CN104266093B - A kind of LED lamp with luring rail - Google Patents

Abstract

The invention provides a kind of LED lamp with luring rail, it is characterized in that, at least comprise LED bulb housing (1), comprise the substrate (2) of multiple submounts (6) and the LED luminescence chip group (3) corresponding to described multiple submounts (6) quantity; Wherein, one side of a described submounts (6) is by luring rail (5) to be attached at the inner surface of described LED bulb housing (1), a described LED luminescence chip group (3) is attached at the opposite side of a described substrate (6), wherein, the described inner surface that lures rail (5) to be arranged at LED bulb housing 1, and described in lure the shape of rail (5) and the shape of described submounts (6) to adapt. The present invention, by arranging and lure rail on described LED bulb housing, makes described substrate can not form mutually current interference, thereby has improved stability and the performance of LED lamp. This radiating mode is easier, and easy operating and realization have good market value.

Description

A kind of LED lamp with luring rail

Technical field

The present invention relates to LED lighting field, especially a kind of LED lamp, particularly, relates toWith the LED lamp that lures rail.

Background technology

Along with the widespread adoption of LED, as the advantage of emerging illumination new light sources, day by day brightEmbodied, but simultaneously, the unidirection luminous property of price, LED and LED need large face aobviouslyLong-pending heat abstractor.

The part that the puzzlement of following several items also becomes LED illumination development day by day hinders.

A, price: LED illumination by LED light source, power drives, LED heat abstractor withAnd four most compositions of bulb structure, along with constantly dropping of LED light source price, otherIt is severe that the Cost Problems of three parts becomes.

B, large-scale heat abstractor

Because LED can produce a large amount of heats when luminous, in design for protection properties of product are steadyFixed, must assist heat radiation with large-area metal, this part metal has increased light fixture cost limitMake the directionality of the unidirectional bright dipping of LED, gone back the globality of the light fixture bright dipping of partial occlusion.

For example, number of patent application is that 201310242060.X, denomination of invention are " LED chip UType pipe heat dissipation, energy conservation lamp ", number of patent application is 201310190476.1, patent name is " oneKind of line style LED light source " technical solution separately all proposed. Correspondingly, also there is portionOffshoot program has proposed to attach the technical scheme with the substrate of luminescence chip on bulb housing, and thisThe problem that the scheme of sample is brought is that the electric charge that may cause on substrate that contacts with each other of substrate causesInterfere with each other, the object of the invention is to solve the problems of the technologies described above.

Summary of the invention

May there is contact between substrate and cause electric charge to disturb for LED lamp in prior artEtc. aspect exist technological deficiency, the object of this invention is to provide a kind of LED lamp with luring rail,It is characterized in that, at least comprise LED bulb housing 1, comprise multiple submounts 6 substrate 2 andCorresponding to the LED luminescence chip group 3 of described multiple submounts 6 quantity; Wherein, a described sonOne side of substrate 6 is by luring rail 5 to be attached at the inner surface of described LED bulb housing 1, described in oneLED luminescence chip group 3 is attached at the opposite side of a described substrate 6, wherein, described in lure rail 5Be arranged at the inner surface of LED bulb housing 1, and described in lure shape and the described submounts 6 of rail 5Shape adapt.

Preferably, described in lure rail 5 to comprise that multiple sons lure rail 51, and described multiple son lure rail 51 withInner surface along described LED bulb housing 1 centered by the top of described LED bulb housing 1 extends.

Preferably, described multiple son lures the junction of rail 51 to have stop part 52.

Preferably, described son lures the length of rail 51 to be less than the length of described submounts 6, and described inIt is the acclive structure of tool that son lures the end of rail 51 and part that described submounts 6 attaches.

Preferably, described in, lure rail 5 for groove shape.

Preferably, described in, lure rail 5 for inner surface etching or compacting at described LED bulb housing 1Become, and described in lure rail 5 to be depressed in the inner surface of described LED bulb housing 1.

Preferably, described in, lure the thickness of rail 5 to be preferably the thickness of described LED bulb housing 150％。

Preferably, described in lure rail 5 for individual components, and be attached to described LED bulb housing 1 inSurface.

Preferably, the outside on the top of described submounts 6 scribbles insulating paint.

Preferably, described substrate 2 is wavy, and the wavy arc at the top of described substrate 2Degree is less than the wavy radian of the pars intermedia of described substrate 2.

Preferably, described LED luminescence chip group 3 comprises one or more LED luminescence chips;And in the time that described LED luminescence chip group 3 comprises multiple LED luminescence chip, described multiple LEDBetween luminescence chip, be connected in series the anode of described multiple LED luminescence chips by bonding line 22Be electrically connected on described substrate 2 negative electrode of described multiple LED luminescence chips and a FPC4 are connected to make to form current supply circuit with power supply.

Preferably, described FPC 4 comprises L binding post, N binding post, flexible wiresRoad plate anode and FPC negative electrode, described FPC negative electrode and described multiple LED send outThe cathodic electricity of optical chip connects, and described FPC anode is electrically connected with described substrate 2.

Preferably, described substrate 2 is transparence or translucent.

The present invention, by LED luminescence chip is close to LED bulb housing, makes LED luminousChip can fully contact in bulb housing, so make LED luminescence chip can closer to outsideBoundary, makes LED luminescence chip to be more easily dispersed into the external world and goes, and has improved widely looseThe thermal efficiency, has improved service life and the service efficiency of LED lamp. Pass through at described LED simultaneouslyOn bulb housing, arrange and lure rail, make described substrate can not form mutually current interference, thereby improveStability and the performance of LED lamp. This radiating mode is easier, easy operating and realityExisting, there is good market value.

Brief description of the drawings

By reading the detailed description of non-limiting example being done with reference to the following drawings, thisIt is more obvious that bright other features, objects and advantages will become:

Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED lampFigure;

Fig. 2 illustrates according to the first embodiment of the present invention, the structural representation of LED lamp;

Fig. 3 show according to the first embodiment of the present invention with the signal of LED lamp that lures railFigure;

Fig. 4 show according to a second embodiment of the present invention with the signal of LED lamp that lures railFigure;

Fig. 5 shows according to the relation that lures rail and LED bulb housing of the first embodiment of the present invention and showsIntention;

Fig. 6 shows according to the relation that lures rail and LED bulb housing of the first embodiment of the present invention and showsIntention;

Fig. 7 illustrates according to the first embodiment of the present invention, the substrate of LED lamp and bulb housing,The structural representation of LED luminescence chip group annexation;

Fig. 8 illustrates according to the first embodiment of the present invention, and substrate and the LED of LED lamp are luminousThe connection diagram of chipset, FPC;

Fig. 9 illustrates according to the first embodiment of the present invention, and in LED lamp, power drives template is integratedConnection diagram in flexible circuitry plate structure; And

Figure 10 illustrates according to the first embodiment of the present invention, in LED lamp outside electric power driving moduleBe placed in the connection diagram of flexible circuitry plate structure.

Detailed description of the invention

It will be appreciated by those skilled in the art that the present invention mainly provides one to have excellent heat dispersion performanceLED lamp, and to realize heat sinking function be mainly to rely on the LED luminescence chip of LED lamp to press close toLED bulb housing, make LED luminescence chip can with external environment condition more short distance liftoff approach,Make the luminescence chip of LED more directly to contact external environment, more simply and easilyRealize the heat radiation of LED luminescence chip. Further, described in it will be appreciated by those skilled in the art thatThe shape of the bulb housing of LED lamp can be circular, can be rectangle, can be also otherWhat shape, this does not affect flesh and blood of the present invention, does not repeat them here,

Particularly, Fig. 1 illustrates according to a specific embodiment of the present invention, LED lampStructural representation. Further, it will be appreciated by those skilled in the art that and the invention provides a kind of LEDLamp, it at least comprises LED bulb housing 1, substrate 2 and LED luminescence chip group 3. ExcellentSelection of land, it will be appreciated by those skilled in the art that described LED lampshade 1 has formed inner space 8, andIn prior art scheme, described LED luminescence chip is placed in described inner space 8.Preferably, it will be appreciated by those skilled in the art that described LED luminescence chip group 3 is by substrate 2Tightly be attached at the inwall of described LED bulb housing 1, by described luminescence chip group 3 is led toCrossing substrate 2 tightly attaches with the inwall of described LED bulb housing 1 and can make described luminescence chipGroup 3 heats that produce are dispersed in the residing external environment condition of LED lamp by the shortest approach,Preferably, the heat of described LED luminescence chip group 3 conducts the lamp to LED by substrate 2Cell-shell 1, thus heat is absorbed by described LED bulb housing 1 equably, and described LED sends outThe heat that optical chip group 3 produces only need to be just passable by very thin one deck LED bulb housingDirectly be dispersed into the external world, and the heat that can not make described LED luminescence chip group 3 produceAccumulate in large quantities in described LED lamp, cause the heat radiation difficulty of LED lamp, make described LEDThe heat that luminescence chip group 3 produces can be gone out by Quick diffusing, has ensured the temperature of LED lampRemain in rational scope, and then ensure normal, safety and the efficient operation of LED lamp.

Particularly, described in a side that it will be appreciated by those skilled in the art that described substrate 2 is close toThe inner surface of LED bulb housing 1, the opposite side of described substrate 2 is close to the luminous core of described LEDSheet group 3. Further, it will be appreciated by those skilled in the art that direct described LED luminescence chipThe inwall that attaches, is fixed on described LED bulb housing 1 has greatly in the realization of technologyDifficulty, therefore needs by the centre with described luminescence chip 3 at described LED bulb housing 1Place described substrate 2, described substrate 2 can be fixed with described bulb housing 1 well,Described substrate 2 can be fixed with described luminescence chip 3, therefore, and by described substrate 2Can realize well the inwall that described luminescence chip 3 is fixed on described LED bulb housing 1.Further, it will be appreciated by those skilled in the art that described LED bulb housing 1 and described substrate 2Between fixed form and described substrate 2 and described LED luminescence chip group 3 between consolidateDetermine mode not unique, can realize the relatively fixing of three, this does not affect the present inventionFlesh and blood, do not repeat them here.

Preferably, it will be appreciated by those skilled in the art that described substrate 2 be preferably translucent orTransparence. Preferably, it will be appreciated by those skilled in the art that described substrate 2 is designed to translucentShape or transparence can ensure the light that described LED luminescence chip group 3 is launched to greatest extentMajor part can both exhale, if described substrate 2 is nontransparent shape or light transmission extreme difference,Can cause the illuminating effect extreme difference of LED lamp, can be that the light that LED lamp projects produces manyShade and blackspot, affected illuminating effect and the function of LED lamp greatly. Further, originallyThose skilled in the art understand, realize described substrate 2 transparence or translucent can be by makingMake described substrate 2 with transparent material, also can be by punching at described substrate 2, thisSample also can increase the penetration capacity of light, can make the illuminating effect of LED lamp better.The processing of any transparent or translucentization that can realize described substrate 2, all can meet thisThe bright requirement to described substrate 2, this does not affect flesh and blood of the present invention, no longer superfluous at thisState.

Preferably, it will be appreciated by those skilled in the art that in this detailed description of the invention described substrate2 surface is obviously little than described LED luminescence chip group 3. The effect that described substrate 2 playsMainly for connecting described LED bulb housing 1 and described LED luminescence chip group 3, soThe size of described substrate 2 is not had to strict restriction, can realize above-mentioned linkage function.But consider that if described substrate is too large, will affect described LED luminescence chip group 3 and see through instituteState the illumination effect of LED bulb housing 1, the illuminating effect of described LED lamp is made a big impact. Therefore, described substrate 2 should can realized the described LED bulb housing 1 of connection and instituteState under the prerequisite of LED luminescence chip group 3 functions, as much as possible little. great Cheng very not like thisThe lighting function of the described LED luminescence chip group 3 of degree ground impact, has ensured described LED lampIlluminating effect, its object and described substrate 2 is designed to transparent or translucent will reachingEffect is consistent, does not repeat them here.

Further, for example it will be appreciated by those skilled in the art that, in another specific embodiment,Specific embodiment shown in Fig. 7, the surface area of described substrate 2 is preferably more than described LEDThe area of luminescence chip group 3, thus described LED luminescence chip group 3 is adhered to by entiretyOn described substrate 2, and further described substrate 2 is fixedly attached to described LED lampThe inner surface of cell-shell 1. Further, it will be appreciated by those skilled in the art that the present invention sets forthAttaching do not represent that described substrate 2 is attached to the inner surface of described LED bulb housing 1, andOnly represent that both are fixed relatively.

Further, it will be appreciated by those skilled in the art that the thickness of described substrate 2 should be less. WhenThe thickness of described substrate 2 remains in a less thickness range, can realize betterLight transmission, is unlikely to the described substrate 2 of light process that described LED luminescence chip group 3 is launchedAfter cause very large decay, ensured the illuminating effect of light transmission and described LED lamp. EnterOne step ground, if it will be appreciated by those skilled in the art that, described substrate 2 is too thick, can serious mistake stopThe light that described LED luminescence chip group 3 is launched, causes the significantly decay of described light,Also can affect the heat dispersion of described LED lamp.

Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixed,Its position can be determined according to the position of described LED luminescence chip group 3 is corresponding. Meanwhile, instituteThe quantity of stating substrate 2 is not unique yet, and it can be also multiple can being one. Further,Those skilled in the art understand determining of quantity and the determining of position of described substrate 2, mainIn order better described LED bulb housing 1 to be pasted with described LED luminescence chip group 3Close, can be in concrete realization, dynamically adjust quantity and the position of described substrate 2,Do not repeat them here.

In sum, described LED lamp is mainly by described LED bulb housing 1, described substrate 2And described LED luminescence chip group 3 forms. Realize described LED lamp by described substrate 2Cell-shell 1 is connected with described LED luminescence chip group 3, makes described LED luminescence chip group3 directly fit in described LED bulb housing 1, have greatly shortened described LED luminescence chip group 3Heat conducting distance, make the heat that described LED luminescence chip group 3 produces directly logicalThe LED bulb housing of crossing thin layer just can promptly pass in external environment condition and go, and greatly carriesThe high radiating efficiency of described LED lamp, has formed the good thermal conductivity of LED lamp, and thenExtend service life and the service efficiency of LED lamp, solved simply and easily LED lampHeat dissipation problem.

Further, it will be appreciated by those skilled in the art that in this detailed description of the invention described LEDThe upper surface of the LED luminescence chip in luminescence chip group 3 scribbles fluorescent material. Particularly, described inLED luminescence chip group 3 comprises one or more LED luminescence chips, preferably, and when it comprisesWhen multiple LED luminescence chip, each LED luminescence chip all can obtain from power drivesThe electric power that module provides, does not repeat them here. Further, preferably, one of them or manyThe upper surface of individual LED luminescence chip scribbles fluorescent material, thereby makes coated fluorescent materialThe light that LED luminescence chip sends is more even, and color is more easily received by consumer.

Further, it will be appreciated by those skilled in the art that Fig. 1 only shows a described baseThe schematic diagram of LED luminescence chip group 3 described in plate 2 and one group, this does not show the present inventionOnly only limit to one group of LED luminescence chip group 3, for example embodiment illustrated in fig. 2 showing organized institutes moreThe schematic diagram of stating LED luminescence chip group 3 described in substrate 2 and a group, does not repeat them here.Further, it will be appreciated by those skilled in the art that at Fig. 8 to middle elaboration embodiment illustrated in fig. 10Drive the preferred embodiment of described LED luminescence chip group 3, tool by circuit connecting modeBody please refer to Fig. 8 to embodiment illustrated in fig. 10.

Fig. 2 illustrates according to the first embodiment of the present invention, the layout architecture schematic diagram of LED lamp.The layout architecture that it will be appreciated by those skilled in the art that described LED lamp is not only just schemed described in figureShape, described LED luminescence chip group 3 can be various shapes with the combination of described substrate 2.Figure shown in described Fig. 2 is the moulding of petal type bulb lamp, wherein said LED luminescence chip group 3For petal type structure, shape extends from the afterbody of described LED bulb housing 1, and along describedThe inner surface of LED bulb housing 1 spreads out with strip, then at the top of described LED bulb housing 1Again gather, its shape is as petal. And described LED luminescence chip group 3 is by described substrate 2Be connected on the inner surface of described LED bulb housing 1, utilize LED bulb housing 1 to carry out direct skyGas heat loss through convection, LED lamp bar directly contacts with LED bulb housing 1, the calorie source that LED producesConstantly conduct to LED bulb housing 1 in source, the horizontal and vertical conduction air of LED bulb housing 1 process,Under the convection action of cool exterior air, constantly carrying out heat exchange, LED bulb housing 1 has playedWell thermolysis. By this kind of design, make heat that LED luminescence chip group 3 produces moreEasily be dispersed in air. It will be appreciated by those skilled in the art that the pattern diagram for other LED lamp,Its general configuration, as Fig. 2 institute formula, is only that the structure of LED luminescence chip group 3 is different, thereforeDo not repeat them here.

With reference to embodiment illustrated in fig. 2, it will be appreciated by those skilled in the art that preferably described luminous coreThe part that sheet group 3 is placed in described LED lampshade 1 tail end is connected with electric power driving module, described power supplyDriver module is connected with power supply by the screw socket of described LED bulb housing 1 afterbody, and at Power supplySituation under described luminescence chip group 3 is powered, is driven, thereby luminescence chip group 3 described in gainedLuminous, and then make LED lamp provided by the present invention luminous.

It will be appreciated by those skilled in the art that the present invention mainly provides a kind of LED with luring railLamp, this design main purpose is to utilize to lure the guide effect of rail, make submounts in bulb housing moreAdd regular movement, avoid submounts in the process stretching in bulb housing 1, mutually between phaseMutual interference and touching, also can make submounts 6 and bulb housing 1 fit more closely simultaneously,Described submounts is more firmly fixed on bulb housing 1 inwall.

Particularly, Fig. 3 shows the LED modulated structure signal of a specific embodiment of the present inventionFigure, the LED lamp of the present embodiment at least comprises LED bulb housing 1, comprise multiple submounts 6Substrate 2 (not shown) and corresponding to the luminous core of LED of described multiple submounts 6 quantitySheet group 3. The described inner surface that lures rail 5 to be arranged at LED bulb housing 1, and described in lure the shape of rail 5The shape of shape and described submounts 6 adapts, so that described submounts 6 can be luring in rail smoothlyMobile.

Further, it will be appreciated by those skilled in the art that owing to stretching into bulb housing 1 at submounts 6Process in, the top of each submounts 6 is the most easily touched, and at submounts 6 and bulbAfter shell 1 is fitted completely, each submounts 6 head portion distances are also more approaching, and that also easily occursThis touches, and therefore lures rail 5 to be preferably placed on the pars intermedia of the inner surface of the front end of LED bulb housing 1Point.

Further, with reference to above-mentioned embodiment illustrated in fig. 3, described in it will be appreciated by those skilled in the art thatLure rail 5 can be arranged in several ways the inner surface of described LED bulb housing 1. For example pass throughThe mode of glue bonding, for example, on a production line, described in lure rail and described LED bulb housing 1Be the different components and parts that separate, manipulator is by applying a certain amount of glue in the described bottom that lures railWater, then will described in lure flange of rail portion to stretch into forward in described LED bulb housing 1, lure described in the most at lastRail 5 is attached at the inner surface of described LED bulb housing 1. Further, change in example at other,Described in can also pass-through mode arranging, lure rail 5 on the inner surface of described LED bulb housing 1, at thisIt will not go into details.

Further, it will be appreciated by those skilled in the art that described submounts 6 extend into bulb housing 1Mode is, first the top that the described submounts 6 of luminescence chip group 3 is housed extend into and lure rail 5End, and along luring rail 5 to extend into the inside of bulb housing 1, final arrival lures the top of rail 5,It forms end-results as shown in Figure 3, and a side of submounts 6 is by luring rail 5 to be attached at described LEDThe inner surface of bulb housing 1, a described LED luminescence chip group 3 is attached at a described substrate 6Opposite side. Luminescence chip group 3 refers to other parts of the present invention with the laminating type of submounts 6,Do not repeat them here.

Further, described in it will be appreciated by those skilled in the art that, lure rail 5 to comprise that multiple sons lure rail 51,It is inner surfaces along described bulb housing 1 centered by the top of bulb housing 1 that described son lures rail 51Extend. Described son lures the quantity of rail 51 and shape not to fix, and needs the number of zygote substrateAmount is definite, for example embodiment illustrated in fig. 4 with shape, but this does not affect in essence of the present inventionHold, do not repeat them here. Particularly, described son lures the length of rail 51 can be according to actual needWant and determine, not repeating them here.

Further, during Fig. 4 shows according to a preferred embodiment of the present invention, with luring railThe structure that lures rail of LED lamp. Preferably, as shown in Figure 4, described multiple sons lure rail 51Junction has stop part 52. The object that designs described stop part 52 is to prevent that son from luring between railInterconnect, lure the submounts 6 in rail 51 mutually to touch thereby prevent from stretching into described son, therebyAvoid the interference between submounts 6. Further, it will be appreciated by those skilled in the art that stop part52 set-up mode has multiple, for example, if described son lures rail and bulb housing 1 one, canUtilization lures the cross section of rail 5 top self-assembling formations as stop part 52, described in generating, lures rail 5Time, multiple sons are not lured between rail 51 and got through at its head portion, but reserve enough materialsMaterial, for example, while luring rail 51 by son described in etched mode carve on described bulb housing 1,Lure rail 51 part that crosses not carve at multiple sons, thereby form described stop part 52. AgainFor example, in the time suppressing described bulb housing 1 by mould one-shot forming, described mould is corresponding to instituteStating and luring the head portion of rail 5 is hollow, thereby this part can nature in the time luring rail 5 described in compactingForm described stop part 52. Further, it will be appreciated by those skilled in the art that described stop part 52All be positioned at the top of bulb housing 1. And change in example at another, if described in lure rail 5 to be and lampCell-shell 1 separates, and conventionally can adopt independent mould to lure rail described in generating, similarly,Described mould is set to the structure that lures tread end to be divided into hollow corresponding to described, thereby forms toolWhat have described stop part 52 lures rail 5, does not repeat them here. Correspondingly, those skilled in the art's reasonSeparate, in such variation example, described stop part 52 is preferably arranged on son and lures the top of rail 51,Shape can be circle or rectangle, takes the mode of bonding to be fitted in son and to lure the top of rail 51.

Further, in conjunction with above-mentioned Fig. 3 and embodiment illustrated in fig. 4, those skilled in the art's reasonSeparate, preferably, described son lures the length of rail 51 to be less than the length of described submounts 6. This designObject be to ensure submounts 6 can possess can be movable part, extend at submounts 6Son lures in the process of rail 51, prevents that son from luring rail 51 that submounts 6 is blocked, and causes submounts distortion.Further, it will be appreciated by those skilled in the art that as fruit lures rail 51 and bulb housing be one,Son lures the size of rail 51 length directly to have influence on the intensity of bulb housing and the difficulty of moulding so,It is the length that is less than described submounts 6 that son is lured to the Design of length of rail 51, can more convenient moulding.

Further, it will be appreciated by those skilled in the art that described son lures end and the described son of rail 51The part that substrate 6 attaches is the acclive structure of tool. For example, adopt etched mode to form and lure rail,Can in the time that luring rail 51 end, engraving take the method that changes gradually the etched degree of depth to form necessarilyThe gradient. Again for example, adopt the mode of mold pressing to produce while luring rail, lure rail 51 ends corresponding at sonMould part is designed to be with acclive structure. The advantage of this design is, described son lures rail 51Tip designs be that gradient structure can make described submounts 6 more easily stretch into, and at submounts6 extend into son completely lures after rail 51, can have certain move place, prevents that submounts quilt from luringRail 51 pushes and is out of shape.

Preferably, as shown in Figure 5, what described son lured rail 51 is shaped as groove shape. This area skillArt personnel understand, and the track in industrial design is generally all designed to groove shape, and groove is easy to processing,And can control the stability of its size, also more easily match with the shape of submounts 6. ExampleAs, in the time that the shape of submounts 6 is comparatively complicated, can make son lure the size of rail 51 to be a bit larger tham sonThe size of substrate 6, ensures that submounts 6 is well contained in son and lures in rail 51. By suchGroove shape design, while making described submounts 6 insert described son to lure rail 51, described submounts 6Can insert described son along described groove and lure rail 51, thereby be more prone to control described insertionJourney, does not repeat them here.

Further, described in it will be appreciated by those skilled in the art that, lure the molding mode of rail 5 to have multiple,For example, can be formed at by surface etching or pressing process the inner surface of described LED bulb housing 1,No matter adopt which kind of technique, all do not affect essentiality content of the present invention, its final purpose all makesLure rail 5 to be depressed in the inner surface of described LED bulb housing 1, do not repeat them here.

Further, lure described in it will be appreciated by those skilled in the art that described in the thickness of rail 5 is preferably50% of the thickness of LED bulb housing 1. Lure the thickness of rail 5 unsuitable blocked up or excessively thin, blocked up meetingAffect the intensity of bulb housing 1 own, mistake is thin is unfavorable for that submounts 6 is in the movement luring in rail 5.

Change in example at another, as shown in Figure 6, described in lure rail 5 to can be designed as individual components,Be separated with bulb housing 1, so more easily independent processing and forming. For example,,, lureRail 5 can be designed as the mechanism of rectangular band groove, and material can be selected glass or plastics etc., adoptsWith the mode moulding of mold pressing, be attached to the inwall of bulb housing 1 by the mode of bonding.

Further, described in it will be appreciated by those skilled in the art that, lure rail 5 to be designed to independently parts,The described each son that lures rail 5 lures between rail 51 and can each other independently, be fixed on separately respectively lampThe inwall of cell-shell 1; Also can interconnect each other, make the as a whole bulb housing that is fixed onWhich kind of mode no matter 1 inwall, adopt, and all do not affect flesh and blood of the present invention, at this no longerRepeat.

Fig. 7 illustrates according to the first embodiment of the present invention, the structural representation of LED lamp substrate.Fig. 7 shown in it will be appreciated by those skilled in the art that is not unique LED lamp substrate structural representation,The object of this figure only shows the general configuration of substrate 2 described in LED lamp. As shown in Figure 7, instituteState on the inner surface that substrate 2 is attached at described LED bulb housing 1 described LED luminescence chip group3 (these are not shown) are attached on described substrate 2 accordingly. Wherein, in this Fig. 7,A part for the substrate 2 illustrating, inwhole, be only the part of the LED bulb housing 1 of arcuation.

Further, in the present embodiment, described substrate 2 at least comprises via hole 21, particularly,The via hole 21 distributing with laser ablation ad hoc rules on described substrate 2, via hole 21 diameters existBetween 0.1～0.5mm, the light of LED luminescence chip group 3 can be passed through. Art technology peopleMember understands, and the quantity of described via hole 21 and distribution are not changeless. For example preferably,Described via hole 21 be uniformly distributed be one rectangular, in a further advantageous embodiment, described mistakeHole 21 is uniformly distributed and is a round shape, and in another preferred embodiment, described via hole 21Part is uniformly distributed, another part non-uniform Distribution, and this does not affect concrete technical side of the present inventionCase. It will be appreciated by those skilled in the art that described via hole 21 is at least as loophole purposes, at this notGive and repeating.

More specifically, described substrate 2 adopts aluminium base by punch forming, and substrate 2 presents straight lineType mode cabling, which can facilitate bending, and LED luminescence chip group 3 is more prone at baseBrake forming on plate 2, the width of LED luminescence chip group 3 can be selected between 0.5～5mm,Substrate 2 thickness are selected between 0.3～2.0mm, and one group of LED luminescence chip group 3 power is preferredGround is between 1～3W, and LED luminescence chip group 3 combination is divided into the various combinations such as 3,4,6,8,To be combined into the LED lamp of different capacity, do not repeat them here.

Below in conjunction with accompanying drawing 8, Fig. 9 and Figure 10, elaborate and how to pass through circuit connecting modeDrive the luminous preferred embodiment of described LED luminescence chip group 3.

Fig. 8 illustrates according to the first embodiment of the present invention, the luminous core of LED lamp substrate and LEDThe connection diagram of sheet group, FPC. It will be appreciated by those skilled in the art that described Fig. 8 notBe the unique connected mode figure of the present embodiment, the object of this figure is intended to explanation and implements preferred embodimentConnection diagram. Particularly, as shown in Figure 8, described in described LED luminescence chip group 3 is connected toOne side of substrate 2, the opposite side of described substrate 2 is connected with the inner surface of described bulb housing 1, thisThose skilled in the art understand, and described LED luminescence chip with the mode that described substrate 2 is connected is notChangeless, can be for example that directly stamp is on the surface of described substrate 2, mode is varied,But do not affect flesh and blood of the present invention, therefore do not repeat them here. Meanwhile, on described substrate 2Be distributed with via hole 21 (in Fig. 8 do not show), about the distribution of via hole 21, in above-mentioned Fig. 7There is narration, therefore do not repeat them here.

More specifically, between described each LED luminescence chip, connect by described bonding line 22 series connectionConnect, by this kind of connected mode, between described each LED luminescence chip, can form a series connectionCircuit, power supply simultaneously and power-off simultaneously.

Further, FPC 4 described in is installed in the one end that connects power supply at described substrate 2,It will be appreciated by those skilled in the art that preferably, the afterbody of described substrate 2 is provided with described flexible circuitryPlate 4. Further, it will be appreciated by those skilled in the art that described FPC 4 is arranged on substrateMethod on 2 is not changeless, what its method that can use pressing also can be with adhesionMethod, method is multiple, but does not affect flesh and blood of the present invention, therefore do not repeat them here.

Further, in the present embodiment, as shown in FIG., preferably, described LED is sent outIn optical chip group 3, the anode of last luminescence chip is electrically connected with described substrate 2, will simultaneouslyNegative electrode and the flexible wires of a luminescence chip of close FPC 4 in LED luminescence chip group 3Cathodic electricity in road plate 4 connects. Further, it will be appreciated by those skilled in the art that in the present invention and carryIn the use procedure of the LED lamp of confession, described substrate 2 will preferably pass through the tail of described bulb housing 1Portion is electrically connected with external power source, and such external power source is normally by lamp socket and described bulbThe afterbody of shell 1 is electrically connected and obtains, thereby makes external power source can drive described LED lamp.Further, it will be appreciated by those skilled in the art that the both positive and negative polarity of external power source will be respectively and described substrate2, FPC 4 is connected, thus the power circuit of complete, and example is as shown in figure 10.

Further, it will be appreciated by those skilled in the art that the use at LED lamp provided by the inventionCheng Zhong, alternating current is directly to use wire and the luminous core of described LED by the lamp holder of described LED lampSheet group is electrically connected or first passes through after the rectification of external driving power, constant current by described lamp holder positionBe electrically connected with described LED luminescence chip group again, and Fig. 8 and embodiment illustrated in fig. 9 in, instituteState the effect that FPC is serving as conducting circuit and LED drive circuit carrier.

Under the direct drive pattern of AC, the alternating current direct of described lamp holder joints was connected wire and was connectedTo L binding post and N binding post on the FPC 4 shown in Fig. 8 or Fig. 9, logicalCross after EMC filter circuit, bridge rectifier, constant-current drive circuit the luminous core of described LEDSheet group is powered, and concrete structure as shown in FIG. 8 and 9. Wherein, described EMC filteringCircuit, bridge rectifier, constant-current drive circuit etc. are not shown in Fig. 8 and Fig. 9, preferablyGround, it is to be all directly attached on FPC by scolding tin and flexibility by COB binding technologyThe circuit of wiring board forms path.

Further, it will be appreciated by those skilled in the art that by above-mentioned connected mode the luminous core of LEDThe both positive and negative polarity of sheet group 3 forms, thereby can the in the situation that of externally fed, can form an electricityLoop, by the break-make of control loop, and then control the luminous of described LED luminescence chip group 3 withNo.

It will be appreciated by those skilled in the art that in order to make LED lamp send the white light of better effect, in instituteState the upper surface of LED luminescence chip group 3 and coat fluorescent material 23, as shown in FIG..

Closer, how the electric loop shown in Fig. 8 is connected with power drives,Below in conjunction with accompanying drawing 9 and accompanying drawing 10, the embodiment that specifically sets forth two kinds of connections.

Fig. 9 illustrates according to the first embodiment of the present invention, and in LED lamp, power drives template is integratedConnection diagram in flexible circuitry plate structure. It will be appreciated by those skilled in the art that described Fig. 9 notBe unique structure connection layout, the object of this figure is intended to illustrate electric power driving module 5 and flexible circuitryThe structure connection of plate 4. Particularly, as shown in Figure 9, in described FPC 4 at leastComprise binding post L, binding post N, FPC anode and FPC negative electrode.Further, in the embodiment shown in fig. 9, described FPC anode and FPCNegative electrode presents in the mode of electric power driving module 5, and described in preferably those skilled in the art understandElectric power driving module 5 is at least integrated, and AC-DC conversion module and constant-current driven module are (not shown in the figuresGo out), thus the both positive and negative polarity of described LED luminescence chip group 3 is formed. Art technology peopleMember understands, and described electric power driving module 5 is placed in the inside of FPC 4, becomes flexible wiresOne of structure of road plate 4, it will be appreciated by those skilled in the art that described electric power driving module 5 is integrated inMethod in FPC 4 has a variety of, does not repeat them here.

Further, with reference to figure 8, it will be appreciated by those skilled in the art that described FPC 4Negative electrode is connected with the cathodic electricity of described LED luminescence chip, the anode of described FPC 4 and instituteStating substrate 2 is electrically connected. By such connected mode, make described substrate 2 with positive charge,Thereby the anode of described LED luminescence chip is connected with any point of described substrate 2, andDo not need to be connected to the anode of described FPC 4, saved described FPC 4Material, be also convenient to process. And in preferred variant, for shown in Fig. 8 to Figure 10Structure, also can be by the anode electricity of the anode of described FPC 4 and described LED luminescence chipConnect, the negative electrode of described FPC 4 is electrically connected with described substrate 2, correspondingly described LEDThe negative electrode of luminescence chip is electrically connected with described substrate 2, thereby also can form for described LED and send outThe current supply circuit of optical chip.

Further, it will be appreciated by those skilled in the art that for a LED luminescence chip group, excellentEach LED luminescence chip in this LED luminescence chip group of selection of land is directly by bonding line 22Connect, thereby form cascaded structure. On such architecture basics, first LED luminescence chipNegative electrode can be used as the negative electrode of described LED luminescence chip group, and last LED luminescence chipAnode can be used as the anode of described LED luminescence chip group. Again further, a variationIn example, it will be appreciated by those skilled in the art that each LED in described LED luminescence chip group sends outOptical chip also can be separately by its anodic bonding to described substrate 2, correspondingly each LED sends outThe negative electrode of optical chip is connected on the negative electrode of described FPC 4, and this does not affect of the present inventionTechnical scheme.

Further, with reference to above-mentioned Fig. 8 and Fig. 9, it will be appreciated by those skilled in the art that above-mentionedEmbodiment and changing in example, it provides the electricity of anode and negative electrode for described LED luminescence chipInterface, thus in the time that the anode of power supply and negative electrode are connected to respectively above-mentioned anode and negative electrode, can formA current supply circuit to described LED luminescence chip, does not repeat them here.

More specifically, with above-mentioned embodiment illustrated in fig. 8 similar, at LED lamp provided by the inventionIn the course of work, when described substrate 2 is electrically connected with external power source by the afterbody of bulb housing 1, instituteState external power source and by described electric power driving module 5 grades, described luminescence chip group 3 driven,Thereby it is luminous to control described luminescence chip group 3. By this kind of connection, described electric power driving module 5Under the effect of FPC 4, with described substrate 2 and described LED luminescence chip group 3Form electric loop, reach the effect of controlling described luminescence chip break-make.

Figure 10 illustrates according to the first embodiment of the present invention, in LED lamp outside electric power driving moduleBe placed in the connection diagram of flexible circuitry plate structure. In conjunction with above-mentioned embodiment illustrated in fig. 8, this areaTechnical staff understands described FPC 4 and at least comprises FPC anode, i.e. Figure 10 instituteShow LED+, and FPC negative electrode, i.e. LED-shown in Figure 10. Described FPCNegative electrode is connected with the cathodic electricity of described multiple LED luminescence chips, described FPC anode and instituteStating substrate 2 is electrically connected. By such connected mode, substrate described in connecting when external power source 72 with positive charge, forms positive pole, thereby the both positive and negative polarity of described luminescence chip group 3 is formed.It will be appreciated by those skilled in the art that described Figure 10 is not unique structure connection layout, the object of this figureBe intended to illustrate the structure connection of external power source (external drive part) 7 and FPC 4.By this kind of design, can control the line of whole luminescence chip group 3 by described FPC 4Road break-make, has realized the whether luminous control to luminescence chip group 3.

Further, shown in Figure 10, under DC mode activated, the friendship of above-mentioned lamp holder jointsStream electricity is directly wired on external driving power, carries out EMC filter in power supply insideAfter wave circuit, bridge rectifier, constant-current drive circuit, then pass through above wire connecting lamp barPositive and negative electrode on FPC, finally forms path. It will be appreciated by those skilled in the art that flexibilityWiring board has only played the effect of communication line here, does not possess the ability that AC directly drives.

Further, with reference to above-mentioned Fig. 1 to Figure 10, it will be appreciated by those skilled in the art that above-mentioned Fig. 1To Figure 10 be not the unique structure connection layout of the present invention, the object of above-mentioned figure is intended to illustrate thisThe structure of the structure of the bright LED lamp providing and wherein LED luminescence chip group and FPC,Connection. As shown in Figure 9, described substrate 2 preferably adopts metallic conductor, so cannot be realExisting complicated circuit and telegraph circuit, so thereunder region laminating great-wall shaped flexible circuitry preferablyPlate, and according to arranging of substrate, multiple LED luminescence chip groups can be set, and each LED is luminousBetween chipset, preferably adopt parallel way, quantity in parallel is by described LED luminescence chip groupNumber determine. Preferably, the quantity of described LED luminescence chip group can be between 3-10 barSelect, according to power difference, combination also can be different, and this does not affect technology of the present inventionScheme.

Further, the bottom of described substrate 2 is anodes, and the negative electrode of described substrate 2 passes through bondingLine is connected to FPC, as shown in Figure 8. And Fig. 8 can be understood to Fig. 9, Tu10ZhongA detail section, electric power driving module 5 and wiring part by Fig. 9 below rectangular regionComposition. Electric power driving module 5 shown in Fig. 9 mainly comprises following parts, for example EMCFilter circuit, bridge rectifier, constant-current drive circuit and other holding circuits composition. Pass throughAbove-mentioned technical scheme, makes LED lamp provided by the invention can pass through DC powered, also canTo drive by alternating current, installation and debugging are safeguarded and all become very simple. Further, onThe alternating current direct of stating lamp holder joints connects on the FPC 4 being wired to above lamp barL ac terminal, N ac terminal, by EMC filter circuit, bridge rectifier, constant currentAfter drive circuit, wherein EMC filter circuit, bridge rectifier, constant-current drive circuit are allDirectly be attached on FPC by scolding tin by COB (chipOnboard) binding technology andThe circuit of FPC forms path.

Further, it will be appreciated by those skilled in the art that because described substrate 2 preferably adopts metal,Therefore described substrate 2 can only serve as an electrode, and LED is a LED device, wantsLuminous must have 2 electrodes, and one adds positive voltage, and one adds negative voltage, and circuit part relies on softProperty wiring board completes, as shown in Figure 8. FPC is without delivering to tail end line place, like thisThe cost that can greatly save wiring board, FPC only needs the electrode cathode with first chipConnect, after the LED quantity of connecting certain, anode conducts electricity conducting by substrate true qualities,Directly fit together by via hole or welding with anode on FPC, realize circuitConducting.

Above specific embodiments of the invention are described. It will be appreciated that, the present invention alsoBe not limited to above-mentioned specific implementations, those skilled in the art can be within the scope of the claimsMake various distortion or amendment, this does not affect flesh and blood of the present invention.

Claims (13)

1. with a LED lamp that lures rail, it is characterized in that, at least comprise LED bulb housing (1), comprise multiple submounts (6)Substrate (2) and corresponding to the LED luminescence chip group (3) of described multiple submounts (6) quantity;

Wherein, a side of described submounts (6) is by luring rail (5) to be attached at the inner surface of described LED bulb housing (1), described inLED luminescence chip group (3) is attached at the opposite side of described submounts (6),

Wherein, described in lure rail (5) to be arranged at the inner surface of LED bulb housing (1), and described in lure shape and the described son of rail (5)The shape of substrate (6) adapts.

2. LED lamp according to claim 1, is characterized in that, described in lure rail (5) to comprise that multiple sons lure rail (51),And described multiple son lures rail (51) interior table along described LED bulb housing (1) centered by the top of described LED bulb housing (1)Face extends.

3. LED lamp according to claim 2, is characterized in that, described multiple sons lure the junction of rail (51) to have to stopPortion (52).

4. according to the LED lamp described in claim 2 or 3, it is characterized in that, described son lures the length of rail (51) to be less than described sonThe length of substrate (6), and the part that described son lures the end of rail (51) and described submounts (6) to attach is the acclive structure of tool.

5. according to the LED lamp described in any one in claims 1 to 3, it is characterized in that, described in to lure rail (5) be groove shape.

6. according to the LED lamp described in any one in claims 1 to 3, it is characterized in that, described in lure rail (5) for describedInner surface etching or the compacting of LED bulb housing (1) form, and described in lure rail (5) be depressed in described LED bulb housing (1) inSurface.

7. LED lamp according to claim 6, is characterized in that, described in to lure the thickness of rail (5) be described LED bulb housing(1) 50% of thickness.

8. according to the LED lamp described in any one in claims 1 to 3, it is characterized in that, described in to lure rail (5) be individual components,And be attached to the inner surface of described LED bulb housing (1).

9. according to the LED lamp described in any one in claim 1 or 2 or 3 or 7, it is characterized in that described submounts (6)The outside on top scribble insulating paint.

10. according to the LED lamp described in any one in claim 1 or 2 or 3 or 7, it is characterized in that, described substrate (2) isWavy, and the wavy radian at the top of described substrate (2) is less than the wavy radian of the pars intermedia of described substrate (2).

11. according to the LED lamp described in any one in claim 1 or 2 or 3 or 7, it is characterized in that the luminous core of described LEDSheet group (3) comprises one or more LED luminescence chips; And when described LED luminescence chip group (3) comprises that multiple LED are luminousWhen chip, between described multiple LED luminescence chips, be connected in series the sun of described multiple LED luminescence chips by bonding line (22)It is upper that the utmost point is electrically connected to described substrate (2), the negative electrode of described multiple LED luminescence chips be connected with a FPC (4) so thatMust form current supply circuit with power supply.

12. LED lamps according to claim 11, is characterized in that, described FPC (4) comprise L binding post,N binding post, FPC anode and FPC negative electrode, described FPC negative electrode and described multiple LED are luminousThe cathodic electricity of chip connects, and described FPC anode is electrically connected with described substrate (2).

13. according to the LED lamp described in any one in claim 1 or 2 or 3 or 7 or 12, it is characterized in that described substrate(2) be transparence or translucent.