CN103883910B - A kind of LED - Google Patents

A kind of LED Download PDF

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Publication number
CN103883910B
CN103883910B CN201410141172.0A CN201410141172A CN103883910B CN 103883910 B CN103883910 B CN 103883910B CN 201410141172 A CN201410141172 A CN 201410141172A CN 103883910 B CN103883910 B CN 103883910B
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Prior art keywords
led
substrate
luminescence chip
lamp cover
chip
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CN103883910A (en
Inventor
李建胜
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SHANGHAI DINGHUI TECHNOLOGY Co Ltd
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SHANGHAI DINGHUI TECHNOLOGY Co Ltd
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Abstract

The invention provides a kind of LED, comprise LED lamp cover, substrate and LED luminescence chip; Wherein, the inner surface of described LED lamp cover is close in the side of described substrate, and the opposite side of described substrate is close to described LED luminescence chip, and described LED luminescence chip is close to the inner surface of described LED lamp cover 1.The present invention is by being close to LED lamp cover by LED euthermic chip, LED euthermic chip fully can be contacted with lampshade, and then enable LED euthermic chip closer to the external world, make LED euthermic chip can more easily be dispersed into the external world to go, greatly increase radiating efficiency, improve service life and the service efficiency of LED.And this radiating mode is easier, is easy to operation and realizes, there is good market value.

Description

A kind of LED
Technical field
The present invention relates to field of LED illumination, especially a kind of LED, particularly, relate to the LED with excellent heat dispersion performance.
Background technology
Along with the widespread adoption of LED, as the advantage of emerging illumination new light sources, embodied day by day significantly, but simultaneously, the unidirection luminous property of price, LED and LED need large-area heat abstractor.
The puzzlement of following several item also becomes the part obstruction of LED illumination development day by day.
A, price: LED illumination is made up of LED light source, power drives, LED heat abstractor and bulb structure four major parts, along with constantly dropping of LED light source price, the Cost Problems of other three parts becomes severe.
B, large-scale heat abstractor
A large amount of heats can be produced due to during LED luminescence; for protection properties of product are stablized in design; must assist heat radiation with large-area metal, this part metal adds the directionality that light fixture cost limits the unidirectional bright dipping of LED, goes back the globality of the light fixture bright dipping of partial occlusion.
Such as, number of patent application is 201310242060.X, denomination of invention is " LED chip U-tube heat dissipation, energy conservation lamp ", and number of patent application is 201310190476.1, patent name is that " a kind of linear LED light source " all proposes respective technical solution.The present invention wishes to provide different technical schemes on this basis.
Summary of the invention
There is the present situation of technical problem needs improvement for LED heat radiation in prior art, the object of this invention is to provide a kind of LED, it is characterized in that, at least comprise LED lamp cover 1, substrate 2 and LED luminescence chip group 3;
Wherein, the side of described substrate 2 is attached at the inner surface of described LED lamp cover 1, and described LED luminescence chip group 3 is attached at the opposite side of described substrate 2.
Preferably, the part that described luminescence chip group 3 is placed in described LED lamp cover 1 tail end is connected with electric power driving module.
Preferably, the upper surface of the one or more LED luminescence chips at least described LED luminescence chip group 3 scribbles fluorescent material.
Preferably, described substrate 2 is provided with at least one via hole 21 as loophole for the region or peripheral region attaching described LED luminescence chip group 3.
Further, at least one via hole 21 described, namely described loophole is evenly distributed.
Further, the surface area of described substrate 2 is greater than the surface area of described LED luminescence chip group 3.
Preferably, described substrate 2 is any one composition in following material: sheet metal; Alloying metal sheet; Or sheet glass.
Preferably, described substrate 2 is transparence or translucent.
Further, the quantity of described substrate 2 is one or more, and accordingly, the quantity of described LED luminescence chip group 3 is no less than the quantity of described substrate 2.
The present invention is by being close to LED lamp cover by LED euthermic chip, LED euthermic chip fully can be contacted with lampshade, and then enable LED euthermic chip closer to the external world, make LED euthermic chip can more easily be dispersed into the external world to go, greatly increase radiating efficiency, improve service life and the service efficiency of LED.And this radiating mode is easier, is easy to operation and realizes, there is good market value.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious:
Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED;
Fig. 2 illustrates according to the first embodiment of the present invention, the layout architecture schematic diagram of LED; And
Fig. 3 illustrates according to the first embodiment of the present invention, the structural representation of LED substrate and lampshade, LED luminescence chip group 3 annexation.
Detailed description of the invention
Those skilled in the art understand, invention broadly provides a kind of LED with excellent heat dispersion performance, and realize heat sinking function and mainly rely on the LED euthermic chip of LED to press close to LED lamp cover, make that LED euthermic chip can short distance be liftoff close more with external environment condition, make the euthermic chip of LED more directly can contact external environment, realize the heat radiation of LED euthermic chip more simply and easily.Further, it will be appreciated by those skilled in the art that the shape of the lampshade of described LED can be circular, can be rectangle, can be other any shapes, this affect flesh and blood of the present invention, does not repeat them here yet,
Particularly, Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED.Wherein, in Fig. 1, the legend of lower left is enlarged drawing, and amplification display is carried out separately to clearly show the present embodiment in this position by it.Further, it will be appreciated by those skilled in the art that and the invention provides a kind of LED, it at least comprises LED lamp cover 1, substrate 2 and LED luminescence chip group 3.Preferably, it will be appreciated by those skilled in the art that described LED lamp cover 1 defines inner space 8, and in the prior art scheme, namely described LED luminescence chip is placed in described inner space 8.Further, those skilled in the art understand, described LED luminescence chip group 3 is tightly attached at the inwall of described LED lamp cover 1 by substrate 2, be dispersed in the external environment condition residing for LED by described luminescence chip group 3 is tightly attached the heat that described luminescence chip group 3 can be made to produce with the inwall of described LED lamp cover by substrate 2 by the shortest approach, namely preferably, the heat of described LED luminescence chip group 3 conducts to LED lamp cover 1 by substrate 2, thus even heat ground absorb by described LED lamp cover 1, the heat that described LED luminescence chip group 3 produces only needs just directly to be dispersed into the external world by very thin one deck LED lamp cover, and the heat that described LED euthermic chip 3 can not be made to produce is present in described LED in large quantities, the heat radiation difficulty of LED can not be caused, the heat that described LED luminescence chip group 3 is produced can be gone out by Quick diffusing, ensure that the temperature of LED remains in rational scope, and then ensure the normal of LED, safety and efficiently work.
Particularly, it will be appreciated by those skilled in the art that the inner surface of described LED lamp cover 1 is close in the side of described substrate 2, the opposite side of described substrate 2 is close to described LED luminescence chip group 3.Further, those skilled in the art understand, the inwall directly attaching described LED luminescence chip, be fixed on described LED lamp cover 1 has great difficulty in the realization of technology, therefore need by placing described substrate 2 in the middle of described LED lamp cover 1 with described luminescence chip 3, described substrate 2 can be fixed with described lampshade 1 well, described substrate 2 can be fixed with described luminescence chip 3, therefore, can realize by described substrate 2 inwall that described luminescence chip 3 is fixed on described LED lamp cover 1 well.Further, those skilled in the art understand, fixed form between described LED lamp cover 1 and described substrate 2 and the fixed form between described substrate 2 and described LED luminescence chip group 3 not unique, the relatively fixing of three can be realized, this does not affect flesh and blood of the present invention, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence.Preferably, those skilled in the art understand, described substrate 2 is designed to translucent or transparence and can ensures that the wide part that described LED luminescence chip group 3 is launched can both exhale to greatest extent, if described substrate 2 is nontransparent shape or light transmission extreme difference, then can cause the illuminating effect extreme difference of LED, can be that the light that LED projects produces many shades and blackspot, greatly have impact on illuminating effect and the function of LED.Further, those skilled in the art understand, realize described substrate 2 transparence or translucent can by use transparent material make described substrate 2, also can by punching at described substrate 2, so also can increase the penetration capacity of light, the illuminating effect of LED can be made better.Any process that can realize transparent or translucentization of described substrate 2, all can meet the requirement of the present invention to described substrate 2, this does not affect flesh and blood of the present invention, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that in this embodiment, the surface of described substrate 2 is obviously little than described LED luminescence chip group 3.The effect that described substrate 2 plays mainly is used for connecting described LED lamp cover 1 and described LED luminescence chip group 3, so not strict restriction to the size of described substrate 2, can realize above-mentioned linkage function.But consider that if described substrate is too large, described LED luminescence chip group 3 will be affected through the illumination effect of described LED lamp cover 1, the illuminating effect of described LED is made a big impact.Therefore, described substrate 2 should realizing connecting described LED lamp cover 1 with under the prerequisite of described LED luminescence chip group 3 function, little as much as possible.Can not affect the lighting function of described LED luminescence chip group 3 so largely, ensure that the illuminating effect of described LED, its object is consistent with described substrate 2 is designed to the transparent or translucent effect that will reach, and does not repeat them here.
Further, those skilled in the art understand, in another specific embodiment, such as specific embodiment shown in Fig. 3, the surface area of described substrate 2 is preferably more than the area of described LED luminescence chip group 3, thus described LED luminescence chip group 3 is adhered on described substrate 2 by entirety, and described substrate 2 is fixedly attached at the inner surface of described LED lamp cover 1 further.Further, it will be appreciated by those skilled in the art that attaching set forth in the present invention does not represent the inner surface that described basic 2 are attached to described LED lamp cover 1, and only represent that both are fixed relatively.
Further, it will be appreciated by those skilled in the art that the thickness of described substrate 2 should be less.When the thickness of described substrate 2 remains in a less thickness range, light transmission can be realized better, the light being unlikely to described LED luminescence chip group 3 is launched causes very large decay after described substrate 2, ensure that the illuminating effect of light transmission and described LED.Further, if it will be appreciated by those skilled in the art that, described substrate 2 is too thick, then serious mistake can stop and cause the light that described LED luminescence chip group 3 is launched the significantly decay of described light, also can affect the heat dispersion of described LED.
Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixing, its position can be determined according to the position of described LED luminescence chip group 3 is corresponding.Meanwhile, the quantity of described substrate 2 is also unique, can be one also can be multiple.Further, those skilled in the art understand the determination of quantity and the determination of position of described substrate 2, mainly in order to better described LED lamp cover 1 be fitted with described LED luminescence chip group 3, can in concrete realization, dynamically adjust quantity and the position of described substrate 2, do not repeat them here.
In sum, described LED forms primarily of described LED lamp cover 1, described substrate 2 and described LED luminescence chip group 3.The connection of described LED lamp cover 1 and described LED luminescence chip group 3 is realized by described substrate 2, described LED luminescence chip group 3 is made directly to fit in described LED lamp cover 1, substantially reduce the heat conducting distance of described LED luminescence chip group 3, the heat that described LED luminescence chip group 3 is produced directly just promptly can be passed in external environment condition by the LED lamp cover of thin layer and go, substantially increase the radiating efficiency of described LED, define the good thermal conductivity of LED, and then extend service life and the service efficiency of LED, solve the heat dissipation problem of LED simply and easily.
Further, it will be appreciated by those skilled in the art that in this embodiment, the upper surface of the LED luminescence chip in described LED luminescence chip group 3 scribbles fluorescent material.Particularly, described LED luminescence chip group 3 comprises one or more LED luminescence chip, and preferably, when it comprises multiple LED luminescence chip, then each LED luminescence chip all can obtain the electric power provided from electric power driving module, does not repeat them here.Further, preferably, the upper surface of wherein one or more LED luminescence chips scribbles fluorescent material, thus the light that the LED luminescence chip of coated fluorescent material is sent is more even, color more easily receive by consumer.
Further, those skilled in the art understand, Fig. 1 illustrate only the schematic diagram of LED luminescence chip group 3 described in a described substrate 2 and a group, this does not show that the present invention is only only limitted to one group of LED luminescence chip group 3, such as the schematic diagram showing LED luminescence chip group 3 described in the described substrate 2 of many groups and a group embodiment illustrated in fig. 2, does not repeat them here.And the annexation schematic diagram of described luminescence chip group 3 and described electric power driving module is not shown in detailed description of the invention shown in Fig. 1, but those skilled in the art are appreciated that in conjunction with prior art, described luminescence chip group 3 carries out driving and luminescence preferably by described electric power driving module, does not repeat them here.Further, those skilled in the art also understand, and wherein length, the length of thickness and described LED luminescence chip group 3, thickness, the shape of basic 2 are only a kind of signals, do not represent the technical program and are only limitted to this kind of shape.
Fig. 2 illustrates according to the first embodiment of the present invention, the layout architecture schematic diagram of LED.It will be appreciated by those skilled in the art that the layout architecture of described LED is not is only figure described in figure, and described LED luminescence chip group 3 can be various shape with the combination of described substrate 2.Figure shown in described Fig. 2 is the moulding of petal type bulb lamp, wherein said LED luminescence chip group 3 is petal type structure, shape extends from the afterbody of described LED lamp cover 1, and spread out along the inner surface of described LED lamp cover 1 with strip, then again gather at the top of described LED lamp cover 1, its shape is namely as petal.And described LED luminescence chip group 3 is connected to by described substrate 2 on the inner surface of described LED lamp cover 1, LED lamp cover 1 is utilized to carry out direct cross-ventilation heat radiation, LED lamp bar directly contacts with LED lamp cover 1, the heat that LED produces conducts to LED lamp cover 1 endlessly, LED lamp cover 1 is through horizontal and vertical conduct air, under the convection action of cool exterior air, constantly carry out heat exchange, LED lamp cover 1 serves good thermolysis.By this kind of design, the heat that LED luminescence chip group 3 is produced more easily is dispersed in air.It will be appreciated by those skilled in the art that the pattern diagram of the LED for other, its general configuration, as Fig. 2 depicted, is only that the structure of LED luminescence chip group 3 is different, therefore does not repeat them here.
With reference to embodiment illustrated in fig. 2, those skilled in the art understand, preferably, the part that described luminescence chip group 3 is placed in described LED lamp cover 1 tail end is connected with electric power driving module, described electric power driving module is connected with power supply by the screw socket of described LED lamp cover 1 afterbody, and when Power supply, described luminescence chip group 3 is powered, driven, thus luminescence chip group 3 described in gained is luminous, and then make LED provided by the present invention luminous.
Fig. 3 illustrates according to the first embodiment of the present invention, the structural representation of LED substrate.It will be appreciated by those skilled in the art that shown Fig. 3 is not unique LED board structure schematic diagram, the object of this figure only shows the general configuration of substrate 2 described in LED.As shown in Figure 3, described substrate 2 is attached on the inner surface of described LED lamp cover 1, and described LED luminescence chip group 3 (this is not shown) is then attached on described substrate 2 accordingly.Wherein, in this Fig. 3, a part for the substrate 2 illustrated not all, is only the part of the LED lamp cover 1 of arcuation.
Further, in the present embodiment, described substrate 2 at least comprises via hole 21, and particularly, with the via hole 21 of laser ablation ad hoc rules distribution on described substrate 2, via hole 21 diameter, between 0.1 ~ 0.5, the light of LED luminescence chip group 3 can be passed through.It will be appreciated by those skilled in the art that described via hole 21 quantity and distribution be not changeless.Such as preferably, described via hole 21 is uniformly distributed in one rectangular, in a further advantageous embodiment, described via hole 21 is uniformly distributed in a round shape, and in another preferred embodiment, the part of described via hole 21 is uniformly distributed, another part non-uniform Distribution, and this does not affect concrete technical scheme of the present invention.It will be appreciated by those skilled in the art that described via hole 21 is at least as loophole purposes, does not repeat them here.
More specifically, described substrate 2 adopts aluminium base to pass through punch forming, substrate 2 presents linear pattern mode cabling, which can facilitate bending, LED luminescence chip group 3 is made to be more prone to brake forming on a substrate 2, the width of LED luminescence chip group 3 can be selected between 0.5 ~ 5mm, substrate 2 thickness is selected between 0.3 ~ 2.0, one group of LED luminescence chip group 3 power is preferably between 1 ~ 3W, the combination of LED luminescence chip group 3 is divided into the various combinations such as 3,4,6,8, to be combined into the LEDbulb lamp of different capacity, do not repeat them here.
Above specific embodiments of the invention are described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.

Claims (7)

1. a LED, is characterized in that, at least comprises LED lamp cover (1), substrate (2) and LED luminescence chip group (3);
Wherein, the side of described substrate (2) is attached at the inner surface of described LED lamp cover (1), and described LED luminescence chip group (3) is attached at the opposite side of described substrate (2);
The quantity of described substrate (2) is multiple, the quantity of described LED luminescence chip group (3) is no less than the quantity of described substrate (2), and described in the surface ratio of described substrate (2), LED luminescence chip group (3) is little.
2. LED according to claim 1, is characterized in that, the part that described luminescence chip group (3) is placed in described LED lamp cover (1) tail end is connected with electric power driving module.
3. LED according to claim 2, is characterized in that, the upper surface of the LED luminescence chip at least described LED luminescence chip group (3) scribbles fluorescent material.
4. LED according to any one of claim 1 to 3, it is characterized in that, described substrate (2) is provided with at least one via hole (21) as loophole for the region or peripheral region attaching described LED luminescence chip group (3).
5. LED according to claim 4, is characterized in that, described at least one via hole (21) is evenly distributed.
6. the LED according to any one of claim 1-3 or 5, is characterized in that, described substrate (2) is any one composition in following material:
-sheet metal;
-alloying metal sheet; Or
-sheet glass.
7. LED according to claim 6, is characterized in that, described substrate (2) is transparence or translucent.
CN201410141172.0A 2014-04-09 2014-04-09 A kind of LED Active CN103883910B (en)

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CN104197223B (en) * 2014-09-11 2017-03-22 上海鼎晖科技股份有限公司 Multiple-point-distribution LED lamp
CN104266093B (en) * 2014-09-11 2016-05-11 上海鼎晖科技股份有限公司 A kind of LED lamp with luring rail
CN104295962B (en) * 2014-10-09 2017-01-18 上海鼎晖科技股份有限公司 LED lamp with insulation protection
CN104565902A (en) * 2014-10-09 2015-04-29 上海鼎晖科技股份有限公司 Spiral LED (light emitting diode) lamp
CN104315373B (en) * 2014-10-10 2016-09-14 上海鼎晖科技股份有限公司 A kind of LED moulding process
CN105627166A (en) * 2014-10-31 2016-06-01 上海博恩世通光电股份有限公司 Large-angle light-emitting lighting emitting diode (LED) bulb lamp
CN106678572A (en) * 2017-01-10 2017-05-17 佛山电器照明股份有限公司 Novel LED lamp bulb

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CN203836664U (en) * 2014-04-09 2014-09-17 上海鼎晖科技股份有限公司 LED lamp

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CN203162690U (en) * 2013-03-29 2013-08-28 深圳市众明半导体照明有限公司 Flexible lamp-panel-type LED lamp tube
CN103292199A (en) * 2013-06-27 2013-09-11 东莞市中实创半导体照明有限公司 Glass package LED fluorescent lamp
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