CN104006321B - A kind of 3D COB LED luminescence component and LED - Google Patents

A kind of 3D COB LED luminescence component and LED Download PDF

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CN104006321B
CN104006321B CN201410251046.0A CN201410251046A CN104006321B CN 104006321 B CN104006321 B CN 104006321B CN 201410251046 A CN201410251046 A CN 201410251046A CN 104006321 B CN104006321 B CN 104006321B
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substrate
led luminescence
led
luminescence chip
chip group
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CN104006321A (en
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李建胜
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SHANGHAI DINGHUI TECHNOLOGY Co Ltd
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SHANGHAI DINGHUI TECHNOLOGY Co Ltd
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Abstract

The present invention provides a kind of 3D COB LED luminescence component, it is luminous that it is used in a LED, described LED at least includes LED cell-shell 1 and radiator 91, described LED luminescence component at least includes substrate 2 and LED luminescence chip group 3, described LED luminescence chip group 3 is attached on described substrate 2, and described substrate 2 and described radiator 91 are connected such that the heat of described LED luminescence chip group 3 is delivered on described radiator 91 by described substrate 2。

Description

A kind of 3D COB LED luminescence component and LED
Technical field
The present invention relates to field of LED illumination, especially a kind of LED, in particular it relates to 3DCOBLED lamp。
Background technology
Along with the widespread adoption of LED, as the advantage of emerging illumination new light sources, day by day emerge from significantly。Such as, the Chinese patent application that number of patent application is 201310239213.5, denomination of invention is " LED and filament thereof " proposes a kind of LED luminescence component, it adopts glass substrate, and on described glass substrate, attach luminescence chip group, described luminescence chip group is coated with fluorescent material, and it is coated with fluorescent material outside described glass substrate, so have the advantage that can double-side, but bring accumulation of heat that after this LED luminescence component is placed in bulb housing, described luminescence chip group sends simultaneously cannot the problem of good heat radiating in bulb housing。And in order to solve heat dissipation problem, it is common practice in bulb housing, rush special gas, for instance halogen gas。And owing to halogen gas needs to seal, so requiring over again the modes such as high temperature envelope bubble, bulb housing is packaged with lamp socket etc., so that described special gas is airtight, and the mode of high temperature envelope bubble can produce high temperature, strong voltage, luminescence chip group, glass substrate can be impacted, cause that the yield of LED is greatly lowered。Simultaneously as LED heat dissipation problem, the quantity also making LED luminescence chip group can not be too much, so that the power of LED is relatively low。
Each producer is proposing respective technical solution in various degree。But heat dissipation problem during LED luminescence does not solve very well, therefore its power is very limited, it is within the contemplation of the invention that provide different technical schemes on this basis。
Summary of the invention
For the technological deficiency that LED heat radiation aspect in prior art exists, it is an object of the invention to provide a kind of 3DCOBLED luminescence component and corresponding 3DCOBLED lamp。
According to an aspect of the present invention, a kind of 3DCOBLED lamp luminescence component is provided, it is luminous that it is used in a LED, described LED at least includes LED cell-shell 1 and radiator 91, described LED luminescence component at least includes substrate 2 and LED luminescence chip group 3, described LED luminescence chip group 3 is attached on described substrate 2, and described substrate 2 and described radiator 91 are connected such that the heat of described LED luminescence chip group 3 is delivered on described radiator 91 by described substrate (2)。
Preferably, described LED luminescence chip group 3 is only attached at the one side of described substrate 2。
Preferably, described substrate 2 does not attach the another side of described LED luminescence chip group 3 and is attached on the inwall of described LED cell-shell 1。
Preferably, described substrate 2 is printed circuit board, and circuit diagram is made by etching or typography in wherein said substrate 2 surface。
Preferably, described substrate 2 is any one in following shape:
-linear type or shaped form；
-half elliptic, and described half elliptic outside edges inwardly arranges；
-inverted U；
-X-type；
-inverted Y-shaped；Or
-the type of falling W。
Preferably, the position that described substrate 2 is bent does not attach described LED luminescence chip group 3。
Preferably, described LED luminescence component also includes radiating connection plate 92, and described substrate 2 is connected on described radiating connection plate 92, and described radiating connection plate 92 is connected to described radiator 91。
Preferably, the shape of described radiating connection plate 92 adapts with the shape of described radiator 91。
Preferably, the end of described substrate 2 be shaped as in following shape any one:
-cone structure, described radiating connection plate 92 is provided with the first jack 93 adapted with described cone structure。
-flat structure, described radiating connection plate 92 is provided with the second jack 94 adapted with described flat structure；Or
The last segment of-described end is the cylindrical-shaped structure that diameter is less, the last segment described part upwards is the cylindrical-shaped structure being relatively large in diameter or flat structure, and described radiating connection plate 92 is provided with the 3rd jack 95 that the cylindrical-shaped structure less with described diameter adapts。
Preferably, after the end of described substrate 2 is connected with described radiating connection plate 92, the electrode on described substrate 2 electrically connects with the electrode on described radiating connection plate 92, so that described LED luminescence chip group 3 can be powered。
Preferably, the end of described substrate 2 electrically connects with current electrode in the lower section of described radiating connection plate 92, so that described LED luminescence chip group 3 can be powered。
Preferably, the upper surface of the LED luminescence chip at least described LED luminescence chip group 3 scribbles fluorescent material 23。
Preferably, described substrate 2 is any one composition in following material: metal base circuit board epoxy radicals wiring board, glass base circuit board, the metal rack of punching press, foil。
Preferably, described substrate 2 is transparence or translucent。
Further, the quantity of described substrate 2 is one or more, and accordingly, the quantity of described LED luminescence chip group 3 is no less than the quantity of described substrate 2。
According to a further aspect of the invention, a kind of 3DCOBLED lamp is provided, at least include LED cell-shell 1, radiator 91, it is characterized in that, described LED also includes according to the 3DCOBLED lamp luminescence component according to any one of claim 1 to 13, and described 3DCOBLED lamp luminescence component is preferably connected with described radiator 91。
Preferably, it is full of air in described LED cell-shell 1。
According to another aspect of the present invention, it is provided that a kind of 3DCOBLED lamp, LED cell-shell 1, substrate 2 and LED luminescence chip group 3, radiator 91 are at least included；
Wherein, described LED luminescence chip group 3 is attached on described substrate 2, and described substrate 2 and described radiator 91 are connected such that the heat of described LED luminescence chip group 3 is delivered on described radiator 91 by described substrate 2。
Preferably, described LED luminescence chip group 3 is only attached at the one side of described substrate 2。
Preferably, described substrate 2 does not attach the another side of described LED luminescence chip group 3 and is attached on the inwall of described LED cell-shell 1。
Preferably, described substrate 2 is any one in following shape:
-linear type or shaped form, and the top 21 of described substrate 2 contacts described LED cell-shell 1；
-linear type or shaped form, and the top 21 of described substrate 2 is close to described LED cell-shell 1；
-half elliptic, and described half elliptic outside edges inwardly arranges；
-inverted U, and the top 21 of described inverted U contacts described LED cell-shell 1；Or
-inverted U, and the top 21 of described inverted U is close to described LED cell-shell 1。
Preferably, described LED also includes radiating connection plate 92, and described substrate 2 is connected on described radiating connection plate 92, and described radiating connection plate 92 is connected to described radiator 91。
Preferably, the shape of described radiating connection plate 92 adapts with the shape of described radiator 91。
Preferably, the end of described substrate 2 be shaped as in following shape any one:
-cone structure, described radiating connection plate 92 is provided with the first jack adapted with described cone structure。
-flat structure, described radiating connection plate 92 is provided with the second jack adapted with described flat structure；Or
The last segment of-described end is the cylindrical-shaped structure that diameter is less, the last segment described part upwards is the cylindrical-shaped structure being relatively large in diameter or flat structure, and described radiating connection plate 92 is provided with the 3rd jack that the cylindrical-shaped structure less with described diameter adapts。
Preferably, after described end is connected with described radiating connection plate 92, the electrode on described substrate 2 electrically connects with the electrode on described radiating connection plate 92, so that described LED luminescence chip group 3 can be powered。
Preferably, described end electrically connects with current electrode in the lower section of described radiating connection plate 92, so that described LED luminescence chip group 3 can be powered。
Preferably, described LED luminescence chip group 3 includes one or more LED luminescence chip；And when described LED luminescence chip group 3 includes multiple LED luminescence chip, it is connected in series by bonding line 22 between the plurality of LED luminescence chip, the anode of the plurality of LED luminescence chip is electrically connected on described substrate 2, and the negative electrode of the plurality of LED luminescence chip and a flexible circuit board are connected with so that forming current supply circuit with power supply。
Preferably, described flexible circuit board 4 is arranged on described substrate 2。
Preferably, described flexible circuit board 4 includes L binding post, N binding post, flexible circuit board anode and flexible circuit board negative electrode, described flexible circuit board negative electrode is connected with the cathodic electricity of the plurality of LED luminescence chip, and described flexible circuit board anode electrically connects with described substrate 2。
Preferably, described flexible circuit board 4 includes flexible circuit board anode and flexible circuit board negative electrode, described flexible circuit board negative electrode is connected with the cathodic electricity of the plurality of LED luminescence chip, described flexible circuit board anode electrically connects with described substrate 2, when described LED uses, described flexible circuit board anode and flexible circuit board negative electrode are connected with power anode and negative electrode respectively。
Preferably, the upper surface of the LED luminescence chip at least described LED luminescence chip group 3 scribbles fluorescent material 23。
Preferably, described substrate 2 is provided with at least one via 21 as loophole for the region or peripheral region attaching described LED luminescence chip group 3。
Preferably, at least one via 21 described is evenly distributed。
Preferably, the surface area of described substrate 2 is more than the surface area of described LED luminescence chip group 3。
Preferably, described substrate 2 is any one composition in following material: sheet metal；Alloying metal sheet；Or sheet glass。
Preferably, described substrate 2 is transparence or translucent。
Further, the quantity of described substrate 2 is one or more, and accordingly, the quantity of described LED luminescence chip group 3 is no less than the quantity of described substrate 2。
The present invention is by arranging radiator 91, then is connected with radiator 91 by substrate 2, and substrate 2 is connected with LED luminescence chip 3, utilizes substrate 2 and radiator 91 to dispel the heat, solves the problem that traditional filament cannot dispel the heat。When LED luminescence chip group 3 is luminous, the heat produced can more quickly pass to radiator 91 by substrate 2 and distribute, it is greatly improved radiating efficiency, improve service life and the service efficiency of LED, simultaneously because the raising of radiating efficiency, the LED of the present invention can make more power, and illumination effect is better。
Accompanying drawing explanation
By reading detailed description non-limiting example made with reference to the following drawings, the other features, objects and advantages of the present invention will become more apparent upon:
Fig. 1 illustrates according to a specific embodiment of the present invention, the overall structure schematic diagram of LED；
Fig. 2 illustrates according to the second embodiment of the present invention, the structural representation after linear type substrate 2 combination；
Fig. 3 illustrates according to the second embodiment of the present invention, the structural representation after inverted U substrate 2 combination；
Fig. 4 illustrates according to the second embodiment of the present invention, the structural representation after X-type substrate 2 combination；
Fig. 5 illustrates according to the second embodiment of the present invention, the structural representation of the type of falling W substrate 2；
Fig. 6 illustrates according to the fourth embodiment of the invention, is provided with the structural representation of the radiating connection plate 92 of difformity jack；
Fig. 7 illustrates according to an embodiment of the invention, the connection diagram of the substrate of LED and LED luminescence chip group, flexible circuit board；
Fig. 8 illustrates according to an embodiment of the invention, and in LED, power drives template is incorporated into the connection diagram in flexible circuit board structure；And
Fig. 9 illustrates according to an embodiment of the invention, and in LED, electric power driving module is placed on the connection diagram of flexible circuit board structure。
Detailed description of the invention
Skilled artisan understands that, invention broadly provides a kind of 3DCOBLED lamp luminescence component, and realize heat sinking function mainly dependence connection radiator 91 on a substrate 2, described radiator 91 or directly contact with external environment condition, or contacted with external environment condition by the base of LED, when, after described LED luminescence chip group 3 luminous generation heat, heat is passed to rapidly radiator 91 by described substrate 2, and then is delivered to external environment condition by radiator 91。Further, skilled artisan understands that, compared with prior art, advantages of the present invention is at least that the heat that the group of LED luminescence chip described in prior art 3 sends passes to described radiator mainly through air, then again through described radiator conduction to space outerpace, and invent and by substrate 2, heat is conducted to radiator in the way of higher efficiency, then conduct again to space outerpace, thus substantially increasing radiating efficiency。Further, it will be appreciated by those skilled in the art that by the present invention, additionally provide the various combination structure of various assemblies in described LED cell-shell 1, thus efficient improve more greatly heat conduction efficiency and effectively providing the frame for movement of practicality。
Skilled artisan understands that, preferably described radiator 91 is shaped as cylindric or round table-like or rounding mesa-shaped, and it is provided with a number of radiating fin, the quantity of described radiating fin, dense degree, thickness, material affect the radiating efficiency of described radiator 91, the shape of the global shape of described radiator 91 and described LED base adapts, and be connected with described LED base, the material of described radiator 91 can be fine aluminium, fine copper or Cu and Al combination etc.。Further, skilled artisan understands that, radiator 91 described in Fig. 1 is a schematic diagram, it is actually described radiator 91 and is placed in the schematic diagram after described LED base, it is coated with by LED base and described LED base exterior is brushed with paint or coating or other materials, therefore from not being immediately seen described radiator 91 in appearance。In FIG, the perspective view of described radiator 91 is not provided, does not repeat them here。
Fig. 1 illustrates a specific embodiment of the present invention, the structural representation of LED。Specifically, described LED at least includes LED cell-shell 1, substrate 2 and LED luminescence chip group 3, radiator 91。Further, as it is shown in figure 1, described LED cell-shell 1 defines inner space, described inner space is used for holding described substrate 2, LED luminescence chip group 3。The connected mode of described substrate 2 and bulb housing 1 has multiple, such as described substrate 2 can be attached on described bulb housing 1 inwall, skilled artisan understands that, this kind of connected mode preferably substrate 2 adopts elastomeric material to make and can bend, and is bonded on the inwall of described bulb housing 1 by glue。And in this specific embodiment, described substrate 2 adopts rigid material to make and preferably makes it not bend, and the inwall of described substrate 2 and described bulb housing 1 keeps certain distance, skilled artisan understands that, this kind of connected mode realizes preferably by the following manner: described radiator 91 is fixed on the bottom of described bulb housing 1, the end of described substrate 2 connects described radiator 91, and keeps being relatively fixed with described radiator 91, and then realizes being relatively fixed of substrate 2 and described bulb housing 1。It will be appreciated by those skilled in the art which kind of mode described substrate 2 adopts connect, in described bulb housing 1, the flesh and blood not affecting the present invention, do not repeat them here。Further, skilled artisan understands that, in a further advantageous embodiment, while the end of described substrate 2 connects described radiator 91, described substrate 2 is also attached to the inwall of described LED cell-shell 1, so that described substrate 2 is while directly conducting heat to described radiator 91, also by described LED cell-shell 1 to exterior conductive heat, thus improving radiating efficiency further。
Further, described LED luminescence chip group 3 is attached on described substrate 2, skilled artisan understands that, the mode that LED luminescence chip group 3 is attached on described substrate 2 has multiple, preferably, adopt Electrostatic Absorption method, its principle is when an object with electrostatic is when the object of another not static electrification, due to electrostatic induction, do not have the interior of articles of electrostatic near static electrification object while can gather with charged object entrained by the electric charge like charges of equal number (opposite side produce) of opposite charge polarity, owing to the charges of different polarity are attracted each other, " Electrostatic Absorption " phenomenon will be shown。According to electrostatic absorption principle, we can make electric charge on LED luminescence chip or substrate band, by the principle that the charges of different polarity attract each other, it is possible to achieve LED luminescence chip group is attached at the step on described substrate。Again such as, change as one, it is also possible to the method just described LED luminescence chip group 3 attached by glue is attached on described substrate 2, and this has no effect on the flesh and blood of the present invention, does not repeat them here。
Further, described substrate 2 and described radiator 91 are connected such that the heat that described LED luminescence chip group 3 produces is delivered on described radiator 91 by described substrate 2。Skilled artisan understands that, preferably described substrate 2 adopts the highly heat-conductive materials such as metal to make, the heat that described LED luminescence chip group 3 produces can pass to described radiator 91 by the air within described bulb housing 1, described substrate 2 can also be passed through simultaneously and pass to described radiator 91, and aerial conduction of comparing, described substrate 2 heat conduction efficiency is higher, and therefore this kind of mode can be greatly improved heat conduction efficiency, accelerates distributing of heat。The connected mode of described substrate 2 and described radiator 91 has multiple, such as can adopt the mode fastened with glue to connect, such as can connect with the mode crossing welding again, again such as, can be threaded at the end of described substrate 2, arranging screw on described radiator 91, described substrate 2 is directly spun on described radiator 91。Again such as, described radiator 91 being provided with the jack matched with described substrate 2 terminal end shape, described substrate 2 is directly inserted on described radiator 91。It will be appreciated by those skilled in the art that the flesh and blood adopting which kind of connected mode to have no effect on the present invention, do not repeat them here。
Preferably as the first embodiment of this detailed description of the invention, described LED luminescence chip group 3 is only attached at the one side of described substrate 2。Skilled artisan understands that, in actual applications, preferably described LED includes many group substrates 2, and preferably described many group substrates 2 are arranged in a crossed manner, therefore described LED luminescence chip group 3 need not be set on the surface that described many group substrates 2 are relative, avoiding the substrate 2 that the light that described LED luminescence chip group 3 sends is arranged at its opposite to be blocked, described LED luminescence chip group 3 is attached to the described many group substrates 2 one side towards bulb housing 1。The attaching mode of described LED luminescence chip group 3, in above existing narration, does not repeat them here。And in a further advantageous embodiment, in order to improve luminous intensity, it is also possible to all attach described LED luminescence chip group 3 on the two sides of described substrate 2, this has no effect on the concrete technical scheme of the present invention。
Preferably, the second embodiment as this detailed description of the invention, described substrate 2 is linear type, and the top 21 of described substrate 2 contacts described LED cell-shell 1, as in figure 2 it is shown, described substrate 2 tilts to the direction of described bulb housing 1 axis and is kept at an angle, and the angle that described many group substrates 2 tilt relative to described bulb housing 1 axis is identical, the top 21 of described many group substrates 2 all contacts described LED cell-shell 1, and finally converges to a bit, is formed and is similar to pyramidal structure。Skilled artisan understands that, the advantage of linear type substrate is that processing technique is easy, speed of production is high, namely can be made into either directly through cutting technique or mould pressing process, described substrate top 21 contacts described LED cell-shell 1 and is more beneficial for keeping being relatively fixed of substrate 2 and bulb housing 1, improve in actual use, the stability of substrate 2。And in a further advantageous embodiment, described substrate 2 arranges with linear type and multiple substrate 2 points to same direction, but the top of described substrate 2 not in contact with, but relatively close on, such technical scheme then will not produce the interactive problem of electric charge between substrate。Those skilled in the art are appreciated that by above-described embodiment, no matter whether the top of described substrate 2 contacts, the top of described substrate 2 can contact the top of described LED cell-shell 1, can not also contact and be only close on the top of described LED cell-shell 1, such mode can the length of length Yu described LED cell-shell 1 by arranging described substrate 2 realize, and has no effect on technical scheme。
Change as one, described substrate 2 can also be shaped form (Fig. 2 is not shown), the shape of described shaped form substrate 2 is similar to described bulb housing 1 shape, can fitting with described bulb housing 1 inwall or not fit, organize after described substrate 2 combines with the interleaved mode being similar to Fig. 2 forms spindle shape more。It will be appreciated by those skilled in the art that shaped form substrate can be made by the technique embossed, it is also possible to linear type substrate is carried out bending process and makes。
Change as another kind, the shape of described shaped form substrate 2 can also S sigmoid, arranges with the axis parallel of described bulb housing 1, it is preferable that more organize described substrate 2 and surround a cylinder, and final combination formation Corallium Japonicum Kishinouye shape。
Further, in another change case, the top 21 of described substrate 2 is close to described LED cell-shell 1, and the shape of described substrate 2 can also be straight line or curve-like, and before set-up mode, existing narration, does not repeat them here。Described substrate 2 does not contact the advantage of described LED cell-shell 1, and the size of described substrate 2 can not be subject to the restriction of described LED cell-shell 1 size, and namely described substrate 2 can large-scale production be universal standard part, as the replacement substrate in actually used。
Further, in another change case, described substrate 2 is inverted U, and the top 21 of described inverted U substrate 2 contacts described LED cell-shell 1。The setting as it is shown on figure 3, many group inverted U substrates 2 intersect, and be connected at inverted U top 21 place, inverted U top 21 also contacts described LED cell-shell 1 simultaneously。Skilled artisan understands that, described inverted U substrate 2 actually falls within shaped form substrate, the curved design of inverted U is easier to processing in shaped form substrate, have only to form linear type substrate bending, substrate design is inverted U and the setting that intersects, the effect that auxiliary is fixing can be played in described inverted U top, and in actual use, the stability of described substrate 2 can be higher。
Changing as one, the top 21 of described inverted U, close to described LED cell-shell 1, does not namely contact with described LED cell-shell 1, and its advantage, in above existing narration, does not repeat them here。
With reference to above-described embodiment, skilled artisan understands that, in a further advantageous embodiment, described substrate 2 be shaped as half elliptic (not shown in Fig. 2), and the half elliptic outward flange of multiple described substrate 2 is all inwardly arranged, form the form that multiple half elliptic is placed back-to-back, the shape of bouquet is integrally formed。Further, it will be appreciated by those skilled in the art that the top of described substrate 2 can contact the inwall of described LED cell-shell 1, it is also possible to not contacting, this has no effect on technical scheme。
Preferably, as the 3rd embodiment of this detailed description of the invention, described LED also includes radiating connection plate 92, and described substrate 2 is connected on described radiating connection plate 92, described radiating connection plate 92 is connected to described radiator 91, and namely described radiating connection plate 92 is as transition connecting apparatus。It will be appreciated by those skilled in the art that arranging radiating connection plate 92 can strengthen the connective stability of described substrate 2 and described radiator 91 further, and described radiating connection plate 92 is processed more easy, production cost is lower。Preferably described substrate 2 is inserted on described radiating connection plate 92, as shown in Figure 6, namely coupling jack 93 is set on described radiating connection plate 92, the shape of the shape of described coupling jack and described substrate 2 end adapts, for connecting difform substrate 2, thus realizing changing the substrate 2 of other shapes under need not changing described radiator 91 situation。
As one change, described radiating connection plate 92 and described substrate 2 are one, for instance a kind of mould of design, and the shape of described dies cavity is identical with the shape after described radiating connection plate 92 and the combination of described substrate 2, one-body molded either directly through mould pressing process。It will be appreciated by those skilled in the art that the flesh and blood adopting which kind of mode to have no effect on the present invention, do not repeat them here。
Further, skilled artisan understands that, described radiating connection plate 92 has multiple with described radiator 91 connected mode, such as can be connected by the mode welded, such as can be connected by the mode of bayonet lock again, such as can being connected by screw again, described radiating connection plate 92 is linked with radiator 91 by described screw through the through hole 95 shown in Fig. 7。。The preferably material selection height heat-conducting of described radiating connection plate 92, it is possible to identical or different from the material of described radiator 91。
Preferably, the 4th embodiment as this detailed description of the invention, the shape of the shape of described radiating connection plate 92 and described radiator 91 adapts, this design can realize the thermal conduction effect of maximum area, and the shape of described radiating connection plate 92 is also better with the connective stability of described radiator 91 simultaneously。Changing as one, the shape of the shape of described radiating connection plate 92 and described radiator 91 can be different, and this has no effect on the substantial effect of the present invention, does not repeat them here。
Preferably as the 5th embodiment of this specifically embodiment, the end of described substrate 2 be shaped as in following shape any one。Such as, preferably as shown in Figure 6, the shape of the end of described substrate 2 is cone structure, described radiating connection plate 92 is provided with the first jack adapted with described cone structure, skilled artisan understands that, the shape of described end is designed as cone structure and can be easier to insert in described first jack, installs more convenient。
Further, change as one, as shown in Figure 6, the shape of the end of described substrate 2 is flat structure, and described radiating connection plate 92 is provided with the second jack adapted with described flat structure, skilled artisan understands that, although described cone structure end is easier to insert in jack than described flat structure end, but described flat structure end is being completely inserted into described second jack, and its dimensional fits Du Genggao, stability is higher。
Further, change as one, as shown in Figure 6, the last segment of described end is the cylindrical-shaped structure that diameter is less, the last segment described part upwards is the cylindrical-shaped structure being relatively large in diameter or flat structure, namely described substrate 2 forms the last segment and forms circular flat shoulder with one section remained upwards, and described radiating connection plate 92 is provided with the 3rd jack that the cylindrical-shaped structure less with described diameter adapts。Designing compared to above two, the dimensional fits Du Genggao of this kind of design, simultaneously because design has circular flat shoulder, complete to be connected with radiating connection plate 92 at described substrate 2, described substrate 2, when receiving vibrations, will not rock, and stability is higher。
In another change, described 3rd jack inner surface is also provided with screw thread, and the cylindric end of described substrate 2 is also equipped with screw thread, and described substrate 2 is threaded connection with described radiator connecting plate 92, improves connective stability further。
Further, it will be appreciated by those skilled in the art that the shape of described substrate 2 end can concurrently forming at shaping substrate 2, namely on the mould of shaping substrate 2, do the design of corresponding shape, realize one-body molded, it is also possible to after substrate 2 molding, become corresponding shape by digital lathe process。Jack on described radiating connection plate 92 can be one-body molded when radiating connection plate 92 described in molding, jack can also be processed by boring or Sheet Metal Forming Technology in the later stage, described jack can be blind hole can also be through hole, and this has no effect on the flesh and blood of the present invention, does not repeat them here。
Preferably as the sixth embodiment of basis specifically embodiment, after described end is connected with described radiating connection plate 92, the electrode on described substrate 2 electrically connects with the electrode on described radiating connection plate 92, so that described LED luminescence chip group 3 can be powered。Skilled artisan understands that, when on described radiating connection plate 92, jack is blind hole, electrode on described substrate 2 is difficulty with directly electrically connecting with power supply motor, now need to electrically connect the electrode on described substrate 2 with the electrode on described radiating connection plate 92, and then connect current electrode by described radiating connection plate 92。This kind of connected mode need not arrange extra wire, and the end at described substrate 2 arranges conducting connection point, and described conducting connection point contacts the electrode realized on described substrate 2 and electrically connects with the electrode on described radiating connection plate 92 with described blind hole。Changing as one, described substrate 2 all adopts high conductive material to make with described radiating connection plate 92, and the outer surface of described substrate 2 end contacts with the jack inner surface of described radiating connection plate 92 and can complete electrical connection。
Further, it will be appreciated by those skilled in the art that when on described radiating connection plate 92, jack is through hole, and the end of substrate 2 do not extend out through hole, now may be used without above-mentioned connected mode and connect, do not repeat them here。
Preferably as the 7th embodiment of this detailed description of the invention, described end electrically connects with current electrode in the lower section of described radiating connection plate 92, so that described LED luminescence chip group 3 can be powered。It will be appreciated by those skilled in the art that when on described radiating connection plate 92, jack is through hole, it is possible to either directly through wire, described end is electrically connected with current electrode, the through hole of the described wire described radiating connection plate 92 of traverse。Change as one, when described end can stretch out the through hole of described radiating connection plate 92, it is possible to do not use wire directly described end to be connected to described current electrode。
Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence。Preferably, skilled artisan understands that, described substrate 2 is designed as translucent or transparence and can ensure that the light major part that described LED luminescence chip group 3 is launched can both exhale to greatest extent, if described substrate 2 is nontransparent shape or light transmission extreme difference, then can cause the illuminating effect extreme difference of LED, can be that the light that LED projects produces many shades and black speck, leverage illuminating effect and the function of LED。Further, it will be appreciated by those skilled in the art that the transparence realizing described substrate 2 or translucent can by use transparent material make described substrate 2, it is also possible to by punching at described substrate 2, so can also increase the penetration capacity of light, it is possible to make the illuminating effect of LED more preferably。The process of any transparent or translucentization being capable of described substrate 2, all can meet the present invention requirement to described substrate 2, and this has no effect on the flesh and blood of the present invention, does not repeat them here。
Preferably, it will be appreciated by those skilled in the art that in this embodiment, the surface of described substrate 2 is substantially little than described LED luminescence chip group 3。The effect that described substrate 2 plays is primarily used to connect described LED cell-shell 1 and described LED luminescence chip group 3, so the size of described substrate 2 is not had strict restriction, it is possible to realize above-mentioned linkage function。But consider that if described substrate is too big, it will affect described LED luminescence chip group 3 through the illumination effect of described LED cell-shell 1, the illuminating effect of described LED is made a big impact。Therefore, described substrate 2 should under being capable of connecting the described LED cell-shell 1 premise with described LED luminescence chip group 3 function, little as much as possible。So will not being largely affected by the lighting function of described LED luminescence chip group 3, it is ensured that the illuminating effect of described LED, its purpose, with described substrate 2 is designed to the transparent or translucent effect to reach is consistent, does not repeat them here。
Preferably as another embodiment, gassy in described LED cell-shell 1, it is preferable that described gas is the mixing gas of nitrogen and argon, its role is to prevent the parts in described bulb housing 1 not oxidized, extend the service life of described LED。Further, changing as one, described LED cell-shell 1 can be evacuated, and its objective is to completely cut off completely air, extends the service life of described LED。
With reference to above-mentioned Fig. 1 to embodiment illustrated in fig. 6, skilled artisan understands that, according to a preferred embodiment of the present invention, provide a kind of 3DCOBLED luminescence component, it specifically includes: substrate 2 and LED luminescence chip group 3, described LED luminescence chip group 3 is attached on described substrate 2, and described substrate 2 and described radiator 91 are connected such that the heat of described LED luminescence chip group 3 is delivered on described radiator 91 by described substrate 2。Skilled artisan understands that, preferably described substrate 2 adopts the highly heat-conductive materials such as metal to make, the heat that described LED luminescence chip group 3 produces can pass to described radiator 91 by the air within described bulb housing 1, described substrate 2 can also be passed through simultaneously and pass to described radiator 91, and aerial conduction of comparing, described substrate 2 heat conduction efficiency is higher, and therefore this kind of mode can be greatly improved heat conduction efficiency, accelerates distributing of heat。The connected mode of described substrate 2 and described radiator 91 has multiple, such as can adopt the mode fastened with glue to connect, such as can connect with the mode crossing welding again, again such as, can be threaded at the end of described substrate 2, arranging screw on described radiator 91, described substrate 2 is directly spun on described radiator 91。Again such as, described radiator 91 being provided with the jack matched with described substrate 2 terminal end shape, described substrate 2 is directly inserted on described radiator 91。It will be appreciated by those skilled in the art that the flesh and blood adopting which kind of connected mode to have no effect on the present invention, do not repeat them here。
Further, it will be appreciated by those skilled in the art that COB full name ChipOnBoard, Chinese chip on board encapsulates, being mounted on printed wiring board by semiconductor chip handing-over, the electrical connection of chip and substrate lead-in wire sewing method realizes, and covers with resin to guarantee reliability。The more commonly used technological process is as follows: cleaning PCB, drips bonded adhesives, chip and pastes, tests, seals black glue and be heating and curing, and these broadly fall into prior art, do not repeat them here。Being characterized in that of the present embodiment, the technology adopting COB to encapsulate described luminescence chip group 3 is connected with described substrate 2, collectively constitutes illuminating source。Described substrate 2 itself can be pcb board, it is also possible to individually arranging pcb board again on described substrate 2, this all affects the flesh and blood of not embodiment, does not repeat them here。
Preferably as another embodiment, described LED luminescence chip group 3 is only attached at the one side of described substrate 2。Skilled artisan understands that, in actual applications, preferably described LED includes many group substrates 2, and preferably described many group substrates 2 are arranged in a crossed manner, therefore described LED luminescence chip group 3 need not be set on the surface that described many group substrates 2 are relative, avoiding the substrate 2 that the light that described LED luminescence chip group 3 sends is arranged at its opposite to be blocked, described LED luminescence chip group 3 is attached to the described many group substrates 2 one side towards bulb housing 1。The attaching mode of described LED luminescence chip group 3, in above existing narration, does not repeat them here。And in another change case, in order to improve luminous intensity, it is also possible to all attach described LED luminescence chip group 3 on the two sides of described substrate 2, this has no effect on the concrete technical scheme of the present invention。
Preferably as this another embodiment, described substrate 2 is printed circuit board (being normally referred to as pcb board), and layout is made by etching or typography in wherein said substrate 2 surface。Skilled artisan understands that, described substrate 2 includes the first base copper, second insulating barrier, trialuminum based layer or base copper, described first base copper and the second insulating barrier constitute pcb board, described trialuminum based layer or base copper are the substrate layers of described substrate 2, layout is made by etching or electronic printing technique in described first base copper surface, described layout needs the position according to the electronic devices and components on described substrate 2 to design, this partial content needs IC layout design to complete, do not affect the flesh and blood of the present invention, do not repeat them here。Described second insulating barrier is for keeping the insulating properties between the circuit on described layout, and the material of described second insulating barrier can be bakelite plate, glass mat and plastic plate。Changing as one, described substrate 2 can be flexible board, and namely the second insulating barrier adopts flexible material to make, such as polyimides or mylar, to realize bending more easily, it is bent into U-shaped, V-type, Z-type, M type, O type etc., to coordinate difform light fixture。
Further, on described substrate 2, also distribution has aperture, described aperture can be component hole, fastener hole, plated through-hole etc., again through COB binding technology, electronic devices and components are set, such as EMC filtering chip, bridge rectifier chip, constant-current driven chip, LED luminescence chip etc., the substrate 2 being provided with above-mentioned electronic devices and components can be used as the light source part of LED, is applied to difform LED。
Preferably as another embodiment, described substrate 2 is linear type, it will be appreciated by those skilled in the art that the advantage of linear type substrate is that processing technique is easy, and speed of production is high, namely can be made into either directly through cutting technique or mould pressing process。Changing as one, described substrate 2 can also be shaped form。It will be appreciated by those skilled in the art that shaped form substrate can be made by the technique embossed, it is also possible to linear type substrate is carried out bending process and makes。No matter being linear type or shaped form substrate, the end of described substrate is all connected with current electrode, and described current electrode can be independent, it is also possible to be integrated on radiating connection plate 92 as shown in Figure 2 or Figure 3, i.e. electrode 94 in Fig. 2 or Fig. 3。When described LED only one of which substrate, the both positive and negative polarity of described current electrode is both connected to the end of described substrate；When described LED exists multiple substrate, it is possible to electrically connected by modes such as wires between multiple substrates, and then it is connected in the plurality of substrate by the both positive and negative polarity of described current electrode the end of any two substrate, forms current supply circuit。
Further, change as another kind, the shape of described shaped form substrate 2 can also S sigmoid, arranges with the axis parallel of described bulb housing 1, it is preferable that more organize described substrate 2 and surround a cylinder, and final combination formation Corallium Japonicum Kishinouye shape。The connected mode of described S shape substrate and current electrode is not as it has been described above, repeat them here。
Further, change as one, described substrate 2 be shaped as half elliptic, and the half elliptic outward flange of multiple described substrate 2 is all inwardly arranged, and forms the form that multiple half elliptic is placed back-to-back, the shape of bouquet is integrally formed。The connected mode of described half elliptic substrate and current electrode is not as it has been described above, repeat them here。
Further, change as one, described substrate 2 is inverted U, it will be appreciated by those skilled in the art that described inverted U substrate 2 actually falls within shaped form substrate, the curved design of inverted U is easier to processing in shaped form substrate, having only to form linear type substrate bending, substrate design is inverted U and the setting that intersects, and the effect that auxiliary is fixing can be played in described inverted U top, in actual use, the stability of described substrate 2 can be higher。The two ends of " U " type opening part of described inverted U substrate connect the both positive and negative polarity of current electrode respectively, form current supply circuit。
Further, changing as one, described substrate 2 is X-type, and the processing mode of described X-type substrate has multiple, for instance, two linear type substrates are tilted certain angle and the setting that intersects, can be formed；Again such as, the first linear type substrate and the second linear type substrate are bent into V-shaped, connect the first linear type substrate and the second linear type substrate at some place, the end of V-shaped, it is possible to form X-type。As shown in Figure 4, the two ends 31 of the lower forks of described X-type substrate connect the both positive and negative polarity of current electrode respectively, form current supply circuit。
Further, changing as one, described substrate 2 is inverted Y-shaped, and the generation type of described Y type substrate such as, shows and the first linear type substrate is bent into V-shaped, then the second linear type substrate is connected directly between the some place, the end of the V-shaped substrate after bending, can be formed。Again such as, more easy, directly three linear type substrates are spliced into Y-shaped。The two ends of described inverted Y-shaped top jag connect the both positive and negative polarity of current electrode respectively, form current supply circuit, change as one, the end of " perpendicular 1 " type of described inverted Y-shaped bottom connects the both positive and negative polarity of current electrode, form current supply circuit, it will be appreciated by those skilled in the art that the size of this kind of connected mode needs described " perpendicular 1 " type bottom is sufficiently large, it is ensured that form the surface of the both positive and negative polarity connecting described current electrode。
Further, change as one, described substrate 2 is the type of falling W, namely the filament shape of conventional incandescent it is similar to, linear type substrate bending such as, is formed, again such as by the generation type of the described type of falling W substrate, first linear type substrate and the second linear type substrate are bent into V-shaped, then two V-shaped substrates are spliced into the type of falling W。As it is shown in figure 5, company the link 32 of the bottom of the described type of falling W substrate connects the both positive and negative polarity of current electrode respectively, form current supply circuit。
Preferably as another embodiment, the position that described substrate 2 is bent does not attach described LED luminescence chip group 3, is so possible to prevent described substrate 2 when bending, and described LED luminescence chip group 3 is deformed and damages, and improves the yield rate of goods。
Preferably as another embodiment, as it is shown on figure 3, described substrate 2 is connected on a radiating connection plate 92, described radiating connection plate 92 is connected to described radiator 91, and namely described radiating connection plate 92 is as transition connecting apparatus。It will be appreciated by those skilled in the art that arranging radiating connection plate 92 can strengthen the connective stability of described substrate 2 and described radiator 91 further, and described radiating connection plate 92 is processed more easy, production cost is lower。Preferably described substrate 2 is inserted on described radiating connection plate 92, as shown in Figure 6, namely coupling jack 93 is set on described radiating connection plate 92, the shape of the shape of described coupling jack and described substrate 2 end adapts, for connecting difform substrate 2, thus realizing changing the substrate 2 of other shapes under need not changing described radiator 91 situation。
As one change, described radiating connection plate 92 and described substrate 2 are one, for instance a kind of mould of design, and the shape of described dies cavity is identical with the shape after described radiating connection plate 92 and the combination of described substrate 2, one-body molded either directly through mould pressing process。It will be appreciated by those skilled in the art that the flesh and blood adopting which kind of mode to have no effect on the present invention, do not repeat them here。
Further, skilled artisan understands that, described radiating connection plate 92 has multiple with described radiator 91 connected mode, such as can be connected by the mode welded, such as can be connected by the mode of bayonet lock again, such as can being connected by screw again, described radiating connection plate 92 is connected with radiator 91 by described screw through the through hole 95 shown in Fig. 7。The preferably material selection height heat-conducting of described radiating connection plate 92, it is possible to identical or different from the material of described radiator 91。
Preferably, as another embodiment, the shape of the shape of described radiating connection plate 92 and described radiator 91 adapts, and this design can realize the thermal conduction effect of maximum area, and the shape of described radiating connection plate 92 is also better with the connective stability of described radiator 91 simultaneously。Changing as one, the shape of the shape of described radiating connection plate 92 and described radiator 91 can be different, and this has no effect on the substantial effect of the present invention, does not repeat them here。
Preferably as another embodiment, the end of described substrate 2 be shaped as in following shape any one。Such as, preferably as shown in Figure 6, the shape of the end of described substrate 2 is cone structure, described radiating connection plate 92 is provided with the first jack adapted with described cone structure, skilled artisan understands that, the shape of described end is designed as cone structure and can be easier to insert in described first jack, installs more convenient。
Further, change as one, as shown in Figure 6, the shape of the end of described substrate 2 is flat structure, and described radiating connection plate 92 is provided with the second jack adapted with described flat structure, skilled artisan understands that, although described cone structure end is easier to insert in jack than described flat structure end, but described flat structure end is being completely inserted into described second jack, and its dimensional fits Du Genggao, stability is higher。
Further, change as one, as shown in Figure 6, the last segment of described end is the cylindrical-shaped structure that diameter is less, the last segment described part upwards is the cylindrical-shaped structure being relatively large in diameter or flat structure, namely described substrate 2 forms the last segment and forms circular flat shoulder with one section remained upwards, and described radiating connection plate 92 is provided with the 3rd jack that the cylindrical-shaped structure less with described diameter adapts。Designing compared to above two, the dimensional fits Du Genggao of this kind of design, simultaneously because design has circular flat shoulder, complete to be connected with radiating connection plate 92 at described substrate 2, described substrate 2, when receiving vibrations, will not rock, and stability is higher。
In another change, described 3rd jack inner surface is also provided with screw thread, and the cylindric end of described substrate 2 is also equipped with screw thread, and described substrate 2 is threaded connection with described radiator connecting plate 92, improves connective stability further。
Further, it will be appreciated by those skilled in the art that the shape of described substrate 2 end can concurrently forming at shaping substrate 2, namely on the mould of shaping substrate 2, do the design of corresponding shape, realize one-body molded, it is also possible to after substrate 2 molding, become corresponding shape by digital lathe process。Jack on described radiating connection plate 92 can be one-body molded when radiating connection plate 92 described in molding, jack can also be processed by boring or Sheet Metal Forming Technology in the later stage, described jack can be blind hole can also be through hole, and this has no effect on the flesh and blood of the present invention, does not repeat them here。
Preferably as another embodiment, after described end is connected with described radiating connection plate 92, the electrode on described substrate 2 electrically connects with the electrode on described radiating connection plate 92, so that described LED luminescence chip group 3 can be powered。Skilled artisan understands that, when on described radiating connection plate 92, jack is blind hole, electrode on described substrate 2 is difficulty with directly electrically connecting with power supply motor, now need to electrically connect the electrode on described substrate 2 with the electrode on described radiating connection plate 92, and then connect current electrode by described radiating connection plate 92。This kind of connected mode need not arrange extra wire, and the end at described substrate 2 arranges conducting connection point, and described conducting connection point contacts the electrode realized on described substrate 2 and electrically connects with the electrode on described radiating connection plate 92 with described blind hole。Changing as one, described substrate 2 all adopts high conductive material to make with described radiating connection plate 92, and the outer surface of described substrate 2 end contacts with the jack inner surface of described radiating connection plate 92 and can complete electrical connection。
Further, it will be appreciated by those skilled in the art that when on described radiating connection plate 92, jack is through hole, and the end of substrate 2 do not extend out through hole, now may be used without above-mentioned connected mode and connect, do not repeat them here。
Preferably as another embodiment, described end electrically connects with current electrode in the lower section of described radiating connection plate 92, so that described LED luminescence chip group 3 can be powered。It will be appreciated by those skilled in the art that when on described radiating connection plate 92, jack is through hole, it is possible to either directly through wire, described end is electrically connected with current electrode, the through hole of the described wire described radiating connection plate 92 of traverse。Change as one, when described end can stretch out the through hole of described radiating connection plate 92, it is possible to do not use wire directly described end to be connected to described current electrode。
Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence。Preferably, skilled artisan understands that, described substrate 2 is designed as translucent or transparence and can ensure that the light major part that described LED luminescence chip group 3 is launched can both exhale to greatest extent, if described substrate 2 is nontransparent shape or light transmission extreme difference, then can cause the illuminating effect extreme difference of LED, can be that the light that LED projects produces many shades and black speck, leverage illuminating effect and the function of LED。Further, it will be appreciated by those skilled in the art that the transparence realizing described substrate 2 or translucent can by use transparent material make described substrate 2, it is also possible to by punching at described substrate 2, so can also increase the penetration capacity of light, it is possible to make the illuminating effect of LED more preferably。The process of any transparent or translucentization being capable of described substrate 2, all can meet the present invention requirement to described substrate 2, and this has no effect on the flesh and blood of the present invention, does not repeat them here。
Preferably as another embodiment, described substrate 2 is any one composition in following material:
One, metal base circuit board, such as copper base or aluminium base, skilled artisan understands that, adopt metal base circuit board, good heat conductivity, but before by other electronic chips such as COB technology encapsulating light emitting chips, it is necessary to arrange insulating barrier on a substrate 2 again, described insulating barrier is for keeping the insulating properties between the circuit on substrate 2。
Two, epoxy radicals wiring board, namely use epoxy resin to make wiring board, it will be appreciated by those skilled in the art that employing epoxy radicals wiring board, can either directly through electronic printing technique printed electronic circuit figure on a substrate 2, again through other electronic chips such as COB technology encapsulating light emitting chips。
Three, glass base circuit board, its feature is similar with epoxy radicals wiring board, there is good insulating properties, also there is excellent light transmission simultaneously, if but glass base circuit board to adopt nonlinear abnormally-structured, require over Design of Dies one-shot forming, and due to itself material, glass base circuit board is easier to when using damage。
Four, the metal rack of punching press, foil, the pluses and minuses of its material are similar with above-mentioned metal base circuit board, simply change in shape and size, are characterized as being and are easier to bending and the difform substrate of molding, improve production efficiency and reduce cost。
Further, skilled artisan understands that, in another specific embodiment, such as specific embodiment shown in Fig. 7, Fig. 8, the surface area of described substrate 2 is preferably more than the area of described LED luminescence chip group 3, so that described LED luminescence chip group 3 is adhered on described substrate 2 by entirety, and further by the described fixing inner surface being attached at described LED cell-shell 1 of substrate 2。Further, it will be appreciated by those skilled in the art that attaching set forth in the present invention does not represent described substrate 2 and is attached to the inner surface of described LED cell-shell 1, and be merely representative of both and be relatively fixed。
Further, it will be appreciated by those skilled in the art that in a preferred embodiment, in order to increase light transmission, the thickness of described substrate 2 should be less。When the thickness of described substrate 2 is maintained in a less thickness range, light transmission can be realized better, it is unlikely to make the light that described LED luminescence chip group 3 is launched cause very big decay after described substrate 2, it is ensured that the illuminating effect of light transmission and described LED。Further, if it will be appreciated by those skilled in the art that, described substrate 2 is too thick, then serious mistake can stop the light that described LED luminescence chip group 3 is launched, cause the significantly decay of described light, also can affect the heat dispersion of described LED。Such technical scheme has no effect on the concrete scheme of the present invention, does not repeat them here。
Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixing, its position can should determine that mutually according to the position of described LED luminescence chip group 3。Meanwhile, the quantity of described substrate 2 is not unique yet, it is possible to be one can also be multiple。Further, skilled artisan understands that the determination of the determination of amount of described substrate 2 and position, it is primarily to and better described LED cell-shell 1 is fitted with described LED luminescence chip group 3, can in concrete implementation, dynamically adjust quantity and the position of described substrate 2, do not repeat them here。
Further, it will be appreciated by those skilled in the art that in this embodiment, the upper surface of the LED luminescence chip in described LED luminescence chip group 3 scribbles fluorescent material。Specifically, described LED luminescence chip group 3 includes one or more LED luminescence chip, it is preferable that when it comprises multiple LED luminescence chip, then each LED luminescence chip all can obtain the electric power provided from electric power driving module, does not repeat them here。Further, it is preferable that the upper surface of wherein one or more LED luminescence chips scribbles fluorescent material, so that the light that the LED luminescence chip being applied fluorescent material sends is more uniform, color is easier to be received by consumer。
Further, in a preferred embodiment of above-described embodiment, described substrate 2 at least includes via 21, specifically, with the via 21 of laser ablation ad hoc rule distribution on described substrate 2, via 21 diameter, between 0.1～0.5mm, the light of LED luminescence chip group 3 can be passed through。It will be appreciated by those skilled in the art that the quantity of described via 21 and distribution are not changeless。Such as preferably, described via 21 is uniformly distributed in one rectangular, in a further advantageous embodiment, described via 21 is uniformly distributed in a round shape, and in another preferred embodiment, the part of described via 21 is uniformly distributed, another part non-uniform Distribution, and this has no effect on the concrete technical scheme of the present invention。It will be appreciated by those skilled in the art that described via 21 is at least as loophole purposes, does not repeat them here。
More specifically, described substrate 2 adopts aluminium base to pass through punch forming, substrate 2 presents linear type mode cabling, which can facilitate bending, LED luminescence chip group 3 is made to be more prone to brake forming on a substrate 2, the width of LED luminescence chip group 3 can select between 0.5～5mm, substrate 2 thickness selects between 0.3～2.0mm, one group of LED luminescence chip group 3 power is preferably between 1～3W, the combination of LED luminescence chip group 3 is divided into the various combinations such as 3,4,6,8, to be combined into the LED of different capacity, do not repeat them here。
Further, skilled artisan understands that, preferably, as an embodiment, described radiating connection plate 92 is provided with built-in power, EMC filter circuit, crossing current drive circuit, preferably described built-in power, EMC filter circuit, crossing current drive circuit is placed directly against on described radiating connection plate 92 by COB binding technology, as shown in Figure 6, described substrate 2 is connected with built-in power by the electrode 94 on described radiating connection plate 92, described luminescence chip group 3 is connected on affiliated substrate 2, described luminescence chip group 3 is driven by described built-in power by electric power driving module, thus it is luminous to control described luminescence chip group 3。By this kind of mode, described substrate 2, luminescence chip group 3, electric power driving module, radiating connection plate 92, built-in power are collectively forming electricity loop, reach to control the result of described luminescence chip 3 break-make。
More specifically, a change case as above-described embodiment, described substrate 2 is electrically connected with external power source by the afterbody of bulb housing 1, described luminescence chip group 3 is driven by described external power source by described electric power driving module 5 grade, thus it is luminous to control described luminescence chip group 3, accordingly, similar with above-described embodiment, described radiating connection plate 92 is provided with EMC filter circuit, crossing current drive circuit, preferably described EMC filter circuit, crossing current drive circuit is placed directly against on described radiating connection plate 92 by COB binding technology, described substrate 2 is connected with the electrode 94 on described radiating connection plate 92。。By this kind of mode, described substrate 2, luminescence chip group 3, electric power driving module, radiating connection plate 92, external power supply are collectively forming electricity loop, reach to control the result of described luminescence chip 3 break-make。
Below in conjunction with accompanying drawing 7, Fig. 8 and Fig. 9, elaborate on how to be driven the preferred embodiment of described LED luminescence chip group 3 luminescence by circuit connecting mode。
Fig. 7 illustrates according to the first embodiment of the present invention, the connection diagram of LED substrate and LED luminescence chip group, flexible circuit board。It will be appreciated by those skilled in the art that described Fig. 7 is not the connection diagram that the purpose of the present embodiment unique connected mode figure, this figure is intended to illustrate to implement preferred embodiment。Specifically, as shown in Figure 7, described LED luminescence chip group 3 is connected to the side of described substrate 2, the inner surface of the opposite side of described substrate 2 and described bulb housing 1 attaches or does not attach, and it will be appreciated by those skilled in the art that the mode that described LED luminescence chip is connected with described substrate 2 is not changeless, can be such as that directly stamp is on the surface of described substrate 2, mode is varied, but has no effect on the flesh and blood of the present invention, therefore does not repeat them here。Meanwhile, on described substrate 2, distribution has via 21 (not showing in Fig. 7), about the distribution of via 21, and existing narration in above-mentioned Fig. 3, therefore do not repeat them here。
More specifically, be connected in series by described bonding line 22 between described each LED luminescence chip, by this kind of connected mode, between described each LED luminescence chip, a series circuit can be formed, power and power-off simultaneously simultaneously。
Further, flexible circuit board 4 described in is installed in the one end connecting power supply at described substrate 2, it will be appreciated by those skilled in the art that preferably, and the afterbody of described substrate 2 is provided with described flexible circuit board 4。Further, it is not changeless for it will be appreciated by those skilled in the art that described flexible circuit board 4 installs method on a substrate 2, it can use the method that the method for pressing can also use adhesion, method is multiple, but has no effect on the flesh and blood of the present invention, therefore does not repeat them here。
Further, in the present embodiment, as shown in FIG., preferably, the anode of last luminescence chip in described LED luminescence chip group 3 is electrically connected with described substrate 2, the negative electrode of a luminescence chip of flexible circuit board 4 close in LED luminescence chip group 3 is connected with the cathodic electricity in flexible circuit board 4 simultaneously。Further, skilled artisan understands that, in the use procedure of LED provided by the invention, afterbody preferably by described bulb housing 1 is electrically connected by described substrate 2 with external power source, such external power source is electrically connected typically by the afterbody of lamp socket Yu described bulb housing 1 and obtains, so that external power source can drive described LED。Further, it will be appreciated by those skilled in the art that the both positive and negative polarity of external power source will be connected with described substrate 2, flexible circuit board 4 respectively, thus constituting complete power circuit, for instance shown in Fig. 9。
Further, skilled artisan understands that, in the use procedure of LED provided by the invention, alternating current is to electrically connect with described LED luminescence chip group after the lamp holder by described LED directly electrically connects or first passed through by described lamp holder position external driving power rectifier, constant current with wire with described LED luminescence chip group again, and in Fig. 7 and embodiment illustrated in fig. 8, described flexible circuit board act as the effect of conducting circuit and LED drive circuit carrier。
Under the direct drive pattern of AC, the alternating current of described lamp holder joints is connected to the L binding post in the flexible circuit board 4 shown in Fig. 7 or Fig. 8 and N binding post either directly through wire, by described LED luminescence chip group being powered after EMC filter circuit, bridge rectifier, constant-current drive circuit, concrete structure is as shown in Figure 7 and Figure 8。Wherein, described EMC filter circuit, bridge rectifier, constant-current drive circuit etc. are not shown in Fig. 7 and Fig. 8, it is preferable that it is all be placed directly against in flexible circuit board by COB binding technology to form path by the circuit of scolding tin and flexible circuit board。
Further, it will be appreciated by those skilled in the art that by above-mentioned connected mode, the both positive and negative polarity of LED luminescence chip group 3 is formed, such that it is able to an electric loop can be formed when externally fed, by controlling the break-make in loop, and then whether control the luminescence of described LED luminescence chip group 3。
It will be appreciated by those skilled in the art that so that LED sends the white light of better effect, the upper surface in described LED luminescence chip group 3 coats fluorescent material 23, as shown in FIG.。
Further, how the electric loop shown in Fig. 7 is connected with power drives, below in conjunction with accompanying drawing 8 and accompanying drawing 9, is specifically described the embodiment of two kinds of connections。
Fig. 8 illustrates that in LED, power drives template is incorporated into the connection diagram in flexible circuit board structure according to the first embodiment of the present invention。It will be appreciated by those skilled in the art that described Fig. 8 is not the structure connection that the purpose of unique structure connection figure, this figure is intended to illustrate electric power driving module 5 and flexible circuit board 4。Specifically, as shown in Figure 8, described flexible circuit board 4 at least includes binding post L, binding post N, flexible circuit board anode and flexible circuit board negative electrode。Further, in the embodiment shown in fig. 8, described flexible circuit board anode and flexible circuit board negative electrode present in the way of electric power driving module 5, and preferably skilled artisan understands that described electric power driving module 5 is at least integrated with AC-DC conversion module and constant-current driven module (not shown), so that the both positive and negative polarity of described LED luminescence chip group 3 is formed。Skilled artisan understands that, described electric power driving module 5 is placed in the inside of flexible circuit board 4, becomes one of structure of flexible circuit board 4, skilled artisan understands that, the method that described electric power driving module 5 is integrated in flexible circuit board 4 has a variety of, does not repeat them here。
Further, with reference to Fig. 7, it will be appreciated by those skilled in the art that the negative electrode of described flexible circuit board 4 is connected with the cathodic electricity of described LED luminescence chip, the anode of described flexible circuit board 4 electrically connects with described substrate 2。By such connected mode, make described substrate 2 with positive charge, so that the anode of described LED luminescence chip is connected with any point of described substrate 2, without the anode being necessarily connected to described flexible circuit board 4, save the material of described flexible circuit board 4, also allow for being processed。And in preferred variant, for structure shown in Fig. 7 to Fig. 9, the anode of the anode of described flexible circuit board 4 with described LED luminescence chip can also be electrically connected, the negative electrode of described flexible circuit board 4 electrically connects with described substrate 2, correspondingly the negative electrode of described LED luminescence chip electrically connects with described substrate 2, thus the current supply circuit for described LED luminescence chip can also be formed。
Further, it will be appreciated by those skilled in the art that for a LED luminescence chip group, it is preferable that each the LED luminescence chip in this LED luminescence chip group connects either directly through bonding line 22, thus forming cascaded structure。On such architecture basics, the negative electrode of first LED luminescence chip can as the negative electrode of described LED luminescence chip group, and the anode of last LED luminescence chip can as the anode of described LED luminescence chip group。Yet further, in a change case, skilled artisan understands that, its anode can also be individually connected on described substrate 2 by each the LED luminescence chip in described LED luminescence chip group, correspondingly the negative electrode of each LED luminescence chip is connected on the negative electrode of described flexible circuit board 4, and this has no effect on technical scheme。
Further, with reference to above-mentioned Fig. 7 and Fig. 8, skilled artisan understands that, in above-described embodiment and change case, it provides the electrical interface of anode and negative electrode for described LED luminescence chip, thus when the anode of power supply is respectively connected to above-mentioned anode with negative electrode with negative electrode, it is possible to form a current supply circuit to described LED luminescence chip, do not repeat them here。
Fig. 9 illustrates that in LED, electric power driving module is placed on the connection diagram of flexible circuit board structure according to the first embodiment of the present invention。In conjunction with above-mentioned embodiment illustrated in fig. 7, skilled artisan understands that described flexible circuit board 4 at least includes flexible circuit board anode, i.e. LED+ shown in Fig. 9, and flexible circuit board negative electrode, i.e. LED-shown in Fig. 9。Described flexible circuit board negative electrode is connected with the cathodic electricity of the plurality of LED luminescence chip, and described flexible circuit board anode electrically connects with described substrate 2。By such connected mode, when connecting external power source 7, described substrate 2 is with positive charge, constitutes positive pole, so that the both positive and negative polarity of described luminescence chip group 3 is formed。It will be appreciated by those skilled in the art that described Fig. 9 is not the structure connection that the purpose of unique structure connection figure, this figure is intended to illustrate external power source (external drive part) 7 and flexible circuit board 4。By this kind of design, the circuit on-off of whole luminescence chip group 3 can be controlled by described flexible circuit board 4, it is achieved that to the luminescence of luminescence chip group 3 whether control。
Further, with reference to shown in Fig. 9, under DC mode activated, the alternating current of above-mentioned lamp holder joints is connected to external either directly through wire and drives on power supply, after power source internal carries out EMC filter circuit, bridge rectifier, constant-current drive circuit, connect the positive and negative electrode in the flexible circuit board above lamp bar again through wire, ultimately form path。It will be appreciated by those skilled in the art that flexible circuit board has here only served the effect of communication line, do not possess the AC ability directly driven。
Further, with reference to above-mentioned Fig. 1 to Fig. 9, it will be appreciated by those skilled in the art that above-mentioned Fig. 1 to Fig. 9 is not the unique structure connection figure of the present invention, the purpose of above-mentioned figure is intended to illustrate the structure of LED provided by the invention and wherein LED luminescence chip group and the structure of flexible circuit board, connection。As shown in Figure 8, described substrate 2 is preferably by metallic conductor, so complicated circuit and telegraph circuit cannot be realized, preferably thereunder region laminating great-wall shaped flexible circuit board, and multiple LED luminescence chip group can be set according to arranging of substrate, and preferably by parallel way between each LED luminescence chip group, quantity in parallel is to be determined by the number of described LED luminescence chip group。Preferably, the quantity of described LED luminescence chip group can select between 3-10 bar, different according to power, and compound mode can also be different, and this has no effect on technical scheme。
Further, the bottom of described substrate 2 is anode, and the negative electrode of described substrate 2 is connected to flexible circuit board by bonding line, as shown in Figure 7。And Fig. 7 is construed as a detail section in Fig. 8, Fig. 9, electric power driving module 5 and wiring part and is made up of lower section rectangular region in Fig. 8。Electric power driving module 5 shown in Fig. 8 mainly comprises following parts, for instance EMC filter circuit, bridge rectifier, constant-current drive circuit and other protection circuit compositions。By above-mentioned technical scheme so that LED provided by the invention can pass through DC powered, it is also possible to is driven by alternating current so that installation and debugging are safeguarded and all become very simple。Further, the alternating current of above-mentioned lamp holder joints is connected to the L ac terminal in the flexible circuit board 4 above lamp bar, N ac terminal either directly through wire, after EMC filter circuit, bridge rectifier, constant-current drive circuit, wherein EMC filter circuit, bridge rectifier, constant-current drive circuit are all be placed directly against in flexible circuit board by COB (chipOnboard) binding technology to form path by the circuit of scolding tin and flexible circuit board。
Further, skilled artisan understands that, owing to described substrate 2 is preferably by metal, therefore described substrate 2 can only serve as an electrode, and LED is a LED device, and wanting luminescence must have 2 electrodes, one adds positive voltage, one adds negative voltage, and circuit part relies on flexible circuit board to complete, as shown in Figure 7。Flexible circuit board is without delivering to tail end line place, so can be greatly saved the cost of wiring board, flexible circuit board only needs to connect with the electrode cathode of first chip, by after the LED quantity of connecting certain, anode is turned on by substrate itself, or weld directly against being combined by via with the anode in flexible circuit board, it is achieved the conducting of circuit。
Above specific embodiments of the invention are described。It is to be appreciated that the invention is not limited in above-mentioned particular implementation, those skilled in the art can make various deformation or amendment within the scope of the claims, and this has no effect on the flesh and blood of the present invention。

Claims (14)

1. a 3DCOBLED lamp luminescence component, it is luminous that it is used in a LED, described LED at least includes LED cell-shell (1) and radiator (91), and described LED luminescence component at least includes substrate (2) and LED luminescence chip group (3)；
It is characterized in that, described LED luminescence chip group (3) is attached on described substrate (2), and described substrate (2) is metal material, described substrate (2) and described radiator (91) are connected such that the heat of described LED luminescence chip group (3) is delivered on described radiator (91) by described substrate (2)；
Wherein, described LED luminescence chip group (3) is made up of some LED luminescence chips, it is connected in series by bonding line (22) between described LED luminescence chip, described substrate (2) connects one end of power supply and is provided with flexible circuit board (4), described LED luminescence chip group (3) is connected with described flexible circuit board (4) near a LED luminescence chip of described flexible circuit board (4) by bonding line (22), described LED luminescence chip group (3) is connected with described substrate (2) farthest away from a LED luminescence chip of described flexible circuit board (4) by bonding line (22)。
2. LED luminescence component according to claim 1, it is characterised in that described LED luminescence chip group (3) is only attached at the one side of described substrate (2)。
3. LED luminescence component according to claim 2, it is characterised in that described substrate (2) does not attach the another side of described LED luminescence chip group (3) and is attached on the inwall of described LED cell-shell (1)。
4. LED luminescence component according to claim 3, it is characterised in that described substrate (2) is any one in following shape:
-linear type；
-shaped form；
-half elliptic, and described half elliptic outside edges inwardly arranges；
-inverted U；
-X-type；
-inverted Y-shaped；Or
-the type of falling W。
5. LED luminescence component according to claim 4, it is characterised in that the position that described substrate (2) is bent does not attach described LED luminescence chip group (3)。
6. LED luminescence component according to any one of claim 1 to 5, it is characterized in that, also include radiating connection plate (92), described substrate (2) is connected on described radiating connection plate (92), and described radiating connection plate (92) is connected to described radiator (91)。
7. LED luminescence component according to claim 6, it is characterised in that the shape of the shape of described radiating connection plate (92) and described radiator (91) adapts。
8. LED luminescence component according to claim 7, it is characterised in that the end of described substrate (2) be shaped as in following shape any one:
-cone structure, described radiating connection plate (92) is provided with the first jack adapted with described cone structure；
-flat structure, described radiating connection plate (92) is provided with the second jack adapted with described flat structure；Or
The last segment of the end of-described substrate (2) is the cylindrical-shaped structure that diameter is less, the last segment described part upwards is the cylindrical-shaped structure being relatively large in diameter or flat structure, and described radiating connection plate (92) is provided with the 3rd jack that the cylindrical-shaped structure less with described diameter adapts。
9. LED luminescence component according to claim 8, it is characterized in that, after the end of described substrate (2) is connected with described radiating connection plate (92), electrode on described substrate (2) electrically connects with the electrode on described radiating connection plate (92), so that described LED luminescence chip group (3) can be powered。
10. LED luminescence component according to claim 9, it is characterized in that, the end of described substrate (2) electrically connects with current electrode in the lower section of described radiating connection plate (92), so that described LED luminescence chip group (3) can be powered。
11. the LED luminescence component according to any one of claim 1-5 and 7-10, it is characterised in that the upper surface of the LED luminescence chip at least described LED luminescence chip group (3) scribbles fluorescent material (23)。
12. LED luminescence component according to claim 11, it is characterised in that the quantity of described substrate (2) is one or more。
13. a 3DCOBLED lamp, at least include LED cell-shell (1) and radiator (91)；It is characterized in that, described LED also includes the 3DCOBLED lamp luminescence component according to any one of claim 1 to 12, and described 3DCOBLED lamp luminescence component is connected with described radiator (91)。
14. 3DCOBLED lamp according to claim 13, it is characterised in that be full of air in described LED cell-shell (1)。
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