 2 is obviously little than described LED luminescence chip group 3.The effect that described substrate 2 plays mainly is used for connecting described LED cell-shell 1 and described LED luminescence chip group 3, so not strict restriction to the size of described substrate 2, can realize above-mentioned linkage function.But consider that if described substrate is too large, described LED luminescence chip group 3 will be affected through the illumination effect of described LED cell-shell 1, the illuminating effect of described LED is made a big impact.Therefore, described substrate 2 should realizing connecting described LED cell-shell 1 with under the prerequisite of described LED luminescence chip group 3 function, little as much as possible.Can not affect the lighting function of described LED luminescence chip group 3 so largely, ensure that the illuminating effect of described LED, its object is consistent with described substrate 2 is designed to the transparent or translucent effect that will reach, and does not repeat them here.

Further, those skilled in the art understand, in another specific embodiment, the surface area of described substrate 2 is preferably more than the area of described LED luminescence chip group 3, thus described LED luminescence chip group 3 is adhered on described substrate 2 by entirety, and described substrate 2 is fixedly attached at the inner surface of described LED cell-shell 1 further.Further, it will be appreciated by those skilled in the art that the attaching that the utility model is set forth does not represent the inner surface that described substrate 2 is attached to described LED cell-shell 1, and only represent that both are fixed relatively.

Further, it will be appreciated by those skilled in the art that the thickness of described substrate 2 should be less.When the thickness of described substrate 2 remains in a less thickness range, light transmission can be realized better, the light being unlikely to described LED luminescence chip group 3 is launched causes very large decay after described substrate 2, ensure that the illuminating effect of light transmission and described LED.Further, if it will be appreciated by those skilled in the art that, described substrate 2 is too thick, then serious mistake can stop and cause the light that described LED luminescence chip group 3 is launched the significantly decay of described light, also can affect the heat dispersion of described LED.

Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixing, its position can be determined according to the position of described LED luminescence chip group 3 is corresponding.Meanwhile, the quantity of described substrate 2 is also unique, can be one also can be multiple.Further, those skilled in the art understand the determination of quantity and the determination of position of described substrate 2, mainly in order to better described LED cell-shell 1 be fitted with described LED luminescence chip group 3, can in concrete realization, dynamically adjust quantity and the position of described substrate 2, do not repeat them here.

Further, it will be appreciated by those skilled in the art that in this embodiment, the upper surface of the LED luminescence chip in described LED luminescence chip group 3 scribbles fluorescent material.Particularly, described LED luminescence chip group 3 comprises one or more LED luminescence chip, and preferably, when it comprises multiple LED luminescence chip, then each LED luminescence chip all can obtain the electric power provided from electric power driving module, does not repeat them here.Further, preferably, the upper surface of wherein one or more LED luminescence chips scribbles fluorescent material, thus the light that the LED luminescence chip of coated fluorescent material is sent is more even, color more easily receive by consumer.

Further, it will be appreciated by those skilled in the art that Fig. 5 illustrate only the schematic diagram of LED luminescence chip group 3 described in a described substrate 2 and a group, this does not show that the utility model is only only limitted to one group of LED luminescence chip group 3.Meanwhile, the cell-shell of LED described in Fig. 51 does not indicate heat radiation point, but embodiment illustrated in fig. 5ly should to combine with Fig. 1 to 4 illustrated embodiment, do not repeat them here.Further, it will be appreciated by those skilled in the art that and middle set forth the preferred embodiment being driven described LED luminescence chip group 3 by circuit connecting mode at Fig. 6 to embodiment illustrated in fig. 8, specifically please refer to Fig. 6 to embodiment illustrated in fig. 8.

With reference to above-mentioned Fig. 1 to embodiment illustrated in fig. 5, those skilled in the art understand, when described substrate 2 is wavy, and the wavy radian of the tail end of described substrate 2 is less than the wavy radian of the pars intermedia of described substrate 2, is greater than the wavy radian at the top of described substrate 2.LED luminescence chip distribution density in order to the tail end meeting described LED luminescence chip group 3 is less than the LED luminescence chip distribution density at the middle part of LED luminescence chip group 3, and the LED luminescence chip distribution density of the tail end of described LED luminescence chip group 3 is greater than the LED luminescence chip distribution density at the top of LED luminescence chip group 3, the LED luminescence chip of described LED luminescence chip 3 is uniformly distributed and can realizes on described wavy substrate 2.Further, because described substrate 2 is wavy, and the wavy radian of the tail end of described substrate 2 is less than the wavy radian of the pars intermedia of described substrate 2, is greater than the wavy radian at the top of described substrate 2.In addition, luminescence chip in described LED luminescence chip group 3 is evenly arranged on described waveform substrate, and then the LED luminescence chip density at middle part realizing described LED luminescence chip group 3 is greater than the density of the LED luminescence chip of the tail end of described LED luminescence chip group 3, and the density of the LED luminescence chip of the tail end of LED luminescence chip group 3 is greater than the density of the LED luminescence chip at the top of described LED luminescence chip group 3.The object and the advantage that realize such density arrangement of described LED luminescence chip group 3 are specifically described in figure 3, do not repeat them here.

In a change case, the wavy radian at the top of described substrate 2 is less than the wavy radian of the pars intermedia of described substrate 2, skilled person understands, in this change case, when described luminescence chip is evenly arranged on described waveform substrate, the LED luminescence chip density that described LED luminescence chip group 3 is positioned at described substrate 2 top is less than the density that described LED luminescence chip group 3 is positioned at the LED luminescence chip of described substrate 2 pars intermedia.

Below in conjunction with accompanying drawing 6, Fig. 7 and Fig. 8, elaborate the preferred embodiment how being driven the luminescence of described LED luminescence chip group 3 by circuit connecting mode.

Fig. 6 illustrates according to the first embodiment of the present utility model, the connection diagram of LED substrate and LED luminescence chip group, FPC.It will be appreciated by those skilled in the art that described Fig. 6 is not that the object of the unique connected mode figure of the present embodiment, this figure is intended to the connection diagram implementing preferred embodiment is described.Particularly, as shown in Figure 6, described LED luminescence chip group 3 is connected to the side of described substrate 2, the opposite side of described substrate 2 is connected with the inner surface of described bulb housing 1, it will be appreciated by those skilled in the art that the mode that described LED luminescence chip is connected with described substrate 2 is not changeless, can be such as that directly stamp is on the surface of described substrate 2, mode is varied, but does not affect flesh and blood of the present utility model, therefore does not repeat them here.Meanwhile, described substrate 2 is distributed with via hole 21 (not showing in Fig. 6), about the distribution of via hole 21, has in above-mentioned Fig. 5 and describe, therefore do not repeat them here.

More specifically, be connected in series by described bonding line 22 between described each LED luminescence chip, by this kind of connected mode, between described each LED luminescence chip, a series circuit can be formed, power supply simultaneously and power-off simultaneously.

Further, FPC 4 described in is installed in the one end connecting power supply at described substrate 2, and it will be appreciated by those skilled in the art that preferably, the afterbody of described substrate 2 is provided with described FPC 4.Further, it will be appreciated by those skilled in the art that described FPC 4 method of installing on a substrate 2 is not changeless, it can use the method for pressing also can use the method for adhesion, method is multiple, but does not affect flesh and blood of the present utility model, therefore does not repeat them here.

Further, in the present embodiment, as shown in FIG., preferably, the anode of last luminescence chip in described LED luminescence chip group 3 is electrically connected with described substrate 2, the negative electrode of a luminescence chip near FPC 4 in LED luminescence chip group 3 is connected with the cathodic electricity in FPC 4 simultaneously.Further, those skilled in the art understand, in the use procedure of the LED provided at the utility model, afterbody preferably by described bulb housing 1 is electrically connected with external power source by described substrate 2, such external power source normally carries out being electrically connected with the afterbody of described bulb housing 1 by lamp socket and obtains, thus makes external power source can drive described LED.Further, it will be appreciated by those skilled in the art that the both positive and negative polarity of external power source will be connected with described substrate 2, FPC 4 respectively, thus form complete power circuit, such as, shown in Fig. 8.

Further, those skilled in the art understand, in the use procedure of the LED provided at the utility model, alternating current be directly to be electrically connected with described LED luminescence chip group with wire by the lamp holder of described LED or by described lamp holder position first by being electrically connected with described LED luminescence chip group again after the rectification of external driving power, constant current, and Fig. 6 and embodiment illustrated in fig. 7 in, described FPC act as the effect of conducting circuit and LED drive circuit carrier.

Under AC Direct driver pattern, the alternating current direct of described lamp holder joints connects and is wired to L binding post on the FPC 4 shown in Fig. 6 or Fig. 7 and N binding post, by powering to described LED luminescence chip group after EMC filter circuit, bridge rectifier, constant-current drive circuit, concrete structure is as shown in Fig. 6 and Fig. 7.Wherein, described EMC filter circuit, bridge rectifier, constant-current drive circuit etc. are not shown in Fig. 6 and Fig. 7, and preferably, it is all directly be attached on FPC by COB binding technology to form path by the circuit of scolding tin and FPC.

Further, it will be appreciated by those skilled in the art that by above-mentioned connected mode, the both positive and negative polarity of LED luminescence chip group 3 is formed, thus can form an electric loop when externally fed, by the break-make of control loop, and then the luminescence controlling described LED luminescence chip group 3 is whether.

It will be appreciated by those skilled in the art that the white light in order to make LED send better effect, coating fluorescent material 23 at the upper surface of described LED luminescence chip group 3, as shown in FIG..

Closer, how the electric loop shown in Fig. 6 is connected with power drives, below in conjunction with accompanying drawing 7 and accompanying drawing 8, and the concrete embodiment setting forth two kinds of connections.

Fig. 7 illustrates according to the first embodiment of the present utility model, and in LED, power drives template is incorporated into the connection diagram in flexible circuitry plate structure.It will be appreciated by those skilled in the art that described Fig. 7 is not the anatomical connectivity situation that the object of unique anatomical connectivity figure, this figure is intended to illustrate electric power driving module 5 and FPC 4.Particularly, as shown in Figure 7, binding post L, binding post N, FPC anode and FPC negative electrode is at least comprised in described FPC 4.Further, in the embodiment shown in fig. 7, described FPC anode and FPC negative electrode present in the mode of electric power driving module 5, and preferably those skilled in the art understand described electric power driving module 5 and are at least integrated with AC-DC conversion module and constant-current driven module (not shown), thus the both positive and negative polarity of described LED luminescence chip group 3 is formed.Those skilled in the art understand, described electric power driving module 5 is placed in the inside of FPC 4, becomes one of structure of FPC 4, and those skilled in the art understand, described electric power driving module 5 method be integrated in FPC 4 has a variety of, does not repeat them here.

Further, with reference to figure 6, it will be appreciated by those skilled in the art that the negative electrode of described FPC 4 is connected with the cathodic electricity of described LED luminescence chip, the anode of described FPC 4 is electrically connected with described substrate 2.By such connected mode, make described substrate 2 with positive charge, thus the anode of described LED luminescence chip is connected with any point of described substrate 2, and do not need the anode that must be connected to described FPC 4, save the material of described FPC 4, be also convenient to process.And in preferred variant, for structure shown in Fig. 6 to Fig. 8, also the anode of the anode of described FPC 4 with described LED luminescence chip can be electrically connected, the negative electrode of described FPC 4 is electrically connected with described substrate 2, correspondingly the negative electrode of described LED luminescence chip is electrically connected with described substrate 2, thus also can form the current supply circuit for described LED luminescence chip.

Further, it will be appreciated by those skilled in the art that for a LED luminescence chip group, each the LED luminescence chip preferably in this LED luminescence chip group is directly connected by bonding line 22, thus forms cascaded structure.On such architecture basics, the negative electrode of first LED luminescence chip can as the negative electrode of described LED luminescence chip group, and the anode of last LED luminescence chip can as the anode of described LED luminescence chip group.Again further, in a change case, those skilled in the art understand, its anode also can be connected to separately on described substrate 2 by each the LED luminescence chip in described LED luminescence chip group, correspondingly the negative electrode of each LED luminescence chip is connected on the negative electrode of described FPC 4, and this does not affect the technical solution of the utility model.

Further, with reference to above-mentioned Fig. 6 and Fig. 7, those skilled in the art understand, in above-described embodiment and change case, it is the electrical interface that described LED luminescence chip provides anode and negative electrode, thus when the anode of power supply and negative electrode are connected to above-mentioned anode and negative electrode respectively, one can be formed to the current supply circuit of described LED luminescence chip, not repeat them here.

More specifically, with above-mentioned embodiment illustrated in fig. 6 similar, in the LED course of work that the utility model provides, when described substrate 2 is electrically connected with external power source by the afterbody of bulb housing 1, described external power source is driven described luminescence chip group 3 by described electric power driving module 5 grade, thus it is luminous to control described luminescence chip group 3.Connected by this kind, described electric power driving module 5, under the effect of FPC 4, forms electric loop with described substrate 2 and described LED luminescence chip group 3, reaches the effect controlling described luminescence chip break-make.

Fig. 8 illustrates according to the first embodiment of the present utility model, and in LED, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.In conjunction with above-mentioned embodiment illustrated in fig. 6, those skilled in the art understand described FPC 4 and at least comprise FPC anode, i.e. LED+ shown in Fig. 8, and FPC negative electrode, i.e. LED-shown in Fig. 8.Described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chip, and described FPC anode is electrically connected with described substrate 2.By such connected mode, when connecting external power source 7, described substrate 2 is with positive charge, forms positive pole, thus the both positive and negative polarity of described luminescence chip group 3 is formed.It will be appreciated by those skilled in the art that described Fig. 8 is not the anatomical connectivity situation that the object of unique anatomical connectivity figure, this figure is intended to illustrate external power source (external drive part) 7 and FPC 4.By this kind of design, the circuit on-off of whole luminescence chip group 3 can be controlled by described FPC 4, achieve the luminescence of luminescence chip group 3 whether control.

Further, shown in figure 8, under DC mode activated, the alternating current direct of above-mentioned lamp holder joints connects and is wired on external driving power, after power source internal carries out EMC filter circuit, bridge rectifier, constant-current drive circuit, again by the positive and negative electrode on the FPC above wire connecting lamp bar, finally form path.It will be appreciated by those skilled in the art that FPC only serves the effect of communication line here, do not possess the ability of AC Direct driver.

Further, the bottom of described substrate 2 is anodes, and the negative electrode of described substrate 2 is connected to FPC by bonding line, as shown in Figure 6.And Fig. 6 can be understood to a detail section in Fig. 7, Fig. 8, electric power driving module 5 and wiring part are made up of below rectangular region in Fig. 7.Electric power driving module 5 shown in Fig. 7 mainly comprises following parts, such as EMC filter circuit, bridge rectifier, constant-current drive circuit and other protection circuits composition.By above-mentioned technical scheme, the LED that the utility model is provided by DC powered, also can be driven by alternating current, installation and debugging is safeguarded and all becomes very simple.Further, the alternating current direct of above-mentioned lamp holder joints connects L ac terminal, N ac terminal on the FPC 4 that is wired to above lamp bar, after EMC filter circuit, bridge rectifier, constant-current drive circuit, wherein EMC filter circuit, bridge rectifier, constant-current drive circuit are all directly be attached on FPC by COB (chipOnboard) binding technology to form path by the circuit of scolding tin and FPC.

Further, those skilled in the art understand, because described substrate 2 preferably adopts metal, therefore described substrate 2 can only serve as an electrode, and LED is a LED device, and wanting luminescence must have 2 electrodes, one adds positive voltage, one adds negative voltage, and circuit part relies on FPC, as shown in Figure 6.FPC is without the need to delivering to tail end line place, greatly can save the cost of wiring board like this, FPC only needs to be connected with the electrode cathode of first chip, after connecting LED quantity certain, anode carrys out conducting by substrate true qualities conduction, directly fit together by via hole or welding with the anode on FPC, the conducting of realizing circuit.

Above specific embodiment of the utility model is described.It is to be appreciated that the utility model is not limited to above-mentioned particular implementation, those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present utility model.

Claims (14)

1. a multipoint mode distribution LED lamp, is characterized in that, at least comprises LED cell-shell (1), LED luminescence chip group (3), and described LED luminescence chip group (3) is placed in described LED cell-shell (1);

Wherein, the outer surface of described LED cell-shell (1) is provided with multiple heat radiation point (7).

2. LED according to claim 1, is characterized in that, is provided with a micropore (72) in the described heat radiation point of part (7).

3. LED according to claim 2, it is characterized in that, the tail end of described LED cell-shell (1) is connected with lamp socket (4), described LED cell-shell (1) or the described lamp socket of tail end (4) be at least provided with a gas outlet.

4. LED according to any one of claim 1 to 3, is characterized in that, described heat radiation point (7) is protruding wave point (71).

5. LED according to claim 4, is characterized in that, described wave point (71) is for being attached at described LED cell-shell (1) outer surface.

6. LED according to claim 5, is characterized in that, the material that described wave point (71) uses is for heat conductivility is higher than the material of described LED cell-shell (1).

7. LED according to claim 4, is characterized in that, described wave point (71) and described LED cell-shell (1) form for simultaneous manufacturing.

8. LED according to any one of claim 1 to 3, is characterized in that, described heat radiation point (7) is for being depressed in the Lunar concavity shape thing (73) of described LED cell-shell (1) outer surface.

9. the LED according to claim 1 or 2 or 3 or 5 or 6 or 7, it is characterized in that, also comprise substrate (2), the quantity of described substrate (2) and the quantity of described LED luminescence chip group (3) adapt, the side of described substrate (2) is attached at the inner surface of described LED cell-shell (1), and a LED luminescence chip group (3) is attached at the opposite side of a corresponding described substrate (2).

10. LED according to claim 9, is characterized in that, the width at the middle part (25) of described substrate (2) is greater than the front end (26) of described substrate (2) and the width of rear end (27).

11. LED according to claim 10, is characterized in that, described substrate (2) is for wavy, and the wavy radian at the top of described substrate (2) is less than the wavy radian of the pars intermedia of described substrate (2).

12. LED according to claim 10 or 11, it is characterized in that, described LED luminescence chip group (3) comprises one or more LED luminescence chip; And when described LED luminescence chip group (3) comprises multiple LED luminescence chip, be connected in series by bonding line (22) between described multiple LED luminescence chip, the anode of described multiple LED luminescence chip is electrically connected on described substrate (2), and the negative electrode of described multiple LED luminescence chip is connected with a FPC (4) to make to form current supply circuit with power supply.

13. LED according to claim 12, it is characterized in that, described FPC (4) comprises L binding post, N binding post, FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chip, and described FPC anode is electrically connected with described substrate (2).

14. LED according to claim 10 or 11 or 13, it is characterized in that, described substrate (2) is transparence or translucent.