CN104197223B

CN104197223B - Multiple-point-distribution LED lamp

Info

Publication number: CN104197223B
Application number: CN201410461086.8A
Authority: CN
Inventors: 李建胜
Original assignee: SHANGHAI DINGHUI TECHNOLOGY Co Ltd
Current assignee: SHANGHAI DINGHUI TECHNOLOGY Co Ltd
Priority date: 2014-09-11
Filing date: 2014-09-11
Publication date: 2017-03-22
Anticipated expiration: 2034-09-11
Also published as: CN104197223A

Abstract

The invention provides a multiple-point-distribution LED lamp. The multiple-point-distribution LED lamp is characterized by at least comprising an LED lamp bulb shell (1) and an LED light-emitting chip set (3); the LED light-emitting chip set (3) is arranged in the LED lamp bulb shell (1); a plurality of radiating points (7) are arranged on the outer surface of the LED lamp bulb shell (1). The radiating points (7) are arranged on the outer surface of the LED lamp bulb shell (1), the radiating surface of the LED lamp bulb shell (1) is heightened so that heat generated when the LED lamp emits light can be rapidly diffused to air, and radiating of the LED lamp is more sufficient accordingly. The radiating mode is easy and convenient to use and easy to operate and implement, and the good market value is achieved.

Description

A kind of multipoint mode distribution LED lamp

Technical field

A kind of a kind of the present invention relates to field of LED illumination, especially LED, in particular it relates to multipoint mode distribution LED lamp.

Background technology

With the widespread adoption of LED, as the advantage of emerging illumination new light sources, emerge from increasingly apparently, but together When LED need large-area heat abstractor.The bulb lamp that daily people get used to possesses a common characteristic：Vitreous body Spheroid shape shell, bulb spherical.One skilled in the art that radiating is to need enough area of dissipations and air to make Convection current, and the distance from thermal source to radiating surface is as short as possible, and thermal source to the thermal resistance between radiating surface it is low be only one it is preferable Radiator structure.But major part LED bulb all reduces glass shell at present, increases the metal with many heat radiating fins in order to radiate Radiator.The surface area of metal heat sink is not more than bare glass shell.By experiment for many years, inventor has found to increase glass The radiating surface of glass shell will be preferably design, but unfortunately, scheme as not existing in the prior art, therefore this The purpose of invention be exactly in order to by way of increasing LED bulb shell radiating surface improving the radiating effect of LED.

The content of the invention

The technological deficiency existed in terms of for LED radiating in prior art, it is an object of the invention to provide a kind of multiple spot Formula distribution LED lamp.

According to an aspect of the present invention, there is provided a kind of multipoint mode distribution LED lamp, it is characterised in that at least including LED Cell-shell 1, LED luminescence chip groups 3, the LED luminescence chip groups 3 are placed in the LED bulb shell 1；Wherein, the LED The outer surface of cell-shell 1 is provided with multiple heat radiation points 7.

Preferably, a micropore 72 is provided with the part heat radiation point 7.

Preferably, the tail end of the LED bulb shell 1 is connected with lamp socket 4, it is preferable that the tail end of the LED bulb shell 1 or Then the lamp socket 4 is at least provided with a gas outlet.

Preferably, the heat radiation point 7 is raised wave point 71.

Preferably, the wave point 71 is to be attached at 1 outer surface of the LED bulb shell.

Preferably, the material used by the wave point 71 is material of the heat conductivility higher than the LED bulb shell 1.

Preferably, the wave point 71 is formed for simultaneous manufacturing with the LED bulb shell 1.And in another preferred reality Apply in example, the wave point 71 is the surface for pasting the LED bulb shell 1 after the LED bulb shell 1 is processed into.

Preferably, the heat radiation point 7 is the Lunar concavity shape thing 73 for being depressed in 1 outer surface of the LED bulb shell.

Preferably, width of the width at the middle part 25 of the substrate 2 more than the front end (26) and rear end 27 of the substrate 2 Degree.

Preferably, the LED luminescence chip groups 3 include one or more LED luminescence chips；And when the luminous cores of the LED When piece group 3 includes multiple LED luminescence chips, it is connected in series by bonding line 22 between the plurality of LED luminescence chips, it is described many The anode of individual LED luminescence chips is electrically connected on the substrate 2, the negative electrode and a flexible circuitry of the plurality of LED luminescence chips Plate to be connected such that and form current supply circuit with power supply.

Preferably, the flexible circuit board 4 is arranged on the substrate 2.

Preferably, the flexible circuit board 4 includes L binding posts, N binding posts, flexible circuit board anode and flexibility Wiring board negative electrode, the flexible circuit board negative electrode are electrically connected with the negative electrode of the plurality of LED luminescence chips, the flexible circuit board Anode is electrically connected with the substrate 2.

Preferably, the flexible circuit board 4 includes flexible circuit board anode and flexible circuit board negative electrode, the flexible wires Road plate negative electrode is electrically connected with the negative electrode of the plurality of LED luminescence chips, and the flexible circuit board anode is electrically connected with the substrate 2 Connect, when the LED is used, the flexible circuit board anode and flexible circuit board negative electrode respectively with power anode and the moon Pole connects.

Preferably, the upper surface of the LED luminescence chips at least in the LED luminescence chip groups 3 scribbles fluorescent material 23.

Preferably, the substrate 2 is used for attaching the region or peripheral region of the LED luminescence chip groups 3 and is provided with least One via 21.

Preferably, at least one via 21 is evenly distributed.

Preferably, surface area of the surface area of the substrate 2 more than the LED luminescence chip groups 3.

Preferably, the substrate 2 is any one composition in following material：Sheet metal；Alloying metal piece；Or glass Piece.

Preferably, the substrate 2 is transparence or translucent.

Further, the quantity of the substrate 2 is one or more, accordingly, the quantity of the LED luminescence chip groups 3 No less than the quantity of the substrate 2.

The present invention arranges heat radiation point 7 by the outer surface in the bulb housing 1, improves the radiating surface of the bulb housing 1, makes Produced heat when luminous of LED can be dispersed in air rapidly, so that the radiating of LED is more abundant.Enter one Step ground, it will be appreciated by those skilled in the art that by the structure of the present invention, be close to LED bulb shell by LED luminescence chips so that LED Luminescence chip can be fully contacted in bulb housing, and then enables LED luminescence chips closer to the external world so that LED lights core Piece can be easier to be dispersed into the external world, greatly increase radiating efficiency, improve the service life of LED and using effect Rate.This radiating mode is easier, it is easy to operation and realization, with good market value.

Description of the drawings

Detailed description non-limiting example made with reference to the following drawings by reading, the further feature of the present invention, Objects and advantages will become more apparent upon：

Fig. 1 illustrates a specific embodiment of the invention, the structural representation of LED；

Fig. 2 illustrates first embodiment of the invention, is provided with a micropore 72 in the part heat radiation point 7 The structural representation of LED

Fig. 3 illustrates first embodiment of the invention, knot of the heat radiation point 7 for the LED of raised wave point 71 Structure schematic diagram.

Fig. 4 illustrates first embodiment of the invention, and the heat radiation point 7 is to be depressed in 1 appearance of the LED bulb shell The structural representation of the LED of the Lunar concavity shape thing 73 in face.

Fig. 5 illustrates first embodiment of the invention, the structural representation of LED；

Fig. 6 illustrates first embodiment of the invention, substrate and LED luminescence chip groups, the flexible circuit board of LED Connection diagram；

Fig. 7 illustrates first embodiment of the invention, and in LED, to be incorporated into flexible circuitry hardened for power driving template Connection diagram in structure；And

Fig. 8 illustrates first embodiment of the invention, and in LED, to be placed on flexible circuitry hardened for electric power driving module The connection diagram of structure.

Specific embodiment

It will be appreciated by those skilled in the art that invention broadly provides a kind of multipoint mode distribution LED lamp, is distributed using multipoint mode The advantage of LED be to make LED that there is more preferable heat dispersion, its function of improving radiating efficiency is mainly described Arrange heat radiation point 7 to realize in LED bulb shell 1, arranging heat radiation point 7 can additionally increase area of dissipation, make the heat in bulb housing 1 Amount distributes rapider and abundant.

Specifically, Fig. 1 illustrates the structural representation of the LED of a specific embodiment of the invention.The present invention A kind of multipoint mode distribution LED lamp is provided, which at least includes LED bulb shell 1,3 (not shown in figure 1) of LED luminescence chip groups, described LED luminescence chip groups 3 are placed in the LED bulb shell 1, wherein, and the outer surface of the LED bulb shell 1 is provided with multiple radiatings Point 7.Further, it will be appreciated by those skilled in the art that the set-up mode of LED luminescence chip groups 3 and bulb housing 1 the present invention other Part is fully described, for example, arranged in attaching mode, be will not be described here.

Further, it is it will be appreciated by those skilled in the art that the shape of the heat radiation point 7 can be diversified, general Shape has circular, square, attractive in appearance for profile, it is also possible to be designed to the multiple patterns such as star, flower pattern.Heat radiation point 7 can be with Bulb housing 1 is integrally formed, it is also possible to be attached on bulb housing 1 again after separately formed.For example, in a preferred embodiment, exist When designing the mould of the LED bulb shell 1, in the design to doing projection or depression in requisition for the position for arranging heat radiation point 7, phase Just there is concave point or salient point as heat radiation point 7 after 1 molding of bulb housing answered.It will be appreciated by those skilled in the art that by such Specific embodiment, can cause the surface area of the LED bulb shell 1 to increase, so as to increase its area of dissipation.In specifically used mistake Cheng Zhong, after the LED luminescence chip groups 3 in the LED bulb shell 1 radiate, heat is conducted to the inner surface of the LED bulb shell 1, And it is further advanced by the outwardly portion radiating of the LED bulb shell 1.As the area of dissipation of the LED bulb shell 1 increases Add, thus with the more preferable radiating effect of conventional bulb.

And in another preferred embodiment, for example, heat radiation point is individually processed, then it is bonded in the appearance of bulb housing 1 Face.Further, it will be appreciated by those skilled in the art that preferably, LED bulb shell 1 is first made, this is traditional handicraft, is then passed through Transparent glue is bonded in the outer surface of bulb housing 1,.For example, bondd by the way of automatization, bulb housing 1 leads on streamline Cross, the annular hollow mould corresponding with 1 profile of bulb housing is set on streamline, and draw-in groove is provided with mould for fixing The heat radiation point 7 of forming, will be stuck in the draw-in groove of mould after the dipped transparent glue in 7 bottom of heat radiation point of forming, when bulb housing 1 During by mould, by automatic control process, make draw-in groove near the outer surface of bulb housing 1 until the bottom of heat radiation point 7 touches Bulb housing 1, the draw-in groove for being now fixed with heat radiation point 7 unclamp, and heat radiation point 7 is bonded in 1 outer surface of bulb housing.Similarly, ability Field technique personnel understand that the purpose for arranging heat radiation point 7 is the area of dissipation for increasing bulb housing 1, and which kind of designs not shadow using The flesh and blood of the present invention is rung, so the heat radiation point is one-shot forming, or it is separately formed, will not be described here.

Further, in a specific embodiment, as shown in Fig. 2 being provided with micropore 72 in the heat radiation point 7, its mesh Be hot-air in bulb housing 1 is discharged by micropore, while cold air can also enter into lamp from micropore 72 Inside cell-shell 1, by such embodiment, can be more quickly dispersed in air with the hot-air inside bulb housing 1, be improved Radiating efficiency.The micropore 72 can be integrally formed by way of mould with heat radiation point 7 and be made, i.e., need in the correspondence of heat radiation point 7 The protrusion of the Position Design needle-like of micropore to be arranged 72, its size are suitable with the size of micropore, after such molding, on heat radiation point 7 Naturally just form micropore 72.Further, it will be appreciated by those skilled in the art that in a further advantageous embodiment, it is also possible to pass through The techniques such as engraving carve out micropore on heat radiation point 7, and artistic carving is typically also adopted by the mode of automatization to be carried out, i.e., described bulb Shell 1 passes through on streamline, is provided with engraved die, the shape of mould and the shape of bulb housing 1 where bulb housing 1 passes through Quite, engraving needle is fixed in the position of need to arrange micropore 72, when bulb housing 1 passes through, by automatic controlling, make Engraving needle is near heat radiation point 7 and then carves out micropore 72 on heat radiation point 7.

Further, with reference to embodiment illustrated in fig. 2, it will be appreciated by those skilled in the art that the quantity of the micropore 72 is not solid It is fixed, the micropore 72 can be set on part heat radiation point 7, it is also possible to the setting micropore 72 on whole heat radiation points 7, and the micropore 72 on heat radiation point 7 position can also be random or ordered arrangement.For example, in a preferred embodiment, it is preferable that described 1 top of LED bulb shell and afterbody arrange micropore 72, and these 72 shapes of micropore on the heat radiation point 7 of LED luminescence chip groups 3 Into plane be as far as possible close to a plane in vertical direction, while 1 left part of the LED bulb shell and right part are luminous near LED Micropore 72 is set on the heat radiation point 7 of chipset 3, and these micropores be as far as possible close in the horizontal direction one it is unilateral, while hanging down Nogata to plane and the plane of horizontal direction should not cross one another, it is to avoid convection current interference each other, such arrangement can To realize more preferable convection effects, the hot-air inside bulb housing 1 and the cold air outside bulb housing 1 is fully exchanged, reach More preferable radiating effect.Further, it will be appreciated by those skilled in the art that the arrangement mode of micropore 72 has various, this has no effect on The flesh and blood of the present invention, will not be described here.

Further, in another change case, the micropore 72 arranged on the heat radiation point 7 of 1 afterbody of the bulb housing can be with Some more, as cold air pressure is more than hot-air, cold air is more to sink to bottom, is set in 1 afterbody of the bulb housing After putting more micropores 72, there can be more cold airs to enter into inside bulb housing 1 from the afterbody of bulb housing 1, oppress bulb housing 1 Internal hot-air is faster discharged to outside bulb housing 1, makes radiating more abundant.

Further, in another preferred change case, the tail end of the LED bulb shell 1 is connected with lamp socket 4, preferably Ground, the tail end of the LED bulb shell 1 or the lamp socket 4 are at least provided with a gas outlet.It will be appreciated by those skilled in the art that With the rising of temperature, atmospheric density diminishes, hot-air be float over above and cold air sinks to following, natural cold air pressure is big In the pressure of hot-air, or after the tail end lamp socket 4 of LED bulb shell 1 is at least provided with gas outlet, more cold airs from Bottom is entered into inside bulb housing 1, and the hot-air such that it is able to oppress 1 top of bulb housing is more rapidly excluded, so as to improve Radiating effect, depending on its quantity can be according to the dimension and shape of bulb housing 1 or lamp socket 4, can be one or more, Can be the arrangement, or irregular arrangement of rule, this has no effect on the flesh and blood of the present invention, and here is no longer gone to live in the household of one's in-laws on getting married State.

Further, it will be appreciated by those skilled in the art that the gas outlet can be integrally formed with bulb housing 1 or lamp socket 4, For example it is integrally formed by mould, to arranging raised in requisition for the position for arranging gas outlet on mould, is so after shaping Can self-assembling formation gas outlet.Can also individually process after 4 molding of bulb housing 1 or lamp socket, for example the technique reality by drilling Existing, bore process is typically also adopted by the mode of automatization to be carried out, i.e., described bulb housing 1 or lamp socket 4 pass through on streamline, The bulb housing 1 or lamp socket 4 are provided with drill bit where passing through, the quantity of drill bit and position can with the quantity of gas outlet and Position by automatic controlling, makes drill bit near the bulb to correspondence when the bulb housing 1 or lamp socket 4 pass through Shell 1 or lamp socket 4 further get out gas outlet in the bulb housing 1 or lamp socket 4.Further, it will be appreciated by those skilled in the art that Take which kind of moulding process has no effect on the flesh and blood of the present invention, will not be described here.

Further, it will be appreciated by those skilled in the art that the arrangement mode of above-mentioned gas outlet can be arranged according to particular order, For example gas outlet can be set in left side afterbody and right side afterbody symmetrical position, can so make the cold air that afterbody is entered more Plus the center being accessible to inside LED bulb shell 1, the hot-air of center is oppressed more quickly to LED bulb shell 1 Inner surface flowing, and then be discharged to outside LED bulb shell 1 from micropore 72.

Further, Fig. 3 shows one embodiment of the specific embodiment of the invention, and the heat radiation point 7 is designed as convex The wave point 71 for rising, this advantage for designing are wider range that the size of wave point can be selected, can as needed to greatest extent Increase area of dissipation.The material of wave point 71 can be identical with bulb housing 1, it is also possible to different, the molding mode of the wave point 71 And set-up mode is had been described in this specific embodiment previous section, be will not be described here.

Preferably, the embodiment shown in Fig. 3, the raised wave point 71 are attached to 1 outer surface of the LED bulb shell.This Art personnel understanding, after the wave point 71 generally wants separately formed, is pasted onto 1 outer surface of bulb housing, glue by glue Transparent material and index of refraction to be selected appropriate with wave point 71, generally the material such as glass, resin, allow the light can be to greatest extent Pass through.Further, radiating effect can also be improved filled with heat-conducting liquid in wave point 71.

Preferably, the embodiment shown in Fig. 3, the raised wave point is with the LED bulb shell 1 for simultaneous manufacturing Into.It is to be integrally formed with Simplified flowsheet, and can to use other extra materials such as glue from this scheme advantage, Can not consider that these materials bring to index of refraction, the impact of thermal conductivity.Shortcoming is that the material that wave point 71 can be selected is received To limitation, can only from 1 identical material of bulb housing.

Further, the raised wave point 71 can use material of the heat conductivility higher than the LED bulb shell 1, example Such as, adopt the ALN of ultra-high conducting heating rate for main material, allow heat rapidly to pass to the air of 71 periphery of wave point.This area skill Art personnel understanding, has no effect on the flesh and blood of the present invention from which kind of high heat conduction material, will not be described here.

Used as a kind of change, Fig. 4 illustrates another embodiment of this specific embodiment, and the heat radiation point 7 is for being depressed in State the Lunar concavity shape thing 73 of 1 outer surface of LED bulb shell.The Lunar concavity shape thing 73 is integrally formed in bulb housing 1, and its quantity can be with Depending on according to 1 dimension and shape of bulb housing, can be one or more, can be rule arrangement, or do not advise Arrangement then, this has no effect on the flesh and blood of the present invention, will not be described here.

Further, it will be appreciated by those skilled in the art that the Lunar concavity shape thing 73 is integrally formed by way of mould Make, i.e. the protrusion of 1 corresponding Position Design Lunar concavity shape of LED bulb shell, after such molding in LED bulb shell 1 nine naturally Form Lunar concavity shape thing 73.In the Lunar concavity shape thing 73, the micropore 72, such as embodiment illustrated in fig. 2 can be similarly set Equally, the molding mode and arrangement mode of micropore is had a detailed description in specific embodiment of the invention previous section, here It will not go into details.

Further, in another embodiment, 7 part of heat radiation point set in the LED bulb shell 1 is ripple Point 71, a part is the Lunar concavity shape thing 73.It is for instance possible to use the mode of mould is integrally formed and makes, and for example can be with The wave point 71 of projection is individually processed, 1 outer surface of bulb housing for being provided with Lunar concavity shape thing 73, specific molding is then pasted onto Technique is had a detailed description in the specific embodiment of the present invention, be will not be described here.Preferably, the wave point 71 and Lunar concavity Shape thing 73 is arranged by the way of symmetrical, and the advantage of this design is that the Lunar concavity shape thing 73 is in 1 outside shape of LED bulb shell Into a cold air chamber, when the wave point 71 and Lunar concavity shape thing 73 are provided with micropore 73, due to cold air pressure it is bigger, The hot-air that micropore 72 on the Lunar concavity shape thing 73 flows out is less, and the cold air of inflow is more, on corresponding wave point 71 The hot-air that micropore 72 flows out is more, and the cold thing of inflow is less, and so in the bulb housing 1, the flowing of air can more Plus it is regular, the hot-air inside bulb housing 1 is more quick and abundant with the exchange of cold air of outside.

With reference to above-described embodiment, it will be appreciated by those skilled in the art that the shape of the bulb housing of the LED can be circular, Can be rectangle, or other any shapes, this has no effect on the flesh and blood of the present invention, will not be described here,

Specifically, Fig. 5 illustrates a specific embodiment of the invention, the structural representation of LED.Further Ground, it will be appreciated by those skilled in the art that the present invention provides a kind of LED, which is at least sent out including LED bulb shell 1, substrate 2 and LED Optical chip group 3.Preferably, it will be appreciated by those skilled in the art that the LED luminescence chip groups 3 be tightly attached at by substrate 2 it is described The inwall of LED bulb shell 1, by tightly attaching the inwall with the LED bulb shell 1 by the luminescence chip group 3 by substrate 2 The heat produced by the luminescence chip group 3 can be made to be dispersed in the external environment condition residing for LED by most short approach, i.e., Preferably, the heat of the LED luminescence chip groups 3 is conducted to LED bulb shell 1 by substrate 2, so as to even heat it is described LED bulb shell 1 is absorbed, and the heat produced by the LED luminescence chip groups 3 is only needed to by one layer of very thin LED bulb shell Just the external world can be directly emitted to, it is described without causing the heat produced by the LED luminescence chip groups 3 to accumulate in large quantities In LED, cause the radiating of LED difficult so that the heat that the LED luminescence chip groups 3 are produced can Quick diffusing go out, Ensure that the temperature of LED is maintained in rational scope, and then ensure the normal of LED, safety and efficient operation.

Specifically, it will be appreciated by those skilled in the art that the interior table of the LED bulb shell 1 is close in the side of the substrate 2 The LED luminescence chip groups 3 are close in face, the opposite side of the substrate 2.Further, it will be appreciated by those skilled in the art that will be described LED luminescence chips directly attach, are fixed on the inwall of the LED bulb shell 1 and have greatly difficulty in the realization of technology, because This is needed by placing the substrate 2 in the middle of the LED bulb shell 1 with the luminescence chip 3, and the substrate 2 can be very It is fixed with the bulb housing 1 well, the substrate 2 can be fixed with the luminescence chip 3, therefore, by described Substrate 2 can realize that the luminescence chip 3 is fixed on the inwall of the LED bulb shell 1 well.Further, this area skill Art personnel understand that the fixed form and the substrate 2 between the LED bulb shell 1 and the substrate 2 is luminous with the LED Fixed form between chipset 3 is not unique, can realize being relatively fixed for three, and this has no effect on the reality of the present invention Matter content, will not be described here.

Preferably, it will be appreciated by those skilled in the art that the substrate 2 is preferably translucent or transparence.Preferably, originally Art personnel understand, the substrate 2 are designed as translucent or transparence and can ensure that the LED sends out to greatest extent The light major part launched by optical chip group 3 can be exhaled, if the substrate 2 is nontransparent shape or light transmission extreme difference, The illuminating effect extreme difference of LED can be then caused, can be that the light projected by LED produces many shades and black speck, be leveraged The illuminating effect of LED and function.Further, it will be appreciated by those skilled in the art that realizing the transparence of the substrate 2 or semi-transparent Bright shape can make the substrate 2 by using transparent material, it is also possible to by being punched in the substrate 2, so also may be used To increase the penetration capacity of light, the illuminating effect of LED is enabled to more preferably.It is any to realize the transparent of the substrate 2 Or the process of translucentization, can meet requirement of the present invention to the substrate 2, this is had no effect in the essence of the present invention Hold, will not be described here.

Preferably, it will be appreciated by those skilled in the art that in this embodiment, institute is substantially compared on the surface of the substrate 2 State LED luminescence chip groups 3 little.The substrate 2 is played a part of to be primarily used to connect the LED bulb shell 1 and the LED Luminescence chip group 3, so not having strict restriction to the size of the substrate 2, can realize above-mentioned linkage function.But If too big in view of the substrate, it will affect the LED luminescence chip groups 3 through the illumination effect of the LED bulb shell 1, The illuminating effect of the LED is made a big impact.Therefore, the substrate 2 can should realized connecting the LED bulb It is on the premise of shell 1 and 3 function of LED luminescence chip groups, little as much as possible.The LED will not be so largely affected by The substrate 2 and is designed to transparent its purpose by the lighting function of luminescence chip group 3, it is ensured that the illuminating effect of the LED Or translucent effect to be reached is consistent, be will not be described here.

Further, it will be appreciated by those skilled in the art that in another specific embodiment, the surface area of the substrate 2 The preferably more than area of the LED luminescence chip groups 3 so that the LED luminescence chip groups 3 by it is overall adhered to it is described On substrate 2, and the substrate 2 is further fixed the inner surface for being attached at the LED bulb shell 1.Further, ability Field technique personnel understand that attaching set forth in the present invention does not represent the interior table that the substrate 2 is attached to the LED bulb shell 1 Face, and be merely representative of both and be relatively fixed.

Further, it will be appreciated by those skilled in the art that the thickness of the substrate 2 should be less.When the thickness of the substrate 2 is protected Hold in a less thickness range, light transmission can be better achieved, be unlikely to make 3 institute of the LED luminescence chip groups The light of transmitting causes very big decay after the substrate 2, it is ensured that the illuminating effect of light transmission and the LED.Enter One step ground, if it will be appreciated by those skilled in the art that the substrate 2 is too thick, can serious mistake stop 3 institute of the LED luminescence chip groups The light of transmitting, causes the significantly decay of the light, can also affect the heat dispersion of the LED.

Preferably, it will be appreciated by those skilled in the art that the position of the substrate 2 is not fixed, its position can basis The position of the LED luminescence chip groups 3 mutually should determine that.Meanwhile, the quantity of the substrate 2 is not also unique, can be one Can be multiple.Further, skilled artisan understands that the determination of the determination of amount of the substrate 2 and position, main If in order to preferably the LED bulb shell 1 is fitted with the LED luminescence chip groups 3, can be in concrete implementation In, quantity and the position of the substrate 2 is dynamically adjusted, be will not be described here.

Further, it will be appreciated by those skilled in the art that in this embodiment, in the LED luminescence chip groups 3 The upper surface of LED luminescence chips scribbles fluorescent material.Specifically, the LED luminescence chip groups 3 include that one or more LED send out Optical chip, it is preferable that when which includes multiple LED luminescence chips, then each LED luminescence chip can obtain from power supply drive The electric power that dynamic model block is provided, will not be described here.Further, it is preferable that wherein one or more LED luminescence chips it is upper Surface scribbles fluorescent material, so that the light sent by the LED luminescence chips for being applied fluorescent material is more uniform, color Easily received by consumer.

Further, it will be appreciated by those skilled in the art that Fig. 5 is illustrate only described in a substrate 2 and one group The schematic diagram of LED luminescence chip groups 3, this is not intended that the present invention is only limited to one group of LED luminescence chip group 3.Meanwhile, in Fig. 5 Heat radiation point is not indicated in the LED bulb shell 1, but embodiment illustrated in fig. 5 should be combined with the illustrated embodiments of Fig. 1 to 4, here It will not go into details.Further, it will be appreciated by those skilled in the art that elaborating to connect by circuit in Fig. 6 to embodiment illustrated in fig. 8 Connect mode to drive the preferred embodiment of the LED luminescence chip groups 3, Fig. 6 is specifically refer to embodiment illustrated in fig. 8.

With reference to above-mentioned Fig. 1 to embodiment illustrated in fig. 5, it will be appreciated by those skilled in the art that when the substrate 2 is wavy, And the wavy radian of the tail end of the substrate 2 is less than the wavy radian of the pars intermedia of the substrate 2, more than the base The wavy radian at the top of plate 2.In order to meet the LED luminescence chip distribution densities of the tail end of the LED luminescence chip groups 3 Less than the LED luminescence chip distribution densities at the middle part of LED luminescence chip groups 3, and the LED of the tail end of the LED luminescence chip groups 3 LED luminescence chip distribution density of the luminescence chip distribution density more than the top of LED luminescence chip groups 3, by the LED luminous core On the wavy substrate 2, uniformly a point tiny fragments of stone, coal, etc. is capable of achieving the LED luminescence chips of piece 3.Further, as the substrate 2 is It is wavy, and the wavy radian of the tail end of the substrate 2 is less than the wavy radian of the pars intermedia of the substrate 2, greatly In the wavy radian at the top of the substrate 2.In addition, the luminescence chip in the LED luminescence chip groups 3 is in the ripple Uniformly arrange on shape wave substrate, so realize the LED luminescence chip groups 3 middle part LED luminescence chips density more than described The density of the LED luminescence chips of the tail end of LED luminescence chip groups 3, and the LED luminescence chips of the tail end of LED luminescence chip groups 3 Density of the density more than the LED luminescence chips at the top of the LED luminescence chip groups 3.Realize the LED luminescence chip groups 3 The purpose and advantage of such density arrangement has been specifically described in figure 3, be will not be described here.

6, Fig. 7 and Fig. 8, elaborate on how by circuit connecting mode to drive the LED to send out below in conjunction with the accompanying drawings The luminous preferred embodiment of optical chip group 3.

Fig. 6 illustrates first embodiment of the invention, LED substrate and LED luminescence chip groups, flexible circuit board Connection diagram.It will be appreciated by those skilled in the art that described Fig. 6 is not the unique connected mode figure of the present embodiment, the mesh of the figure Be intended to illustrate implement preferred embodiment connection diagram.Specifically, as shown in fig. 6, the LED luminescence chip groups 3 connect To the side of the substrate 2, the opposite side of the substrate 2 is connected with the inner surface of the bulb housing 1, those skilled in the art's reason Solution, the mode that the LED luminescence chips are connected with the substrate 2 is not changeless, for example, can be that directly stamp exists The surface of the substrate 2, mode are varied, but have no effect on the flesh and blood of the present invention, therefore will not be described here.Meanwhile, Via 21 (not showing in Fig. 6) is distributed with the substrate 2, with regard to the distribution of via 21, is already described in above-mentioned Fig. 5, therefore Will not be described here.

More specifically, be connected in series by the bonding line 22 between described each LED luminescence chip, by this kind of connection Mode, can form a series circuit between described each LED luminescence chip, while power supply and while power-off.

Further, flexible circuit board 4 described in, people in the art are installed the one end for connecting power supply in the substrate 2 Member understands, it is preferable that the afterbody of the substrate 2 is provided with the flexible circuit board 4.Further, those skilled in the art's reason Solution, it is not changeless that the flexible circuit board 4 installs method on a substrate 2, and which can be using the method for pressing Can be various with the method for adhesion, method, but flesh and blood of the invention is had no effect on, therefore will not be described here.

Further, in the present embodiment, as shown in FIG., it is preferable that will be last in the LED luminescence chip groups 3 The anode of one luminescence chip is electrically connected with the substrate 2, at the same by LED luminescence chip groups 3 near flexible circuit board 4 one The negative electrode of individual luminescence chip is electrically connected with the negative electrode in flexible circuit board 4.Further, it will be appreciated by those skilled in the art that at this During the use of the LED that invention is provided, the substrate 2 is by preferably by the afterbody and external power source of the bulb housing 1 It is electrically connected, such external power source is electrically connected typically by the afterbody of lamp socket and the bulb housing 1 and obtains, from And allow external power source to drive the LED.Further, it will be appreciated by those skilled in the art that the both positive and negative polarity of external power source It is connected with the substrate 2, flexible circuit board 4 respectively, so as to constitute complete power circuit, such as shown in Fig. 8.

Further, it will be appreciated by those skilled in the art that during the use of the LED that the present invention is provided, alternating current is Directly electrically connected with the LED luminescence chip groups with wire by the lamp holder of the LED or by the lamp holder position elder generation Electrically connected with the LED luminescence chip groups after external driving power supply rectification, constant current again, and real shown in Fig. 6 and Fig. 7 Apply in example, the flexible circuit board act as turning on the effect of circuit and LED drive circuit carrier.

Under AC direct driving modes, the alternating current direct of the lamp holder joints connects and is wired to shown in Fig. 6 or Fig. 7 Flexible circuit board 4 on L binding posts and N binding posts, by EMC filter circuit, bridge rectifier, constant-current driving The LED luminescence chip groups are powered after circuit, concrete structure is as shown in Fig. 6 and Fig. 7.Wherein, the EMC filtered electricals Road, bridge rectifier, constant-current drive circuit etc. are not illustrated in Fig. 6 and Fig. 7, it is preferable which is all to bind skill by COB Art is placed directly against in flexible circuit board and forms path by the circuit of scolding tin and flexible circuit board.

Further, it will be appreciated by those skilled in the art that by above-mentioned connected mode, the both positive and negative polarity of LED luminescence chip groups 3 is Jing is formed, and such that it is able to form an electrical circuit in the case of externally fed, by the break-make of control loop, and then is controlled The LED luminescence chip groups 3 it is whether luminous.

It will be appreciated by those skilled in the art that in order that LED sends the white light of more preferable effect, in the LED luminescence chips The upper surface of group 3 coats fluorescent material 23, as shown in FIG..

Closer, how the electrical circuit shown in Fig. 6 is connected with power drives, below in conjunction with accompanying drawing 7 and accompanying drawing 8, it is specifically described the embodiment of two kinds of connections.

Fig. 7 illustrates first embodiment of the invention, and in LED, to be incorporated into flexible circuitry hardened for power driving template Connection diagram in structure.It will be appreciated by those skilled in the art that described Fig. 7 is not unique structure connection figure, the purpose meaning of the figure In explanation electric power driving module 5 and the structure connection of flexible circuit board 4.Specifically, as shown in fig. 7, the flexible circuitry At least include binding post L, binding post N, flexible circuit board anode and flexible circuit board negative electrode in plate 4.Further, exist In embodiment illustrated in fig. 7, the flexible circuit board anode and flexible circuit board negative electrode are in the way of electric power driving module 5 It is existing, and preferably skilled artisan understands that the electric power driving module 5 is at least integrated with AC-DC conversion module and constant current Drive module (not shown), so that the both positive and negative polarity of the LED luminescence chip groups 3 is formed.Those skilled in the art Understand, the electric power driving module 5 is placed in the inside of flexible circuit board 4, becomes one of structure of flexible circuit board 4, ability Field technique personnel understand that the method that the electric power driving module 5 is integrated in flexible circuit board 4 has many kinds, and here is not superfluous State.

Further, with reference to Fig. 6, it will be appreciated by those skilled in the art that the negative electrode of the flexible circuit board 4 is sent out with the LED The negative electrode electrical connection of optical chip, the anode of the flexible circuit board 4 are electrically connected with the substrate 2.By such connected mode, So that the substrate 2 carries positive charge, so that the anode of the LED luminescence chips is connected with any point of the substrate 2 , without being necessarily connected to the anode of the flexible circuit board 4, the material of the flexible circuit board 4 is saved, also just In being processed.And in preferred variant, for structure shown in Fig. 6 to Fig. 8, it is also possible to by the sun of the flexible circuit board 4 Pole is electrically connected with the anode of the LED luminescence chips, and the negative electrode of the flexible circuit board 4 is electrically connected with the substrate 2, correspondingly The negative electrode of the LED luminescence chips is electrically connected with the substrate 2, so as to form the confession for the LED luminescence chips Electrical circuit.

Further, it will be appreciated by those skilled in the art that being directed to a LED luminescence chip group, the preferably LED lights core Each LED luminescence chip in piece group is directly connected by bonding line 22, so as to form cascaded structure.In such architecture basics On, the negative electrode of first LED luminescence chip can be used as the negative electrode of the LED luminescence chip groups, and luminous cores of last LED The anode of piece can be used as the anode of the LED luminescence chip groups.Yet further, in a change case, art technology Personnel understand that its anode individually can also be connected to the base by each the LED luminescence chip in the LED luminescence chip groups On plate 2, correspondingly the negative electrode of each LED luminescence chip is connected on the negative electrode of the flexible circuit board 4, and this has no effect on this The technical scheme of invention.

Further, with reference to above-mentioned Fig. 6 and Fig. 7, it will be appreciated by those skilled in the art that in above-described embodiment and change case In, which provides the electrical interface of anode and negative electrode for the LED luminescence chips, is connect with negative electrode respectively so as to work as the anode of power supply During to above-mentioned anode and negative electrode, a current supply circuit to the LED luminescence chips can be formed, be will not be described here.

More specifically, it is similar with above-mentioned embodiment illustrated in fig. 6, in the LED course of work that the present invention is provided, work as institute State substrate 2 to electrically connect with external power source by the afterbody of bulb housing 1, the external power source is by described electric power driving module 5 etc. The luminescence chip group 3 is driven, is lighted so as to control the luminescence chip group 3.By this kind of connection, the power supply drives Dynamic model block 5 in the presence of flexible circuit board 4 forms electrical circuit with the substrate 2 and the LED luminescence chip groups 3, reaches Control the effect of the luminescence chip break-make.

Fig. 8 illustrates first embodiment of the invention, and in LED, to be placed on flexible circuitry hardened for electric power driving module The connection diagram of structure.With reference to above-mentioned embodiment illustrated in fig. 6, skilled artisan understands that the flexible circuit board 4 is at least wrapped Include flexible circuit board anode, i.e., LED+ shown in Fig. 8, and flexible circuit board negative electrode, i.e., LED- shown in Fig. 8.The flexible circuitry Plate negative electrode is electrically connected with the negative electrode of the plurality of LED luminescence chips, and the flexible circuit board anode is electrically connected with the substrate 2. By such connected mode, when external power source 7 is connected, the substrate 2 carries positive charge, constitutes positive pole, so that described The both positive and negative polarity of luminescence chip group 3 is formed.It will be appreciated by those skilled in the art that described Fig. 8 is not unique structure connection figure, the figure Purpose be intended to illustrate the structure connection of external power source (external drive part) 7 and flexible circuit board 4.Set by this kind of Meter, can control the circuit on-off of whole luminescence chip group 3 by the flexible circuit board 4, realize to luminescence chip group 3 The control for whether lighting.

Further, with reference to shown in Fig. 8, under DC mode activateds, the alternating current direct of above-mentioned lamp holder joints connected wire It is connected in external driving power supply, after power source internal carries out EMC filter circuit, bridge rectifier, constant-current drive circuit, The positive and negative electrode in the flexible circuit board above lamp bar is connected by wire again, path is ultimately formed.Those skilled in the art manage Solution, flexible circuit board have only served the effect of communication line here, the ability for not possessing AC direct drives.

Further, the bottom of the substrate 2 is anode, and the negative electrode of the substrate 2 is connected to flexible wires by bonding line Road plate, as shown in Figure 6.And Fig. 6 is construed as a detail section in Fig. 7, Fig. 8, electric power driving module 5 and wire connecting portion Divide and be made up of lower section rectangular region in Fig. 7.Electric power driving module 5 shown in Fig. 7 mainly includes following part, for example EMC filter circuit, bridge rectifier, constant-current drive circuit and other protection circuits are constituted.By above-mentioned technical scheme, The LED of present invention offer is allowd to pass through DC powered, it is also possible to by exchanging electric drive so that installation and debugging are safeguarded All become very simple.Further, the alternating current direct of above-mentioned lamp holder joints connects the flexibility being wired to above lamp bar L ac terminals, N ac terminals on wiring board 4, after EMC filter circuit, bridge rectifier, constant-current drive circuit, its Middle EMC filter circuit, bridge rectifier, constant-current drive circuit are all direct by COB (chip On board) binding technology It is attached in flexible circuit board and path is formed by the circuit of scolding tin and flexible circuit board.

Further, it will be appreciated by those skilled in the art that as the substrate 2 is preferably by metal, therefore the substrate 2 An electrode can only be served as, LED is a LED device, wanting to light there are 2 electrodes, one plus positive voltage, One plus negative voltage, circuit part rely on flexible circuit board to complete, as shown in Figure 6.Flexible circuit board need not be sent to end line At road, the cost of wiring board can be so greatlyd save, and flexible circuit board only needs to connect i.e. with the electrode cathode of first chip Can, after certain LED quantity of connecting, anode is turned on by substrate true qualities conduction, and the anode in flexible circuit board is logical Via or welding directly fit together, and realize the conducting of circuit.

Above the specific embodiment of the present invention is described.It is to be appreciated that the invention is not limited in above-mentioned Particular implementation, those skilled in the art can make various modifications or modification within the scope of the claims, this not shadow Ring the flesh and blood of the present invention.

Claims

1. a kind of multipoint mode distribution LED lamp, it is characterised in that at least including LED bulb shell (1), LED luminescence chip groups (3), institute State LED luminescence chip groups (3) to be placed in the LED bulb shell (1)；

Wherein, the outer surface of LED bulb shell (1) is provided with multiple heat radiation points (7)；

The part heat radiation point (7) is raised wave point (71), and the part heat radiation point (7) is depressed in the LED bulb shell (1) Lunar concavity shape thing (73) of outer surface, the wave point and the Lunar concavity shape thing are provided with micropore (72)；

Also include substrate (2), the quantity of substrate (2) is adapted with the quantity of LED luminescence chip groups (3), the base The side of plate (2) is attached at the inner surface of the LED bulb shell (1), and one LED luminescence chip groups (3) are attached at correspondence The opposite side of one substrate (2).

2. LED according to claim 1, it is characterised in that the tail end of LED bulb shell (1) is connected with lamp socket (4), the tail end or the lamp socket (4) of LED bulb shell (1) is at least provided with a gas outlet.

3. LED according to claim 1, it is characterised in that described wave point (71) are for being attached at the LED bulb shell (1) outer surface.

4. LED according to claim 3, it is characterised in that the material used by wave point (71) is heat conductivility Higher than the material of the LED bulb shell (1).

5. LED according to claim 1, it is characterised in that wave point (71) are with the LED bulb shell (1) Secondary processing and forming is formed.

6. LED according to claim 1, it is characterised in that the width at the middle part (25) of substrate (2) is more than described The width of the front end (26) and rear end (27) of substrate (2).

7. LED according to claim 6, it is characterised in that described substrate (2) are wavy, and the substrate (2) Wavy radian of the wavy radian at top less than the pars intermedia of the substrate (2).

8. LED according to claim 7, it is characterised in that described LED luminescence chip groups (3) include one or more LED luminescence chips；And when described LED luminescence chip groups (3) include multiple LED luminescence chips, the plurality of LED luminescence chips Between be connected in series by bonding line (22), the anode of the plurality of LED luminescence chips is electrically connected on the substrate (2), institute The negative electrode and a flexible circuit board (4) for stating multiple LED luminescence chips to be connected such that and form current supply circuit with power supply.

9. LED according to claim 8, it is characterised in that described flexible circuit board (4) include that L binding posts, N connect Line terminals, flexible circuit board anode and flexible circuit board negative electrode, the flexible circuit board negative electrode and the luminous cores of the plurality of LED The negative electrode electrical connection of piece, the flexible circuit board anode are electrically connected with the substrate (2).

10. LED according to claim 8 or claim 9, it is characterised in that described substrate (2) are transparence or translucent.

11. LEDs according to claim 10, it is characterised in that the quantity of substrate (2) is one or more, right Ying Di, the quantity of LED luminescence chip groups (3) are no less than the quantity of the substrate (2).