CN104197223A - Multiple-point-distribution LED lamp - Google Patents
Multiple-point-distribution LED lamp Download PDFInfo
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- CN104197223A CN104197223A CN201410461086.8A CN201410461086A CN104197223A CN 104197223 A CN104197223 A CN 104197223A CN 201410461086 A CN201410461086 A CN 201410461086A CN 104197223 A CN104197223 A CN 104197223A
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- 238000009826 distribution Methods 0.000 title claims abstract description 16
- 238000004020 luminiscence type Methods 0.000 claims description 140
- 239000000758 substrate Substances 0.000 claims description 103
- 239000000463 material Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 101710031899 moon Proteins 0.000 claims description 15
- 230000005611 electricity Effects 0.000 claims description 7
- 230000000875 corresponding Effects 0.000 claims description 6
- 230000000994 depressed Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 20
- 229920002456 HOTAIR Polymers 0.000 description 13
- 210000004369 Blood Anatomy 0.000 description 12
- 239000008280 blood Substances 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 239000003292 glue Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 210000001503 Joints Anatomy 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 241000209202 Bromus secalinus Species 0.000 description 1
- 206010027146 Melanoderma Diseases 0.000 description 1
- 229910004682 ON-OFF Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The invention provides a multiple-point-distribution LED lamp. The multiple-point-distribution LED lamp is characterized by at least comprising an LED lamp bulb shell (1) and an LED light-emitting chip set (3); the LED light-emitting chip set (3) is arranged in the LED lamp bulb shell (1); a plurality of radiating points (7) are arranged on the outer surface of the LED lamp bulb shell (1). The radiating points (7) are arranged on the outer surface of the LED lamp bulb shell (1), the radiating surface of the LED lamp bulb shell (1) is heightened so that heat generated when the LED lamp emits light can be rapidly diffused to air, and radiating of the LED lamp is more sufficient accordingly. The radiating mode is easy and convenient to use and easy to operate and implement, and the good market value is achieved.
Description
Technical field
The present invention relates to LED lighting field, especially a kind of LED lamp, particularly, relates to a kind of multipoint mode distribution LED lamp.
Background technology
Along with the widespread adoption of LED, the advantage as emerging illumination new light sources, is embodied day by day significantly, but LED lamp needs large-area heat abstractor simultaneously.The bulb lamp that daily people are accustomed to using has a common characteristic: vitreum spheroid shape shell, bulb sphere is luminous.Those skilled in the art know that heat radiation is to need enough area of dissipation and air do convection current, and the distance from thermal source to radiating surface is short as far as possible, and thermal source is only a desirable radiator structure to the thermal resistance between radiating surface is low.But current most of LED bulb all dwindles glass shell, increases the metal heat sink with a lot of heat radiating fins in order to dispel the heat.The surface area of metal heat sink is not greater than bare glass shell.By experiment for many years, the radiating surface that inventor finds to increase glass shell will be better design, but it's a pity, do not have in the prior art such scheme, therefore object of the present invention is exactly in order to improve the radiating effect of LED lamp by increasing the mode of LED bulb housing radiating surface.
Summary of the invention
The technological deficiency existing for LED lamp heat radiation aspect in prior art, the object of this invention is to provide a kind of multipoint mode distribution LED lamp.
According to an aspect of the present invention, provide a kind of multipoint mode distribution LED lamp, it is characterized in that, at least comprise LED bulb housing 1, LED luminescence chip group 3, described LED luminescence chip group 3 is placed in described LED bulb housing 1; Wherein, the outer surface of described LED bulb housing 1 is provided with a plurality of heat radiation points 7.
Preferably, in the described heat radiation point 7 of part, be provided with a micropore 72.
Preferably, the tail end of described LED bulb housing 1 is connected with lamp socket 4, and preferably, or the described lamp socket 4 of the tail end of described LED bulb housing 1 is at least provided with a gas outlet.
Preferably, described heat radiation point 7 is protruding wave point 71.
Preferably, described wave point 71 is for being attached at described LED bulb housing 1 outer surface.
Preferably, the material that described wave point 71 is used is the material of heat conductivility higher than described LED bulb housing 1.
Preferably, described wave point 71 and described LED bulb housing 1 process for one-shot forming.And in a further advantageous embodiment, described wave point 71 is to paste the surface of described LED bulb housing 1 after described LED bulb housing 1 is processed into.
Preferably, described heat radiation point 7 is for being depressed in the moon hole shape thing 73 of described LED bulb housing 1 outer surface.
Preferably, the width at the middle part 25 of described substrate 2 is greater than the front end (26) of described substrate 2 and the width of rear end 27.
Preferably, described LED luminescence chip group 3 comprises one or more LED luminescence chips; And when described LED luminescence chip group 3 comprises a plurality of LED luminescence chip, between described a plurality of LED luminescence chip, by bonding line 22, be connected in series, the anode of described a plurality of LED luminescence chips is electrically connected on described substrate 2, and the negative electrode of described a plurality of LED luminescence chips is connected with a FPC so that form current supply circuit with power supply.
Preferably, described FPC 4 is arranged on described substrate 2.
Preferably, described FPC 4 comprises L binding post, N binding post, FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described a plurality of LED luminescence chips, and described FPC anode is electrically connected to described substrate 2.
Preferably, described FPC 4 comprises FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described a plurality of LED luminescence chips, described FPC anode is electrically connected to described substrate 2, when described LED lamp is used, described FPC anode and FPC negative electrode are connected with power anode and negative electrode respectively.
Preferably, the upper surface of the LED luminescence chip at least described LED luminescence chip group 3 scribbles fluorescent material 23.
Preferably, described substrate 2 is provided with at least one via hole 21 for attaching region or the peripheral region of described LED luminescence chip group 3.
Preferably, described at least one via hole 21 is evenly distributed.
Preferably, the surface area of described substrate 2 is greater than the surface area of described LED luminescence chip group 3.
Preferably, described substrate 2 is any composition in following material: sheet metal; Alloying metal sheet; Or sheet glass.
Preferably, described substrate 2 is transparence or translucent.
Further, the quantity of described substrate 2 is one or more, and accordingly, the quantity of described LED luminescence chip group 3 is no less than the quantity of described substrate 2.
The present invention arranges heat radiation point 7 by the outer surface at described bulb housing 1, improves the radiating surface of described bulb housing 1, the heat that LED lamp produces when luminous can be dispersed in air rapidly, thereby make the heat radiation of LED lamp more abundant.Further, those skilled in the art understand, by structure of the present invention, LED luminescence chip is close to LED bulb housing, LED luminescence chip can fully be contacted in bulb housing, and then LED luminescence chip can, closer to the external world, be made LED luminescence chip to be more easily dispersed into the external world and go, improve widely radiating efficiency, improved service life and the service efficiency of LED lamp.This radiating mode is easier, and easy operating and realization have good market value.
Accompanying drawing explanation
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that other features, objects and advantages of the present invention will become:
Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED lamp;
Fig. 2 illustrates according to the first embodiment of the present invention, is provided with the structural representation of the LED lamp of a micropore 72 in the described heat radiation point 7 of part
Fig. 3 illustrates according to the first embodiment of the present invention, and described heat radiation point 7 is the structural representation of the LED lamp of protruding wave point 71.
Fig. 4 illustrates according to the first embodiment of the present invention, and described heat radiation point 7 is for being depressed in the structural representation of LED lamp of the moon hole shape thing 73 of described LED bulb housing 1 outer surface.
Fig. 5 illustrates according to the first embodiment of the present invention, the structural representation of LED lamp;
Fig. 6 illustrates according to the first embodiment of the present invention, the connection diagram of the substrate of LED lamp and LED luminescence chip group, FPC;
Fig. 7 illustrates according to the first embodiment of the present invention, and in LED lamp, power drives template is incorporated into the connection diagram in flexible circuitry plate structure; And
Fig. 8 illustrates according to the first embodiment of the present invention, and in LED lamp, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.
The specific embodiment
Those skilled in the art understand, the present invention mainly provides a kind of multipoint mode distribution LED lamp, adopt the advantage of the LED lamp of multipoint mode distribution to be to make LED light fixture to have better heat dispersion, its function that improves radiating efficiency is mainly on described LED bulb housing 1, heat radiation point 7 to be set to realize, heat radiation point 7 is set can additionally increase area of dissipation, makes the dissipation of heat in bulb housing 1 rapider and abundant.
Particularly, Fig. 1 illustrates according to the structural representation of the LED lamp of a specific embodiment of the present invention.The invention provides a kind of multipoint mode distribution LED lamp, it at least comprises LED bulb housing 1, LED luminescence chip group 3 (not shown in figure 1)s, described LED luminescence chip group 3 is placed in described LED bulb housing 1, and wherein, the outer surface of described LED bulb housing 1 is provided with a plurality of heat radiation points 7.Further, it will be appreciated by those skilled in the art that LED luminescence chip group 3 and the set-up mode of bulb housing 1 have abundant description in other parts of the present invention, for example, in attaching mode, arrange, do not repeat them here.
Further, the shape that it will be appreciated by those skilled in the art that described heat radiation point 7 can be that diversified, general shape has circle, square, and attractive in appearance for profile also can be designed to the multiple patterns such as star, flower type.Heat radiation point 7 can be one-body molded with bulb housing 1, also after moulding, is attached on bulb housing 1 separately again.For example, in a preferred embodiment, when the mould of the described LED bulb housing 1 of design, to do the design of projection or depression in requisition for the position that heat radiation point 7 is set, after corresponding bulb housing 1 moulding, just there is concave point or salient point as heat radiation point 7.It will be appreciated by those skilled in the art that by such specific embodiment, can be so that the surface area of described LED bulb housing 1 increase, thus increase its area of dissipation.In concrete use procedure, after LED luminescence chip group 3 heat radiations in described LED bulb housing 1, heat conducts to the inner surface of described LED bulb housing 1, and the outer surface that passes through further described LED bulb housing 1 is to external cooling.Because the area of dissipation of described LED bulb housing 1 has increased, so have and the better radiating effect of conventional bulb.
And in another preferred embodiment, for example, process separately heat radiation point, be then bonded in the outer surface of bulb housing 1.Further, it will be appreciated by those skilled in the art that preferably, first make LED bulb housing 1, this is traditional handicraft, then by transparent glue, is bonded in the outer surface of bulb housing 1.For example, adopt the mode of automation to bond, bulb housing 1 passes through on streamline, the annular hollow mould corresponding with bulb housing 1 profile is set on streamline, and on mould, be provided with draw-in groove for fixed-type good heat radiation point 7, after being soaked to transparent glue, the heat radiation point of forming 7 bottoms were stuck in the draw-in groove of mould, when bulb housing 1 passes through mould, pass through automatic control process, make draw-in groove near the outer surface of bulb housing 1 until the bottom of heat radiation point 7 touches bulb housing 1, the draw-in groove that is now fixed with heat radiation point 7 unclamps, heat radiation point 7 is bonded in to bulb housing 1 outer surface.Similarly, it will be appreciated by those skilled in the art that the object that heat radiation point 7 is set is to increase the area of dissipation of bulb housing 1, adopt which kind of design not affect flesh and blood of the present invention, so described heat radiation point is one-shot forming, or moulding separately, do not repeat them here.
Further, in a specific embodiment, as shown in Figure 2, in described heat radiation point 7, be provided with micropore 72, its object is to make the hot-air in bulb housing 1 to discharge by micropore, and cold air also can enter into bulb housing 1 inside from micropore 72 simultaneously, by such embodiment, hot-air that can bulb housing 1 inside is dispersed in air more fast, improves radiating efficiency.Described micropore 72 can be with heat radiation point 7 by one-body molded the making of mode of mould, 7 pairs of heat radiation points in requisition for Position Design needle-like outstanding that micropore 72 is set, the size of its size and micropore is suitable, after moulding, naturally just forms micropore 72 on heat radiation point 7 like this.Further, those skilled in the art understand, in a further advantageous embodiment, also can be by technique carve micropores on heat radiation point 7 such as engravings, artistic carving generally also adopts the mode of automation to carry out, be that described bulb housing 1 passes through on streamline, the place of passing through at bulb housing 1 is provided with engraved die, the shape of the shape of mould and bulb housing 1 is suitable, the fixing engraving needle in 72 the position that micropore need to be set, when bulb housing 1 by time, by automatic controlling, make engraving needle near heat radiation point 7 so that on heat radiation point 7 carve micropore 72.
Further, with reference to embodiment illustrated in fig. 2, those skilled in the art understand, the quantity of described micropore 72 is unfixing, can on part heat radiation point 7, described micropore 72 be set, also can all on heat radiation point 7, micropore 72 be set, and described micropore 72 position on heat radiation point 7 can be also random or ordered arrangement.For example, in a preferred embodiment, preferably, on described LED bulb housing 1 top and the afterbody heat radiation point 7 near LED luminescence chip group 3, micropore 72 is set, and the plane that these micropores 72 form approaches a plane in vertical direction as far as possible, on described LED bulb housing 1 left part and the heat radiation point 7 of right part near LED luminescence chip group 3, micropore 72 is set simultaneously, and these micropores approach in the horizontal direction as far as possible one unilateral, the plane of vertical direction and the plane of horizontal direction do not cross one another simultaneously, avoid convection current each other to disturb, such arrangement can realize better convection effects, the hot-air of bulb housing 1 inside and the cold air of bulb housing 1 outside are fully exchanged, reach better radiating effect.Further, the arrangement mode that it will be appreciated by those skilled in the art that micropore 72 has multiple, and this does not affect flesh and blood of the present invention, does not repeat them here.
Further, at another, change in example, the micropore 72 arranging on the heat radiation point 7 of described bulb housing 1 afterbody can be more more, because cold air pressure is greater than hot-air, cold air is more to sink to bottom, after the more micropores 72 of described bulb housing 1 afterbody setting, can have more cold air to enter into bulb housing 1 inside from the afterbody of bulb housing 1, the hot-air of compressing bulb housing 1 inside is discharged to bulb housing 1 outside faster, makes heat radiation more abundant.
Further, at another, preferably change in example, the tail end of described LED bulb housing 1 is connected with lamp socket 4, and preferably, the tail end of described LED bulb housing 1 or described lamp socket 4 are at least provided with a gas outlet.Those skilled in the art understand, rising along with temperature, atmospheric density diminishes, hot-air is to float over above and below cold air sinks to, natural cold air pressure is greater than the pressure of hot-air, or the described lamp socket 4 of tail end at LED bulb housing 1 at least sets out after gas port, more cold air enters into bulb housing 1 inside from bottom, thereby the hot-air that can oppress bulb housing 1 top is got rid of more rapidly, thereby raising radiating effect, its quantity can be determined according to size and the shape of bulb housing 1 or lamp socket 4, can be one or more, it can be regular arrangement, also can be irregular arrangement, this does not affect flesh and blood of the present invention, do not repeat them here.
Further, it will be appreciated by those skilled in the art that described gas outlet can be one-body molded with bulb housing 1 or lamp socket 4, for example one-body molded by mould, on mould, the position in requisition for setting out gas port is arranged to projection, like this can self-assembling formation gas outlet after moulding.Also can after bulb housing 1 or lamp socket 4 moulding, process separately, for example the technique by boring realizes, bore process generally also adopts the mode of automation to carry out, be that described bulb housing 1 or lamp socket 4 pass through on streamline, the place of passing through at described bulb housing 1 or lamp socket 4 is provided with drill bit, the quantity of drill bit and position can be with the quantity of gas outlet and position to corresponding, when described bulb housing 1 or lamp socket 4 pass through, by automatic controlling, make drill bit near described bulb housing 1 or lamp socket 4 and then get out gas outlet at described bulb housing 1 or lamp socket 4.Further, it will be appreciated by those skilled in the art that and take which kind of moulding process not affect flesh and blood of the present invention, not repeat them here.
Further, those skilled in the art understand, the arrangement mode of above-mentioned gas outlet can be arranged according to particular order, for example can set out gas port in the position of left side afterbody and right side afterbody symmetry, the cold air that can make afterbody enter is like this more prone to arrive the center of LED bulb housing 1 inside, the hot-air of compressing center flows to the inner surface of LED bulb housing 1 more fast, and then is discharged to LED bulb housing 1 outside from micropore 72.
Further, Fig. 3 shows an embodiment of the specific embodiment of the invention, described heat radiation point 7 is designed to protruding wave point 71, and the advantage of this design is wider range that the size of wave point can be selected, and can increase to greatest extent as required area of dissipation.The material of wave point 71 can be identical with bulb housing 1, also can be different, and the molding mode of described wave point 71 and set-up mode, in the existing description of this specific embodiment previous section, do not repeat them here.
Preferably, the embodiment shown in Fig. 3, the wave point 71 of described projection is attached to described LED bulb housing 1 outer surface.Those skilled in the art understand, described wave point 71 is wanted, after independent moulding, by glue, to stick on bulb housing 1 outer surface conventionally, and glue and wave point 71 will select transparent material and index of refraction to want suitably, be generally the materials such as glass, resin, light can be passed through to greatest extent.Further, in wave point 71, also can be filled with heat-conducting liquid and improve radiating effect.
Preferably, the embodiment shown in Fig. 3, the wave point of described projection and described LED bulb housing 1 process for one-shot forming.Select this scheme advantage to be one-body moldedly can simplify technique, and do not need to use other extra materials such as glue, can not consider the impact on index of refraction, thermal conductivity that these materials bring.Shortcoming is that 71 materials that can select of wave point are limited to, and can only select the material identical with bulb housing 1.
Further, the wave point 71 of described projection can be used heat conductivility higher than the material of described LED bulb housing 1, and for example, adopting the ALN of ultra-high conducting heating rate is main material, allows heat pass to rapidly the air of wave point 71 peripheries.It will be appreciated by those skilled in the art that and select which kind of high heat-conducting not affect flesh and blood of the present invention, not repeat them here.
As a kind of variation, Fig. 4 illustrates another embodiment of this specific embodiment, and described heat radiation point 7 is for being depressed in the moon hole shape thing 73 of described LED bulb housing 1 outer surface.Described moon hole shape thing 73 is one-body molded in bulb housing 1, and its quantity can be determined according to bulb housing 1 size and shape, can be one or more, it can be regular arrangement, can be irregular arrangement, this affect flesh and blood of the present invention, does not repeat them here yet.
Further, those skilled in the art understand, described moon hole shape thing 73 is by one-body molded the making of mode of mould, and the Position Design moon of LED bulb housing 1 correspondence hole shape is outstanding, nine naturally just forms the moon and cheats shape thing 73 like this after moulding on LED bulb housing 1.In described moon hole shape thing 73, described micropore 72 similarly can be set, for example embodiment illustrated in fig. 2 the same, the molding mode of micropore and arrangement mode have a detailed description in specific embodiment of the invention previous section, do not repeat them here.
Further, in another embodiment, heat radiation point 7 parts set on described LED bulb housing 1 are wave points 71, and a part is described moon hole shape thing 73.For example, one-body molded the making of mode that can adopt mould, for example can process separately protruding wave point 71 again, then sticks on bulb housing 1 outer surface that is provided with moon hole shape thing 73, concrete moulding process has a detailed description in the specific embodiment of the present invention, does not repeat them here.Preferably, described wave point 71 and moon hole shape thing 73 adopt symmetrical mode to arrange, the advantage of this design is, described moon hole shape thing 73 is in a LED bulb housing 1 cold air chamber of outside formation, when described wave point 71 and moon hole shape thing 73 is provided with micropore 73, because cold air pressure is larger, the hot-air that micropore 72 on described moon hole shape thing 73 flows out still less, the cold air flowing into is more, the hot-air that micropore 72 on corresponding wave point 71 flows out is more, the cold thing flowing into still less, more regular in the mobile meeting of described bulb housing 1 interior cold and hot air like this, the hot-air of bulb housing 1 inside and outside exchange of cold air more fast and fully.
With reference to above-described embodiment, the shape that it will be appreciated by those skilled in the art that the bulb housing of described LED lamp can be circular, can be rectangle, can be also other any shapes, and this does not affect flesh and blood of the present invention, do not repeat them here,
Particularly, Fig. 5 illustrates according to a specific embodiment of the present invention, the structural representation of LED lamp.Further, it will be appreciated by those skilled in the art that and the invention provides a kind of LED lamp, it at least comprises LED bulb housing 1, substrate 2 and LED luminescence chip group 3.Preferably, those skilled in the art understand, described LED luminescence chip group 3 is tightly attached at the inwall of described LED bulb housing 1 by substrate 2, by described luminescence chip group 3 is tightly attached with the inwall of described LED bulb housing 1 and can be made the heat that described luminescence chip group 3 produces be dispersed in the residing external environment condition of LED lamp by the shortest approach by substrate 2, preferably, the heat of described LED luminescence chip group 3 conducts to LED bulb housing 1 by substrate 2, thereby heat is absorbed by described LED bulb housing 1 equably, the heat that described LED luminescence chip group 3 produces only need to just can directly be dispersed into the external world by very thin one deck LED bulb housing, and the heat that can not make described LED luminescence chip group 3 produce accumulates in described LED lamp in large quantities, cause the heat radiation difficulty of LED lamp, the heat that described LED luminescence chip group 3 is produced can be gone out by Quick diffusing, the temperature that has guaranteed LED lamp remains in rational scope, and then assurance LED lamp is normal, safety and efficient operation.
Particularly, it will be appreciated by those skilled in the art that a side of described substrate 2 is close to the inner surface of described LED bulb housing 1, the opposite side of described substrate 2 is close to described LED luminescence chip group 3.Further, those skilled in the art understand, the inwall that described LED luminescence chip is directly attached, is fixed on to described LED bulb housing 1 has great difficulty in the realization of technology, therefore need by place described substrate 2 in the middle of described LED bulb housing 1 and described luminescence chip 3, described substrate 2 can be fixed with described bulb housing 1 well, described substrate 2 can be fixed with described luminescence chip 3, therefore, by described substrate 2, can realize well the inwall that described luminescence chip 3 is fixed on described LED bulb housing 1.Further, those skilled in the art understand, fixed form between fixed form between described LED bulb housing 1 and described substrate 2 and described substrate 2 and described LED luminescence chip group 3 is not unique, can realize the relatively fixing of three, this does not affect flesh and blood of the present invention, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence.Preferably, those skilled in the art understand, described substrate 2 is designed to translucent or transparence and can guarantees to greatest extent that the wide part that described LED luminescence chip group 3 is launched can both exhale, if described substrate 2 is nontransparent shape or light transmission extreme difference, can cause the illuminating effect extreme difference of LED lamp, can be that the light that LED lamp projects produces many shades and blackspot, greatly affect illuminating effect and the function of LED lamp.Further, those skilled in the art understand, realize described substrate 2 transparence or translucent can be by using transparent material make described substrate 2, also can be by punching at described substrate 2, so also can increase the penetration capacity of light, can make the illuminating effect of LED lamp better.Any processing that can realize transparent or translucentization of described substrate 2, all can meet the requirement of the present invention to described substrate 2, and this does not affect flesh and blood of the present invention, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that in this specific embodiment, the surface of described substrate 2 is obviously little than described LED luminescence chip group 3.The effect that described substrate 2 plays is mainly for connecting described LED bulb housing 1 and described LED luminescence chip group 3, so the size of described substrate 2 is not had to strict restriction, can realizing above-mentioned linkage function.But consider that if described substrate is too large, and will affect the illumination effect that described LED luminescence chip group 3 sees through described LED bulb housing 1, the illuminating effect of described LED lamp is made a big impact.Therefore, described substrate 2 should be realizing under the prerequisite that connects described LED bulb housing 1 and described LED luminescence chip group 3 functions, as much as possible little.Can not affect largely like this lighting function of described LED luminescence chip group 3, guarantee the illuminating effect of described LED lamp, its object is consistent with described substrate 2 is designed to the transparent or translucent effect that will reach, and does not repeat them here.
Further, those skilled in the art understand, in another specific embodiment, the surface area of described substrate 2 is preferably more than the area of described LED luminescence chip group 3, thereby described LED luminescence chip group 3 is adhered on described substrate 2 by integral body, and further described substrate 2 is fixedly attached to the inner surface of described LED bulb housing 1.Further, it will be appreciated by those skilled in the art that attaching set forth in the present invention does not represent that described substrate 2 is attached to the inner surface of described LED bulb housing 1, and only represent that both are fixed relatively.
Further, it will be appreciated by those skilled in the art that the thickness of described substrate 2 should be less.When the thickness of described substrate 2 remains in a less thickness range, can realize better light transmission, the light that is unlikely to described LED luminescence chip group 3 is launched causes very large decay after described substrate 2, has guaranteed the illuminating effect of light transmission and described LED lamp.Further, if it will be appreciated by those skilled in the art that, described substrate 2 is too thick, can serious mistake stop the light that described LED luminescence chip group 3 is launched, and causes the significantly decay of described light, also can affect the heat dispersion of described LED lamp.
Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixed, its position can be determined according to the position of described LED luminescence chip group 3 is corresponding.Meanwhile, the quantity of described substrate 2 is not unique yet, and it can be also a plurality of can being one.Further, those skilled in the art understand determining of quantity and the determining of position of described substrate 2, mainly in order better described LED bulb housing 1 to be fitted with described LED luminescence chip group 3, can be in concrete realization, quantity and the position of dynamically adjusting described substrate 2, do not repeat them here.
Further, it will be appreciated by those skilled in the art that in this specific embodiment, the upper surface of the LED luminescence chip in described LED luminescence chip group 3 scribbles fluorescent material.Particularly, described LED luminescence chip group 3 comprises one or more LED luminescence chips, and preferably, when it comprises a plurality of LED luminescence chip, each LED luminescence chip all can obtain the electric power providing from electric power driving module, does not repeat them here.Further, preferably, the upper surface of wherein one or more LED luminescence chips scribbles fluorescent material, thereby the light that the LED luminescence chip of coated fluorescent material is sent is more even, and color is more easily received by consumer.
Further, it will be appreciated by those skilled in the art that Fig. 5 only shows the schematic diagram of LED luminescence chip group 3 described in a described substrate 2 and a group, this does not show that the present invention only only limits to one group of LED luminescence chip group 3.Meanwhile, on the bulb housing of LED described in Fig. 51, do not indicate heat radiation point, but embodiment illustrated in fig. 5 should combining with Fig. 1 to 4 illustrated embodiment do not repeat them here.Further, it will be appreciated by those skilled in the art that at Fig. 6 to the middle preferred embodiment that drives described LED luminescence chip group 3 by circuit connecting mode of having set forth embodiment illustrated in fig. 8, specifically please refer to Fig. 6 to embodiment illustrated in fig. 8.
Extremely embodiment illustrated in fig. 5 with reference to above-mentioned Fig. 1, those skilled in the art understand, when described substrate 2 is while being wavy, and the wavy radian of the tail end of described substrate 2 is less than the wavy radian of the pars intermedia of described substrate 2, is greater than the wavy radian at the top of described substrate 2.In order to meet the LED luminescence chip distribution density of the tail end of described LED luminescence chip group 3, be less than the LED luminescence chip distribution density at the middle part of LED luminescence chip group 3, and the LED luminescence chip distribution density of the tail end of described LED luminescence chip group 3 is greater than the LED luminescence chip distribution density at the top of LED luminescence chip group 3, the LED luminescence chip of described LED luminescence chip 3 is evenly divided on described wavy substrate 2 tiny fragments of stone, coal, etc. can realize.Further, because described substrate 2 is wavy, and the wavy radian of the tail end of described substrate 2 is less than the wavy radian of the pars intermedia of described substrate 2, is greater than the wavy radian at the top of described substrate 2.In addition, luminescence chip in described LED luminescence chip group 3 is evenly arranged on described waveform substrate, and then the LED luminescence chip density that realizes the middle part of described LED luminescence chip group 3 is greater than the density of LED luminescence chip of the tail end of described LED luminescence chip group 3, and the density of the LED luminescence chip of the tail end of LED luminescence chip group 3 is greater than the density of LED luminescence chip at the top of described LED luminescence chip group 3.Realize object and the advantage that such density of described LED luminescence chip group 3 arranges and specifically set forth in Fig. 3, do not repeat them here.
Below in conjunction with accompanying drawing 6, Fig. 7 and Fig. 8, elaborate and how by circuit connecting mode, to drive the luminous preferred embodiment of described LED luminescence chip group 3.
Fig. 6 illustrates according to the first embodiment of the present invention, the connection diagram of LED lamp substrate and LED luminescence chip group, FPC.It will be appreciated by those skilled in the art that described Fig. 6 is not the unique connected mode figure of the present embodiment, the object of this figure is intended to the connection diagram that preferred embodiment is implemented in explanation.Particularly, as shown in Figure 6, described LED luminescence chip group 3 is connected to a side of described substrate 2, the opposite side of described substrate 2 is connected with the inner surface of described bulb housing 1, it will be appreciated by those skilled in the art that the mode that described LED luminescence chip is connected with described substrate 2 is not changeless, can be for example that directly stamp is on the surface of described substrate 2, mode is varied, but does not affect flesh and blood of the present invention, therefore do not repeat them here.Meanwhile, be distributed with via hole 21 (not showing in Fig. 6) on described substrate 2, about the distribution of via hole 21, existing narration in above-mentioned Fig. 5, therefore do not repeat them here.
More specifically, between described each LED luminescence chip, by described bonding line 22, be connected in series, by this kind of connected mode, between described each LED luminescence chip, can form a series circuit, power supply simultaneously and power-off simultaneously.
Further, at FPC 4 described in one end installation one of described substrate 2 connection power supplys, it will be appreciated by those skilled in the art that preferably, the afterbody of described substrate 2 is provided with described FPC 4.Further, it will be appreciated by those skilled in the art that the method that described FPC 4 is arranged on substrate 2 is not changeless, it can use the method for pressing also can use the method for adhesion, method is multiple, but does not affect flesh and blood of the present invention, therefore do not repeat them here.
Further, in the present embodiment, as shown in FIG., preferably, the anode of last luminescence chip in described LED luminescence chip group 3 is electrically connected to described substrate 2, the negative electrode of a luminescence chip of close FPC 4 in LED luminescence chip group 3 is connected with the cathodic electricity in FPC 4 simultaneously.Further, those skilled in the art understand, in the use procedure of LED lamp provided by the invention, described substrate 2 is electrically connected to the afterbody by described bulb housing 1 preferably with external power source, such external power source is normally electrically connected to and obtains with the afterbody of described bulb housing 1 by lamp socket, thereby makes external power source can drive described LED lamp.Further, it will be appreciated by those skilled in the art that the both positive and negative polarity of external power source will be connected with described substrate 2, FPC 4 respectively, thus the power circuit of complete, and example is as shown in Figure 8.
Further, those skilled in the art understand, in the use procedure of LED lamp provided by the invention, alternating current be the lamp holder by described LED lamp directly with wire, be electrically connected to described LED luminescence chip group or by described lamp holder position first by being electrically connected to described LED luminescence chip group again after the rectification of external driving power, constant current, and Fig. 6 and embodiment illustrated in fig. 7 in, described FPC is serving as the effect of conducting circuit and LED drive circuit carrier.
Under the direct drive pattern of AC, the alternating current direct of described lamp holder joints connects L binding post and the N binding post on the FPC 4 being wired to shown in Fig. 6 or Fig. 7, by described LED luminescence chip group being powered after EMC filter circuit, bridge rectifier, constant-current drive circuit, concrete structure is as shown in Fig. 6 and Fig. 7.Wherein, described EMC filter circuit, bridge rectifier, constant-current drive circuit etc. are not shown in Fig. 6 and Fig. 7, and preferably, it is all by COB binding technology, to be directly attached to the circuit by scolding tin and FPC on FPC to form path.
Further, it will be appreciated by those skilled in the art that by above-mentioned connected mode, the both positive and negative polarity of LED luminescence chip group 3 forms, thereby in situation about can externally power, can form an electric loop, by the break-make of control loop, and then control the whether luminous of described LED luminescence chip group 3.
It will be appreciated by those skilled in the art that in order to make LED lamp send the white light of better effect, at the upper surface of described LED luminescence chip group 3, coat fluorescent material 23, as shown in FIG..
Closer, how the electric loop shown in Fig. 6 is connected with power drives, below in conjunction with accompanying drawing 7 and accompanying drawing 8, the embodiment that specifically sets forth two kinds of connections.
Fig. 7 illustrates according to the first embodiment of the present invention, and in LED lamp, power drives template is incorporated into the connection diagram in flexible circuitry plate structure.It will be appreciated by those skilled in the art that described Fig. 7 is not unique structure connection layout, the object of this figure is intended to illustrate the structure connection of electric power driving module 5 and FPC 4.Particularly, as shown in Figure 7, in described FPC 4, at least comprise binding post L, binding post N, FPC anode and FPC negative electrode.Further, in the embodiment shown in fig. 7, described FPC anode and FPC negative electrode present in the mode of electric power driving module 5, and preferably those skilled in the art understand described electric power driving module 5 at least integrated AC-DC conversion module and constant-current driven module (not shown), thereby the both positive and negative polarity of described LED luminescence chip group 3 is formed.Those skilled in the art understand, described electric power driving module 5 is placed in the inside of FPC 4, becomes one of structure of FPC 4, and those skilled in the art understand, described electric power driving module 5 is integrated in method in FPC 4 to be had a variety ofly, does not repeat them here.
Further, with reference to figure 6, it will be appreciated by those skilled in the art that the negative electrode of described FPC 4 is connected with the cathodic electricity of described LED luminescence chip, the anode of described FPC 4 is electrically connected to described substrate 2.By such connected mode, make described substrate 2 with positive charge, thereby the anode of described LED luminescence chip is connected with any point of described substrate 2, and do not need to be connected to the anode of described FPC 4, saved the material of described FPC 4, be also convenient to process.And in preferred variant, for structure shown in Fig. 6 to Fig. 8, also the anode of described FPC 4 can be electrically connected to the anode of described LED luminescence chip, the negative electrode of described FPC 4 is electrically connected to described substrate 2, correspondingly the negative electrode of described LED luminescence chip is electrically connected to described substrate 2, thereby also can form the current supply circuit for described LED luminescence chip.
Further, it will be appreciated by those skilled in the art that for a LED luminescence chip group, preferably each the LED luminescence chip in this LED luminescence chip group directly connects by bonding line 22, thereby forms cascaded structure.On such architecture basics, the negative electrode of first LED luminescence chip can be used as the negative electrode of described LED luminescence chip group, and the anode of last LED luminescence chip can be used as the anode of described LED luminescence chip group.Again further, at one, change in example, those skilled in the art understand, each LED luminescence chip in described LED luminescence chip group also can be separately by its anodic bonding to described substrate 2, correspondingly the negative electrode of each LED luminescence chip is connected on the negative electrode of described FPC 4, and this does not affect technical scheme of the present invention.
Further, with reference to above-mentioned Fig. 6 and Fig. 7, those skilled in the art understand, in above-described embodiment and variation example, it provides the electrical interface of anode and negative electrode for described LED luminescence chip, thereby when the anode of power supply and negative electrode are connected to respectively above-mentioned anode and negative electrode, can form a current supply circuit to described LED luminescence chip, not repeat them here.
More specifically, with above-mentioned embodiment illustrated in fig. 6 similar, in the LED lamp course of work provided by the invention, when the afterbody of described substrate 2 by bulb housing 1 is electrically connected to external power source, described external power source drives described luminescence chip group 3 by described electric power driving module 5 grades, thereby it is luminous to control described luminescence chip group 3.By this kind of connection, described electric power driving module 5, under the effect of FPC 4, forms electric loop with described substrate 2 and described LED luminescence chip group 3, reaches the effect of controlling described luminescence chip break-make.
Fig. 8 illustrates according to the first embodiment of the present invention, and in LED lamp, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.In conjunction with above-mentioned embodiment illustrated in fig. 6, those skilled in the art understand described FPC 4 and at least comprise FPC anode, i.e. LED+ shown in Fig. 8, and FPC negative electrode, i.e. LED-shown in Fig. 8.Described FPC negative electrode is connected with the cathodic electricity of described a plurality of LED luminescence chips, and described FPC anode is electrically connected to described substrate 2.By such connected mode, when connecting external power source 7 described in substrate 2 with positive charge, form anodal, thereby the both positive and negative polarity of described luminescence chip group 3 is formed.It will be appreciated by those skilled in the art that described Fig. 8 is not unique structure connection layout, the object of this figure is intended to illustrate the structure connection of external power source (external drive part) 7 and FPC 4.By this kind of design, by described FPC 4, can control the circuit on-off of whole luminescence chip group 3, realized the whether luminous control to luminescence chip group 3.
Further, shown in figure 8, under DC mode activated, the alternating current direct of above-mentioned lamp holder joints connects and is wired on external driving power, in power supply inside, carry out after EMC filter circuit, bridge rectifier, constant-current drive circuit, by the positive and negative electrode on the FPC above wire connecting lamp bar, finally form path again.It will be appreciated by those skilled in the art that FPC has only played the effect of communication line here, do not possess the ability that AC directly drives.
Further, the bottom of described substrate 2 is anodes, and the negative electrode of described substrate 2 is connected to FPC by bonding line, as shown in Figure 6.And Fig. 6 can be understood to a detail section in Fig. 7, Fig. 8, electric power driving module 5 and wiring part below rectangular region in Fig. 7 forms.Electric power driving module 5 shown in Fig. 7 mainly comprises following parts, and for example EMC filter circuit, bridge rectifier, constant-current drive circuit and other holding circuits form.By above-mentioned technical scheme, make LED lamp provided by the invention can pass through DC powered, also can drive by alternating current, installation and debugging are safeguarded and all become very simple.Further, the alternating current direct of above-mentioned lamp holder joints connects L ac terminal, the N ac terminal on the FPC 4 being wired to above lamp bar, after EMC filter circuit, bridge rectifier, constant-current drive circuit, wherein EMC filter circuit, bridge rectifier, constant-current drive circuit are all by COB (chip On board) binding technology, to be directly attached to the circuit by scolding tin and FPC on FPC to form path.
Further, those skilled in the art understand, because described substrate 2 preferably adopts metal, therefore described substrate 2 can only serve as an electrode, and LED is a LED device, and wanting luminously must have 2 electrodes, one adds positive voltage, one adds negative voltage, and circuit part relies on FPC to complete, as shown in Figure 6.FPC is without delivering to tail end line place, can greatly save the cost of wiring board like this, FPC only needs to be connected with the electrode cathode of first chip, after the LED quantity of connecting certain, anode conducts electricity conducting by substrate true qualities, directly fit together by via hole or welding with the anode on FPC, realize the conducting of circuit.
Above specific embodiments of the invention are described.It will be appreciated that, the present invention is not limited to above-mentioned specific implementations, and those skilled in the art can make various distortion or modification within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (15)
1. a multipoint mode distribution LED lamp, is characterized in that, at least comprises LED bulb housing (1), LED luminescence chip group (3), and described LED luminescence chip group (3) is placed in described LED bulb housing (1);
Wherein, the outer surface of described LED bulb housing (1) is provided with a plurality of heat radiation points (7).
2. LED lamp according to claim 1, is characterized in that, is provided with a micropore (72) in the described heat radiation point of part (7).
3. LED lamp according to claim 2, it is characterized in that, the tail end of described LED bulb housing (1) is connected with lamp socket (4), preferably, described LED bulb housing (1) or the described lamp socket of tail end (4) be at least provided with a gas outlet.
4. according to the LED lamp described in any one in claims 1 to 3, it is characterized in that, described heat radiation point (7) is protruding wave point (71).
5. LED lamp according to claim 4, is characterized in that, described wave point (71) is for being attached at described LED bulb housing (1) outer surface.
6. LED lamp according to claim 5, is characterized in that, the material that described wave point (71) is used is the material of heat conductivility higher than described LED bulb housing (1).
7. LED lamp according to claim 4, is characterized in that, described wave point (71) and described LED bulb housing (1) process for one-shot forming.
8. according to the LED lamp described in any one in claims 1 to 3, it is characterized in that, described heat radiation point (7) is for being depressed in the moon hole shape thing (73) of described LED bulb housing (1) outer surface.
9. according to the LED lamp described in any one in claim 1 to 8, it is characterized in that, also comprise substrate (2), the quantity of the quantity of described substrate (2) and described LED luminescence chip group (3) adapts, one side of described substrate (2) is attached at the inner surface of described LED bulb housing (1), and a described LED luminescence chip group (3) is attached at the opposite side of a corresponding described substrate (2).
10. according to the LED lamp described in right 9, it is characterized in that, the width at the middle part (25) of described substrate (2) is greater than the front end (26) of described substrate (2) and the width of rear end (27).
11. according to the LED lamp described in claim 9 or 10, it is characterized in that, described substrate (2) is wavy, and the wavy radian at the top of described substrate (2) is less than the wavy radian of the pars intermedia of described substrate (2).
12. according to the LED lamp described in any one in claim 1 to 11, it is characterized in that, described LED luminescence chip group (3) comprises one or more LED luminescence chips; And when described LED luminescence chip group (3) comprises a plurality of LED luminescence chip, between described a plurality of LED luminescence chip, by bonding line (22), be connected in series, it is upper that the anode of described a plurality of LED luminescence chips is electrically connected to described substrate (2), and the negative electrode of described a plurality of LED luminescence chips is connected with a FPC (4) so that form current supply circuit with power supply.
13. LED lamps according to claim 12, it is characterized in that, described FPC (4) comprises L binding post, N binding post, FPC anode and FPC negative electrode, described FPC negative electrode is connected with the cathodic electricity of described a plurality of LED luminescence chips, and described FPC anode is electrically connected to described substrate (2).
14. according to the LED lamp described in any one in claim 9 to 13, it is characterized in that, preferably, described substrate (2) is transparence or translucent.
15. according to the LED lamp described in any one in claim 9 to 14, it is characterized in that, the quantity of described substrate (2) is one or more, and accordingly, the quantity of described LED luminescence chip group (3) is no less than the quantity of described substrate (2).
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