CN203880468U

CN203880468U - 3D COB LED lamp light-emitting assembly and LED lamp

Info

Publication number: CN203880468U
Application number: CN201420301256.1U
Authority: CN
Inventors: 李建胜
Original assignee: SHANGHAI DINGHUI TECHNOLOGY Co Ltd
Current assignee: SHANGHAI DINGHUI TECHNOLOGY Co Ltd
Priority date: 2014-06-06
Filing date: 2014-06-06
Publication date: 2014-10-15
Anticipated expiration: 2024-06-06

Abstract

The utility model provides a 3D COB LED lamp light-emitting assembly applied in an LED lamp to emit light. The LED lamp at least comprises an LED bulb shell 1 and a radiator 91. The LED lamp light-emitting assembly at least comprises a substrate 2 and an LED light-emitting chip set 3. The LED light-emitting chip set 3 is attached to the substrate 2, and the substrate 2 is connected with the radiator 91 so that the heat of the LED light-emitting chip set 3 can be transmitted to the radiator 91 through the substrate 2.

Description

A kind of 3D COB LED lamp luminescence component and LED lamp

Technical field

The utility model relates to LED lighting field, and especially a kind of LED lamp particularly, relates to 3D COB LED lamp.

Background technology

Along with the widespread adoption of LED, the advantage as emerging illumination new light sources, is embodied day by day significantly.For example, the Chinese patent application that number of patent application is 201310239213.5, utility model name is called " LED lamp and filament thereof " has proposed a kind of LED luminescence component, it adopts glass substrate, and on described glass substrate, attach luminescence chip group, in described luminescence chip group, apply fluorescent material, and all apply fluorescent material in described glass substrate outside, the benefit of bringing is like this can double-side, but has brought this LED luminescence component simultaneously and be placed in the problem that described luminescence chip group is sent after bulb housing accumulation of heat cannot good heat radiating in bulb housing.And in order to solve heat dissipation problem, common way is to rush special gas in bulb housing, halogen family gas for example.And because halogen family gas needs sealing, so needing again to seal by high temperature the modes such as bubble encapsulates bulb housing and lamp socket etc., thereby make described special gas airtight, and the mode of high temperature envelope bubble can produce high temperature, strong voltage, can impact luminescence chip group, glass substrate, cause the yield of LED lamp significantly to reduce.Meanwhile, due to LED lamp heat dissipation problem, also make the quantity of LED luminescence chip group can not be too much, thereby make the power of LED lamp relatively low.

Each producer is proposing technical solution separately in various degree.The not fine solution of heat dissipation problem when but LED lamp is luminous, so its power is very limited, the utility model is wished the technical scheme that provides on this basis different.

Utility model content

The technological deficiency existing for LED lamp heat radiation aspect in prior art, the purpose of this utility model is to provide a kind of 3D COB LED luminescence component and corresponding 3D COB LED lamp.

According to an aspect of the present utility model, a kind of 3D COB LED lamp luminescence component is provided, it is used in a LED lamp luminous, described LED lamp at least comprises LED bulb housing 1 and radiator 91, described LED lamp luminescence component at least comprises substrate 2 and LED luminescence chip group 3, described LED luminescence chip group 3 is attached on described substrate 2, and described substrate 2 is connected so that the heat of described LED luminescence chip group 3 is delivered on described radiator 91 by described substrate (2) with described radiator 91.

Preferably, described LED luminescence chip group 3 is only attached at the one side of described substrate 2.

Preferably, the another side that described substrate 2 does not attach described LED luminescence chip group 3 is attached on the inwall of described LED bulb housing 1.

Preferably, described substrate 2 is printed circuit boards, and circuit diagram is made by etching or typography in wherein said substrate 2 surfaces.

Preferably, described substrate 2 is any in following shape:

-linear pattern or shaped form;

-half elliptic, and the outside inwardly setting in described half elliptic edge;

-inverted U;

-X-type;

-inverted Y-shaped; Or

-the type of falling W.

Preferably, the position that described substrate 2 is bent does not attach described LED luminescence chip group 3.

Preferably, described LED lamp luminescence component also comprises radiating connection plate 92, and described substrate 2 is connected on described radiating connection plate 92, and described radiating connection plate 92 is connected to described radiator 91.

Preferably, the shape of the shape of described radiating connection plate 92 and described radiator 91 adapts.

Preferably, the end 22 of described substrate 2 be shaped as any in following shape:

-cone structure, described radiating connection plate 92 is provided with the first jack 93 adapting with described cone structure.

-flat structure, described radiating connection plate 92 is provided with the second jack 94 adapting with described flat structure; Or

The last segment of-described end 22 is the cylindrical-shaped structure that diameter is less, the part that described the last segment makes progress is cylindrical-shaped structure or the flat structure that diameter is larger, and described radiating connection plate 92 is provided with the 3rd jack 95 that the cylindrical-shaped structure less with described diameter adapts.

Preferably, after described end 22 is connected with described radiating connection plate 92, the electrode on described substrate 22 is electrically connected to the electrode on described radiating connection plate 92, thereby described LED luminescence chip group 3 can be powered.

Preferably, described end 22 is electrically connected to current electrode below described radiating connection plate 92, thereby described LED luminescence chip group 3 can be powered.

Preferably, the upper surface of the LED luminescence chip at least described LED luminescence chip group 3 scribbles fluorescent material 23.

Preferably, described substrate 2 is any composition in following material: metal base circuit board epoxy radicals wiring board, glass-based wiring board, the metallic support of punching press, sheet metal.

Preferably, described substrate 2 is transparence or translucent.

Further, the quantity of described substrate 2 is one or more, and accordingly, the quantity of described LED luminescence chip group 3 is no less than the quantity of described substrate 2.

According to another aspect of the present utility model, a kind of 3D COB LED lamp is provided, at least comprise LED bulb housing 1, radiator 91, it is characterized in that, described LED lamp also comprises according to according to the 3D COB LED lamp luminescence component described in any one in claim 1 to 13, and described 3D COB LED lamp luminescence component is preferably connected with described radiator 91.

Preferably, in described LED bulb housing 1, be full of air.

According to another aspect of the present utility model, a kind of 3D COB LED lamp is provided, at least comprise LED bulb housing 1, substrate 2 and LED luminescence chip group 3, radiator 91;

Wherein, described LED luminescence chip group 3 is attached on described substrate 2, and described substrate 2 is connected so that the heat of described LED luminescence chip group 3 is delivered on described radiator 91 by described substrate 2 with described radiator 91.

Preferably, described substrate 2 is any in following shape:

-linear pattern or shaped form, and the described LED bulb housing 1 of top 21 contact of described substrate 2;

-linear pattern or shaped form, and the top 21 of described substrate 2 approaches described LED bulb housing 1;

-inverted U, and the described LED bulb housing 1 of top 21 contact of described inverted U; Or

-inverted U, and the top 21 of described inverted U approaches described LED bulb housing 1.

Preferably, described LED lamp also comprises radiating connection plate 92, and described substrate 2 is connected on described radiating connection plate 92, and described radiating connection plate 92 is connected to described radiator 91.

-cone structure, described radiating connection plate 92 is provided with the first jack adapting with described cone structure.

-flat structure, described radiating connection plate 92 is provided with the second jack adapting with described flat structure; Or

The last segment of-described end 22 is the cylindrical-shaped structure that diameter is less, the part that described the last segment makes progress is cylindrical-shaped structure or the flat structure that diameter is larger, and described radiating connection plate 92 is provided with the 3rd jack that the cylindrical-shaped structure less with described diameter adapts.

Preferably, described LED luminescence chip group 3 comprises one or more LED luminescence chips; And when described LED luminescence chip group 3 comprises a plurality of LED luminescence chip, between described a plurality of LED luminescence chip, by bonding line 22, be connected in series, the anode of described a plurality of LED luminescence chips is electrically connected on described substrate 2, and the negative electrode of described a plurality of LED luminescence chips is connected with a FPC so that form current supply circuit with power supply.

Preferably, described FPC 4 is arranged on described substrate 2.

Preferably, described FPC 4 comprises L binding post, N binding post, FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described a plurality of LED luminescence chips, and described FPC anode is electrically connected to described substrate 2.

Preferably, described FPC 4 comprises FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described a plurality of LED luminescence chips, described FPC anode is electrically connected to described substrate 2, when described LED lamp is used, described FPC anode and FPC negative electrode are connected with power anode and negative electrode respectively.

Preferably, described substrate 2 is provided with at least one via hole 21 as loophole for attaching region or the peripheral region of described LED luminescence chip group 3.

Preferably, described at least one via hole 21 is evenly distributed.

Preferably, the surface area of described substrate 2 is greater than the surface area of described LED luminescence chip group 3.

Preferably, described substrate 2 is any composition in following material: sheet metal; Alloying metal sheet; Or sheet glass.

Preferably, described substrate 2 is transparence or translucent.

The utility model is by radiator 91 is set, then substrate 2 is connected with radiator 91, and substrate 2 is connected with LED luminescence chip 3, utilizes substrate 2 and radiator 91 to dispel the heat, and has solved the problem that traditional filament cannot dispel the heat.When LED luminescence chip group 3 is luminous, the heat producing can pass to more fast radiator 91 by substrate 2 and distribute, improved greatly radiating efficiency, service life and the service efficiency of LED lamp have been improved, while is due to the raising of radiating efficiency, LED lamp of the present utility model can be made more high power, and illumination effect is better.

Accompanying drawing explanation

By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that other features, objects and advantages of the present utility model will become:

Fig. 1 illustrates according to a specific embodiment of the present utility model, the overall structure schematic diagram of LED lamp;

Fig. 2 illustrates according to the second embodiment of the present utility model, the structural representation after linear pattern substrate 2 and radiating connection plate 92 combinations;

Fig. 3 illustrates according to the second embodiment of the present utility model, the structural representation after inverted U substrate 2 and radiating connection plate 92 combinations;

Fig. 4 illustrates according to the second embodiment of the present utility model, the structural representation after X-type substrate 2 and radiating connection plate 92 combinations;

Fig. 5 illustrates according to the second embodiment of the present utility model, the structural representation of the type of falling W substrate 2 and radiating connection plate 92;

Fig. 6 illustrates according to the 4th embodiment of the present utility model, is provided with the structural representation of the radiating connection plate 92 of difformity jack;

Fig. 7 illustrates according to an embodiment of the present utility model, the connection diagram of the substrate of LED lamp and LED luminescence chip group, FPC;

Fig. 8 illustrates according to an embodiment of the present utility model, and in LED lamp, power drives template is incorporated into the connection diagram in flexible circuitry plate structure; And

Fig. 9 illustrates according to an embodiment of the present utility model, and in LED lamp, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.

The specific embodiment

Those skilled in the art understand, the utility model mainly provides a kind of 3D COB LED lamp luminescence component, and realizing heat sinking function is mainly to rely on to be connected to the radiator 91 on substrate 2, described radiator 91 or directly contact with external environment condition, or the base by LED lamp contacts with external environment condition, after the luminous generation heat of described LED luminescence chip group 3, heat is passed to rapidly radiator 91 by described substrate 2, and then is delivered to external environment condition by radiator 91.Further, those skilled in the art understand, compared with prior art, advantage of the present utility model is at least that the heat that the luminescence chip of LED described in prior art group 3 is sent mainly passes to described radiator by air, and then conduct to space outerpace by described radiator, and utility model conducts to radiator by heat in more high efficiency mode by substrate 2, and then conduct to space outerpace, thereby greatly improved radiating efficiency.Further, it will be appreciated by those skilled in the art that by the utility model, the various combination structure of the various assemblies in described LED bulb housing 1 is also provided, thereby larger efficiency ground has improved heat conduction efficiency and practical frame for movement is effectively provided.

Those skilled in the art understand, preferably described radiator 91 is shaped as cylindric or round table-like or inverted round stage shape, and be provided with the radiating fin of some, the quantity of described radiating fin, dense degree, thickness, material affect the radiating efficiency of described radiator 91, the shape of the global shape of described radiator 91 and described LED base adapts, and be connected with described LED base, the material of described radiator 91 can be fine aluminium, fine copper or Cu and Al combination etc.Further, those skilled in the art understand, radiator described in Fig. 1 91 is a schematic diagram, it is actually described radiator 91 and is placed in described LED base schematic diagram afterwards, it is coated by LED base and described LED base exterior is brushed with paint or coating or other materials, therefore from can not directly seeing described radiator 91 in appearance.In Fig. 1, the perspective view of described radiator 91 is not provided, do not repeat them here.

Fig. 1 shows a specific embodiment of the present utility model, the structural representation of LED lamp.Particularly, described LED lamp at least comprises LED bulb housing 1, substrate 2 and LED luminescence chip group 3, radiator 91.Further, as shown in Figure 1, described LED bulb housing 1 has formed inner space, and described inner space is used for holding described substrate 2, LED luminescence chip group 3.Described substrate 2 has multiple with the connected mode of bulb housing 1, for example described substrate 2 can be attached on described bulb housing 1 inwall, those skilled in the art understand, this kind of connected mode preferably substrate 2 adopts elastomeric materials to make and can be crooked, and by glue, is bonded on the inwall of described bulb housing 1.And in this specific embodiment, described substrate 2 adopts rigid material to make and preferably make it not crooked, and described substrate 2 keeps certain distance with the inwall of described bulb housing 1, those skilled in the art understand, this kind of connected mode preferably realizes in the following manner: described radiator 91 is fixed on the bottom of described bulb housing 1, the end of described substrate 2 connects described radiator 91, and keeps relative fixing with described radiator 91, and then realizes the relative fixing of substrate 2 and described bulb housing 1.It will be appreciated by those skilled in the art which kind of mode described substrate 2 adopts connect and do not affect flesh and blood of the present utility model in described bulb housing 1, does not repeat them here.Further, those skilled in the art understand, in a further advantageous embodiment, when the end of described substrate 2 connects described radiator 91, described substrate 2 is also attached to the inwall of described LED bulb housing 1, thereby make described substrate 2 directly in described radiator 91 conduction heats, also by described LED bulb housing 1 to outside heat by conduction amount, thereby improve further radiating efficiency.

Further, described LED luminescence chip group 3 is attached on described substrate 2, those skilled in the art understand, the mode that LED luminescence chip group 3 is attached on described substrate 2 has multiple, preferably, adopt Electrostatic Absorption method, its principle is when an object with static is near another not during the object of static electrification, due to electrostatic induction, the interior of articles that there is no static can gather the electric charge (opposite side produces the like charges of equal number) with the entrained opposite charge polarity of charged object near one side of static electrification object, because the charges of different polarity are attracted each other, will show " Electrostatic Absorption " phenomenon.According to electrostatic absorption principle, we can make electric charge on LED luminescence chip or base plate strip, and the principle attracting each other by the charges of different polarity can realize LED luminescence chip group is attached to the step on described substrate.Again for example, as a kind of variation, the just described LED luminescence chip of the method that also can attach by glue group 3 is attached on described substrate 2, and this does not affect flesh and blood of the present utility model, does not repeat them here.

Further, described substrate 2 is connected with described radiator 91 so that the heat that described LED luminescence chip group 3 produces is delivered on described radiator 91 by described substrate 2.Those skilled in the art understand, preferably described substrate 2 adopts the highly heat-conductive materials such as metal to make, the heat of described LED luminescence chip group 3 generations can be given described radiator 91 by the transfer of air of described bulb housing 1 inside, also can pass to described radiator 91 by described substrate 2 simultaneously, and the air transmitted of comparing, described substrate 2 heat conduction efficiency are higher, so this kind of mode can improve heat conduction efficiency greatly, accelerate distributing of heat.Described substrate 2 has multiple with the connected mode of described radiator 91, for example can adopt the mode fastening with glue connects, for example can connect with the mode of crossing welding again, again for example, can screw thread be set at the end of described substrate 2, on described radiator 91, screw is set, described substrate 2 is directly spun on described radiator 91.Again for example, be provided with the jack matching with described substrate 2 terminal end shape on described radiator 91, described substrate 2 is directly inserted on described radiator 91.It will be appreciated by those skilled in the art that and adopt which kind of connected mode not affect flesh and blood of the present utility model, not repeat them here.

Preferably, as first embodiment of this specific embodiment, described LED luminescence chip group 3 is only attached at the one side of described substrate 2.Those skilled in the art understand, in actual applications, preferably described LED lamp comprises many group substrates 2, and preferably described many group substrates 2 are arranged in a crossed manner, therefore on the relative surface of described many group substrates 2, do not need to arrange described LED luminescence chip group 3, the substrate 2 that the light of avoiding described LED luminescence chip group 3 to send is arranged at its opposite blocks, and described LED luminescence chip group 3 is attached to described many group substrates 2 towards the one side of bulb housing 1.The attaching mode of described LED luminescence chip group 3, in existing narration above, does not repeat them here.And in a further advantageous embodiment, in order to improve luminous intensity, also can all attach on the two sides of described substrate 2 described LED luminescence chip group 3, this does not affect concrete technical scheme of the present utility model.

Preferably, the second embodiment as this specific embodiment, described substrate 2 is linear patterns, and the described LED bulb housing 1 of top 21 contact of described substrate 2, as shown in Figure 2, described substrate 2 tilts and is kept at an angle to the direction of described bulb housing 1 axis, and the angle that described many group substrates 2 tilt with respect to described bulb housing 1 axis is identical, the top 21 of described many group substrates 2 all contacts described LED bulb housing 1, and finally converges to a bit, forms and is similar to pyramidal structure.Those skilled in the art understand, the advantage of linear pattern substrate is that processing technology is easy, speed of production is high, directly by cutting technique or mould pressing process, can be made into, the described substrate top 21 described LED bulb housing 1 of contact is more conducive to keep the relative fixing of substrate 2 and bulb housing 1, improve in actual use the stability of substrate 2.And in a further advantageous embodiment, described substrate 2 points to same direction with linear pattern setting a plurality of substrate 2, but the top of described substrate 2 does not contact, but relatively closes on, such technical scheme can not produce the interactive problem of electric charge between substrate.Those skilled in the art are appreciated that by above-described embodiment, no matter whether the top of described substrate 2 contacts, the top of described substrate 2 can contact the top of described LED bulb housing 1, also can not contact and be only the top of closing on described LED bulb housing 1, such mode can, by the length of described substrate 2 being set and the length of described LED bulb housing 1 realizes, not affect the technical solution of the utility model.

As a kind of variation, described substrate 2 can be also shaped form (Fig. 2 is not shown), the shape of described shaped form substrate 2 is similar to described bulb housing 1 shape, can or not fit with described bulb housing 1 inwall laminating, organize described substrate 2 to be similar to the rear spindle shape that forms of interleaved mode combination of Fig. 2 more.It will be appreciated by those skilled in the art that shaped form substrate can make by the technique of mold pressing, also linear pattern substrate can be carried out to bending and process and make.

As another kind, change, the shape of described shaped form substrate 2 also can S sigmoid, be arranged in parallel with the axis of described bulb housing 1, and preferably the described substrate 2 of many groups surrounds a cylinder, and is finally combined to form coral shape.

Further, in another changes example, the top 21 of described substrate 2 approaches described LED bulb housing 1, and the shape of described substrate 2 can be also straight line or curve-like, and existing narration before set-up mode, does not repeat them here.The advantage that described substrate 2 does not contact described LED bulb housing 1 is, the size of described substrate 2 can not be subject to the restriction of described LED bulb housing 1 size, and described substrate 2 can large-scale production be universal standard part, the replacement substrate in using as reality.

Further, at another, change in example, described substrate 2 is inverted Us, and the described LED bulb housing 1 of top 21 contact of described inverted U substrate 2.As shown in Figure 3, organize inverted U substrate 2 mutually arranged in a crossed manner more, and be connected at 21 places, inverted U top, inverted U top 21 also contacts described LED bulb housing 1 simultaneously.Those skilled in the art understand, described inverted U substrate 2 in fact also belongs to shaped form substrate, the curved design of inverted U is easier to processing in shaped form substrate, only the bending of linear pattern substrate can need to be formed, substrate design is inverted U and mutually arranged in a crossed manner, auxiliary fixing effect can be played in described inverted U top, and in actual use, the stability of described substrate 2 can be higher.

As a kind of variation, the top 21 of described inverted U approaches described LED bulb housing 1, does not contact with described LED bulb housing 1, and its advantage, in existing narration above, does not repeat them here.

With reference to above-described embodiment, those skilled in the art understand, in a further advantageous embodiment, described substrate 2 be shaped as half elliptic (not shown in Fig. 2), and the half elliptic outward flange of a plurality of described substrates 2 all inwardly arranges, form the form that a plurality of half elliptics are placed back-to-back, the whole shape that forms bouquet.Further, it will be appreciated by those skilled in the art that the top of described substrate 2 can contact the inwall of described LED bulb housing 1, can not contact yet, this does not affect the technical solution of the utility model.

Preferably, as the 3rd embodiment of this specific embodiment, described LED lamp also comprises radiating connection plate 92, and described substrate 2 is connected on described radiating connection plate 92, described radiating connection plate 92 is connected to described radiator 91, and described radiating connection plate 92 is as transition connecting apparatus.It will be appreciated by those skilled in the art that the connective stability that radiating connection plate 92 can further be strengthened described substrate 2 and described radiator 91 is set, and 92 processing of described radiating connection plate are more easy, production cost is lower.Preferably described substrate 2 is inserted on described radiating connection plate 92, as shown in Figure 6, coupling jack 93 is set on described radiating connection plate 92, the shape of the shape of described coupling jack and described substrate 2 ends adapts, be used for connecting difform substrate 2, thereby realize, do not needing to change the substrate 2 of changing other shapes in described radiator 91 situations.

As a kind of variation, described radiating connection plate 92 is one with described substrate 2, for example, design a kind of mould, and the shape after the shape of described dies cavity combines with described radiating connection plate 92 and described substrate 2 is identical, directly one-body molded by mould pressing process.It will be appreciated by those skilled in the art that and adopt which kind of mode not affect flesh and blood of the present utility model, not repeat them here.

Further, those skilled in the art understand, described radiating connection plate 92 has multiple with described radiator 91 connected modes, for example can connect by the mode of welding, for example can connect by the mode of bayonet lock again, for example can connect by screw again, described screw links described radiating connection plate 92 and radiator 91 through the through hole 95 shown in Fig. 7.。The high heat-conducting of the material selection of described radiating connection plate 92 preferably, can be identical or different from the material of described radiator 91.

Preferably, the 4th embodiment as this specific embodiment, the shape of the shape of described radiating connection plate 92 and described radiator 91 adapts, this design can realize the thermal conduction effect of maximum area, and the shape of described radiating connection plate 92 and the connective stability of described radiator 91 are also better simultaneously.As a kind of variation, the shape of described radiating connection plate 92 can be different from the shape of described radiator 91, and this does not affect essence effect of the present utility model, does not repeat them here.

Preferably, as this 5th embodiment of embodiment specifically, the end 22 of described substrate 2 be shaped as any in following shape.For example, preferably as shown in Figure 6, the shape of the end 22 of described substrate 2 is cone structures, described radiating connection plate 92 is provided with the first jack adapting with described cone structure, those skilled in the art understand, the shape of described end 22 is designed to cone structure and can be more easily inserted in described the first jack, installs more convenient.

Further, as a kind of variation, as shown in Figure 6, the shape of the end 22 of described substrate 2 is flat structures, and described radiating connection plate 92 is provided with the second jack adapting with described flat structure, and those skilled in the art understand, although described cone structure end 22 is more easily inserted in jack than described flat structure end 22, but described flat structure end 22 is being inserted into described the second jack completely, its dimensional fits Du Genggao, stability is stronger.

Further, as a kind of variation, as shown in Figure 6, the last segment of described end 22 is the cylindrical-shaped structure that diameter is less, the part that described the last segment makes progress is cylindrical-shaped structure or the flat structure that diameter is larger, be that described substrate 2 forms the last segment and residue one section of formation circular flat shoulder upwards, described radiating connection plate 92 is provided with the 3rd jack that the cylindrical-shaped structure less with described diameter adapts.Than above-mentioned two kinds of designs, the dimensional fits Du Genggao of this kind of design, simultaneously owing to being designed with circular flat shoulder, completing and is connected with radiating connection plate 92 at described substrate 2, and described substrate 2, when receiving vibrations, can not rock, and stability is higher.

In another changes, described the 3rd jack inner surface can also be provided with screw thread, and the cylindric end 22 of described substrate 2 is also provided with screw thread, and described substrate 2 is threaded connection with described radiator connecting plate 92, further improves connective stability.

Further, the shape that it will be appreciated by those skilled in the art that described substrate 2 ends can form in shaping substrate 2, on the mould of shaping substrate 2, do corresponding shape design, realize one-body moldedly, can also, after substrate 2 moulding, by digital lathe, be processed into corresponding shape.Jack on described radiating connection plate 92 can be one-body molded during radiating connection plate 92 described in moulding, also can by boring or Sheet Metal Forming Technology, process jack in the later stage, described jack can be that blind hole can be also through hole, this does not affect flesh and blood of the present utility model, does not repeat them here.

Preferably, as this 6th embodiment of embodiment specifically, after described end 22 is connected with described radiating connection plate 92, the electrode on described substrate 2 is electrically connected to the electrode on described radiating connection plate 92, thereby described LED luminescence chip group 3 can be powered.Those skilled in the art understand, when on described radiating connection plate 92, jack is blind hole, electrode on described substrate 2 is difficult to realize directly and is electrically connected to power supply motor, now need the electrode on described substrate 2 to be electrically connected to the electrode on described radiating connection plate 92, and then connect current electrode by described radiating connection plate 92.This kind of connected mode do not need to arrange extra wire, at the end of described substrate 2, conduction tie point is set, and described conduction tie point contacts the electrode of realizing on described substrate 2 and is electrically connected to the electrode on described radiating connection plate 92 with described blind hole.As a kind of variation, described substrate 2 all adopts high conductive material to make with described radiating connection plate 92, and the outer surface of described substrate 2 ends 22 contacts and can complete electrical connection with the jack inner surface of described radiating connection plate 92.

Further, it will be appreciated by those skilled in the art that jack is through hole on the described radiating connection plate 92, and the end 22 of substrate 2 do not stretch out through hole, now can adopt above-mentioned connected mode to connect yet, do not repeat them here.

Preferably, as the 7th embodiment of this specific embodiment, described end 22 is electrically connected to current electrode below described radiating connection plate 92, thereby described LED luminescence chip group 3 can be powered.It will be appreciated by those skilled in the art that when jack is through hole on described radiating connection plate 92, can directly by wire, described end 22 be electrically connected to current electrode, described wire is through the through hole of described radiating connection plate 92.As a kind of variation, when described end 22 can stretch out the through hole of described radiating connection plate 92, can not use wire directly described end 22 to be connected to described current electrode.

Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence.Preferably, those skilled in the art understand, described substrate 2 is designed to translucent or transparence and can guarantees to greatest extent that the wide part that described LED luminescence chip group 3 is launched can both exhale, if described substrate 2 is nontransparent shape or light transmission extreme difference, can cause the illuminating effect extreme difference of LED lamp, can be that the light that LED lamp projects produces many shades and blackspot, greatly affect illuminating effect and the function of LED lamp.Further, those skilled in the art understand, realize described substrate 2 transparence or translucent can be by using transparent material make described substrate 2, also can be by punching at described substrate 2, so also can increase the penetration capacity of light, can make the illuminating effect of LED lamp better.Any processing that can realize transparent or translucentization of described substrate 2, all can meet the requirement of the utility model to described substrate 2, and this does not affect flesh and blood of the present utility model, does not repeat them here.

Preferably, it will be appreciated by those skilled in the art that in this specific embodiment, the surface of described substrate 2 is obviously little than described LED luminescence chip group 3.The effect that described substrate 2 plays is mainly for connecting described LED bulb housing 1 and described LED luminescence chip group 3, so the size of described substrate 2 is not had to strict restriction, can realizing above-mentioned linkage function.But consider that if described substrate is too large, and will affect the illumination effect that described LED luminescence chip group 3 sees through described LED bulb housing 1, the illuminating effect of described LED lamp is made a big impact.Therefore, described substrate 2 should be realizing under the prerequisite that connects described LED bulb housing 1 and described LED luminescence chip group 3 functions, as much as possible little.Can not affect largely like this lighting function of described LED luminescence chip group 3, guarantee the illuminating effect of described LED lamp, its object is consistent with described substrate 2 is designed to the transparent or translucent effect that will reach, and does not repeat them here.

Preferably, as another embodiment, the interior gassy of described LED bulb housing 1, preferably, described gas is the mist of nitrogen and argon gas, its role is to prevent that the parts in described bulb housing 1 are not oxidized, extends the service life of described LED lamp.Further, as a kind of variation, described LED bulb housing 1 can be evacuated, and its objective is completely isolated air, extends the service life of described LED lamp.

Extremely embodiment illustrated in fig. 6 with reference to above-mentioned Fig. 1, those skilled in the art understand, according to a preferred embodiment of the present utility model, a kind of 3D COB LED luminescence component is provided, it specifically comprises: substrate 2 and LED luminescence chip group 3, described LED luminescence chip group 3 is attached on described substrate 2, and described substrate 2 is connected so that the heat of described LED luminescence chip group 3 is delivered on described radiator 91 by described substrate 2 with described radiator 91.Those skilled in the art understand, preferably described substrate 2 adopts the highly heat-conductive materials such as metal to make, the heat of described LED luminescence chip group 3 generations can be given described radiator 91 by the transfer of air of described bulb housing 1 inside, also can pass to described radiator 91 by described substrate 2 simultaneously, and the air transmitted of comparing, described substrate 2 heat conduction efficiency are higher, so this kind of mode can improve heat conduction efficiency greatly, accelerate distributing of heat.Described substrate 2 has multiple with the connected mode of described radiator 91, for example can adopt the mode fastening with glue connects, for example can connect with the mode of crossing welding again, again for example, can screw thread be set at the end of described substrate 2, on described radiator 91, screw is set, described substrate 2 is directly spun on described radiator 91.Again for example, be provided with the jack matching with described substrate 2 terminal end shape on described radiator 91, described substrate 2 is directly inserted on described radiator 91.It will be appreciated by those skilled in the art that and adopt which kind of connected mode not affect flesh and blood of the present utility model, not repeat them here.

Further, it will be appreciated by those skilled in the art that COB full name Chip On Board, the encapsulation of Chinese chip on board, be about to semiconductor chip handing-over and be mounted on printed wiring board, the electrical connection of chip and substrate realizes with lead-in wire sewing method, and covers to guarantee reliability with resin.More conventional technological process is as follows: clean PCB, a bonded adhesives, chip attach, test, the black glue of envelope are heating and curing, and these all belong to prior art, do not repeat them here.The feature of the present embodiment is, adopts the technology of COB encapsulation to be connected with described substrate 2 described luminescence chip group 3, jointly forms illuminating source.Described substrate 2 itself can be pcb board, also can pcb board be set separately on described substrate 2 again, and this all affects the not flesh and blood of embodiment, does not repeat them here.

Preferably, as another embodiment, described LED luminescence chip group 3 is only attached at the one side of described substrate 2.Those skilled in the art understand, in actual applications, preferably described LED lamp comprises many group substrates 2, and preferably described many group substrates 2 are arranged in a crossed manner, therefore on the relative surface of described many group substrates 2, do not need to arrange described LED luminescence chip group 3, the substrate 2 that the light of avoiding described LED luminescence chip group 3 to send is arranged at its opposite blocks, and described LED luminescence chip group 3 is attached to described many group substrates 2 towards the one side of bulb housing 1.The attaching mode of described LED luminescence chip group 3, in existing narration above, does not repeat them here.And change in example at another, in order to improve luminous intensity, also can all attach on the two sides of described substrate 2 described LED luminescence chip group 3, this does not affect concrete technical scheme of the present utility model.

Preferably, as this another embodiment, described substrate 2 is printed circuit board (being conventionally referred to as pcb board), and line map is made by etching or typography in wherein said substrate 2 surfaces.Those skilled in the art understand, described substrate 2 comprises the first base copper, the second insulating barrier, trialuminum based layer or base copper, described the first base copper and the second insulating barrier form pcb board, described trialuminum based layer or base copper are the substrate layers of described substrate 2, line map is made by etching or electronic printing technique in described the first base copper surface, described line map need to design according to the position of the electronic devices and components on described substrate 2, this partial content needs IC layout design to complete, do not affect flesh and blood of the present utility model, do not repeat them here.Described the second insulating barrier can be bakelite plate, glass mat and plastic plate for keeping the insulating properties between the circuit on described line map, the material of described the second insulating barrier.As a kind of variation, described substrate 2 can be flexible board, the second insulating barrier adopts flexible material to make, for example polyimides or polyester film, to realize bending more easily, be bent into U-shaped, V-type, Z-type, M type, O type etc., to coordinate difform light fixture.

Further, on described substrate 2, be also distributed with aperture, described aperture can be component hole, fastener hole, plated through-hole etc., by COB binding technology, electronic devices and components are set again, such as EMC filtering chip, bridge rectifier chip, constant-current driven chip, LED luminescence chip etc., the substrate 2 that is provided with above-mentioned electronic devices and components can be used as the Lights section of LED lamp, is applied to difform LED lamp.

Preferably, as another embodiment, described substrate 2 is linear patterns, and the advantage that it will be appreciated by those skilled in the art that linear pattern substrate is that processing technology is easy, and speed of production is high, directly by cutting technique or mould pressing process, can be made into.As a kind of variation, described substrate 2 can be also shaped form.It will be appreciated by those skilled in the art that shaped form substrate can make by the technique of mold pressing, also linear pattern substrate can be carried out to bending and process and make.No matter be linear pattern or shaped form substrate, the end of described substrate is all connected with current electrode, and described current electrode can be independent, can be also on the radiating connection plate 92 being integrated in as shown in Figure 2 or Figure 3, i.e. electrode 94 in Fig. 2 or Fig. 3.When described LED lamp only has a substrate, the both positive and negative polarity of described current electrode is all connected to the end of described substrate; When there is a plurality of substrate in described LED lamp, can will between a plurality of substrates, by modes such as wires, be electrically connected to, and then the both positive and negative polarity of described current electrode is connected to the end of any two substrates in described a plurality of substrate, form current supply circuit.

Further, as another kind, change, the shape of described shaped form substrate 2 also can S sigmoid, be arranged in parallel with the axis of described bulb housing 1, and preferably the described substrate 2 of many groups surrounds a cylinder, and is finally combined to form coral shape.The connected mode of described S shape substrate and current electrode as mentioned above, does not repeat them here.

Further, as a kind of variation, described substrate 2 be shaped as half elliptic, and the half elliptic outward flange of a plurality of described substrates 2 all inwardly arranges, and forms the form that a plurality of half elliptics are placed back-to-back, the whole shape that forms bouquet.The connected mode of described half elliptic substrate and current electrode as mentioned above, does not repeat them here.

Further, as a kind of variation, described substrate 2 is inverted Us, it will be appreciated by those skilled in the art that described inverted U substrate 2 in fact also belongs to shaped form substrate, the curved design of inverted U is easier to processing in shaped form substrate, only the bending of linear pattern substrate can need to be formed, substrate design is inverted U and mutually arranged in a crossed manner, and auxiliary fixing effect can be played in described inverted U top, in actual use, the stability of described substrate 2 can be higher.The two ends of " U " type opening part of described inverted U substrate connect respectively the both positive and negative polarity of current electrode, form current supply circuit.

Further, as a kind of variation, described substrate 2 is X-types, and the processing mode of described X-type substrate has multiple, for example, by two linear pattern substrate inclination certain angles and mutually arranged in a crossed manner, can form; Again for example, the first linear pattern substrate and the second linear pattern substrate are bent into V font, at some place, the end of V font, connect the first linear pattern substrate and the second linear pattern substrate, also can form X-type.As shown in Figure 4, the two ends 31 of the bottom bifurcated of described X-type substrate connect respectively the both positive and negative polarity of current electrode, form current supply circuit.

Further, as a kind of variation, described substrate 2 is inverted Y-shaped, and the generation type of described Y type substrate for example, is now bent into V font by the first linear pattern substrate, then the second linear pattern substrate is directly connected to the some place, the end of the V font substrate after bending, can form.Again for example, more easy, directly three linear pattern substrates are spliced into Y-shaped.The two ends of described inverted Y-shaped top jag connect respectively the both positive and negative polarity of current electrode, form current supply circuit, as a kind of variation, " perpendicular 1 " end of type of described inverted Y-shaped bottom connects the both positive and negative polarity of current electrode, form current supply circuit, it will be appreciated by those skilled in the art that this kind of connected mode needs the size of described " perpendicular 1 " type bottom enough large, guarantees to form the surface of the both positive and negative polarity that connects described current electrode.

Further, as a kind of variation, described substrate 2 is the types of falling W, be similar to the filament shape of conventional incandescent, the generation type of the described type of falling W substrate for example, forms the bending of linear pattern substrate, again for example, the first linear pattern substrate and the second linear pattern substrate are bent into V font, then two V font substrates are spliced into the type of falling W.As shown in Figure 5, the company of the bottom of the described type of falling a W substrate link 32 connects respectively the both positive and negative polarity of current electrode, forms current supply circuit.

Preferably, as another embodiment, the position that described substrate 2 is bent does not attach described LED luminescence chip group 3, can prevent that so described substrate 2 is when bending, and described LED luminescence chip group 3 produces distortion and damages, and improves the yield rate of goods.

Preferably, as another embodiment, as shown in Figure 3, described substrate 2 is connected on a radiating connection plate 92, and described radiating connection plate 92 is connected to described radiator 91, and described radiating connection plate 92 is as transition connecting apparatus.It will be appreciated by those skilled in the art that the connective stability that radiating connection plate 92 can further be strengthened described substrate 2 and described radiator 91 is set, and 92 processing of described radiating connection plate are more easy, production cost is lower.Preferably described substrate 2 is inserted on described radiating connection plate 92, as shown in Figure 6, coupling jack 93 is set on described radiating connection plate 92, the shape of the shape of described coupling jack and described substrate 2 ends adapts, be used for connecting difform substrate 2, thereby realize, do not needing to change the substrate 2 of changing other shapes in described radiator 91 situations.

Further, those skilled in the art understand, described radiating connection plate 92 has multiple with described radiator 91 connected modes, for example can connect by the mode of welding, for example can connect by the mode of bayonet lock again, for example can connect by screw again, described screw is connected described radiating connection plate 92 through the through hole 95 shown in Fig. 7 with radiator 91.The high heat-conducting of the material selection of described radiating connection plate 92 preferably, can be identical or different from the material of described radiator 91.

Preferably, as another embodiment, the shape of the shape of described radiating connection plate 92 and described radiator 91 adapts, and this design can realize the thermal conduction effect of maximum area, and the shape of described radiating connection plate 92 and the connective stability of described radiator 91 are also better simultaneously.As a kind of variation, the shape of described radiating connection plate 92 can be different from the shape of described radiator 91, and this does not affect essence effect of the present utility model, does not repeat them here.

Preferably, as another embodiment, the end 22 of described substrate 2 be shaped as any in following shape.For example, preferably as shown in Figure 6, the shape of the end 22 of described substrate 2 is cone structures, described radiating connection plate 92 is provided with the first jack adapting with described cone structure, those skilled in the art understand, the shape of described end 22 is designed to cone structure and can be more easily inserted in described the first jack, installs more convenient.

Preferably, as another embodiment, after described end 22 is connected with described radiating connection plate 92, the electrode on described substrate 2 is electrically connected to the electrode on described radiating connection plate 92, thereby described LED luminescence chip group 3 can be powered.Those skilled in the art understand, when on described radiating connection plate 92, jack is blind hole, electrode on described substrate 2 is difficult to realize directly and is electrically connected to power supply motor, now need the electrode on described substrate 2 to be electrically connected to the electrode on described radiating connection plate 92, and then connect current electrode by described radiating connection plate 92.This kind of connected mode do not need to arrange extra wire, at the end of described substrate 2, conduction tie point is set, and described conduction tie point contacts the electrode of realizing on described substrate 2 and is electrically connected to the electrode on described radiating connection plate 92 with described blind hole.As a kind of variation, described substrate 2 all adopts high conductive material to make with described radiating connection plate 92, and the outer surface of described substrate 2 ends 22 contacts and can complete electrical connection with the jack inner surface of described radiating connection plate 92.

Preferably, as another embodiment, described end 22 is electrically connected to current electrode below described radiating connection plate 92, thereby described LED luminescence chip group 3 can be powered.It will be appreciated by those skilled in the art that when jack is through hole on described radiating connection plate 92, can directly by wire, described end 22 be electrically connected to current electrode, described wire is through the through hole of described radiating connection plate 92.As a kind of variation, when described end 22 can stretch out the through hole of described radiating connection plate 92, can not use wire directly described end 22 to be connected to described current electrode.

Preferably, as another embodiment, described substrate 2 is any composition in following material:

One, metal base circuit board, for example copper base or aluminium base, those skilled in the art understand, adopt metal base circuit board, good heat conductivity, but before by other electronic chips such as COB technology encapsulating light emitting chips, insulating barrier need to be set on substrate 2 again, described insulating barrier is for keeping the insulating properties between the circuit on substrate 2.

Two, epoxy radicals wiring board, use epoxy resin to make wiring board, it will be appreciated by those skilled in the art that and adopt epoxy radicals wiring board, can directly pass through electronic printing technique printed electronic circuit figure on substrate 2, then by other electronic chips such as COB technology encapsulating light emitting chips.

Three, glass-based wiring board, its feature is similar with epoxy radicals wiring board, there is good insulating properties, also there is good light transmission simultaneously, but glass-based wiring board is if adopt nonlinear abnormally-structured, need to pass through Design of Dies one-shot forming, and due to itself material, glass-based wiring board is easier to while using damage.

Four, the metallic support of punching press, sheet metal, the pluses and minuses of its material and above-mentioned metal base circuit board are similar, just aspect shape and size, change, and feature is easier bending and the difform substrate of moulding, enhances productivity and reduces costs.

Further, those skilled in the art understand, in another specific embodiment, example is specific embodiment as shown in Figure 7, Figure 8, the surface area of described substrate 2 is preferably more than the area of described LED luminescence chip group 3, thereby described LED luminescence chip group 3 is adhered on described substrate 2 by integral body, and further described substrate 2 is fixedly attached to the inner surface of described LED bulb housing 1.Further, it will be appreciated by those skilled in the art that the attaching that the utility model is set forth does not represent that described substrate 2 is attached to the inner surface of described LED bulb housing 1, and only represent that both are fixed relatively.

Further, it will be appreciated by those skilled in the art that in a preferred embodiment, in order to increase light transmission, the thickness of described substrate 2 should be less.When the thickness of described substrate 2 remains in a less thickness range, can realize better light transmission, the light that is unlikely to described LED luminescence chip group 3 is launched causes very large decay after described substrate 2, has guaranteed the illuminating effect of light transmission and described LED lamp.Further, if it will be appreciated by those skilled in the art that, described substrate 2 is too thick, can serious mistake stop the light that described LED luminescence chip group 3 is launched, and causes the significantly decay of described light, also can affect the heat dispersion of described LED lamp.Such technical scheme does not affect concrete scheme of the present utility model, does not repeat them here.

Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixed, its position can be determined according to the position of described LED luminescence chip group 3 is corresponding.Meanwhile, the quantity of described substrate 2 is not unique yet, and it can be also a plurality of can being one.Further, those skilled in the art understand determining of quantity and the determining of position of described substrate 2, mainly in order better described LED bulb housing 1 to be fitted with described LED luminescence chip group 3, can be in concrete realization, quantity and the position of dynamically adjusting described substrate 2, do not repeat them here.

Further, it will be appreciated by those skilled in the art that in this specific embodiment, the upper surface of the LED luminescence chip in described LED luminescence chip group 3 scribbles fluorescent material.Particularly, described LED luminescence chip group 3 comprises one or more LED luminescence chips, and preferably, when it comprises a plurality of LED luminescence chip, each LED luminescence chip all can obtain the electric power providing from electric power driving module, does not repeat them here.Further, preferably, the upper surface of wherein one or more LED luminescence chips scribbles fluorescent material, thereby the light that the LED luminescence chip of coated fluorescent material is sent is more even, and color is more easily received by consumer.

Further, in a preferred embodiment of above-described embodiment, described substrate 2 at least comprises via hole 21, particularly, the via hole 21 distributing with laser ablation ad hoc rules on described substrate 2, via hole 21 diameters, between 0.1～0.5mm, the light of LED luminescence chip group 3 can be passed through.It is not changeless it will be appreciated by those skilled in the art that the quantity of described via hole 21 and distributing.For example preferably, described via hole 21 be uniformly distributed be one rectangular, in a further advantageous embodiment, described via hole 21 is uniformly distributed and is a round shape, and in another preferred embodiment, the part of described via hole 21 is uniformly distributed, another part non-uniform Distribution, and this does not affect concrete technical scheme of the present utility model.It will be appreciated by those skilled in the art that described via hole 21, at least as loophole purposes, does not repeat them here.

More specifically, described substrate 2 adopts aluminium base by punch forming, substrate 2 presents linear pattern mode cabling, which can facilitate bending, make LED luminescence chip group 3 be more prone to brake forming on substrate 2, the width of LED luminescence chip group 3 can be selected between 0.5～5mm, substrate 2 thickness are selected between 0.3～2.0mm, one group of LED luminescence chip group 3 power is preferably between 1～3W, LED luminescence chip group 3 combination is divided into the various combinations such as 3,4,6,8, to be combined into the LED lamp of different capacity, do not repeat them here.

Further, those skilled in the art understand, preferably, as an embodiment, described radiating connection plate 92 is provided with built-in power, EMC filter circuit, crossing current drive circuit, described built-in power preferably, EMC filter circuit, crossing current drive circuit is directly attached on described radiating connection plate 92 by COB binding technology, as shown in Figure 6, described substrate 2 is connected with built-in power by the electrode 94 on described radiating connection plate 92, described luminescence chip group 3 is connected on affiliated substrate 2, described built-in power drives described luminescence chip group 3 by electric power driving module, thereby it is luminous to control described luminescence chip group 3.By this kind of mode, described substrate 2, luminescence chip group 3, electric power driving module, radiating connection plate 92, built-in power form electric loop jointly, reach the result of controlling described luminescence chip 3 break-makes.

More specifically, one as above-described embodiment changes example, described substrate 2 is electrically connected to external power source by the afterbody of bulb housing 1, described external power source drives described luminescence chip group 3 by described electric power driving module 5 grades, thereby it is luminous to control described luminescence chip group 3, accordingly, similar with above-described embodiment, described radiating connection plate 92 is provided with EMC filter circuit, crossing current drive circuit, described EMC filter circuit preferably, crossing current drive circuit is directly attached on described radiating connection plate 92 by COB binding technology, described substrate 2 is connected with the electrode 94 on described radiating connection plate 92.。By this kind of mode, described substrate 2, luminescence chip group 3, electric power driving module, radiating connection plate 92, external power supply form electric loop jointly, reach the result of controlling described luminescence chip 3 break-makes.

Below in conjunction with accompanying drawing 7, Fig. 8 and Fig. 9, elaborate and how by circuit connecting mode, to drive the luminous preferred embodiment of described LED luminescence chip group 3.

Fig. 7 illustrates according to the first embodiment of the present utility model, the connection diagram of LED lamp substrate and LED luminescence chip group, FPC.It will be appreciated by those skilled in the art that described Fig. 7 is not the unique connected mode figure of the present embodiment, the object of this figure is intended to the connection diagram that preferred embodiment is implemented in explanation.Particularly, as shown in Figure 7, described LED luminescence chip group 3 is connected to a side of described substrate 2, the inner surface of the opposite side of described substrate 2 and described bulb housing 1 attaches or does not attach, and it will be appreciated by those skilled in the art that the mode that described LED luminescence chip is connected with described substrate 2 is not changeless, can be for example that directly stamp is on the surface of described substrate 2, mode is varied, but does not affect flesh and blood of the present utility model, therefore do not repeat them here.Meanwhile, be distributed with via hole 21 (not showing in Fig. 7) on described substrate 2, about the distribution of via hole 21, existing narration in above-mentioned Fig. 3, therefore do not repeat them here.

More specifically, between described each LED luminescence chip, by described bonding line 22, be connected in series, by this kind of connected mode, between described each LED luminescence chip, can form a series circuit, power supply simultaneously and power-off simultaneously.

Further, at FPC 4 described in one end installation one of described substrate 2 connection power supplys, it will be appreciated by those skilled in the art that preferably, the afterbody of described substrate 2 is provided with described FPC 4.Further, it will be appreciated by those skilled in the art that the method that described FPC 4 is arranged on substrate 2 is not changeless, it can use the method for pressing also can use the method for adhesion, method is multiple, but does not affect flesh and blood of the present utility model, therefore do not repeat them here.

Further, in the present embodiment, as shown in FIG., preferably, the anode of last luminescence chip in described LED luminescence chip group 3 is electrically connected to described substrate 2, the negative electrode of a luminescence chip of close FPC 4 in LED luminescence chip group 3 is connected with the cathodic electricity in FPC 4 simultaneously.Further, those skilled in the art understand, in the use procedure of the LED lamp providing at the utility model, described substrate 2 is electrically connected to the afterbody by described bulb housing 1 preferably with external power source, such external power source is normally electrically connected to and obtains with the afterbody of described bulb housing 1 by lamp socket, thereby makes external power source can drive described LED lamp.Further, it will be appreciated by those skilled in the art that the both positive and negative polarity of external power source will be connected with described substrate 2, FPC 4 respectively, thus the power circuit of complete, and example is as shown in Figure 9.

Further, those skilled in the art understand, in the use procedure of the LED lamp providing at the utility model, alternating current be the lamp holder by described LED lamp directly with wire, be electrically connected to described LED luminescence chip group or by described lamp holder position first by being electrically connected to described LED luminescence chip group again after the rectification of external driving power, constant current, and Fig. 7 and embodiment illustrated in fig. 8 in, described FPC is serving as the effect of conducting circuit and LED drive circuit carrier.

Under the direct drive pattern of AC, the alternating current direct of described lamp holder joints connects L binding post and the N binding post on the FPC 4 being wired to shown in Fig. 7 or Fig. 8, by described LED luminescence chip group being powered after EMC filter circuit, bridge rectifier, constant-current drive circuit, concrete structure as shown in Figure 7 and Figure 8.Wherein, described EMC filter circuit, bridge rectifier, constant-current drive circuit etc. are not shown in Fig. 7 and Fig. 8, and preferably, it is all by COB binding technology, to be directly attached to the circuit by scolding tin and FPC on FPC to form path.

Further, it will be appreciated by those skilled in the art that by above-mentioned connected mode, the both positive and negative polarity of LED luminescence chip group 3 forms, thereby in situation about can externally power, can form an electric loop, by the break-make of control loop, and then control the whether luminous of described LED luminescence chip group 3.

It will be appreciated by those skilled in the art that in order to make LED lamp send the white light of better effect, at the upper surface of described LED luminescence chip group 3, coat fluorescent material 23, as shown in FIG..

Further, how the electric loop shown in Fig. 7 is connected with power drives, below in conjunction with accompanying drawing 8 and accompanying drawing 9, the embodiment that specifically sets forth two kinds of connections.

Fig. 8 illustrates according to the first embodiment of the present utility model, and in LED lamp, power drives template is incorporated into the connection diagram in flexible circuitry plate structure.It will be appreciated by those skilled in the art that described Fig. 8 is not unique structure connection layout, the object of this figure is intended to illustrate the structure connection of electric power driving module 5 and FPC 4.Particularly, as shown in Figure 8, in described FPC 4, at least comprise binding post L, binding post N, FPC anode and FPC negative electrode.Further, in the embodiment shown in fig. 8, described FPC anode and FPC negative electrode present in the mode of electric power driving module 5, and preferably those skilled in the art understand described electric power driving module 5 at least integrated AC-DC conversion module and constant-current driven module (not shown), thereby the both positive and negative polarity of described LED luminescence chip group 3 is formed.Those skilled in the art understand, described electric power driving module 5 is placed in the inside of FPC 4, becomes one of structure of FPC 4, and those skilled in the art understand, described electric power driving module 5 is integrated in method in FPC 4 to be had a variety ofly, does not repeat them here.

Further, with reference to figure 7, it will be appreciated by those skilled in the art that the negative electrode of described FPC 4 is connected with the cathodic electricity of described LED luminescence chip, the anode of described FPC 4 is electrically connected to described substrate 2.By such connected mode, make described substrate 2 with positive charge, thereby the anode of described LED luminescence chip is connected with any point of described substrate 2, and do not need to be connected to the anode of described FPC 4, saved the material of described FPC 4, be also convenient to process.And in preferred variant, for structure shown in Fig. 7 to Fig. 9, also the anode of described FPC 4 can be electrically connected to the anode of described LED luminescence chip, the negative electrode of described FPC 4 is electrically connected to described substrate 2, correspondingly the negative electrode of described LED luminescence chip is electrically connected to described substrate 2, thereby also can form the current supply circuit for described LED luminescence chip.

Further, it will be appreciated by those skilled in the art that for a LED luminescence chip group, preferably each the LED luminescence chip in this LED luminescence chip group directly connects by bonding line 22, thereby forms cascaded structure.On such architecture basics, the negative electrode of first LED luminescence chip can be used as the negative electrode of described LED luminescence chip group, and the anode of last LED luminescence chip can be used as the anode of described LED luminescence chip group.Again further, at one, change in example, those skilled in the art understand, each LED luminescence chip in described LED luminescence chip group also can be separately by its anodic bonding to described substrate 2, correspondingly the negative electrode of each LED luminescence chip is connected on the negative electrode of described FPC 4, and this does not affect the technical solution of the utility model.

Further, with reference to above-mentioned Fig. 7 and Fig. 8, those skilled in the art understand, in above-described embodiment and variation example, it provides the electrical interface of anode and negative electrode for described LED luminescence chip, thereby when the anode of power supply and negative electrode are connected to respectively above-mentioned anode and negative electrode, can form a current supply circuit to described LED luminescence chip, not repeat them here.

Fig. 9 illustrates according to the first embodiment of the present utility model, and in LED lamp, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.In conjunction with above-mentioned embodiment illustrated in fig. 7, those skilled in the art understand described FPC 4 and at least comprise FPC anode, i.e. LED+ shown in Fig. 9, and FPC negative electrode, i.e. LED-shown in Fig. 9.Described FPC negative electrode is connected with the cathodic electricity of described a plurality of LED luminescence chips, and described FPC anode is electrically connected to described substrate 2.By such connected mode, when connecting external power source 7 described in substrate 2 with positive charge, form anodal, thereby the both positive and negative polarity of described luminescence chip group 3 is formed.It will be appreciated by those skilled in the art that described Fig. 9 is not unique structure connection layout, the object of this figure is intended to illustrate the structure connection of external power source (external drive part) 7 and FPC 4.By this kind of design, by described FPC 4, can control the circuit on-off of whole luminescence chip group 3, realized the whether luminous control to luminescence chip group 3.

Further, shown in figure 9, under DC mode activated, the alternating current direct of above-mentioned lamp holder joints connects and is wired on external driving power, in power supply inside, carry out after EMC filter circuit, bridge rectifier, constant-current drive circuit, by the positive and negative electrode on the FPC above wire connecting lamp bar, finally form path again.It will be appreciated by those skilled in the art that FPC has only played the effect of communication line here, do not possess the ability that AC directly drives.

Further, with reference to above-mentioned Fig. 1 to Fig. 9, those skilled in the art understand, above-mentioned Fig. 1 to Fig. 9 is not the unique structure connection layout of the utility model, structure, the connection of the structure of the LED lamp that the object of above-mentioned figure is intended to illustrate that the utility model provides and wherein LED luminescence chip group and FPC.As shown in Figure 8, described substrate 2 preferably adopts metallic conductor, so cannot realize complicated circuit and telegraph circuit, so region laminating great-wall shaped FPC thereunder preferably, and according to arranging of substrate, a plurality of LED luminescence chip groups can be set, and between each LED luminescence chip group, preferably adopting parallel way, quantity in parallel is that the number by described LED luminescence chip group determines.Preferably, the quantity of described LED luminescence chip group can be selected between 3-10 bar, different according to power, and combination also can be different, and this does not affect the technical solution of the utility model.

Further, the bottom of described substrate 2 is anodes, and the negative electrode of described substrate 2 is connected to FPC by bonding line, as shown in Figure 7.And Fig. 7 can be understood to a detail section in Fig. 8, Fig. 9, electric power driving module 5 and wiring part below rectangular region in Fig. 8 forms.Electric power driving module 5 shown in Fig. 8 mainly comprises following parts, and for example EMC filter circuit, bridge rectifier, constant-current drive circuit and other holding circuits form.By above-mentioned technical scheme, make the LED lamp that the utility model provides can pass through DC powered, also can drive by alternating current, installation and debugging are safeguarded and all become very simple.Further, the alternating current direct of above-mentioned lamp holder joints connects L ac terminal, the N ac terminal on the FPC 4 being wired to above lamp bar, after EMC filter circuit, bridge rectifier, constant-current drive circuit, wherein EMC filter circuit, bridge rectifier, constant-current drive circuit are all by COB (chip On board) binding technology, to be directly attached to the circuit by scolding tin and FPC on FPC to form path.

Further, those skilled in the art understand, because described substrate 2 preferably adopts metal, therefore described substrate 2 can only serve as an electrode, and LED is a LED device, and wanting luminously must have 2 electrodes, one adds positive voltage, one adds negative voltage, and circuit part relies on FPC to complete, as shown in Figure 7.FPC is without delivering to tail end line place, can greatly save the cost of wiring board like this, FPC only needs to be connected with the electrode cathode of first chip, after the LED quantity of connecting certain, anode carrys out conducting by substrate conduction itself, directly fit together by via hole or welding with the anode on FPC, realize the conducting of circuit.

Above specific embodiment of the utility model is described.It will be appreciated that, the utility model is not limited to above-mentioned specific implementations, and those skilled in the art can make various distortion or modification within the scope of the claims, and this does not affect flesh and blood of the present utility model.

Claims

1. a 3D COB LED lamp luminescence component, it is used in a LED lamp luminous, described LED lamp at least comprises LED bulb housing (1) and radiator (91), and described LED lamp luminescence component at least comprises substrate (2) and LED luminescence chip group (3);

It is characterized in that, it is upper that described LED luminescence chip group (3) is attached at described substrate (2), and described substrate (2) is connected so that the heat of described LED luminescence chip group (3) is delivered on described radiator (91) by described substrate (2) with described radiator (91).

2. LED lamp luminescence component according to claim 1, is characterized in that, described LED luminescence chip group (3) is only attached at the one side of described substrate (2).

3. LED lamp luminescence component according to claim 2, is characterized in that, the another side that described substrate (2) does not attach described LED luminescence chip group (3) is attached on the inwall of described LED bulb housing (1).

4. according to the LED lamp described in any one in claims 1 to 3, it is characterized in that, described substrate (2) is printed circuit board, and circuit diagram is made by etching or typography in wherein said substrate (2) surface.

5. LED lamp luminescence component according to claim 4, is characterized in that, described substrate (2) is any in following shape:

-linear pattern or shaped form;

-inverted U;

-X-type;

-inverted Y-shaped; Or

-the type of falling W.

6. LED lamp luminescence component according to claim 5, is characterized in that, the position that described substrate (2) is bent does not attach described LED luminescence chip group (3).

7. according to the LED lamp luminescence component described in claim 5 or 6, it is characterized in that, also comprise radiating connection plate (92), it is upper that described substrate (2) is connected to described radiating connection plate (92), and described radiating connection plate (92) is connected to described radiator (91).

8. LED lamp luminescence component according to claim 7, is characterized in that, the shape of the shape of described radiating connection plate (92) and described radiator (91) adapts.

9. LED lamp luminescence component according to claim 8, is characterized in that, the end (22) of described substrate (2) be shaped as any in following shape:

-cone structure, described radiating connection plate (92) is provided with the first jack adapting with described cone structure;

-flat structure, described radiating connection plate (92) is provided with the second jack adapting with described flat structure; Or

The last segment of-described end (22) is the cylindrical-shaped structure that diameter is less, the part that described the last segment makes progress is cylindrical-shaped structure or the flat structure that diameter is larger, and described radiating connection plate (92) is provided with the 3rd jack that the cylindrical-shaped structure less with described diameter adapts.

10. LED lamp luminescence component according to claim 9, it is characterized in that, after described end (22) is connected with described radiating connection plate (92), electrode on described substrate (22) is electrically connected to the electrode on described radiating connection plate (92), thereby described LED luminescence chip group (3) can be powered.

11. according to the LED lamp luminescence component described in claim 9 or 10, it is characterized in that, described end (22) is electrically connected to current electrode in the below of described radiating connection plate (92), thereby described LED luminescence chip group (3) can be powered.

12. LED lamp luminescence components according to claim 11, is characterized in that, described substrate (2) is any composition in following material:

-metal base circuit board;

-epoxy radicals wiring board;

-glass-based wiring board;

The metallic support of-punching press; Or

-sheet metal.

13. LED lamp luminescence components according to claim 12, is characterized in that, preferably, described substrate (2) is transparence or translucent.

14. according to the LED lamp luminescence component described in claim 12 or 13, it is characterized in that, the quantity of described substrate (2) is one or more.

15. 1 kinds of 3D COB LED lamps, at least comprise LED bulb housing (1), radiator (91), it is characterized in that, described LED lamp also comprises according to the 3D COB LED lamp luminescence component described in claim 1,2,3,5,6,8,9,10 or 12, and described 3D COB LED lamp luminescence component is preferably connected with described radiator (91).

16. 3D COB LED lamps according to claim 15, is characterized in that, in described LED bulb housing (1), are full of air.